CN221166724U - Vertical wafer coating jig for sputtering coating process - Google Patents
Vertical wafer coating jig for sputtering coating process Download PDFInfo
- Publication number
- CN221166724U CN221166724U CN202323051157.0U CN202323051157U CN221166724U CN 221166724 U CN221166724 U CN 221166724U CN 202323051157 U CN202323051157 U CN 202323051157U CN 221166724 U CN221166724 U CN 221166724U
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- wafer
- inner ring
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- vertical
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- 238000000576 coating method Methods 0.000 title claims abstract description 23
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 20
- 239000011248 coating agent Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 86
- 230000000694 effects Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a vertical wafer coating jig for a sputtering coating process, which comprises a machine table and a support, wherein the machine table is provided with a rotating motor, the support comprises an inner ring and an outer ring, the inner ring is connected with the output end of the rotating motor, a connecting rod is arranged between the inner ring and the outer ring, one end of the connecting rod is connected with the outer wall of the inner ring, the other end of the connecting rod is connected with the outer wall of the outer ring, the connecting rod is used for connecting the inner ring and the outer ring into a whole, the plurality of connecting rods are uniformly distributed according to the circumference, the machine table is provided with guide grooves, the outer bottom of the ring is provided with guide parts, the guide parts are coupled with the guide grooves, the top of the outer ring is provided with a facade wafer tray, the facade wafer tray is plurality of wafer accommodating grooves for accommodating wafers are uniformly distributed according to the circumference, and the wafer accommodating grooves are arranged in a plurality of and are arranged at intervals. The utility model has the following advantages and effects: the vertical-face wafer tray can be more stable in the rotating process, so that films formed on the surfaces of the wafers are more uniform, and the coating quality is improved.
Description
Technical Field
The utility model relates to the technical field of wafer processing, in particular to a vertical wafer coating jig for a sputtering coating process.
Background
Both the crystal oscillator and the wafer belong to microelectronic elements, and are manufactured by grinding, polishing and other processes of sliced monocrystalline silicon, so the crystal oscillator and the wafer are also called wafers, are basic materials for manufacturing semiconductor chips, the wafers serve as an optical base material, and film plating on the wafers becomes a basic requirement for improving the optical performance of the wafers.
The process of coating the wafer is generally completed by a physical vapor deposition sputtering method and is implemented by a sputtering device, the sputtering device comprises a reaction chamber and a manipulator, a target is arranged in the reaction chamber, when the wafer needs to be coated, the manipulator places the wafer in the reaction chamber, the target is used for carrying out sputtering treatment on the wafer, in order to carry out batch coating on the wafer, a coating jig is additionally arranged in the reaction chamber, and batch coating on the wafer can be realized by installing a plurality of wafers to be coated on the coating jig.
For example, chinese patent document CN218710815U discloses a vertical annular wafer coating jig, which comprises a rotary machine; the jig units are arranged on the side face of the rotary machine table and are sequentially connected end to form a ring; the jig unit comprises a jig panel, wherein the jig panel is bent into at least two vertical faces, and each vertical face is provided with at least two accommodating through holes; the trays are accommodated in the accommodating through holes, and the front ends of the trays are provided with wafer accommodating grooves; and the other ends of the pressing arms press and fix the tray in the accommodating through hole.
According to the technical scheme, a plurality of wafers can be mounted on a plurality of jig units in the film plating jig, batch film plating can be carried out on the wafers at the same time under the cooperation of the rotary machine, and the number of wafers in the same batch can be greatly increased by the plurality of jig units which are annular on the side surface of the rotary machine, so that the film plating efficiency of the wafers is greatly improved.
However, the present inventors found that, in the process of implementing the above technical solution, after the sputtering apparatus is connected to the rotary machine, since each vertical surface is in a suspended state, the vertical surface is easy to shake during the rotation process, so that the sputtering apparatus is affected to sputter the wafer through the target material, and the thin film formed on the surface of the wafer is not uniform enough.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model aims to provide the vertical wafer film plating jig for the sputtering film plating process, which can enable the vertical wafer tray to be more stable in the rotating process, is beneficial to more uniform film formed on the surface of the wafer and improves the film plating quality.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a vertical wafer coating jig for sputter coating technology, includes board and support, be equipped with the rotating electrical machines on the board, the support includes inner ring and outer loop, the inner ring is connected in the output of rotating electrical machines, be equipped with the connecting rod between inner ring and the outer loop, connecting rod one end is connected in the inner ring outer wall, and the other end is connected in the outer loop outer wall, the connecting rod is used for connecting inner ring and outer loop into a whole, the connecting rod is a plurality of and according to circumference evenly distributed, be equipped with the guide way on the board, the outer bottom of ring is equipped with the guide part, the guide part couples in the guide way, the outer loop top is equipped with facade wafer tray, facade wafer tray is a plurality of and according to circumference evenly distributed, the outside surface of facade wafer tray is equipped with the wafer holding groove that is used for placing the wafer, wafer holding groove is a plurality of and mutual interval setting.
The utility model is further provided with: the bottom of the guide groove is provided with an annular guide rail, the bottom of the guide part is rotationally connected with a plurality of pulleys which are uniformly distributed according to the circumference, and the pulleys are coupled with the annular guide rail and can form sliding fit between the two.
The utility model is further provided with: the facade wafer tray is connected with downwardly extending connecting portion, connecting portion radian and outer circular arc looks adaptation, be equipped with first screw hole on the outer loop, first screw hole is a plurality of to according to circumference evenly distributed, be equipped with the second screw hole that can be relative with first screw hole on the connecting portion, be connected through the retaining member between second screw hole and the first screw hole.
The utility model is further provided with: still include the linking arm, the linking arm is used for connecting into whole with adjacent connecting portion, the linking arm both sides are equipped with the junction surface of laminating with connecting portion, the junction surface is equipped with the connecting hole, be equipped with the locating hole on the connecting portion, the connecting hole can be relative with the locating hole, be connected through the retaining member between connecting hole and the locating hole.
The utility model is further provided with: the inner ring is provided with a plurality of through holes which are uniformly distributed according to the circumference.
Compared with the prior art, the utility model has the beneficial effects that:
Because the guide way is arranged on the machine table, and the outer ring of the support is arranged in the guide way, the facade wafer tray is connected to the outer ring of the support, the effect of supporting the facade wafer tray can be achieved, the rotating motor drives the facade wafer tray connected to the support to rotate, the guide part can form sliding fit with the guide way, the rotating path of the facade wafer tray plays a role in guiding, so that the facade wafer tray is more stable in rotation, the technical problem that the facade wafer tray is in a suspended state in rotation and easy to shake in long-time use is effectively solved, the wafer tray is more stable in the rotating process, films formed on the surface of the wafer are more uniform, and the film coating quality is improved.
Drawings
FIG. 1 is a schematic top view of the present utility model;
FIG. 2 is a schematic diagram of a specific connection structure between a rotary motor and a bracket according to the present utility model;
Fig. 3 is a schematic view showing a specific structure of the neutral plane wafer tray according to the present utility model.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 to 3, the utility model discloses a vertical wafer coating jig for a sputtering coating process, which comprises a machine 1 and a support 2, wherein the machine 1 is provided with a rotating motor 3, the support 2 comprises an inner ring 21 and an outer ring 22, the inner ring 21 is connected to the output end of the rotating motor 3, a connecting rod 4 is arranged between the inner ring 21 and the outer ring 22, one end of the connecting rod 4 is connected to the outer wall of the inner ring 21, the other end of the connecting rod is connected to the outer wall of the outer ring 22, the connecting rod 4 is used for connecting the inner ring 21 and the outer ring 22 into a whole, the connecting rod 4 is a plurality of guide grooves 5 are uniformly distributed according to the circumference, the outer bottom of the machine 1 is provided with a guide part 221, the guide part 221 is coupled with the guide groove 5, the top of the outer ring 22 is provided with a plurality of vertical wafer trays 6, the vertical wafer trays 6 are uniformly distributed according to the circumference, the outer side surface of the vertical wafer trays 6 are provided with a plurality of wafer accommodating grooves 61, the wafer accommodating grooves 61 are mutually arranged at intervals, the vertical wafer trays 6 are connected to the outer ring 22, the outer ring 22 of the support 2 can play a supporting role in supporting the vertical wafer trays 6, the rotating motor 3 drives the wafer trays 6 to be connected to the wafer trays 2 to rotate along the guide part in the guide groove 6, the wafer trays are more stably rotate along the guide groove 6, and the wafer trays can form a stable rotating path in the vertical wafer trays, and the vertical wafer trays can more stably rotate, and the wafer trays can form a stable wafer tray surface through the guide path in the vertical wafer tray can be more stably and better rotate through the guide grooves.
In this embodiment, the bottom of the guiding groove 5 is further provided with an annular guiding rail 7, the bottom of the guiding portion 221 is rotationally connected with a plurality of pulleys 8, the pulleys 8 are uniformly distributed according to the circumference, the pulleys 8 are coupled with the annular guiding rail and can form sliding fit between the two, in the process that the rotating motor 3 drives the vertical face wafer tray 6 connected with the bracket 2 to rotate, the pulleys 8 and the annular guiding rail can form sliding fit, so that the sliding friction contacting between the guiding portion 221 and the guiding groove 5 is replaced by rolling friction, and the rotating path of the vertical face wafer tray 6 can be prevented from playing a guiding role, and meanwhile, the rotating motor 3 can be conveniently driven to rotate the vertical face wafer tray 6.
In this embodiment, the vertical face wafer tray 6 is integrally connected with the connecting portion 62 extending downward, the radian of the connecting portion 62 is adapted to the radian of the outer ring 22, so as to increase the contact area between the connecting portion 62 and the outer ring 22, so that the vertical face wafer tray 6 is stably connected with the outer ring 22 through the connecting portion 62, the outer ring 22 is provided with the first threaded holes 222, the first threaded holes 222 are multiple and uniformly distributed according to the circumference, the connecting portion 62 is provided with the second threaded holes 621 which can be opposite to the first threaded holes 222, the second threaded holes 621 and the first threaded holes 222 are connected through locking pieces, the locking pieces are specifically locking screws, and the vertical face wafer tray 6 and the outer ring 22 can be detachably connected through screwing the screws into or out of the first threaded holes 222 and the second threaded holes 621, so that the whole has the advantage of convenience in assembly.
In this embodiment, the connecting arm 9 is further provided, the connecting arm 9 is used for connecting the adjacent connecting portions 62 into a whole, two sides of the connecting arm 9 are provided with connecting surfaces attached to the connecting portions 62, the connecting surfaces are provided with connecting holes, the connecting portions 62 are provided with positioning holes 622, the connecting holes can be opposite to the positioning holes 622, the connecting holes are connected with the positioning holes 622 through locking pieces, the locking pieces are specifically bolts and nuts, after the bolts are screwed into the positioning holes 622 and the connecting holes, the nuts are screwed into the bolts, the connecting arm 9 can be connected to the junction of the adjacent connecting portions 62, so that after the plurality of vertical face wafer trays 6 are assembled on the outer ring 22, the connecting portions of the connecting arm 9 and the adjacent connecting portions 62 are connected into a whole, and the overall stability of the vertical face wafer trays 6 during rotation is further improved.
In this embodiment, the inner ring 21 is provided with a plurality of through holes 211, the through holes 211 are uniformly distributed along the circumference, the through holes 211 are opposite to the holes at the output end of the rotating motor 3, so that the connection between the support 2 and the output end of the rotating motor 3 is facilitated, when the wafers are coated, the support 2 is connected to the rotating motor 3, a plurality of vertical face wafer trays 6 with wafers placed in the wafer accommodating groove 61 are mounted on the outer ring 22 of the support 2, then the connecting arm 9 is mounted at the junction of the adjacent vertical face wafer trays 6, each vertical face wafer tray 6 is driven to rotate at a constant speed through the rotating motor 3, and the sputtering device uses the target material to perform sputtering treatment on the wafers in the rotating process of the vertical face wafer trays 6, so as to complete batch coating of the wafers.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.
Claims (5)
1. The utility model provides a vertical wafer coating jig for sputter coating technology, its characterized in that includes board and support, be equipped with the rotating electrical machines on the board, the support includes inner ring and outer loop, the inner ring is connected in the output of rotating electrical machines, be equipped with the connecting rod between inner ring and the outer loop, connecting rod one end is connected in the inner ring outer wall, and the other end is connected in the outer loop outer wall, the connecting rod is used for connecting inner ring and outer loop into a whole, the connecting rod is a plurality of and according to circumference evenly distributed, be equipped with the guide way on the board, the outer bottom of ring is equipped with the guide part, the guide part couples in the guide way, the outer loop top is equipped with the facade wafer tray, the facade wafer tray is a plurality of and according to circumference evenly distributed, the outside surface of facade wafer tray is equipped with the wafer holding tank that is used for placing the wafer, the wafer holding tank is a plurality of and each other interval setting.
2. The vertical wafer coating jig for a sputter coating process according to claim 1, wherein the bottom of the guide groove is provided with an annular guide rail, the bottom of the guide part is rotatably connected with a plurality of pulleys which are uniformly distributed along the circumference, and the pulleys are coupled to the annular guide rail and can form a sliding fit between the two.
3. The vertical wafer film plating jig for the sputtering film plating process according to claim 1, wherein the vertical wafer tray is connected with a connecting part extending downwards, the radian of the connecting part is matched with the radian of the outer ring, the outer ring is provided with a plurality of first threaded holes, the first threaded holes are uniformly distributed according to the circumference, the connecting part is provided with a second threaded hole which can be opposite to the first threaded hole, and the second threaded hole is connected with the first threaded hole through a locking piece.
4. The vertical wafer coating jig for a sputter coating process according to claim 3, further comprising a connecting arm, wherein the connecting arm is used for connecting adjacent connecting parts into a whole, two sides of the connecting arm are provided with connecting surfaces attached to the connecting parts, the connecting surfaces are provided with connecting holes, the connecting parts are provided with positioning holes, the connecting holes can be opposite to the positioning holes, and the connecting holes are connected with the positioning holes through locking pieces.
5. The vertical wafer coating jig for a sputter coating process according to claim 1, wherein the inner ring is provided with a plurality of through holes which are uniformly distributed along the circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323051157.0U CN221166724U (en) | 2023-11-13 | 2023-11-13 | Vertical wafer coating jig for sputtering coating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323051157.0U CN221166724U (en) | 2023-11-13 | 2023-11-13 | Vertical wafer coating jig for sputtering coating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221166724U true CN221166724U (en) | 2024-06-18 |
Family
ID=91461753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323051157.0U Active CN221166724U (en) | 2023-11-13 | 2023-11-13 | Vertical wafer coating jig for sputtering coating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221166724U (en) |
-
2023
- 2023-11-13 CN CN202323051157.0U patent/CN221166724U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |