CN221178226U

CN221178226U - Integrated circuit radiator

Info

Publication number: CN221178226U
Application number: CN202322457112.7U
Authority: CN
Inventors: 刘家星; 陈兵
Original assignee: Shenzhen Hengrui Infinite Technology Co ltd
Current assignee: Shenzhen Hengrui Infinite Technology Co ltd
Priority date: 2023-09-07
Filing date: 2023-09-07
Publication date: 2024-06-18
Anticipated expiration: 2033-09-07

Abstract

The utility model discloses an integrated circuit radiator, which comprises an integrated circuit board, wherein a first radiating fin is fixedly arranged at the top of the integrated circuit board, a first radiating plate is arranged at the top of the first radiating fin, a plurality of second radiating plates are fixedly arranged at the two sides of the first radiating plate respectively, a plurality of third radiating plates are fixedly arranged at the top of the second radiating plate, radiating mechanisms are fixedly arranged at the two sides of the integrated circuit board respectively, the radiating mechanisms are detachably mounted with the integrated circuit board, pins are fixedly arranged on the side wall of the integrated circuit board, a plurality of wiring holes are formed in the top of the first radiating fin, the radiating mechanisms comprise U-shaped plates which are detachably mounted on the outer wall of the integrated circuit board, a buffer block is fixedly arranged on the inner wall of the U-shaped plate, a vertical plate is fixedly arranged at the outer side of the buffer block, and a second radiating fin is arranged at the inner side of the vertical plate.

Description

Integrated circuit radiator

Technical Field

The present utility model relates to the field of integrated circuit heat dissipation technology, and in particular, to an integrated circuit heat sink.

Background

The heat generated by the integrated circuit in the electronic equipment during operation can be quite large, and the normal operation of the integrated circuit can be influenced if the heat cannot be timely emitted, so that the heat is emitted by a radiator, the overhigh temperature of the integrated circuit is prevented, and the normal and safe operation of the integrated circuit is ensured.

Most of the existing integrated circuit radiators have low heat dissipation efficiency and inconvenient assembly and disassembly, so the utility model provides the integrated circuit radiator to solve the problems.

Disclosure of utility model

In view of the foregoing drawbacks of the prior art, an object of the present utility model is to provide an integrated circuit heat sink.

In order to achieve the above purpose, the utility model provides an integrated circuit radiator, which comprises an integrated circuit board, wherein a first radiating fin is fixedly arranged at the top of the integrated circuit board, a first radiating plate is arranged at the top of the first radiating fin, a plurality of second radiating plates are respectively and fixedly arranged at two sides of the first radiating plate, a plurality of third radiating plates are respectively and fixedly arranged at the top of the second radiating plate, radiating mechanisms are respectively and fixedly arranged at two sides of the integrated circuit board, and the radiating mechanisms and the integrated circuit board can be detachably arranged.

Further, pins are fixedly arranged on the side wall of the integrated circuit board, and a plurality of wiring holes are formed in the top of the first radiating fin.

Further, the heat dissipation mechanism comprises a U-shaped plate, the U-shaped plate is detachably mounted on the outer wall of the integrated circuit board, a buffer block is fixedly arranged on the inner wall of the U-shaped plate, a vertical plate is fixedly arranged on the outer side of the buffer block, and a second radiating fin is arranged on the inner side of the vertical plate.

Further, the riser is kept away from the fixed mounting panel that is provided with in one side of buffer block, the mounting groove has been seted up to the mounting panel lateral wall, the mounting groove card is equipped with the second fin, the second fin with integrated circuit board contact each other.

Further, the buffer block comprises a rubber elastic layer, and a heat-resistant layer is fixedly arranged on the outer side of the rubber elastic layer.

Further, the standing groove is formed in the top of the first radiating fin, the first radiating plate is arranged in the standing groove in a clamped mode, and the cross section of the first radiating plate is rectangular.

Further, set screws are respectively arranged on two sides of the top of the first heat dissipation plate, and the first heat dissipation plate is fixed by screwing the set screws.

Further, ten second cooling plates are provided, and the set screw is made of stainless steel.

Compared with the prior art, the utility model has the beneficial effects that:

1. Through the structures of the first radiating fin, the second radiating plate, the third radiating plate, the first radiating plate, the buffer block, the second radiating fin and the like, the first radiating fin radiates heat to the top of the integrated circuit board, the installation mode among the first radiating plate, the second radiating plate and the third radiating plate improves the radiating area of the radiating plate, and meanwhile, the second radiating fin is attached to the integrated circuit board under the action of the buffer block, so that the radiating effect of the integrated circuit is improved, and the problem of low radiating efficiency of most of the existing integrated circuit radiators is solved;

2. Through the standing groove, first heating panel and the set screw isotructure that set up, first heating panel card is established in the standing groove, and first heating panel is fixed in the standing groove through screwing set screw, and the heating panel installation is dismantled conveniently, has solved the inconvenient problem of current most integrated circuit radiator installation dismantlement.

Drawings

In order to more clearly illustrate the solution of the present utility model, a brief description will be given below of the drawings required for the description of the embodiments of the present utility model, it being apparent that the drawings in the following description are some embodiments of the present utility model, and that other drawings may be obtained from these drawings without the exercise of inventive effort for a person of ordinary skill in the art.

FIG. 1 is a top view provided by the present utility model;

FIG. 2 is a front view provided by the present utility model;

FIG. 3 is a top view of a heat dissipating mechanism provided by the present utility model;

FIG. 4 is a right side view of the mounting plate provided by the present utility model;

FIG. 5 is a schematic diagram of a buffer block structure according to the present utility model;

FIG. 6 is an enlarged schematic view of section A provided by the present utility model;

Reference numerals illustrate:

1. Pins; 2. a third heat dissipation plate; 3. a second heat dissipation plate; 4. a first heat dissipation plate; 5. a set screw; 6. a first heat sink; 7. a wiring hole; 8. an integrated circuit board; 9. a heat dissipation mechanism; 91. a U-shaped plate; 92. a mounting groove; 93. a buffer block; 931. a heat-resistant layer; 932. a rubber elastic layer; 94. a second heat sink; 95. a riser; 96. a mounting plate; 10. and (5) placing a groove.

Detailed Description

The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

The terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Referring to fig. 1-6, the present utility model provides an integrated circuit radiator, which comprises an integrated circuit board 8, wherein a first heat sink 6 is fixedly arranged at the top of the integrated circuit board 8, a first heat sink 4 is installed at the top of the first heat sink 6, a plurality of second heat sinks 3 are respectively and fixedly arranged at two sides of the first heat sink 4, a plurality of third heat sinks 2 are respectively and fixedly arranged at the top of the second heat sinks 3, a heat dissipation mechanism 9 is respectively and fixedly arranged at two sides of the integrated circuit board 8, the heat dissipation mechanism 9 and the integrated circuit board 8 are detachably mounted, pins 1 are fixedly arranged at the side wall of the integrated circuit board 8, a plurality of wiring holes 7 are formed at the top of the first heat sink 3, the heat dissipation mechanism 9 comprises a U-shaped plate 91, the U-shaped plate 91 is detachably mounted on the outer wall of the integrated circuit board 8, a buffer block 93 is fixedly arranged at the inner wall of the U-shaped plate 91, a riser 95 is fixedly arranged at the outer side of the buffer block 93, a second heat sink 94 is arranged at the inner side of the riser 95, the buffer block 93 comprises a rubber elastic layer 932, a heat-resistant layer 931 is fixedly arranged on the outer side of the rubber elastic layer 932, a mounting plate 96 is fixedly arranged on one side, far away from the buffer block 93, of a vertical plate 95, a mounting groove 92 is formed in the side wall of the mounting plate 96, a second radiating fin 94 is clamped in the mounting groove 92, the radiating fin 94 is in contact with the integrated circuit board 8, through the structures of the arranged first radiating fin 6, the second radiating plate 3, the third radiating fin 2, the first radiating fin 4, the buffer block 93, the second radiating fin 94 and the like, the first radiating fin 6 radiates heat to the top of the integrated circuit board 8, the mounting mode among the first radiating fin 4, the second radiating fin 3 and the third radiating fin 2 improves the radiating area of the radiating plate, meanwhile, the second radiating fin 94 is attached to the integrated circuit board 8 under the action of the buffer block 93, the radiating effect of the integrated circuit is improved, the problem of low heat dissipation efficiency of most of the existing integrated circuit heat sinks is solved;

Referring to fig. 1 and 6, a placement groove 10 is formed in the top of the first cooling fin 6, a first cooling plate 4 is clamped in the placement groove 10, the cross section of the first cooling plate 4 is rectangular, positioning screws 5 are respectively arranged on two sides of the top of the first cooling plate 4, the first cooling plate 4 is fixed by screwing the positioning screws 5, ten second cooling plates 3 are arranged, the positioning screws 5 are made of stainless steel materials, the first cooling plate 4 is clamped in the placement groove 10 through the structures of the placement groove 10, the first cooling plate 4, the positioning screws 5 and the like, the first cooling plate 4 is fixed in the placement groove 10 through screwing the positioning screws 5, and the cooling plate is convenient to install and detach, so that the problem that most of existing integrated circuit radiators are inconvenient to install and detach is solved.

The working principle and the using method of the utility model are as follows:

During the use, first fin 6 is installed at the top of integrated circuit board 8, and first fin 6 dispels the heat to the top of integrated circuit board 8, and the mounting means between first heating panel 4, second heating panel 3 and third heating panel 2 has improved the radiating area of heating panel, and second fin 94 is laminated mutually with integrated circuit board 8 under buffer block 93's effect simultaneously, has improved integrated circuit radiating effect, and first heating panel 4 card is established in standing groove 10, and first heating panel 4 is fixed in standing groove 10 through screwing set screw 5, and the heating panel installation is dismantled conveniently.

The foregoing is merely illustrative of the present utility model and is not to be construed as limiting thereof; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; all equivalent structures or equivalent flow changes made by the specification and the attached drawings of the utility model or directly or indirectly applied to other related technical fields are included in the protection scope of the utility model.

Claims

1. An integrated circuit heat sink, characterized by: including the integrated circuit board, the fixed first fin that is provided with in integrated circuit board top, first heating panel is installed at first fin top, first heating panel both sides are fixed respectively and are provided with a plurality of second heating panel, the fixed a plurality of third heating panel that is provided with in second heating panel top, the fixed cooling mechanism that is provided with respectively in integrated circuit board both sides, cooling mechanism with integrated circuit board demountable installation.

2. The integrated circuit heat sink of claim 1, wherein: the integrated circuit board is characterized in that pins are fixedly arranged on the side wall of the integrated circuit board, and a plurality of wiring holes are formed in the top of the first radiating fin.

3. The integrated circuit heat sink of claim 2, wherein: the heat dissipation mechanism comprises a U-shaped plate, the U-shaped plate is detachably mounted on the outer wall of the integrated circuit board, a buffer block is fixedly arranged on the inner wall of the U-shaped plate, a vertical plate is fixedly arranged on the outer side of the buffer block, and a second radiating fin is arranged on the inner side of the vertical plate.

4. An integrated circuit heat sink as recited in claim 3, wherein: the riser is kept away from the fixed mounting panel that is provided with in one side of buffer block, the mounting groove has been seted up to the mounting panel lateral wall, the mounting groove card is equipped with the second fin, the second fin with integrated circuit board contact each other.

5. The integrated circuit heat sink of claim 4, wherein: the buffer block comprises a rubber elastic layer, and a heat-resistant layer is fixedly arranged on the outer side of the rubber elastic layer.

6. The integrated circuit heat sink of claim 5, wherein: the top of the first radiating fin is provided with a placing groove, the placing groove is internally provided with the first radiating plate in a clamping mode, and the cross section of the first radiating plate is rectangular.

7. The integrated circuit heat sink of claim 6, wherein: the top both sides of first heating panel are provided with set screw respectively, first heating panel is through screwing set screw is fixed.

8. The integrated circuit heat sink of claim 7, wherein: ten second cooling plates are arranged in total, and the positioning screws are made of stainless steel materials.