CN221177316U - Power supply circuit and electronic equipment - Google Patents
Power supply circuit and electronic equipment Download PDFInfo
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- CN221177316U CN221177316U CN202322948768.9U CN202322948768U CN221177316U CN 221177316 U CN221177316 U CN 221177316U CN 202322948768 U CN202322948768 U CN 202322948768U CN 221177316 U CN221177316 U CN 221177316U
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Abstract
The application discloses a power supply circuit and electronic equipment, and belongs to the technical field of circuit control. The power supply circuit includes: the power supply system comprises a power supply end, a power supply management chip, a load, a step-up and step-down power supply device, a low-dropout linear voltage regulator and a functional device, wherein the input end of the power supply management chip is electrically connected with the power supply end, the output end of the power supply management chip is electrically connected with the load, and a control pin of the power supply management chip is connected with the power supply end through a first switch component; the input end of the step-up and step-down power supply device is electrically connected with the power supply end, the output end of the step-up and step-down power supply device is electrically connected with the input end of the low dropout linear voltage regulator, the output end of the low dropout linear voltage regulator is electrically connected with the functional device, and the output end of the step-up and step-down power supply device is also connected with the control pin of the power management chip through a second switch assembly.
Description
Technical Field
The application belongs to the technical field of circuit control, and particularly relates to a power supply circuit and electronic equipment.
Background
In the related art, in order to ensure that an operating system of electronic equipment such as a mobile phone can normally work in a low-voltage state, a step-up and step-down power supply device is generally added in a circuit, so that when the battery voltage is lower than the voltage required by normal work of peripheral devices (such as an image pickup module), the battery voltage can be boosted to a higher value by the step-up and step-down power supply device, so that normal work of the peripheral devices is maintained.
Because the minimum voltages required by different modules are different, in order to ensure that all modules can work normally, a conventional step-up and step-down power supply device can set the output voltage to be the highest value in the working voltages required by the back-end devices. For example, the minimum voltage required by the camera module is 2.8V, the requirement on the stability of the power supply is high, a low-dropout linear voltage regulator is usually required to be used as the power supply, and the power supply conversion efficiency of the low-dropout linear voltage regulator is related to the difference between the input voltage and the output voltage, so that the larger the voltage difference is, the lower the conversion efficiency is; therefore, when the output voltage of the step-up/down power supply device is high, the power supply conversion efficiency of the low dropout linear regulator is affected, and the whole power supply circuit has the problem of high energy loss.
Disclosure of utility model
The application aims to provide a power supply circuit and electronic equipment, which can solve the problem of large energy loss of the power supply circuit in the related technology.
In order to solve the technical problems, the application is realized as follows:
In a first aspect, an embodiment of the present application provides a power supply circuit, including: the power supply end, the power management chip, the load, the step-up and step-down power supply device, the low dropout linear voltage regulator and the functional device, wherein,
The input end of the power management chip is electrically connected with the power supply end, the output end of the power management chip is electrically connected with the load, and the control pin of the power management chip is connected with the power supply end through a first switch component;
The input end of the step-up/step-down power supply device is electrically connected with the power supply end, the output end of the step-up/step-down power supply device is electrically connected with the input end of the low-dropout linear voltage regulator, the output end of the low-dropout linear voltage regulator is electrically connected with the functional device, and the output end of the step-up/step-down power supply device is also connected with the control pin of the power management chip through a second switch component;
When the output voltage of the power supply end is higher than the working voltage required by the control pin of the power management chip, the first switch component is conducted so that the control pin of the power management chip is directly electrically connected with the power supply end, and the second switch component disconnects the output end of the buck-boost power supply device from being electrically connected with the control pin of the power management chip;
And under the condition that the output voltage of the power supply end is lower than or equal to the working voltage required by the control pin of the power management chip, the first switch component disconnects the electrical connection between the control pin of the power management chip and the power supply end, and the second switch component is conducted so as to enable the output end of the buck-boost power supply device to be electrically connected with the control pin of the power management chip.
In a second aspect, an embodiment of the present application proposes an electronic device, including the power supply circuit of the first aspect.
In the embodiment of the application, the conversion efficiency of the low-dropout linear voltage regulator can be improved by connecting the first switch component in series between the control pin of the power management chip and the power supply end, and connecting the second switch component in series between the output end of the buck-boost power supply device and the control pin of the power management chip, and then controlling the on-off state of the first switch component and the second switch component, so that the power supply loss of the functional device is reduced.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a block diagram of a power supply circuit provided by an embodiment of the present application;
FIG. 2 is a second block diagram of a power supply circuit according to an embodiment of the present application;
FIG. 3 is a third block diagram of a power supply circuit according to an embodiment of the present application;
fig. 4 is a diagram showing a structure of a power supply circuit according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 4, an embodiment of the present application provides a power supply circuit including: a power supply terminal 10, a power management chip 20, a load 30, a step-up/step-down voltage source device 40, a low dropout linear regulator 50, and a functional device 60.
The power supply terminal 10 may be understood as an output terminal of a system power supply network, which may be understood as a power supply network for supplying power to the load 30, the functional device 60, and the like of an electronic device such as a mobile phone.
The above-described power management chip 20 may be understood as a chip for managing the voltage required by the load 30. Wherein an input terminal (IN) of the power management chip 20 is electrically connected with the power supply terminal 10; the output terminal (OUT) of the power management chip 20 is electrically connected to the load 30 and is used for outputting a voltage required by the load 30; a first switch assembly 70 is further connected in series between the control pin (BuckCtrl pin) of the power management chip 20 and the power supply terminal 10, that is, the control pin of the power management chip 20 may be electrically connected with the power supply terminal 10 through the first switch assembly 70.
The buck-boost power device 40 may be compatible with the buck-boost function, and the input terminal (IN) of the buck-boost power device 40 is electrically connected with the power supply terminal 10, the output terminal (OUT) of the buck-boost power device 40 is electrically connected with the input terminal (IN) of the low dropout linear regulator 50, the output terminal (OUT) of the low dropout linear regulator 50 is electrically connected with the functional device 60, and a second switch assembly 80 is further connected IN series between the output terminal of the buck-boost power device 40 and the control pin of the power management chip 20, that is, the output terminal of the buck-boost power device 40 may also be electrically connected with the control pin of the power management chip 20 through the second switch assembly 80.
The low dropout linear regulator 50 can perform a voltage stabilizing function, and the voltage at the input end of the low dropout linear regulator 50 is higher than the voltage at the output end thereof, i.e. in the voltage stabilizing process of the low dropout linear regulator 50, a voltage stabilizing mode is generally adopted after the voltage is reduced, so that the voltage output by the output end thereof is a constant voltage, and the stable operation of the functional device 60 is maintained.
The load 30 may be a chip device including a functional module such as a Central Processing Unit (CPU) and an image processing unit (GPU).
The functional device 60 may be a camera module, a micro control module, or a sensor module, etc. for implementing an image acquisition function, a touch control function, etc. of the mobile phone electronic device.
The power management chip 20, the step-up/down power device 40, and the low dropout linear regulator 50 are each provided with a ground pin (GND) for grounding the power management chip 20, the step-up/down power device 40, and the low dropout linear regulator 50.
Since the power supply conversion efficiency of the low dropout linear regulator 50 is related to the difference between the input voltage and the output voltage, that is, the larger the difference between the input voltage and the output voltage of the low dropout linear regulator 50 is, the lower the conversion efficiency of the low dropout linear regulator 50 is, which in turn results in the larger the power supply loss of the functional device 60.
In this embodiment, the conversion efficiency of the low dropout linear regulator 50 can be improved by connecting the first switching element 70 in series between the control pin of the power management chip 20 and the power supply terminal 10, and connecting the second switching element 80 in series between the output terminal of the buck-boost power device 40 and the control pin of the power management chip 20, and then by controlling the on/off states of the first switching element 70 and the second switching element 80, thereby reducing the power supply loss of the functional device 60.
For example, in the case that the output voltage of the power supply terminal 10 is higher than the working voltage required by the control pin of the power management chip 20, the first switch component 70 can be controlled to conduct the electrical connection between the control pin of the power management chip 20 and the power supply terminal 10, so that the power supply terminal 10 can directly supply power to the control pin of the power management chip 20, thereby meeting the working requirement of the power management chip 20; meanwhile, the second switch assembly 80 is controlled to disconnect the output end of the buck-boost power device 40 from the control pin of the power management chip 20, so that the buck-boost power device 40 can perform buck processing on the output voltage of the power supply end 10, and the voltage after buck is slightly higher than the working voltage required by the functional device 60, so as to reduce the difference between the input voltage and the output voltage of the low dropout linear regulator 50, further improve the conversion efficiency of the low dropout linear regulator 50, and reduce the power supply loss of the functional device 60.
For another example, in the case that the output voltage of the power supply terminal 10 is lower than or equal to the operating voltage required by the control pin of the power management chip 20, the first switch assembly 70 may be controlled to disconnect the control pin of the power management chip 20 from the power supply terminal 10, so as to boost the output voltage of the power supply terminal 10 by the buck-boost power device 40, and transmit the boosted voltage to the control pin of the power management chip 20 through the second switch assembly 80 in the on state, so that the boosted voltage can meet the operating requirement of the power management chip 20.
Optionally, the power supply circuit further includes a voltage detection module and a control module, where the voltage detection module is used to detect the output voltage of the power supply terminal 10;
The control module is electrically connected with the voltage detection module, the first switch assembly 70 and the second switch assembly 80 respectively;
In the case that the voltage detection module detects that the output voltage of the power supply terminal 10 is higher than the working voltage required by the control pin of the power management chip 20, the control module is configured to control the first switch assembly 70 to conduct the electrical connection between the control pin of the power management chip 20 and the power supply terminal 10, and to control the second switch assembly 80 to disconnect the electrical connection between the output terminal of the buck-boost power device 40 and the control pin of the power management chip 20;
In the case that the voltage detection module detects that the output voltage of the power supply terminal 10 is lower than or equal to the operating voltage required by the control pin of the power management chip 20, the control module is configured to control the first switch assembly 70 to disconnect the electrical connection between the control pin of the power management chip 20 and the power supply terminal 10, and to control the second switch assembly 80 to conduct the electrical connection between the output terminal of the buck-boost power device 40 and the control pin of the power management chip 20.
In this embodiment, the output voltage of the power supply terminal 10 may be detected by the voltage detection module, and based on the detected voltage, the detected voltage is compared with the working voltage required by the control pin of the power management chip 20, and based on the comparison result, the on or off of the first switch component 70 and the second switch component 80 is controlled, so as to achieve the purpose of reducing the power supply loss of the functional device 60.
It will be appreciated that the first switch assembly 70 and the second switch assembly 80 may both be switching elements, such as control switching devices, to enable the control pin of the power management chip 20 to be turned on or off from the power supply terminal 10 and to enable the control pin of the power management chip 20 to be turned on or off from the output terminal of the buck-boost power device 40 by controlling the on or off of the switches.
In some embodiments, the first switch component 70 and the second switch component 80 may be MOS transistors, and may implement on-off of the control pin of the power management chip 20 and the power supply terminal 10, and implement on-off of the control pin of the power management chip 20 and the output terminal of the buck-boost power supply device 40 based on the on-off function of the MOS transistors.
Optionally, the first switch component 70 is a first MOS transistor, a source of the first MOS transistor is connected to the power supply terminal 10, and a drain of the first MOS transistor is connected to a control pin of the power management chip 20; the second switch component 80 is a second MOS transistor, a source electrode of the second MOS transistor is connected to the output end of the buck-boost power supply device 40, and a drain electrode of the second MOS transistor is connected to the control pin of the power supply management chip 20; under the condition that the output voltage of the power supply end 10 is higher than the output voltage of the step-up and step-down power supply device 40, the first MOS tube is turned on, and the second MOS tube is turned off; in the case that the output voltage of the power supply terminal 10 is lower than or equal to the output voltage of the step-up/down power supply device 40, the first MOS transistor is turned off, and the second MOS transistor is turned on.
In this embodiment, under the condition that the output voltage of the power supply terminal 10 is higher than the output voltage of the buck-boost power device 40, the potential of the source electrode of the first MOS transistor is higher than that of the source electrode of the second MOS transistor, which is known based on the potential difference principle, so that the first MOS transistor is turned on and the second MOS transistor is turned off; correspondingly, under the condition that the output end voltage of the power supply end 10 is lower than or equal to the output voltage of the buck-boost power supply device 40, the potential of the source electrode of the first MOS tube is lower than or equal to the potential of the source electrode of the second MOS tube, based on the potential difference principle, the first MOS tube is turned off, and the second MOS tube is turned on. Therefore, the high-potential voltage in the power supply circuit can be connected with the control pin of the power management chip 20 without additionally arranging other control switches, and the control pin of the power management chip 20 can work normally.
In other embodiments, the first switch assembly 70 and the second switch assembly 80 may be diodes, and may implement on-off of the control pin of the power management chip 20 and the power supply terminal 10, and implement on-off of the control pin of the power management chip 20 and the output terminal of the buck-boost power device 40 based on the on-off function of the diodes.
Optionally, the first switch component 70 is a first diode, the anode of the first diode is connected with the power supply end 10, and the cathode of the first diode is connected with the control pin of the power management chip 20; the second switch assembly 80 comprises a second diode, the anode of the second diode is connected with the output end of the buck-boost power supply device 40, and the cathode of the second diode is connected with the control pin of the power management chip 20; in the case where the output voltage of the power supply terminal 10 is higher than the output voltage of the step-up/down power supply device 40, the first diode is turned on and the second diode is turned off; in the case where the output voltage of the power supply terminal 10 is lower than or equal to the output voltage of the step-up/down power supply device 40, the first diode is turned off and the second diode is turned on.
In this embodiment, in the case that the output voltage of the power supply terminal 10 is higher than the output voltage of the step-up/down power supply device 40, since the potential of the positive electrode of the first diode is higher than the potential of the positive electrode of the second diode, it is known based on the potential difference principle, so that the first diode is turned on and the second diode is turned off; accordingly, in the case where the output terminal voltage of the power supply terminal 10 is lower than or equal to the output voltage of the step-up/down power supply device 40, since the potential of the positive electrode of the first diode is lower than or equal to the potential of the positive electrode of the second diode, it is known based on the potential difference principle that the first diode is turned off and the second diode is turned on. Therefore, the high-potential voltage in the power supply circuit can be connected with the control pin of the power management chip 20 without additionally arranging other control switches, and the control pin of the power management chip 20 can work normally.
In still other embodiments, the first switch assembly 70 may be a MOS transistor and the second switch assembly 80 may be a diode; or the first switch component 70 may be a diode, and the second switch component 80 may be a MOS transistor, and based on the on-off function of the MOS transistor and the diode, the on-off of the control pin of the power management chip 20 and the power supply terminal 10, and the on-off of the control pin of the power management chip 20 and the output terminal of the buck-boost power supply device 40 are implemented.
Optionally, the first switch component 70 is a third MOS transistor, a source of the third MOS transistor is connected to the power supply terminal 10, and a drain of the third MOS transistor is connected to a control pin of the power management chip 20; the second switch assembly 80 is a third diode, the positive electrode of the third diode is connected with the output end of the buck-boost power supply device 40, and the negative electrode of the third diode is connected with the control pin of the power management chip 20; when the output voltage of the power supply terminal 10 is higher than the output voltage of the step-up/step-down power supply device 40, the third MOS transistor is turned on, and the third diode is turned off; in the case where the output voltage of the power supply terminal 10 is lower than or equal to the output voltage of the step-up/down power supply device 40, the third MOS transistor is turned off and the third diode is turned on.
In this embodiment, when the output voltage of the power supply terminal 10 is higher than the output voltage of the buck-boost power device 40, the potential of the source electrode of the third MOS transistor is higher than the potential of the anode electrode of the third diode, which is known based on the potential difference principle, so that the third MOS transistor is turned on and the third diode is turned off; accordingly, in the case where the output terminal voltage of the power supply terminal 10 is lower than or equal to the output voltage of the buck-boost power supply device 40, since the potential of the source of the third MOS transistor is lower than or equal to the potential of the anode of the third diode, it is known based on the potential difference principle, and therefore, the third MOS transistor is turned off and the third diode is turned on. Therefore, the high-potential voltage in the power supply circuit can be connected with the control pin of the power management chip 20 without additionally arranging other control switches, and the control pin of the power management chip 20 can work normally.
Optionally, the first switch assembly 70 is a fourth diode, the anode of the fourth diode is connected with the power supply end 10, and the cathode of the fourth diode is connected with the control pin of the power management chip 20; the second switch component 80 comprises a fourth MOS tube, a source electrode of the fourth MOS tube is connected with the output end of the buck-boost power supply device 40, a drain electrode of the fourth MOS tube is connected with a control pin of the power management chip 20, and the fourth diode is turned on and turned off under the condition that the output voltage of the power supply end 10 is higher than the output voltage of the buck-boost power supply device 40; when the output voltage of the power supply terminal 10 is lower than or equal to the output voltage of the step-up/down power supply device 40, the fourth diode is turned off and the fourth MOS transistor is turned on.
In this embodiment, under the condition that the voltage at the output end of the power supply end 10 is higher than the output voltage of the buck-boost power supply device 40, the potential of the positive electrode of the fourth diode is higher than the potential of the source electrode of the fourth MOS transistor, based on the potential difference principle, so that the fourth diode is turned on, and the fourth MOS transistor is turned off; accordingly, in the case where the output terminal voltage of the power supply terminal 10 is lower than or equal to the output voltage of the buck-boost power supply device 40, since the potential of the positive electrode of the fourth diode is lower than or equal to the potential of the source electrode of the fourth MOS transistor, it is known based on the potential difference principle, and thus the fourth diode is turned off and the fourth MOS transistor is turned on. Therefore, the high-potential voltage in the power supply circuit can be connected with the control pin of the power management chip 20 without additionally arranging other control switches, and the control pin of the power management chip 20 can work normally.
In the following, a power supply circuit is taken as an example for a mobile phone, and in the power supply circuit, the voltage output range of the power supply terminal 10 may be set to 3.0V to 4.5V, the operation voltage required for the control pin of the power management chip 20 may be set to 3.5V, and the operation voltage of the functional device 60 may be set to 2.8V, for example, the operation voltage of the camera module may be set to 2.8V.
The control pins of the power management chip 20 include two power supply paths, and the two power supply paths are respectively: a first power supply path (power supply end 10→first switch assembly 70→control pin of power management chip 20) and a second power supply path (power supply end of step-up/down power supply device 40→second switch assembly 80→control pin of power management chip 20), and the on or off of the first power supply path can be realized by controlling the on or off of first switch assembly 70; and the on or off of the second power supply path may be achieved by controlling the on or off of the second switching assembly 80.
As shown in fig. 1, when the output voltage of the power supply terminal 10 is higher than 3.5V, that is, when the output voltage of the power supply terminal 10 is higher than the operating voltage required by the control pin of the power management chip 20, the first switch component 70, such as the first MOS transistor, may be directly controlled to be in a conductive state, so that the control pin of the power management chip 20 may be directly powered through the first power supply path; meanwhile, the second switch assembly 80, such as the second MOS transistor, is controlled to be in an off state, so that the step-up/down voltage regulator 40 can step-down the output voltage of the power supply terminal 10, and the step-down voltage is slightly higher than the working voltage required by the functional device 60, so as to reduce the difference between the input voltage and the output voltage of the low dropout linear regulator 50, further improve the conversion efficiency of the low dropout linear regulator 50, and reduce the power supply loss of the functional device 60.
For example, the output voltage of the power supply terminal 10 may be stepped down by the step-up/down power device 40, so that the output voltage of the step-up/down power device 40 is 3.1V, and then the step-down power device 50 converts the output voltage into 2.8V and supplies power to the functional device 60, for example, to supply power to the image capturing module, so as to improve the conversion efficiency of the low dropout linear voltage regulator 50 and reduce the power supply loss of the functional device 60.
The conversion efficiency of the low dropout linear regulator 50 can be increased from η1 to η2 relative to supplying power to the control pins of the power management chip 20 by directly using the buck-boost power device 40, i.e. to outputting a voltage of 3.5V relative to the operating voltage required to buck-boost power device 40 to meet the control pins of the power management chip 20.
Wherein η1=2.8/3.1=90.3%, that is, η1 is equal to the ratio of the output voltage to the input voltage of the low dropout linear regulator 50 after the scheme of the present application is adopted; η2=2.8/3.5=80%, i.e., η2 is equal to the ratio of the output voltage to the input voltage of the low dropout linear regulator 50 after the conventional scheme is adopted; as can be seen, by adopting the power supply circuit scheme of the present application, the conversion efficiency of the low dropout linear regulator 50 is effectively improved.
As shown in fig. 2, when the output voltage of the power supply terminal 10 is lower than or equal to 3.5V, that is, when the output voltage of the power supply terminal 10 is lower than or equal to the operation voltage required by the control pin of the power management chip 20, and because the voltage of the power supply terminal 10 is in a decreasing trend during the power supply process, and when the output voltage of the power supply terminal 10 is lower than or equal to 3.5V, particularly when the output voltage of the power supply terminal 10 is lower than or equal to 3.5V, the output voltage of the power supply terminal 10 is difficult to satisfy the operation voltage required by the control pin of the power management chip 20, it is necessary to boost the output voltage of the power supply terminal 10 by the buck-boost power supply device 40, so that the output voltage of the buck-boost power supply device 40 can reach 3.5V, and by controlling the second switch component 80 to be turned on, for example, by controlling the second MOS transistor to supply power to the control pin of the power management chip 20 through the second power supply path, and satisfy the operation requirement of the power management chip 20. Meanwhile, since the voltage at the output end of the buck-boost power device 40 is higher than the output voltage at the power supply end 10, the first switch assembly 70, i.e. the first MOS transistor, is in the off state, and the power supply path of the power supply circuit is optimized.
It should be noted that, when the voltage at the output end of the buck-boost power device 40 is higher than the output voltage at the power supply end 10, the second MOS transistor is turned on, and the first MOS transistor is turned off; and when the voltage of the output end of the buck-boost power device 40 is lower than the output voltage of the power supply end 10, the second MOS transistor is turned off, and the first MOS transistor is turned on.
It can be understood that the first MOS transistor may be replaced by a first diode, the second MOS transistor may be replaced by a second diode, that is, the first switch assembly 70 may be a first diode, the second switch assembly 80 may be a second diode, and referring specifically to fig. 3 and fig. 4, the above-mentioned process may be implemented through on/off control of the first diode and the second diode, and the same technical effects may be achieved, which will not be repeated herein.
In some embodiments, the first MOS transistor may be replaced with a third MOS transistor, the second MOS transistor may be replaced with a third diode, that is, the first switch assembly 70 may be a third MOS transistor, and the second switch assembly 80 may be a third diode; alternatively, the first MOS transistor may be replaced by a fourth diode, the second MOS transistor may be replaced by a fourth MOS transistor, that is, the first switch assembly 70 may be a fourth diode, and the second switch assembly 80 may be a fourth MOS transistor, and the process may be implemented by controlling the on or off of the corresponding switch assembly, which is not described herein again.
When the voltage at the output terminal of the buck-boost power device 40 is higher than the output voltage at the power supply terminal 10, the second diode is turned on, and the first diode is turned off; and when the voltage at the output terminal of the buck-boost power device 40 is lower than the output voltage at the power supply terminal 10, the second diode is turned off and the first diode is turned on.
In addition, because the capacity of the high voltage section with the battery voltage larger than 3.5V accounts for about 97%, the scheme disclosed by the application can improve the conversion efficiency of the low dropout linear voltage regulator 50 and reduce the power supply loss of the functional device 60; meanwhile, the cruising ability of the battery can be improved, and heating is reduced.
The embodiment of the application also provides electronic equipment, which comprises the power supply circuit.
It should be noted that, the implementation manner of the above-mentioned power supply circuit embodiment is also applicable to the embodiment of the electronic device, and the same technical effects can be achieved, which is not described herein again.
The electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, a Personal Digital Assistant (PDA), or the like.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A power supply circuit is characterized by comprising a power supply end, a power management chip, a load, a step-up and step-down power supply device, a low dropout linear voltage regulator and a functional device, wherein,
The input end of the power management chip is electrically connected with the power supply end, the output end of the power management chip is electrically connected with the load, and the control pin of the power management chip is connected with the power supply end through a first switch component;
The input end of the step-up/step-down power supply device is electrically connected with the power supply end, the output end of the step-up/step-down power supply device is electrically connected with the input end of the low-dropout linear voltage regulator, the output end of the low-dropout linear voltage regulator is electrically connected with the functional device, and the output end of the step-up/step-down power supply device is also connected with the control pin of the power management chip through a second switch component;
When the output voltage of the power supply end is higher than the working voltage required by the control pin of the power management chip, the first switch component is conducted so that the control pin of the power management chip is directly electrically connected with the power supply end, and the second switch component disconnects the output end of the buck-boost power supply device from being electrically connected with the control pin of the power management chip;
And under the condition that the output voltage of the power supply end is lower than or equal to the working voltage required by the control pin of the power management chip, the first switch component disconnects the electrical connection between the control pin of the power management chip and the power supply end, and the second switch component is conducted so as to enable the output end of the buck-boost power supply device to be electrically connected with the control pin of the power management chip.
2. The power supply circuit of claim 1, further comprising a voltage detection module and a control module, the voltage detection module configured to detect an output voltage of the power supply terminal;
the control module is electrically connected with the voltage detection module, the first switch assembly and the second switch assembly respectively;
When the voltage detection module detects that the output voltage of the power supply end is higher than the working voltage required by the control pin of the power management chip, the control module is used for controlling the first switch assembly to conduct the electric connection between the control pin of the power management chip and the power supply end, and controlling the second switch assembly to disconnect the electric connection between the output end of the buck-boost power supply device and the control pin of the power management chip;
When the voltage detection module detects that the output voltage of the power supply end is lower than or equal to the working voltage required by the control pin of the power management chip, the control module is used for controlling the first switch component to disconnect the electrical connection between the control pin of the power management chip and the power supply end, and controlling the second switch component to conduct the electrical connection between the output end of the buck-boost power supply device and the control pin of the power management chip.
3. The power supply circuit of claim 1, wherein the first switch component is a first MOS transistor, a source of the first MOS transistor is connected to the power supply terminal, and a drain of the first MOS transistor is connected to a control pin of the power management chip;
The second switch component is a second MOS tube, a source electrode of the second MOS tube is connected with the output end of the buck-boost power supply device, and a drain electrode of the second MOS tube is connected with the control pin of the power supply management chip.
4. The power supply circuit according to claim 3, wherein the first MOS transistor is turned on and the second MOS transistor is turned off when the output voltage of the power supply terminal is higher than the output voltage of the step-up/step-down power supply device;
under the condition that the output voltage of the power supply end is lower than or equal to the output voltage of the step-up/step-down power supply device, the first MOS tube is turned off, and the second MOS tube is turned on.
5. The power supply circuit of claim 1, wherein the first switch assembly is a first diode, an anode of the first diode is connected to the power supply terminal, and a cathode of the first diode is connected to a control pin of the power management chip;
The second switch component is a second diode, the positive electrode of the second diode is connected with the output end of the buck-boost power supply device, and the negative electrode of the second diode is connected with the control pin of the power supply management chip.
6. The power supply circuit according to claim 5, wherein the first diode is turned on and the second diode is turned off in a case where an output voltage of the power supply terminal is higher than an output voltage of the step-up/down power supply device;
and under the condition that the output voltage of the power supply end is lower than or equal to the output voltage of the step-up/step-down power supply device, the first diode is cut off, and the second diode is conducted.
7. The power supply circuit of claim 1, wherein the first switch component is a third MOS transistor, a source of the third MOS transistor is connected to the power supply terminal, and a drain of the third MOS transistor is connected to a control pin of the power management chip;
The second switch component is a third diode, the positive electrode of the third diode is connected with the output end of the buck-boost power supply device, and the negative electrode of the third diode is connected with the control pin of the power supply management chip.
8. The power supply circuit according to claim 7, wherein the third MOS transistor is turned on and the third diode is turned off in a case where an output voltage of the power supply terminal is higher than an output voltage of the step-up/down power supply device;
And under the condition that the output voltage of the power supply end is lower than or equal to the output voltage of the step-up/step-down power supply device, the third MOS tube is turned off, and the third diode is turned on.
9. The power supply circuit according to claim 1, wherein the first switch component is a fourth diode, the anode of the fourth diode is connected to the power supply terminal, and the cathode of the fourth diode is connected to the control pin of the power management chip;
The second switch component comprises a fourth MOS tube, a source electrode of the fourth MOS tube is connected with the output end of the buck-boost power supply device, and a drain electrode of the fourth MOS tube is connected with the control pin of the power supply management chip.
10. The power supply circuit according to claim 9, wherein the fourth diode is turned on and the fourth MOS transistor is turned off when the output voltage of the power supply terminal is higher than the output voltage of the step-up/step-down power supply device;
And under the condition that the output voltage of the power supply end is lower than or equal to the output voltage of the step-up/step-down power supply device, the fourth diode is cut off, and the fourth MOS tube is conducted.
11. An electronic device comprising the power supply circuit of any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322948768.9U CN221177316U (en) | 2023-11-01 | 2023-11-01 | Power supply circuit and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322948768.9U CN221177316U (en) | 2023-11-01 | 2023-11-01 | Power supply circuit and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221177316U true CN221177316U (en) | 2024-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322948768.9U Active CN221177316U (en) | 2023-11-01 | 2023-11-01 | Power supply circuit and electronic equipment |
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| Country | Link |
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| CN (1) | CN221177316U (en) |
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- 2023-11-01 CN CN202322948768.9U patent/CN221177316U/en active Active
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