CN221177947U - Processing module low temperature starts heating system - Google Patents
Processing module low temperature starts heating system Download PDFInfo
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- CN221177947U CN221177947U CN202322924378.8U CN202322924378U CN221177947U CN 221177947 U CN221177947 U CN 221177947U CN 202322924378 U CN202322924378 U CN 202322924378U CN 221177947 U CN221177947 U CN 221177947U
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- copper foil
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 83
- 238000012545 processing Methods 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000011889 copper foil Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 19
- 230000005669 field effect Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 14
- 229910044991 metal oxide Inorganic materials 0.000 claims description 11
- 150000004706 metal oxides Chemical class 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 238000001514 detection method Methods 0.000 abstract description 9
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a low-temperature starting heating system of a processing module, which can be effectively applied to the condition that the working temperature of a chip is far lower than the ambient temperature. The FPGA is adopted to generate PWM signals to control the copper foil heating circuit, so that the system temperature can be regulated rapidly and accurately. The temperature detection circuit is designed, so that the chip can be effectively and quickly heated to the working temperature of the chip, and meanwhile, the heating threshold is set, the temperature range of the chip can be ensured, and the chip is prevented from being damaged; the FPGA is used for designing detection logic, so that interference pulse signals can be filtered out, and the correctness of the signals is ensured; the PCB layout is carried out on the chip to be heated, and the copper foil is arranged around the device to be heated, so that the chip to be heated has pertinence, and the heating can be realized more quickly and effectively.
Description
Technical Field
The utility model relates to the technical field of electronic components, in particular to a processing module low-temperature starting heating system which can realize low-temperature starting and high-temperature heat dissipation by utilizing a copper foil heating processing module.
Background
The chip is used as a core component of modern technology, and has very strict requirements on the adaptability and reliability of temperature. The performance and stability of a chip depends to a large extent on the operating temperature at which it is exposed. The requirements for temperature adaptation and reliability are also different for different chip types due to differences in application fields and technical requirements.
Generally, consumer chips operate at temperatures ranging from 0 ℃ to 70 ℃. Industrial chips typically have a wide operating temperature range, from-40℃to 85℃or higher. Military-grade chips need to accommodate extreme temperature variations, typically from-55 ℃ to 125 ℃ and even wider.
In some special application scenarios, the actual working temperature of the chip is sometimes smaller than the normal working temperature of the chip, so that the chip cannot be started, and therefore, the chip needs to be heated in such a scenario, so that the chip can be started normally.
In the prior art, in order to heat the chip, methods generally adopted include resistor heating, heating film heating and heating by arranging heating resistance wires in a PCB board. However, these approaches have certain drawbacks. For example, implementation by a resistor or the like has a disadvantage of heat source concentration. The heating film is required to be attached to the surface of the device for heating, and the heat dissipation of the chip is difficult at high temperature due to the non-heat conduction characteristic of the heating film; meanwhile, the heating film is required to be installed in a flying lead mode, cannot be directly attached to a circuit board in a surface-mounted mode, and reliability in a severe environment is required to be verified. The method for heating the whole PCB by adding the heating resistor filaments into the wiring in the PCB is high in cost, does not have heating pertinence, and is slow in heating rate.
Disclosure of utility model
In view of the above, the present utility model provides a process module low temperature start-up heating system for overcoming or at least partially solving the above problems.
The utility model provides the following scheme:
a process module low temperature start-up heating system comprising:
the FPGA device is used for generating a pulse width modulation signal;
A metal-oxide semiconductor field effect transistor connected to the FPGA device and to a power supply;
The heating resistor is connected with the metal-oxide semiconductor field effect transistor;
The heating copper foil is arranged on the surface of the PCB and around the processing module, and is connected with the heating resistor;
The metal-oxide semiconductor field effect transistor is used for controlling the heating state of the heating resistor according to the pulse width modulation signal, and the heating copper foil is used for receiving heat generated by the heating resistor so as to heat the processing module.
Preferably: the temperature sensor is connected with the FPGA device; and the temperature sensors are used for acquiring the temperature of the processing module and sending the temperature to the FPGA device so that the FPGA device generates the pulse width modulation signal according to the temperature.
Preferably: the temperature sensors are uniformly distributed around the processing module.
Preferably: the height of the heating resistor is 0.55 mm.
Preferably: the height of the heated copper foil is 1.0 mm.
According to the specific embodiment provided by the utility model, the utility model discloses the following technical effects:
The low-temperature starting heating system for the processing module provided by the embodiment of the application can be effectively applied to the condition that the working temperature of a chip is far lower than the ambient temperature. The FPGA is adopted to generate PWM signals to control the copper foil heating circuit, so that the system temperature can be regulated rapidly and accurately. The temperature detection circuit is designed, so that the chip can be effectively and quickly heated to the working temperature of the chip, and meanwhile, the heating threshold is set, the temperature range of the chip can be ensured, and the chip is prevented from being damaged; the FPGA is used for designing detection logic, so that interference pulse signals can be filtered out, and the correctness of the signals is ensured; the PCB layout is carried out on the chip to be heated, and the copper foil is arranged around the device to be heated, so that the chip to be heated has pertinence, and the heating can be realized more quickly and effectively.
Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings by those of ordinary skill in the art without inventive effort.
FIG. 1 is a block diagram illustrating a connection of a low temperature start heating system for a processing module according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a heating circuit according to an embodiment of the present utility model.
In the figure: the semiconductor device comprises an FPGA device 1, a metal-oxide semiconductor field effect transistor 2, a heating resistor 3, a heating copper foil 4 and a temperature sensor 5.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.
Referring to fig. 1, a low-temperature start heating system for a processing module according to an embodiment of the present utility model, as shown in fig. 1, may include:
an FPGA device 1, the FPGA device 1 being configured to generate a pulse width modulation signal (PWM signal);
A metal-oxide semiconductor field effect transistor 2, the metal-oxide semiconductor field effect transistor 2 being connected to the FPGA device 1 and to a power supply;
A heating resistor 3, the heating resistor 3 being connected to the metal-oxide semiconductor field effect transistor 2; further, the height of the heating resistor 3 is 0.55 mm.
The heating copper foil 4 is arranged on the surface of the PCB and around the processing module, and the heating copper foil 4 is connected with the heating resistor 3; further, the heated copper foil has a height of 1.0 mm.
Wherein the metal-oxide semiconductor field effect transistor 2 is used for controlling the heating state of the heating resistor 3 according to the pulse width modulation signal, and the heating copper foil 4 is used for receiving the heat generated by the heating resistor 3 so as to heat the processing module 4.
The processing module low-temperature starting heating system provided by the embodiment of the application can effectively filter the interference pulse signals by utilizing the FPGA design detection logic; the heating copper foil is arranged around the processing module device to be heated, so that the method has pertinence, and the problem of heat source concentration in the traditional resistance heating can be solved. Meanwhile, the heating copper foil only needs to be arranged around the processing module and has good heat conduction property, and normal heat dissipation of the processing module in a high-temperature state is not affected.
It can be understood that, in general, after the processing module (processor chip) starts to work normally, it generates a certain amount of heat, in order to monitor the temperature of the processing module in real time and prevent the condition that the temperature of the processing module is too high, the embodiment of the application may further provide a plurality of temperature sensors 5, where a plurality of temperature sensors 5 are connected with the FPGA device 1; the temperature sensors 5 are used for acquiring the temperature of the processing module and sending the temperature to the FPGA device 1, so that the FPGA device 1 generates the pulse width modulation signal according to the temperature. Further, the plurality of temperature sensors 5 are uniformly arranged around the processing module. Temperature information detection is provided to prevent the chip from being damaged by over-temperature. The chip ambient temperature signal detection circuit can be further provided, and the rapid collection of the temperature characteristic information of the circuit board can be ensured.
The low-temperature start heating system of the processing module provided by the embodiment of the application is described in detail below by taking a system in which the operating temperature of an application scene is-55 degrees and the lowest operating temperature of RK3588 is-40 degrees as an example, and therefore a board needs to be heated.
The heating circuit adopts FPGA to produce PWM signal, heats the copper foil around through heating resistor and MOS pipe, then satisfies the heating demand of partial chip through the form of heat conduction. A Metal-Oxide-semiconductor field effect transistor (MOS transistor), abbreviated as Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), is a field-effect transistor (field-effect transistor) that can be widely used in analog circuits and digital circuits.
The temperature sensors are arranged around the chip to be heated as much as possible to collect the temperature in real time, heating is started when the temperature is lower than the lowest working temperature (-40 ℃) of the chip, and heating is stopped when the temperature reaches-20 ℃.
The heating part is divided into two paths of series resistors for heating, the wide part is provided with copper foil wiring, the copper foil is heated through the heating resistor and the MOS tube, and the copper foil heats surrounding devices RK 3588. The height of the resistor is 0.55mm, the height of the copper foil is 1.0mm, the power of the heating circuit is 24W, and the heating circuit can be adjusted according to actual needs.
As shown in fig. 2, the system, in use:
Step 1: the MOSFET Q38 plays a role of an electronic switch, and outputs PWM wave signals to the FPGA device as heating switch signals.
Step 2: when the FPGA device outputs a low level, Q37 is turned on, a current flows from the drain (S) to the source (D), the heat generating resistor starts to generate heat, and the heat is supplied to the heat generating copper foil.
Step 3: after the heating copper foil heats, heat is continuously conducted to the chip, and the temperature of the chip is monitored in real time by the temperature sensor arranged around the chip.
Step 4: the temperature sensor monitors the temperature value and transmits the output result to the FPGA device; the FPGA device compares the real-time temperature with a set threshold value until the real-time temperature exceeds the threshold value, namely, the chip can be started normally;
Step 5: and after the temperature acquisition and threshold comparison are realized by the FPGA device and the chip starting temperature is met, the temperature of the copper foil is controlled through the high and low level of the PWM wave, so that the chip environment temperature meeting the requirement is formed.
In a word, the processing module low-temperature starting heating system provided by the application can be effectively applied to the condition that the working temperature of a chip is far lower than the ambient temperature. The FPGA is adopted to generate PWM signals to control the copper foil heating circuit, so that the system temperature can be regulated rapidly and accurately. The temperature detection circuit is designed, so that the chip can be effectively and quickly heated to the working temperature of the chip, and meanwhile, the heating threshold is set, the temperature range of the chip can be ensured, and the chip is prevented from being damaged; the FPGA is used for designing detection logic, so that interference pulse signals can be filtered out, and the correctness of the signals is ensured; the PCB layout is carried out on the chip to be heated, and the copper foil is arranged around the device to be heated, so that the chip to be heated has pertinence, and the heating can be realized more quickly and effectively.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
From the above description of embodiments, it will be apparent to those skilled in the art that the present application may be implemented in software plus a necessary general hardware platform. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the embodiments or some parts of the embodiments of the present application.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for a system or system embodiment, since it is substantially similar to a method embodiment, the description is relatively simple, with reference to the description of the method embodiment being made in part. The systems and system embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model are included in the protection scope of the present utility model.
Claims (5)
1. A process module low temperature start-up heating system, comprising:
the FPGA device is used for generating a pulse width modulation signal;
A metal-oxide semiconductor field effect transistor connected to the FPGA device and to a power supply;
The heating resistor is connected with the metal-oxide semiconductor field effect transistor;
The heating copper foil is arranged on the surface of the PCB and around the processing module, and is connected with the heating resistor;
The metal-oxide semiconductor field effect transistor is used for controlling the heating state of the heating resistor according to the pulse width modulation signal, and the heating copper foil is used for receiving heat generated by the heating resistor so as to heat the processing module.
2. The processing module low temperature start-up heating system of claim 1, further comprising a plurality of temperature sensors, a plurality of the temperature sensors being coupled to the FPGA device; and the temperature sensors are used for acquiring the temperature of the processing module and sending the temperature to the FPGA device so that the FPGA device generates the pulse width modulation signal according to the temperature.
3. The process module low temperature start-up heating system of claim 2, wherein a plurality of the temperature sensors are uniformly disposed about the process module.
4. The process module cold start heating system of claim 1, wherein the heat generating resistor has a height of 0.55 mm.
5. The process module cold start heating system of claim 1, wherein the heated copper foil has a height of 1.0 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322924378.8U CN221177947U (en) | 2023-10-31 | 2023-10-31 | Processing module low temperature starts heating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322924378.8U CN221177947U (en) | 2023-10-31 | 2023-10-31 | Processing module low temperature starts heating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221177947U true CN221177947U (en) | 2024-06-18 |
Family
ID=91532835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322924378.8U Active CN221177947U (en) | 2023-10-31 | 2023-10-31 | Processing module low temperature starts heating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221177947U (en) |
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2023
- 2023-10-31 CN CN202322924378.8U patent/CN221177947U/en active Active
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