CN221185338U - Semiconductor processing welding set - Google Patents
Semiconductor processing welding set Download PDFInfo
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- CN221185338U CN221185338U CN202323136190.3U CN202323136190U CN221185338U CN 221185338 U CN221185338 U CN 221185338U CN 202323136190 U CN202323136190 U CN 202323136190U CN 221185338 U CN221185338 U CN 221185338U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 238000003466 welding Methods 0.000 title claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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Abstract
The utility model belongs to the technical field of semiconductor processing and welding devices, in particular to a semiconductor processing and welding device, which comprises a processing base; the processing cavity is provided with a stabilizing device; a screw rod is rotatably arranged in the movable groove; a positioning plate is fixedly connected to the top end surface of the connecting sheet; a small motor is arranged on the side surface of the processing base; a first telescopic cylinder is arranged in the mounting groove; a first telescopic rod is arranged at the end part of the first telescopic cylinder; the end part of the first telescopic cylinder is fixedly connected with a push plate; an auxiliary device is arranged on the processing cavity; a second telescopic cylinder is arranged on the top end surface of the structural cavity; a second telescopic rod is arranged at the bottom of the second telescopic cylinder; a rubber pad is arranged at the bottom of the pressing plate; through the combined action of the stabilizing device and the auxiliary device, the phenomenon that the semiconductor is displaced or even falls in the processing process is avoided, and the smooth operation of semiconductor welding is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing and welding devices, in particular to a semiconductor processing and welding device.
Background
In the process of semiconductor processing, the designated position needs to be welded, so that the semiconductor processing requirement is met, and the production quality of the semiconductor is ensured;
One chinese patent with publication No. CN109693028a discloses an automatic welding device and welding method for semiconductor lasers, comprising: the device comprises a machine base, N fixed bases, a movable base, a positioning base, a lower electrode, an upper electrode and a lower electrode contact. Along with the continuous rotation of the disc, each positioning base on the disc is continuously rotated below the upper electrode, so that uninterrupted welding is realized, multi-station uninterrupted production is realized, and the production efficiency of the semiconductor laser is greatly improved. The tube seat and the tube cap are coaxially clamped and fixed through the clamping and positioning mechanism before welding, so that the precision of the semiconductor laser during welding is ensured, the loss rate is reduced, the pollution of the tube is reduced, and the consumption of raw materials is saved;
When the automatic welding device and the welding method for the semiconductor laser are used, the phenomenon that the semiconductor is displaced in the welding process can occur, so that the welding position is deviated in the welding process, and even the phenomenon that the semiconductor falls off can be caused; therefore, a semiconductor processing and welding device is proposed to solve the above-mentioned problems.
Disclosure of utility model
In order to overcome the defects in the prior art and solve the existing problems of the semiconductor processing and welding device, the utility model provides the semiconductor processing and welding device.
The technical scheme adopted for solving the technical problems is as follows: the utility model relates to a semiconductor processing welding device, which comprises a processing base; the three sides of the top end surface of the processing base are fixedly connected with a supporting plate frame; the support plate frame is enclosed with a processing cavity at the top of the processing base; the processing cavity is provided with a stabilizing device; the stabilizing device comprises a moving groove; a movable groove is formed in the center of the end face of the bottom of the inner wall of the processing cavity; a screw rod is rotatably arranged in the movable groove; a connecting sheet is sleeved outside the section of the wire rod; a positioning plate is fixedly connected to the top end surface of the connecting sheet; a small motor is arranged on the side surface of the processing base; the end part of the output shaft of the small motor penetrates through the seat body of the processing base and is connected with one end of the screw rod; the fixing effect of the semiconductor is effectively achieved.
Preferably, a mounting groove is formed in one side plate body of the support plate frame; one end of the mounting groove is communicated with the processing cavity; a first telescopic cylinder is arranged in the mounting groove; a first telescopic rod is arranged at the end part of the first telescopic cylinder; the end part of the first telescopic cylinder is fixedly connected with a push plate; the fixing effect of the semiconductor in different directions is realized.
Preferably, the bottom end surface of the positioning plate is not contacted with the bottom end surface of the inner wall of the processing cavity; the bottom end face of the push plate is not contacted with the bottom end face of the inner wall of the processing cavity; when the first telescopic cylinder is stretched to the longest distance, the push plate is intersected with the movement track of the positioning plate; so that the stabilizing device can function smoothly.
Preferably, structural grooves are symmetrically formed in two sides of the bottom of the inner wall of the processing cavity; one end of the structural groove is communicated with the outside; the semiconductor is convenient to take.
Preferably, an auxiliary device is arranged on the processing cavity; the auxiliary device includes a structural lumen; a structural cavity is formed in the side surface of the inner wall of the processing cavity; a second telescopic cylinder is arranged on the top end surface of the structural cavity; a second telescopic rod is arranged at the bottom of the second telescopic cylinder; the bottom of the second telescopic rod is fixedly connected with a pressing plate; a rubber pad is arranged at the bottom of the pressing plate; the fixing effect on the vertical direction of the semiconductor is achieved.
Preferably, the length of the pressing plate is longer than the opening length of the structural cavity; the motion track of the pressing plate is intersected with the opening space of the processing cavity; the bottom end face of the inner wall of the structural cavity and the bottom end face of the inner wall of the processing cavity are positioned on the same horizontal plane; so that the auxiliary device can function smoothly.
The utility model has the advantages that:
1. According to the utility model, through the structural design of the stabilizing device, the small motor is turned on, the screw rod rotates, the connecting sheet drives the positioning plate to move along the moving groove towards the semiconductor direction, the positioning plate is clamped at the side of the semiconductor, then, the first telescopic cylinder in the mounting groove is turned on, the first telescopic rod pushes the push plate to move towards the semiconductor direction, the push plate is clamped at the other side of the semiconductor, the fixed clamping effect of different positions of the semiconductor is realized, the phenomenon that the semiconductor is displaced or even falls in the processing process is avoided, and the smooth progress of semiconductor welding operation is ensured.
2. According to the utility model, through the structural design of the auxiliary device, the second telescopic cylinder in the structural cavity is opened, the second telescopic rod drives the pressing plate and the rubber pad to move downwards, so that the auxiliary fixing effect of the semiconductor in the vertical direction is realized, the fixing state of the semiconductor is more stable, and the operation effect of the stabilizing device is fully exerted.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic view of an isometric structure;
FIG. 2 is an enlarged schematic view of the structure shown at A in FIG. 1;
FIG. 3 is a schematic view of a structure of a processing base;
Fig. 4 is an enlarged schematic view of the structure at B in fig. 1.
In the figure: 1. processing a base; 2. a support plate frame; 3. a processing chamber; 401. a moving groove; 402. a screw rod; 403. a connecting sheet; 404. a positioning plate; 405. a small motor; 406. a mounting groove; 407. a first telescopic cylinder; 408. a first telescopic rod; 409. a push plate; 410. a structural groove; 501. a structural cavity; 502. a second telescopic cylinder; 503. a second telescopic rod; 504. a pressing plate; 505. and a rubber pad.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, a semiconductor processing and welding device includes a processing base 1; the positions of three sides of the top end surface of the processing base 1 are fixedly connected with a supporting plate frame 2; the supporting plate frame 2 is enclosed with a processing cavity 3 at the top of the processing base 1; a stabilizing device is arranged on the processing cavity 3; the stabilizing device includes a moving slot 401; a movable groove 401 is formed in the center of the end face of the bottom of the inner wall of the processing cavity 3; a screw 402 is rotatably installed inside the moving groove 401; a connecting sheet 403 is sleeved outside the section of the screw rod 402; a positioning plate 404 is fixedly connected to the top end surface of the connecting sheet 403; a small motor 405 is arranged on the side surface of the processing base 1; the end part of the output shaft of the small motor 405 passes through the seat body of the processing seat 1 and is connected with one end of the screw rod 402; a mounting groove 406 is formed on one side plate body of the support plate frame 2; one end of the mounting groove 406 is communicated with the processing cavity 3; a first telescopic cylinder 407 is arranged in the mounting groove 406; a first telescopic rod 408 is arranged at the end part of the first telescopic cylinder 407; the end part of the first telescopic cylinder 407 is fixedly connected with a push plate 409; the bottom end surface of the positioning plate 404 is not contacted with the bottom end surface of the inner wall of the processing cavity 3; the bottom end surface of the push plate 409 is not contacted with the bottom end surface of the inner wall of the processing cavity 3; when the first telescopic cylinder 407 stretches to the longest distance, the push plate 409 intersects with the movement track of the positioning plate 404; the two sides of the bottom of the inner wall of the processing cavity 3 are symmetrically provided with structural grooves 410; one end of the structure groove 410 is communicated with the outside;
During working, in the process of semiconductor processing, the designated position needs to be welded, so that the semiconductor processing requirement is met, and the production quality of the semiconductor is ensured; when the conventional automatic welding device for the semiconductor laser is used, the phenomenon that a semiconductor is displaced in the welding process, so that the welding position is shifted in the welding process, and even the semiconductor is dropped is caused.
Referring to fig. 4, an auxiliary device is installed on the processing chamber 3; the auxiliary device comprises a structural cavity 501; a structural cavity 501 is formed on the side surface of the inner wall of the processing cavity 3; a second telescopic cylinder 502 is arranged on the top end surface of the structural cavity 501; a second telescopic rod 503 is arranged at the bottom of the second telescopic cylinder 502; the bottom of the second telescopic rod 503 is fixedly connected with a pressing plate 504; a rubber pad 505 is arranged at the bottom of the pressing plate 504; the length of the pressing plate 504 is longer than the opening length of the structural cavity 501; the motion track of the pressing plate 504 is intersected with the opening space of the processing cavity 3; the bottom end face of the inner wall of the structural cavity 501 and the bottom end face of the inner wall of the processing cavity 3 are positioned on the same horizontal plane;
During operation, in order to ensure that the stabilizing device can play a role in components, the auxiliary device can be used for operation, after the semiconductor is fixed by the stabilizing device, the second telescopic cylinder 502 in the structural cavity 501 is opened, the second telescopic rod 503 drives the pressing plate 504 and the rubber pad 505 to move downwards, the auxiliary fixing effect on the vertical direction of the semiconductor is achieved, the fixing state of the semiconductor is more stable, and the operation effect of the stabilizing device is fully exerted.
Working principle: in the process of semiconductor processing, the designated position needs to be welded, so that the semiconductor processing requirement is met, and the production quality of the semiconductor is ensured; when the existing automatic welding device for the semiconductor laser is used, the phenomenon that the semiconductor is displaced in the welding process, so that the welding position is shifted in the welding process, and even the semiconductor is dropped is caused;
In order to ensure that the stabilizing device can play a role in components, the auxiliary device can be used for operation, after the semiconductor is fixed by the stabilizing device, the second telescopic cylinder 502 in the structural cavity 501 is opened, the second telescopic rod 503 drives the pressing plate 504 and the rubber pad 505 to move downwards, the auxiliary fixing effect of the semiconductor in the vertical direction is achieved, the fixing state of the semiconductor is more stable, and the operation effect of the stabilizing device is fully exerted.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. A semiconductor processing and welding device comprises a processing base (1); the three sides of the top end surface of the processing base (1) are fixedly connected with a supporting plate frame (2); the support plate frame (2) is enclosed with a processing cavity (3) at the top of the processing base (1); a stabilizing device is arranged on the processing cavity (3); the method is characterized in that: the stabilizing device comprises a moving slot (401); a movable groove (401) is formed in the center of the end face of the bottom of the inner wall of the processing cavity (3); a screw rod (402) is rotatably arranged in the moving groove (401); a connecting sheet (403) is sleeved outside the section of the screw rod (402); a positioning plate (404) is fixedly connected to the top end surface of the connecting sheet (403); a small motor (405) is arranged on the side surface of the processing base (1); the end part of the output shaft of the small motor (405) penetrates through the seat body of the processing base (1) and is connected with one end of the screw rod (402).
2. The semiconductor processing and bonding apparatus according to claim 1, wherein: a mounting groove (406) is formed in one side plate body of the support plate frame (2); one end of the mounting groove (406) is communicated with the processing cavity (3); a first telescopic cylinder (407) is arranged in the mounting groove (406); a first telescopic rod (408) is arranged at the end part of the first telescopic cylinder (407); the end part of the first telescopic cylinder (407) is fixedly connected with a push plate (409).
3. A semiconductor processing and bonding apparatus according to claim 2, wherein: the bottom end surface of the positioning plate (404) is not contacted with the bottom end surface of the inner wall of the processing cavity (3); the bottom end surface of the push plate (409) is not contacted with the bottom end surface of the inner wall of the processing cavity (3); when the first telescopic cylinder (407) stretches to the longest distance, the push plate (409) is intersected with the movement track of the positioning plate (404).
4. A semiconductor processing bonding apparatus according to claim 3, wherein: the two sides of the bottom of the inner wall of the processing cavity (3) are symmetrically provided with structural grooves (410); one end of the structural groove (410) is communicated with the outside.
5. The semiconductor processing and bonding apparatus according to claim 4, wherein: an auxiliary device is arranged on the processing cavity (3); the auxiliary device comprises a structural cavity (501); a structural cavity (501) is formed on the side surface of the inner wall of the processing cavity (3); a second telescopic cylinder (502) is arranged on the top end surface of the structural cavity (501); a second telescopic rod (503) is arranged at the bottom of the second telescopic cylinder (502); a pressing plate (504) is fixedly connected to the bottom of the second telescopic rod (503); a rubber pad (505) is installed at the bottom of the pressing plate (504).
6. The semiconductor processing and bonding apparatus according to claim 5, wherein: the length of the pressing plate (504) is longer than the opening length of the structural cavity (501); the motion track of the pressing plate (504) is intersected with the opening space of the processing cavity (3); the bottom end face of the inner wall of the structural cavity (501) and the bottom end face of the inner wall of the processing cavity (3) are positioned on the same horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323136190.3U CN221185338U (en) | 2023-11-20 | 2023-11-20 | Semiconductor processing welding set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323136190.3U CN221185338U (en) | 2023-11-20 | 2023-11-20 | Semiconductor processing welding set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221185338U true CN221185338U (en) | 2024-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323136190.3U Active CN221185338U (en) | 2023-11-20 | 2023-11-20 | Semiconductor processing welding set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221185338U (en) |
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2023
- 2023-11-20 CN CN202323136190.3U patent/CN221185338U/en active Active
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