CN221205339U - Moisture drying device and dish washer - Google Patents

Abstract

The utility model belongs to the technical field of kitchen appliances, and discloses a wet gas drying device and a dish washer. The wet gas drying device comprises a runner shell and a heat exchange assembly; a flow channel is formed in the flow channel shell, a fluid inlet and a backflow port which are communicated with the flow channel are formed in the flow channel shell, and the fluid inlet and the backflow port are both used for being communicated with a cavity to be dried; the heat exchange assembly comprises a semiconductor refrigerating piece and a heat exchanger, at least part of the heat exchanger is arranged in the flow channel, and the heat exchanger is used for cooling air flow in the flow channel; the semiconductor refrigerating piece is arranged outside the runner shell, and the refrigerating end of the semiconductor refrigerating piece is in heat exchange fit with the heat exchanger. The semiconductor refrigerating piece in the wet gas drying device can reduce the temperature of the heat exchange medium in the heat exchanger, is arranged outside the runner shell, can facilitate outward diffusion of heat of the heating end of the semiconductor refrigerating piece, and is beneficial to heat dissipation of the semiconductor refrigerating piece.

Description

Moisture drying device and dish washer

Technical Field

The utility model relates to the technical field of kitchen appliances, in particular to a wet gas drying device and a dish washer.

Background

The temperature in the inner container is high after the dish washer works, and the humidity is high, and the dish washer needs to be dried and cooled in time so as to avoid residual water stains on tableware and avoid burn after a user opens a machine door.

The drying mode of the existing dish washer generally leads the wet air in the liner into the runner through the fan, a heat exchanger is arranged in the runner, a heat exchange medium is arranged in the heat exchanger, the heat exchange efficiency is quickened through the heat exchange of air flow and the heat exchange medium, and the gas after the condensed water is separated out returns to the liner, so that the purpose of drying the liner is achieved. However, the air flow in the flow channel is large, and the heat exchange medium in the heat exchanger is limited, so that the cooling effect of the heat exchanger on the air flow is poor, and the drying efficiency of the liner is affected.

Disclosure of utility model

The utility model aims to provide a wet gas drying device and a dish washing machine, which can improve the heat exchange efficiency with fluid so as to improve the drying efficiency.

To achieve the purpose, the utility model adopts the following technical scheme:

a moisture drying apparatus comprising:

the drying device comprises a runner shell, wherein a runner is formed in the runner shell, a fluid inlet and a backflow port which are communicated with the runner are formed in the runner shell, and the fluid inlet and the backflow port are both used for being communicated with a cavity to be dried;

The heat exchange assembly comprises a semiconductor refrigerating piece and a heat exchanger, at least part of the heat exchanger is arranged in the flow channel, and the heat exchanger is used for cooling air flow in the flow channel; the semiconductor refrigerating piece is arranged outside the runner shell, and the refrigerating end of the semiconductor refrigerating piece is in heat exchange fit with the heat exchanger.

As an alternative scheme of the above moisture drying device, an inlet flow channel and an outlet flow channel are arranged in the semiconductor refrigeration piece, the inlet flow channel is used for introducing heat exchange medium, and the inlet flow channel is positioned at the refrigeration end of the semiconductor refrigeration piece and is communicated with the inlet of the heat exchanger;

The discharge flow passage is used for discharging heat exchange medium, and is positioned at the heating end of the semiconductor refrigerating piece and communicated with the outlet of the heat exchanger.

As an alternative to the above-mentioned wet gas drying apparatus, the heat exchange assembly further includes a waste heat pipe, the waste heat pipe being in communication with the discharge flow passage, at least a portion of the waste heat pipe being located in the flow passage and downstream of the heat exchanger in the direction of airflow.

As an alternative of the above moisture drying device, the heat exchange assembly further includes a heat storage tank, the heat storage tank is disposed outside the runner casing, and the heat storage tank is communicated with the waste heat pipe.

As an alternative to the above-mentioned moisture drying device, the heat storage tank is used for contact heat exchange with the cavity to be dried.

As an alternative to the above-mentioned wet gas drying apparatus, a liquid drain port is provided on the heat storage tank.

As an alternative to the above-described moisture drying device, the flow channel extends in a curved manner.

As an alternative to the above-mentioned wet gas drying apparatus, the wet gas drying apparatus further includes a fan disposed in the flow passage and downstream of the heat exchanger in the flow direction of the air flow.

As an alternative to the above-mentioned wet gas drying apparatus, a heating assembly is disposed in the flow channel, and the heating assembly is disposed in the flow channel and downstream of the heat exchanger in the airflow direction.

The dishwasher comprises an inner container and the moisture drying device, wherein the fluid inlet and the backflow port are communicated with the inner container.

The utility model has the beneficial effects that:

According to the wet gas drying device, the semiconductor refrigerating piece is arranged, so that the temperature of the heat exchange medium in the heat exchanger can be reduced, the heat exchange effect of the heat exchange medium in the heat exchanger and the air flow in the flow channel is improved, and the influence of the small size of the heat exchanger and the small total amount of the heat exchange medium on the heat exchange effect is made up; the semiconductor refrigerating piece is arranged outside the runner shell, so that the heat of the heating end of the semiconductor refrigerating piece can be conveniently diffused outwards, and the heat dissipation of the semiconductor refrigerating piece is facilitated.

The dish washer provided by the utility model comprises the moisture drying device, and can improve the drying efficiency of the inner container.

Drawings

Fig. 1 is a schematic structural diagram of a moisture drying device according to a first embodiment of the present utility model;

fig. 2 is a schematic diagram of a moisture drying device according to a first embodiment of the present utility model;

fig. 3 is a front view of a moisture drying apparatus according to an embodiment of the present utility model without the second housing;

Fig. 4 is a schematic structural view of the moisture drying device according to the first embodiment of the present utility model when the second housing is not assembled.

In the figure:

10. A flow passage housing; 11. a first housing; 101. a cooling flow passage; 102. a return flow path; 111. a fluid inlet; 112. a return port; 12. a second housing; 13. a mounting cover; 14. a partition; 20. a blower; 21. a motor; 22. an impeller; 30. a heating assembly; 40. a heat exchange assembly; 41. a heat exchanger; 42. a semiconductor refrigeration member; 43. a heat storage tank; 44. and a waste heat pipeline.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

Example 1

The embodiment provides a moisture drying device for cooling and drying moist hot air in a cavity to be dried. The wet-air drying device can be used in a dish washer, and the embodiment is described by taking a cavity to be dried as an inner container of the dish washer as an example.

As shown in fig. 1 and 2, the moisture drying device includes a flow path housing 10 and a blower 20, a flow path is formed in the flow path housing 10, a fluid inlet 111 and a return port 112 are provided on the flow path housing 10, and the fluid inlet 111 and the return port 112 are both used for communicating with a cavity to be dried (in this embodiment, a liner) storing moisture. A flow passage is formed in the flow passage housing 10, and both the fluid inlet 111 and the return port 112 communicate with the flow passage. The fan 20 is used for driving air flow in the liner to enter the flow channel from the fluid inlet 111 and return to the liner from the return port 112.

In order to improve the cooling effect of the air flow in the flow channel and reduce the humidity of the air returning to the liner, the wet gas drying device further comprises a heat exchange assembly 40, at least part of the heat exchange assembly 40 is arranged in the flow channel and exchanges heat with the air flow in the flow channel, the temperature of the air flow is reduced, and the moisture in the air flow is condensed and separated out, so that the aim of reducing the humidity of the air flow is fulfilled.

The heat exchange assembly 40 positioned in the runner shell 10 is limited in size due to the limitation of the size of the runner shell 10, and the air flow introduced into the runner by the liner is large, so that the heat of the heat exchange assembly 40 and the air flow for heat exchange is limited, the cooling efficiency of the air flow is restricted, and the drying efficiency of the liner is further influenced.

To solve the above problems, as shown in fig. 2 and 3, the heat exchange assembly 40 includes a heat exchanger 41 and a semiconductor refrigerator 42, at least a part of the heat exchanger 41 is disposed in the flow channel, and the heat exchanger 41 is used for cooling the air flow in the flow channel 101; the semiconductor refrigeration piece 42 is arranged outside the flow channel, and the refrigeration end of the semiconductor refrigeration piece 42 is in heat exchange fit with the heat exchanger 41. By arranging the semiconductor refrigerating piece 42, the temperature of the heat exchange medium in the heat exchanger 41 can be reduced, so that the heat exchange effect of the heat exchange medium in the heat exchanger 41 and the air flow in the flow channel is improved, and the influence of the small size of the heat exchanger 41 and the small total amount of the heat exchange medium on the heat exchange effect is compensated; the semiconductor refrigeration piece 42 is arranged outside the runner shell 10, so that heat of a heating end of the semiconductor refrigeration piece 42 can be conveniently diffused outwards, and the semiconductor refrigeration piece 42 can radiate heat.

In this embodiment, the heat exchanger 41 is a tube heat exchanger. The heat exchanger 41 includes a plurality of heat exchange tubes arranged in parallel at intervals so that the air flow in the flow passage can be fully contacted with the heat exchange tubes to improve the heat exchange effect.

An inlet flow path and an outlet flow path are provided in the semiconductor refrigeration member 42. The inlet flow channel is arranged at the refrigerating end of the semiconductor refrigerating piece 42 and is communicated with the inlet of the heat exchanger 41, and the inlet flow channel is used for introducing heat exchange medium so that the heat exchange medium can enter the heat exchanger 41 after passing through the refrigerating end of the semiconductor refrigerating piece 42, and the heat of the heat exchange medium is absorbed in the process of passing through the refrigerating end of the semiconductor refrigerating piece 42, so that the heat exchange medium entering the heat exchanger 41 stores cold energy. The discharge flow passage is located at the heating end of the semiconductor refrigeration member 42 and is communicated with the outlet of the heat exchanger 41, and the discharge flow passage is used for discharging the heat exchange medium in the heat exchanger 41. In the process of discharging the heat exchange medium through the discharge flow passage, the heat exchange medium exchanges heat with the heating end of the semiconductor refrigeration piece 42, absorbs the heat of the heating end, and discharges the heat exchange medium after absorbing the heat so as to dissipate the heat of the semiconductor refrigeration piece 42.

In this embodiment, the heating end of the semiconductor refrigeration member 42 is cooled by self-heating through being disposed outside the runner shell 10, and the cooling effect is good by absorbing heat through the heat exchange medium flowing through the semiconductor refrigeration member 42, so that the refrigeration effect of the semiconductor refrigeration member 42 on the heat exchange medium entering the heat exchanger 41 can be ensured.

In order to fully utilize the waste heat of the discharged heat exchange medium, the heat exchange assembly 40 further comprises a waste heat pipeline 44, the waste heat pipeline 44 is communicated with the discharge flow channel, at least part of the waste heat pipeline 44 is positioned in the flow channel and positioned at the downstream of the heat exchanger 41 along the airflow flowing direction, so that the airflow in the flow channel is cooled by the heat exchanger 41 to remove water, then passes through the waste heat pipeline 44, is heated by the waste heat pipeline 44 to be further dried and raised in temperature, and the dried airflow with a certain temperature returns to the liner through the return port 112 to accelerate the drying efficiency of the liner.

For convenience in storing the discharged heat exchange medium, the heat exchange assembly 40 further includes a heat storage tank 43, the heat storage tank 43 is disposed outside the runner housing 10, and the heat storage tank 43 is communicated with the waste heat pipe 44, so that the heat exchange medium can be stored in the heat storage tank 43 through the waste heat pipe 44.

Further, the heat storage tank 43 may be in contact with the inner container so as to keep the inner container warm by the heat of the heat exchange medium stored in the heat storage tank 43, so as to improve the drying effect of the inner container.

As shown in fig. 2, the heat storage tank 43 has a flat structure to reduce the thickness of the heat storage tank 43, which is advantageous to reduce the thickness of the moisture drying device to reduce the installation space requirement of the moisture drying device.

The heat storage tank 43 and the flow path case 10 are aligned in a straight line and communicate, and the alignment direction of the heat storage tank 43 and the flow path case 10 is perpendicular to the thickness of the flow path case 10. This kind of setting can reduce the whole thickness of moisture drying device to solve the restricted problem of installation space.

The dimension of the heat storage tank 43 in the thickness direction of the runner casing 10 is not greater than the thickness of the runner casing 10 to reduce the overall thickness of the moisture drying device. Further, the center plane of the heat storage tank 43 in the thickness direction of the runner casing 10 coincides with the center plane of the runner casing 10 in the thickness direction, i.e., the heat storage tank 43 does not protrude from the runner casing 10 in the thickness direction of the runner casing 10, to further reduce the overall thickness of the moisture drying device.

In this embodiment, the heat storage tank 43 is provided with a liquid outlet to facilitate the discharge of the heat exchange medium in the heat storage tank 43.

In the embodiment, the heat exchange medium is kitchen water, and the kitchen water is used as the heat exchange medium, so that the cost is low. When the heat exchange medium is introduced, water enters the heat exchanger 41 through the inlet flow channel, and then enters the waste heat pipeline 44 through the outlet flow channel. After the air flow in the flow channel is heated by the heat of the water in the waste heat pipeline 44, the water enters the heat storage box 43 for storage. The water in the heat storage tank 43 can keep the temperature of the inner container so as to fully utilize the heat in the water. The liquid outlet can discharge the water in the heat storage box 43 into the liner or the sewer, can also be communicated with the inlet flow channel so as to realize the cyclic utilization of the water, and can also be used as the pre-washing water of the next washing stage of the dish washer, so that the reusability of the device is improved, the complexity is reduced, and the volume is reduced.

Optionally, a drain port communicating with the flow passage is provided at the bottom end of the flow passage case 10, through which condensed water condensed in the flow passage can drain out of the flow passage. The condensed water can be stored for recycling after being discharged, and can also be directly discharged into the liner or the sewer.

As shown in fig. 3, a flow passage is formed in the flow passage housing 10, the flow passage includes a cooling flow passage 101 and a return flow passage 102 which are communicated, a fluid inlet 111 is connected to a head end of the cooling flow passage 101, a return flow port 112 is connected to a tail end of the return flow passage 102, a part of the heat exchanger 41 is disposed in the cooling flow passage 101, and the fan 20 is disposed downstream of the heat exchanger 41 in the airflow flowing direction, specifically disposed at one end of the return flow passage 102 connected to the cooling flow passage 101. The fan 20 can drive the gas in the liner to enter the cooling flow channel 101 through the fluid inlet 111, the gas is cooled in the cooling flow channel 101 and then condensed to obtain condensed water, and the drier gas enters the reflux flow channel 102 through the fan 20 and returns to the liner through the reflux port 112.

In this embodiment, after the humid air in the liner is introduced into the flow channel, the humid air flows in the cooling flow channel 101 first, and is cooled during the flowing process, so that the moisture in the humid air is condensed into condensed water; the lower humidity gas continues along the cooling flow path 101 and through the fan 20 into the return flow path 102 and back into the liner through the return port 112. The gas with higher humidity in the inner container enters the flow channel for cooling, the gas with lower humidity returns to the inner container, and the inner container can be dried by circulating the steps. The humid air is firstly cooled in the cooling flow passage 101 to reduce the humidity, and then enters the return flow passage 102 in contact with the fan 20, so that the contact between the humid air and the fan 20 can be reduced, and the failure rate of the fan 20 can be reduced.

In this embodiment, the fan 20 is located in the flow channel, and can play a role of protecting the fan 20 through the flow channel shell 10, so as to avoid the fan 20 from colliding with or being influenced by external environment to fail.

Since the axial dimension of the fan 20 is generally smaller than the radial dimension of the fan 20, in order to reduce the dimension of the runner casing 10, the part of the runner in this embodiment is configured as a double-layer structure, the fan 20 is disposed at the double-layer position, so that the axis of the fan 20 extends along the thickness direction of the runner casing 10, the axial end face of the fan 20 is air-fed, and the circumferential surface of the fan 20 is air-discharged, so that the space in the runner is fully utilized, the thickness of the runner casing 10 is reduced, and the dimension of the runner casing 10 is reduced.

Specifically, the end of the cooling flow path 101 and the head end of the return flow path 102 are stacked and communicate in the thickness direction of the flow path case 10, and the fan 20 is disposed at the head end of the return flow path 102. Wherein, the axial end face of the fan 20 is used for air inlet, and the circumferential surface of the fan 20 is used for air outlet.

As shown in fig. 4, the flow passage housing 10 includes a housing and a partition 14 provided in the housing, the partition 14 being provided with a communication port, the partition 14 dividing a space in the housing into two parts in a flow direction of gas, one side surface of the partition 14 and an inner wall of the housing enclosing a cooling flow passage 101, the other side surface and an inner wall of the housing enclosing a return flow passage 102, the cooling flow passage 101 and the return flow passage 102 being communicated through the communication port in the partition 14.

Specifically, the housing includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 are connected in the thickness direction of the flow path housing 10 and enclose a flow path. A partition 14 is provided between the first housing 11 and the second housing 12 to partition a part of the space within the casing into a double-layered structure.

To avoid the condensed water condensed in the cooling flow path 101 from contacting the fan 20, the fan 20 is higher than the end of the heat exchanger 41 downstream in the airflow direction, so that the airflow cooled by the heat exchanger 41 needs to flow upward before passing through the fan 20. Specifically, the blower 20 is higher than the bottom end of the cooling flow passage 101. That is, in the process that the air flow flows from the cooling flow channel 101 to the fan 20, a region where the air flow flows from bottom to top exists, so that condensed water in the cooling flow channel 101 can be gathered at the bottom end of the cooling flow channel 101 under the action of gravity without contacting with the fan 20. As shown in fig. 3, after the cooling flow channel 101 extends from top to bottom, the end is bent and extends upward, and the return flow channel 102 communicates with the end of the cooling flow channel 101 to prevent condensed water from entering the return flow channel 102.

To enhance the cooling effect of the moisture in the liner in the cooling flow passage 101, the cooling flow passage 101 is curved to extend to lengthen the flow path of the moisture in the cooling flow passage 101. In other embodiments, only a portion of the cooling flow path 101 may extend in a curved manner to extend the flow path of the airflow.

As shown in fig. 2, the flow channel shell 10 further includes a mounting cover 13, a fan mounting hole is provided on the housing, the mounting cover 13 is connected with the housing and shields the mounting hole, and the fan 20 is provided on the mounting cover 13 and extends into the flow channel through the fan mounting hole. Through setting up installation lid 13 and fan mounting hole, installation lid 13 can be dismantled and assembled by the outside of shell to realize the dismouting of fan 20, make things convenient for the maintenance of fan 20, convenient operation.

Wherein, as shown in fig. 3, the blower 20 includes a motor 21 and an impeller 22. The motor 21 is disposed on a side surface of the mounting cover 13 facing the inside of the flow passage, and the motor 21 is in driving connection with the impeller 22 to drive the impeller 22 to rotate. The fan 20 is completely positioned in the runner shell 10, and the motor 21 and the impeller 22 can be protected through the runner shell 10, so that the fan 20 is prevented from being knocked and damaged.

In order to improve the drying efficiency of the liner, the heating assembly 30 is disposed in the backflow channel 102, and the backflow port 112 is located downstream of the heating assembly 30 along the airflow flowing direction, so that the airflow entering the backflow channel 102 is heated by the heating assembly 30 and then returns to the liner through the backflow port 112. The air flow entering the inner container from the backflow port 112 is dry high-temperature air flow, so that the moisture in the inner container can be dried, and the drying efficiency is improved.

Alternatively, the heating assembly 30 may be a PTC heater or a heating wire. The PTC heating element is composed of a PTC ceramic heating element and an aluminum tube, and has the advantages of small thermal resistance and high heat exchange efficiency. The heating wire is generally made of iron-chromium-aluminum or nickel-chromium electrothermal alloy, and has the advantages of high heating temperature, long service life and low cost.

In order to ensure that the air flow entering the reflow channel 102 is heated by the heating component 30 and then enters the liner through the reflow opening 112, the reflow channel 102 is divided into a reflow front section and a reflow rear section by the heating component 30, and the heating component 30 is positioned at the joint of the reflow front section and the reflow rear section and is communicated with the reflow front section and the reflow rear section. The air flow in the reflow heating front section can only enter the reflow heating rear section after passing through the heating component 30, so as to ensure the heating effect of the heating component 30 on the reflow air flow.

In this embodiment, the heating assembly 30 is a cuboid, one set of surfaces of the heating assembly 30 opposite to each other are an air inlet surface and an air outlet surface, and the other four side surfaces of the heating assembly 30 are all abutted against the inner wall of the backflow channel 102, so as to ensure that the air flow entering the backflow channel 102 passes through the heating assembly 30.

Alternatively, the heating assembly 30 may include a heating body for generating heat and a plurality of fins provided at intervals on the heating body to heat the air flow by conduction of the heat generated by the heating body; the gaps between two adjacent fins are for the passage of air flow.

In this embodiment, the heating component 30 is disposed in the runner casing 10, and the heating component 30 is assembled and disassembled by assembling and disassembling the casing. The shell wraps the heating component 30, so that the heating component 30 can be prevented from being contacted with other structures, and the heating component 30 is protected.

In order to prevent the washing water in the liner from entering the runner through the fluid inlet 111 or the backflow port 112 during the washing process, water return grooves are formed in the runner shell 10 corresponding to the fluid inlet 111 and the backflow port 112, one water return groove is at least arranged around the bottom of the fluid inlet 111, and the other water return groove is at least arranged around the bottom of the backflow port 112. The water return tank can block the washing water, so that the washing water is accumulated in the water return tank, and the washing water can flow back into the inner container through the fluid inlet 111 or the return port 112.

In order to prevent impurities in the liner from entering the runner casing 10, the fluid inlet 111 and the backflow port 112 are provided with grid members, and the grid members are used for filtering the impurities so as to prevent the inside of the runner casing 10 from being blocked or polluted, and ensure the use sanitation.

Optionally, the grid piece can be as cover body type structure, and cover body type structure passes through screw pair with the shell and is connected to make things convenient for dismouting and change.

In this embodiment, the dehumidification and drying process of the liner may occur after the rinsing process is completed, and cold water is injected through the inlet channel and fills the heat exchanger 41 through the cooling end of the semiconductor cooling element 42. Since the refrigerating power of the semiconductor refrigerating element 42 is far lower than the heat dissipation power, in order to fully improve the function of the semiconductor refrigerating element 42, the semiconductor refrigerating element 42 can be started in advance before the inner container is dehumidified and dried, the water in the heat exchanger 41 is refrigerated in advance, and the heat exchange effect of the heat exchanger 41 and the fluid in the flow channel is improved. In the drying stage, the fan 20 is turned on, and a large amount of moisture enters the flow channel from the liner to be cooled, so that a large amount of convection heat exchange occurs, and a large amount of cold energy is reserved in advance by the heat exchanger 41, so that a stronger cooling and dehumidifying effect is achieved.

Along with condensation and circulation of moisture in the liner, the heat exchange medium absorbing heat further absorbs the heat of the heating end of the semiconductor refrigeration piece 42 through the exhaust flow passage to dissipate heat of the semiconductor refrigeration piece 42; the heat exchange medium after absorbing the heat enters the waste heat pipeline 44 to heat the gas at the downstream of the heat exchanger 41 so as to improve the drying efficiency of the liner; the heat exchange medium enters the heat storage box 43 through the waste heat pipeline 44, and the heat storage box 43 can be used as an insulating layer to maintain the temperature in the liner and improve the liner drying efficiency.

Example two

The embodiment provides a dish washer, including the casing, set up in the inner bag of casing, set up the supporter in the inner bag, set up in the spraying subassembly and the moisture drying device in embodiment one in the casing. The spraying component is used for spraying washing water to tableware and the like on the rack arranged in the liner so as to clean the tableware. The fluid inlet 111 and the return 112 in the moisture drying device are both in communication with the liner to dry the liner.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. A moisture drying apparatus, comprising:

The drying device comprises a runner shell (10), wherein a runner is formed in the runner shell (10), a fluid inlet (111) and a backflow port (112) which are communicated with the runner are formed in the runner shell (10), and the fluid inlet (111) and the backflow port (112) are both used for being communicated with a cavity to be dried;

A heat exchange assembly (40), wherein the heat exchange assembly (40) comprises a semiconductor refrigeration piece (42) and a heat exchanger (41), at least part of the heat exchanger (41) is arranged in the flow channel, and the heat exchanger (41) is used for cooling the air flow in the flow channel; the semiconductor refrigerating piece (42) is arranged outside the runner shell (10), and the refrigerating end of the semiconductor refrigerating piece (42) is in heat exchange fit with the heat exchanger (41).

2. The wet gas drying apparatus according to claim 1, wherein an inlet flow channel and an outlet flow channel are provided in the semiconductor refrigeration element (42), the inlet flow channel being used for introducing a heat exchange medium, the inlet flow channel being located at the refrigeration end of the semiconductor refrigeration element (42) and communicating with the inlet of the heat exchanger (41);

The discharge flow passage is used for discharging heat exchange medium, is positioned at the heating end of the semiconductor refrigerating piece (42) and is communicated with the outlet of the heat exchanger (41).

3. The wet gas drying apparatus according to claim 2, wherein the heat exchange assembly (40) further comprises a waste heat conduit (44), the waste heat conduit (44) being in communication with the exhaust flow passage, at least part of the waste heat conduit (44) being located within the flow passage downstream of the heat exchanger (41) in the direction of airflow.

4. A moisture drying apparatus according to claim 3, wherein the heat exchange assembly (40) further comprises a heat storage tank (43), the heat storage tank (43) being arranged outside the runner casing (10), the heat storage tank (43) being in communication with the waste heat conduit (44).

5. The moisture drying device according to claim 4, characterized in that the heat storage tank (43) is adapted to be in contact heat exchange with the cavity to be dried.

6. The wet gas drying apparatus according to claim 4, wherein a liquid drain port is provided on the heat storage tank (43).

7. The moisture drying apparatus of any one of claims 1-6, wherein the flow channel extends in a curved manner.

8. The wet gas drying apparatus according to any one of claims 1-6, further comprising a fan (20), the fan (20) being arranged within the flow channel downstream of the heat exchanger (41) in the direction of flow of the gas stream.

9. A wet gas drying apparatus according to any one of claims 1-6, characterized in that a heating assembly (30) is arranged in the flow channel, the heating assembly (30) being arranged in the flow channel downstream of the heat exchanger (41) in the direction of flow of the gas flow.

10. A dishwasher comprising a liner, characterized in that it further comprises a moisture drying device according to any one of claims 1-9, both the fluid inlet (111) and the return (112) being in communication with the liner.