CN221149972U

CN221149972U - Material centering mechanism

Info

Publication number: CN221149972U
Application number: CN202322878252.1U
Authority: CN
Inventors: 滕玉超; 宁瑞强; 杨世杰; 魏朋忠; 赵文翰; 宫圆圆; 李得贤; 周森羽
Original assignee: Changdian Integrated Circuit Shaoxing Co ltd
Current assignee: Changdian Integrated Circuit Shaoxing Co ltd
Priority date: 2023-10-26
Filing date: 2023-10-26
Publication date: 2024-06-14
Anticipated expiration: 2033-10-26

Abstract

The application relates to the technical field of wafer processing equipment, in particular to a material centering mechanism, which comprises a machine table, wherein a plurality of centering rods are movably arranged on the machine table; the lower end of the centering rod is provided with a linkage block, a plurality of linkage blocks are arranged in a synchronous sliding mode along the side length direction perpendicular to the machine table, and the machine table is provided with a driving structure for driving the linkage blocks to move. The application has the following effects: when the wafer is placed on the machine by the gripper, the gripper is not located at the center of the machine, the linkage block is enabled to move through the driving structure, then the centering rod moves inwards, the contour line formed by the centering rod is reduced inwards in equal proportion, and then the wafer is aligned to the center.

Description

Material centering mechanism

Technical Field

The application relates to the technical field of wafer processing equipment, in particular to a material centering mechanism.

Background

In the related processing process of the wafer, the wafer is required to be processed in batches, and the specific processing mode is that the wafer is placed on a single machine, a vacuum chuck is arranged at the lower side of the machine, and the wafer is fixed and then is processed.

Before the suction cup is adsorbed, the wafer needs to be placed on the machine table through the gripper, and whether the placement position is accurate or not has great influence on the processing quality, but the gripper and the surface of the machine table are necessarily at a certain distance in the process of releasing the wafer, and the possibility of shifting in the horizontal direction exists in the process of releasing the wafer.

Disclosure of utility model

In order to place the wafer at the center of the machine as much as possible, the application provides a material centering mechanism.

The application provides a material centering mechanism, which adopts the following technical scheme: a material centering mechanism comprises a machine table, wherein a plurality of centering rods are movably arranged on the machine table; the lower end of the centering rod is provided with a linkage block, a plurality of linkage blocks are arranged in a synchronous sliding mode along the side length direction perpendicular to the machine table, and the machine table is provided with a driving structure for driving the linkage blocks to move.

By adopting the technical scheme, after the wafer is placed on the machine by the gripper, the gripper is not arranged at the center of the machine, the linkage block is enabled to move through the driving structure, then the centering rod moves inwards, the contour line formed by the centering rod is reduced inwards in equal proportion, and then the wafer is aligned to the center.

Preferably, the driving structure comprises a driving block and a linkage rod, wherein the driving block and the linkage rod are arranged in a sliding manner along the direction perpendicular to the machine table, and the two ends of the linkage rod are respectively hinged with the driving block and the linkage block.

Through adopting above-mentioned technical scheme, the motion of initiative piece in vertical direction will make the both ends of gangbar all slide to make the gangbar move in the horizontal direction.

Preferably, the lower side of the machine table is rotationally connected with a threaded screw rod, the threaded screw rod penetrates through and is in threaded connection with the driving block, and the driving block is circumferentially limited on the machine table.

Through adopting above-mentioned technical scheme, make the initiative piece move in vertical direction through rotating the screw rod, the motion condition of tread will be stable, is fit for driving the linkage piece.

Preferably, the lower side of the machine table is provided with at least one limiting rod penetrating through the driving block.

Through adopting above-mentioned technical scheme, after the gag lever post passes the initiative piece, play its spacing in circumference.

Preferably, the centering rod has a vertical section and a bevel section, the bevel section having a transition bevel facing inward toward the inside of the machine.

Through adopting above-mentioned technical scheme, after centering rod set up to two sections, the tongs is when placing, places the wafer on transition inclined plane, and the linkage piece outwards moves this moment, and the wafer finally accurately contacts in the board through vertical section.

Preferably, the centering rod is U-shaped, the upper end of the centering rod is the transition inclined plane, and the lower side of the centering rod is an integral vertical part.

By adopting the technical scheme, the whole extension length of the centering rod is increased, the corresponding contact point is increased, and the corresponding guide stability can be increased.

Preferably, a curved surface is arranged between the vertical section and the inclined surface section.

By adopting the technical scheme, the bent part can form protection for the edge of the wafer, and the wafer can conveniently move from the transition inclined plane to the vertical section.

Preferably, the machine is provided with a sliding channel for sliding the linkage block, and the sliding channel is divided into an adjusting area and a centering area from one side close to the machine to the other side.

Preferably, the inner wall of the sliding channel in the adjusting area is provided with an elastic clamping strip, and the side wall of the linkage block is provided with a convex point which is correspondingly abutted against the elastic clamping strip.

Through adopting above-mentioned technical scheme, when moving in the adjustment district, the elasticity card strip will take place to touch with the bump, but can not hinder the motion of linkage piece completely for the similar slight card of linkage piece in the in-process of motion takes place to be blocked the condition, can adjust the wafer is whole this moment, adjusts to horizontally state, is convenient for contact the board through vertical section, and will not block in the motion process to the middle zone, can guarantee subsequent motion stability.

In summary, the present application includes at least one of the following beneficial technical effects:

1. When the wafer is placed on the machine table by the gripper, assuming that the wafer is not positioned at the center of the machine table, the linkage block moves through the driving structure, and then the centering rod moves inwards, so that the contour line formed by the centering rod is reduced inwards in equal proportion, and then the wafer is aligned to the center;

2. the centering rod moves from outside to inside to gradually push the wafer to the center, so that the subsequent adsorption and processing are facilitated;

3. The centering rod moves from inside to outside, the wafer is changed to slide towards the center through the transition inclined plane, and finally the wafer is pushed to the center through the vertical section.

Drawings

FIG. 1 is a schematic structural view of embodiment 1 of the present application;

FIG. 2 is a schematic structural view of a middle linkage block and a centering rod according to embodiment 2 of the present application;

FIG. 3 is a schematic diagram of the structure of the sliding channel and the linkage block in embodiment 3 of the present application;

Fig. 4 is a schematic diagram showing the structural relationship between the elastic clip strip and the bump in another view in embodiment 3 of the present application.

Reference numerals illustrate: 100. a machine table; 110. centering rod; 111. a linkage block; 112. a slip path; 113. an active block; 114. a linkage rod; 115. a guide rod; 120. a threaded screw rod; 121. a limit rod; 131. a vertical section; 132. a bevel section; 133. a transition inclined plane; 134. a curved surface; 141. an adjustment zone; 142. centering region; 143. an elastic clamping strip; 144. and (5) protruding points.

Detailed Description

The present application will be described in further detail with reference to the accompanying drawings.

Examples

The embodiment of the application discloses a material centering mechanism, referring to fig. 1, which comprises a machine 100, wherein the machine 100 is integrally rectangular, a plurality of centering rods 110 are movably arranged on the convex part of the machine 100 at the periphery of the machine 100. The lower end of the centering rod 110 is provided with a linkage block 111, a plurality of linkage blocks 111 are synchronously and slidably arranged along the side length direction vertical to the machine 100, and a driving structure for driving the linkage blocks 111 to move is arranged on the machine 100.

The machine 100 is provided with a sliding channel 112, the linkage block 111 slides in the sliding channel, and in order to improve the sliding stability, in other embodiments, rollers or balls may be mounted on the linkage block 111, so as to reduce the overall sliding friction.

The driving structure comprises a driving block 113 which is arranged in a sliding way along the direction vertical to the machine 100, and a linkage rod 114 of which the two ends are respectively hinged with the driving block 113 and the linkage block 111. A guide bar 115 is provided on the lower side of the machine 100, and the guide bar 115 is inserted into the link block 111. The lower side of the linkage block 111 is externally and convexly hinged with a linkage rod 114. The lower side of the machine 100 is rotatably connected with a threaded screw rod 120, the threaded screw rod 120 is penetrated and is in threaded connection with the driving block 113, the driving mode of the threaded screw rod 120 can be motor driving, and the driving block 113 moves in the vertical direction through rotation. In order to realize the limit of the driving block 113 in the circumferential direction, a limit rod 121 is further arranged on the lower side of the machine 100 parallel to the threaded screw rod 120, and the limit rod 121 penetrates through the driving block 113.

When the screw 120 rotates, the driving block 113 is driven to move downward, the linkage block 111 is driven to move inward by the linkage rod 114, and the wafer is moved to a position in the middle of the machine 100 by the centering rod 110 gradually.

Examples

Unlike embodiment 1, referring to fig. 2, the centering rod 110 moves outward and centers the wafer, and specifically, the centering rod 110 has a vertical section 131 and a bevel section 132, and the bevel section 132 has a transition bevel 133 facing toward the inside of the machine 100. The centering rod 110 is in a U shape, the upper end of the centering rod is provided with a transition inclined plane 133, and the lower end of the centering rod is provided with an integral vertical part, so that a stable abutting effect is formed on the wafer through a longer contact surface.

The specific centering principle is that, in the initial position, the position of the centering rod 110 will be smaller than the area of the wafer, but the wafer can be placed on the transition inclined plane 133 by the gripper, and then the linkage block 111 is moved outwards by the driving structure, so that the edge of the wafer moves downwards from the transition inclined plane 133, and finally the dropping position is formed by the vertical section 131, and in this embodiment, the curved surface 134 is formed between the vertical section 131 and the inclined plane section 132, so that the purpose of protecting the wafer can be achieved.

Examples

Unlike embodiment 2, referring to fig. 3 and 4, the sliding channel 112 is divided into an adjustment area 141 and a centering area 142 from one side close to the machine 100 to the other side. The adjusting area 141 is mainly the area where the linkage block 111 can slightly vibrate when moving, and the corresponding front section of the transition slope 133 can make the wafer slide smoothly, while the middle area 142, which is close to the vertical section 131, can slide to the center of the machine 100 in a stable stroke in the later stage.

Specifically, the inner wall of the sliding channel 112 in the adjusting area 141 is provided with an elastic clamping strip 143, and the side wall of the linkage block 111 is provided with a bump 144 corresponding to the bump on the elastic clamping strip 143, and the bump are at the same height on the horizontal plane. In the motion process of the linkage block 111, the elastic clamping strips 143 are arranged in a plurality along the motion direction, when the protruding points 144 are abutted against the elastic clamping strips 143, the elastic clamping strips 143 can slightly block the motion, after the protruding points 144 move, the linkage block 111 can be blocked to a certain extent, and then a vibration effect is formed, so that the wafer can slide down conveniently.

It should be noted that, since there is a gap between the sliding channel 112 and the side wall of the linkage block 111, in order to improve the motion stability of the linkage block 111, in this embodiment, two guide rods 115 are arranged in parallel to play a main guiding role.

The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in this way, therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.

Claims

1. The utility model provides a material centering mechanism, includes board (100), its characterized in that: a plurality of centering rods (110) are movably arranged on the machine table (100); the lower end of the centering rod (110) is provided with a linkage block (111), a plurality of linkage blocks (111) are arranged in a synchronous sliding mode along the side length direction perpendicular to the machine table (100), and the machine table (100) is provided with a driving structure for driving the linkage blocks (111) to move.

2. A material centering mechanism as claimed in claim 1, wherein: the driving structure comprises a driving block (113) which is arranged in a sliding way along the direction perpendicular to the machine table (100), and a linkage rod (114) with two ends respectively hinged with the driving block (113) and the linkage block (111).

3. A material centering mechanism as claimed in claim 2, wherein: the machine table (100) is characterized in that a threaded screw rod (120) is rotatably connected to the lower side of the machine table (100), the threaded screw rod (120) penetrates through and is in threaded connection with the driving block (113), and the driving block (113) is circumferentially limited to the machine table (100).

4. A material centering mechanism as claimed in claim 3, wherein: at least one limiting rod (121) penetrating through the driving block (113) is arranged on the lower side of the machine table (100).

5. A material centering mechanism as claimed in claim 4, wherein: the centering rod (110) has a vertical section (131) and a bevel section (132), the bevel section (132) having a transition bevel (133) facing the inside of the machine (100).

6. A material centering mechanism as claimed in claim 5, wherein: the centering rod (110) is U-shaped, the upper end part of the centering rod is the transition inclined plane (133), and the lower side of the centering rod is an integral vertical part.

7. A material centering mechanism as claimed in claim 6, wherein: a curved surface (134) is arranged between the vertical section (131) and the inclined surface section (132).

8. A material centering mechanism as claimed in claim 4 or claim 7, wherein: the machine table (100) is provided with a sliding channel (112) for sliding the linkage block (111), and the sliding channel (112) is divided into an adjusting area (141) and a centering area (142) from one side close to the machine table (100) to the other side.

9. A material centering mechanism as claimed in claim 8, wherein: the inner wall of the sliding channel (112) in the adjusting area (141) is provided with an elastic clamping strip (143), and the side wall of the linkage block (111) is provided with a convex point (144) which is correspondingly abutted against the elastic clamping strip (143).