CN221202863U - Module structure of integrated DCDC constant current board - Google Patents
Module structure of integrated DCDC constant current board Download PDFInfo
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- CN221202863U CN221202863U CN202322612915.5U CN202322612915U CN221202863U CN 221202863 U CN221202863 U CN 221202863U CN 202322612915 U CN202322612915 U CN 202322612915U CN 221202863 U CN221202863 U CN 221202863U
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- constant current
- dcdc constant
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- plate
- module structure
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- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 title claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 239000004593 Epoxy Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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Abstract
The utility model discloses a module structure of an integrated DCDC constant current board, which comprises a control board, a DCDC constant current board, an epoxy board, a heat dissipation substrate, a bottom board and an upper cover, wherein the control board is closely mounted on the heat dissipation substrate; the DCDC constant current plate is arranged on the control plate; the DCDC constant current plate is positioned between the control board and the radiating substrate; the epoxy plate is positioned between the DCDC constant current plate and the radiating substrate; the bottom plate is arranged on the lower surface of the heat dissipation substrate; the upper cover covers the upper part of the control panel and is matched with the bottom plate. Therefore, the DCDC constant current board is fixed on the control board and is positioned between the control board and the radiating substrate, and the DCDC constant current board and the radiating substrate are separated from each other by adopting the epoxy board, so that the DCDC constant current board and the control board are integrated and share the radiating substrate for radiating, a radiating device which is independently used for the DCDC constant current board is omitted, materials are saved, and the production cost is reduced; meanwhile, the connecting process and the operation process are simplified, and the whole module structure is simpler.
Description
Technical Field
The utility model relates to the technical field of charging piles, in particular to a module structure of an integrated DCDC constant current board.
Background
Along with the encouragement of the country to the new energy field, more and more electric vehicles enter thousands of households in society, but the charging of electric vehicles is an important factor restricting the development of electric new energy, and the problem of electric vehicle charging and cruising is solved through arranging charging piles in the present stage, but the traditional charging pile system adopts a power distribution device to convert the voltage of a high-voltage wire into 220V commercial voltage, and then converts the commercial voltage into required charging voltage through a voltage conversion circuit.
In order to output stable current, the existing charging pile is required to be provided with a DCDC constant current plate outside a charging module, the DCDC constant current plate is required to be provided with a water cooling plate or the area of the water cooling plate and the range of a cooling water channel are increased to dissipate heat, the size and the cost of the whole charging equipment are increased, the space utilization rate is low, a wire harness is required to be connected between the module and the DCDC constant current plate, the assembly is complicated, and the assembly is complicated.
Therefore, improvements should be made to the existing charging modules to solve the above-mentioned problems.
Disclosure of utility model
In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its main objective is to provide a module structure of an integrated DCDC constant current board, which is formed by fixing the DCDC constant current board on a control board and between the control board and a heat dissipation substrate, and separating the DCDC constant current board and the heat dissipation substrate from each other by using an epoxy board, so that the DCDC constant current board and the control board are integrated and share the heat dissipation substrate for heat dissipation, thereby eliminating a heat dissipation device for the DCDC constant current board alone, saving materials, and reducing production cost.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The module structure of the integrated DCDC constant current board comprises a control board, a DCDC constant current board, an epoxy board, a heat dissipation substrate, a bottom board and an upper cover, wherein the control board is tightly attached to the heat dissipation substrate; the DCDC constant current plate is arranged on the control plate; the DCDC constant current plate is positioned between the control board and the radiating substrate; the epoxy plate is positioned between the DCDC constant current plate and the radiating substrate; the bottom plate is arranged on the lower surface of the heat dissipation substrate; the upper cover covers the upper part of the control panel and is matched with the bottom plate.
As a preferred embodiment: and the heat dissipation substrate is provided with an embedded groove with a hollowed-out area corresponding to the DCDC constant current plate area, and the bottom plate is embedded in the embedded groove.
As a preferred embodiment: the epoxy plate is provided with a through hole corresponding to the hollowed-out area on the embedded groove, and components on the DCDC constant current plate penetrate through the through hole and are connected to the bottom plate.
As a preferred embodiment: connecting columns are vertically arranged at four corners of the upper surface of the DCDC constant current board respectively, and the connecting columns are arranged on the control board.
As a preferred embodiment: and a plurality of pins are vertically arranged on the components on the lower surface of the DCDC constant current plate, and penetrate through the through holes and are inserted on the bottom plate.
As a preferred embodiment: the upper cover is provided with a side wall, and the side wall is connected to the side edge of the radiating substrate through a screw.
As a preferred embodiment: the upper edge of the radiating substrate is provided with a plurality of sinking grooves for fixing the bottom plate at intervals, and a plurality of abdicating spaces which are convenient for locking screws in the sinking grooves are arranged on the upper cover corresponding to the plurality of sinking grooves.
As a preferred embodiment: and a yielding notch is arranged on three side edges and one corner of the control panel corresponding to the sinking groove.
As a preferred embodiment: screw holes are formed in the inner sides of the embedded grooves, and the bottom plate is locked in the embedded grooves by screws after being embedded in the embedded grooves.
As a preferred embodiment: the lower surface of the bottom plate is flush with the lower surface of the heat dissipation substrate.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, in particular, the technical proposal shows that the DCDC constant current board is fixed on the control board and positioned between the control board and the radiating substrate, and the DCDC constant current board and the radiating substrate are separated from each other by the epoxy board, so that the DCDC constant current board and the control board are integrated and share the radiating substrate for radiating, thereby avoiding a radiating device for the DCDC constant current board independently, saving materials and reducing production cost; meanwhile, the connecting process and the operation process are simplified, and the whole module structure is simpler.
In order to more clearly illustrate the structural features and efficacy of the present utility model, a detailed description thereof will be given below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic perspective view of a module structure according to the present utility model;
FIG. 2 is an exploded perspective view of the modular structure of the present utility model;
FIG. 3 is a further exploded perspective view of the modular structure of the present utility model;
FIG. 4 is another perspective view of FIG. 3;
fig. 5 is a schematic perspective view of the DCDC constant current board and heat dissipating substrate of the present utility model.
The attached drawings are used for identifying and describing:
10. A control board; 11. a relief notch; 20. DCDC constant current board; 21. pins; 22. a connecting column; 30. an epoxy board; 31. a through hole; 40. a heat-dissipating substrate; 41. a recessed groove; 42. hollow areas; 43. a screw hole; 44. sinking grooves; 50. a bottom plate; 60. an upper cover; 61. a sidewall; 62. and (5) giving way space.
Detailed Description
The utility model is as shown in fig. 1 to 5, a module structure of an integrated DCDC constant current board, comprising a control board 10, a DCDC constant current board 20, an epoxy board 30, a heat dissipation substrate 40, a bottom board 50 and an upper cover 60, wherein:
The control board 10 is closely mounted on the heat dissipation substrate 40, and heat generated by the control board 10 is transferred to the heat dissipation substrate 40 for rapid dissipation; the DCDC constant current plate 20 is arranged on the control plate 10, and the DCDC constant current plate 20 is positioned between the control plate 10 and the heat dissipation substrate 40; the DCDC constant current board 20 is integrated on the control board 10, when the control board 10 is tightly attached to the heat dissipation substrate 40 for heat dissipation, heat on the DCDC constant current board 20 is dissipated through the heat dissipation substrate 40, and a heat dissipation device is not required to be arranged for the DCDC constant current board 20 independently, so that the material cost is saved, the whole volume of a product is reduced, the occupied space is reduced, and the product is more convenient to install and store. The epoxy board 30 is located between the DCDC constant current board 20 and the heat dissipation substrate 40, and the epoxy board 30 is arranged to separate the DCDC constant current board 20 and the heat dissipation substrate 40 from each other, so that electrical conduction between the DCDC constant current board 20 and the heat dissipation substrate 40 is avoided; some heat generated by the DCDC constant current board 20 is indirectly transferred to the heat dissipation substrate 40 through the epoxy board 30 to be dissipated.
The bottom plate 50 is mounted on the lower surface of the heat dissipation substrate 40; specifically, an embedded groove 41 having a hollowed-out area 42 is provided on the heat dissipation substrate 40 corresponding to the DCDC constant current board 20 area, and the bottom plate 50 is embedded in the embedded groove 41; screw holes 43 are formed in the inner side of the embedded groove 41, and the bottom plate 50 is embedded in the embedded groove 41 and is fixed in the embedded groove 41 by matching screws with the screw holes 43; and the lower surface of the bottom plate 50 is flush with the lower surface of the heat dissipation substrate 40, so that the bottom of the module structure is smoother, and the bottom of the product is easier to be attached and assembled with other matched components during the whole installation, so that the assembly is more neat.
The epoxy board 30 is provided with a through hole 31 corresponding to the hollowed-out area 42 on the embedded groove 41 of the heat dissipation substrate 40, and the components on the DCDC constant current board 20 pass through the through hole 31 and are connected to the bottom board 50; specifically, a plurality of pins 21 are vertically disposed on a component on the lower surface of the DCDC constant current board 20, and the pins 21 are inserted on the bottom plate 50 through the through holes 31 (the component is an MOS tube, and the MOS tube is embedded in the heat dissipation substrate 40 and is fixed on the bottom plate 50 through the pins 21). In addition, connecting columns 22 are vertically arranged at four corners of the upper surface of the DCDC constant current board 20, and the connecting columns 22 are mounted on the control board 10 to fix the DCDC constant current board 20 on the control board 10; the connection post 22 and the control board 10 form a height space enough to accommodate the main body portion of the DCDC constant current board 20.
The upper cover 60 covers the upper part of the control board 10 and is matched with the bottom board 50; the upper cover 60 has a side wall 61, and the side wall 61 is connected to the side edge of the heat dissipation substrate 40 by a screw; the upper edge of the heat dissipating substrate 40 is provided with a plurality of countersunk grooves 44 for fixing the bottom plate 50 at intervals, and a plurality of abdicating spaces 62 for locking screws in the countersunk grooves 44 are arranged on the upper cover 60 corresponding to the countersunk grooves 44; the three sides and one corner of the control board 10 are provided with relief notches 11 corresponding to the sink grooves 44. During assembly, the relief space 62 and the relief notch 11 can be used to pass through a screwdriver to place a screw in the countersink 44, so that the heat dissipation substrate 40 is fixed.
According to the utility model, under the condition that the functions of the existing module are unchanged and the size of the existing module is not changed, the DCDC constant current board 20 is integrated into the module by adjusting the layout of components in the module, and the module is divided into the control board 10 and the DCDC constant current board 20, and the two layers of the DCDC constant current board 20 are arranged on the heat dissipation substrate 40, so that the module has multiple functions, compared with the traditional module, the DCDC constant current board 20 is externally arranged, the volume of equipment is reduced, the space utilization rate is improved, the product is simpler, the disassembly and assembly are also faster and more convenient, the production efficiency is higher, the yield is higher, the parts are fewer, and the cost is lower.
The utility model has the design key points that the DCDC constant current board is fixed on the control board and positioned between the control board and the radiating substrate, and the DCDC constant current board and the radiating substrate are separated from each other by adopting the epoxy board, so that the DCDC constant current board and the control board are integrated and share the radiating substrate for radiating, a radiating device which is independently aimed at the DCDC constant current board is omitted, materials are saved, and the production cost is reduced; meanwhile, the connecting process and the operation process are simplified, and the whole module structure is simpler.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the technical scope of the present utility model, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present utility model still fall within the scope of the technical solutions of the present utility model.
Claims (10)
1. The utility model provides an integrated DCDC constant current board's module structure which characterized in that: the heat dissipation device comprises a control board, a DCDC constant current board, an epoxy board, a heat dissipation substrate, a bottom board and an upper cover, wherein the control board is tightly attached to the heat dissipation substrate; the DCDC constant current plate is arranged on the control plate; the DCDC constant current plate is positioned between the control board and the radiating substrate; the epoxy plate is positioned between the DCDC constant current plate and the radiating substrate; the bottom plate is arranged on the lower surface of the heat dissipation substrate; the upper cover covers the upper part of the control panel and is matched with the bottom plate.
2. The module structure of the integrated DCDC constant current board according to claim 1, wherein: and the heat dissipation substrate is provided with an embedded groove with a hollowed-out area corresponding to the DCDC constant current plate area, and the bottom plate is embedded in the embedded groove.
3. The module structure of the integrated DCDC constant current board according to claim 2, wherein: the epoxy plate is provided with a through hole corresponding to the hollowed-out area on the embedded groove, and components on the DCDC constant current plate penetrate through the through hole and are connected to the bottom plate.
4. A module structure of an integrated DCDC constant current board according to claim 3, characterized in that: connecting columns are vertically arranged at four corners of the upper surface of the DCDC constant current board respectively, and the connecting columns are arranged on the control board.
5. The module structure of the integrated DCDC constant current board according to claim 4, wherein: and a plurality of pins are vertically arranged on the components on the lower surface of the DCDC constant current plate, and penetrate through the through holes and are inserted on the bottom plate.
6. The module structure of the integrated DCDC constant current board according to claim 1, wherein: the upper cover is provided with a side wall, and the side wall is connected to the side edge of the radiating substrate through a screw.
7. The module structure of the integrated DCDC constant current board according to claim 6, wherein: the upper edge of the radiating substrate is provided with a plurality of sinking grooves for fixing the bottom plate at intervals, and a plurality of abdicating spaces which are convenient for locking screws in the sinking grooves are arranged on the upper cover corresponding to the plurality of sinking grooves.
8. The module structure of the integrated DCDC constant current board according to claim 7, wherein: and a yielding notch is arranged on three side edges and one corner of the control panel corresponding to the sinking groove.
9. The module structure of the integrated DCDC constant current board according to claim 2, wherein: screw holes are formed in the inner sides of the embedded grooves, and the bottom plate is locked in the embedded grooves by screws after being embedded in the embedded grooves.
10. The module structure of the integrated DCDC constant current board according to claim 2, wherein: the lower surface of the bottom plate is flush with the lower surface of the heat dissipation substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322612915.5U CN221202863U (en) | 2023-09-26 | 2023-09-26 | Module structure of integrated DCDC constant current board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322612915.5U CN221202863U (en) | 2023-09-26 | 2023-09-26 | Module structure of integrated DCDC constant current board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221202863U true CN221202863U (en) | 2024-06-21 |
Family
ID=91521957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322612915.5U Active CN221202863U (en) | 2023-09-26 | 2023-09-26 | Module structure of integrated DCDC constant current board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221202863U (en) |
-
2023
- 2023-09-26 CN CN202322612915.5U patent/CN221202863U/en active Active
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