CN221103919U - Heat abstractor and electric capacity charger - Google Patents
Heat abstractor and electric capacity charger Download PDFInfo
- Publication number
- CN221103919U CN221103919U CN202323051608.0U CN202323051608U CN221103919U CN 221103919 U CN221103919 U CN 221103919U CN 202323051608 U CN202323051608 U CN 202323051608U CN 221103919 U CN221103919 U CN 221103919U
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- Prior art keywords
- heat
- frame
- plate
- water tank
- heat sink
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- 238000001816 cooling Methods 0.000 claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 239000003990 capacitor Substances 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 238000005057 refrigeration Methods 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipating device and a capacitor charger, which belong to the technical field of capacitor chargers, and comprise a shell, wherein a connecting frame is arranged on the outer surface of the shell, a flow guiding component is arranged in the connecting frame, the flow guiding component comprises a flow guiding fan, and the outer side of the flow guiding fan is connected with a European filter frame; the positioning plate is connected to the inner wall of the shell; according to the utility model, the air flow guiding fan in the connecting frame can blow air into the shell of the capacitor charger, so that the air flow guiding function is realized, and the internal heat is blown out for heat dissipation; the liquid for internal cooling of the circulating water tank is conveyed to the inside of the circulating cooling box through the water pump, flows in cooperation with the first connecting pipe, takes away heat absorbed by the heat dissipation plate through the heat conducting fin at the bottom, and can ensure that the liquid for internal cooling of the circulating water tank is cooled through the semiconductor refrigerating fin at one side of the circulating water tank, so that the continuous heat dissipation cooling effect is ensured.
Description
Technical Field
The utility model relates to the technical field of capacitor chargers, in particular to a heat dissipation device and a capacitor charger.
Background
The inside of the capacitor charger structure is provided with a driving circuit board for controlling the charging of the capacitor battery, and the capacitor charger is provided with two ports, one external power supply and one external device needing to be charged. The capacitor charger can generate a large amount of heat in the process of charging the battery, if the heat of the charger is not timely dissipated, the heat of the charger is easily generated, the performance of the internal elements of the charger can be reduced or even damaged due to the long-term high-heat working environment, the service life of the charger is prolonged, and the sustainable use of consumers is not facilitated. And the inside of current charger can not fine messenger's air flow to can not carry out fine heat dissipation to the charger main part, charge under high temperature environment work for a long time, can accelerate the loss of battery, shorten the life of battery. Therefore, we need to propose a heat dissipating device and a capacitor charger.
Disclosure of utility model
The utility model aims to provide a heat dissipation device and a capacitor charger, which can improve the air flow in the capacitor charger, strengthen the heat dissipation effect on the charger, ensure that the working environment is not high-temperature and high-heat in the working process of the charger, further reduce the occurrence of the condition that the performance of internal elements is reduced or even damaged, and solve the problems in the background technology.
To achieve the above object, the present utility model provides: the heat dissipation device comprises a shell, wherein a connecting frame is arranged on the outer surface of the shell, a flow guide assembly is arranged in the connecting frame, the flow guide assembly comprises a flow guide fan, and an European filter frame is connected to the outer side of the flow guide fan; the locating plate is connected to the shells inner wall, the surface sliding connection of locating plate has buffer assembly's installing frame, the internal surface of installing frame is connected with and bears the frame, the below that bears the frame is provided with cooling subassembly, cooling subassembly's circulation cooling box's bottom is connected with circulation water tank, one side of circulation water tank inlays and is equipped with semiconductor refrigeration piece.
Preferably, the flow guiding assembly further comprises: the clamping cylinder is connected to the inner wall of the connecting frame, and the clamping rod is connected to the surface of the filtering frame; the surface of the clamping rod is movably inserted into the clamping cylinder, and the flow guide fan is detachably arranged on the inner wall of the connecting frame.
Preferably, the buffer assembly further comprises: the base plate is connected to the bottom of the mounting frame, and the guide rod is connected to the bottom of the base plate; the guide rod is connected with the surface of the positioning plate in a sliding mode, and the baffle is arranged below the positioning plate at the bottom end of the guide rod.
Preferably, the surface cover of guide bar is equipped with buffer spring, buffer spring's top is connected with the bottom of backing plate, buffer spring's bottom is connected on the surface of locating plate.
Preferably, the cooling assembly further comprises: the cooling plate is connected with the top of the circulating cooling box and is arranged on the top of the cooling plate; the bottom of the heat dissipation plate is connected with a heat conduction sheet, and the heat conduction sheet is inserted into the circulation cooling box through a partition plate.
Preferably, the circulating cooling boxes are connected through first connecting pipes, the bottoms of the circulating cooling boxes are connected with second connecting pipes, and the bottoms of the second connecting pipes are communicated with the circulating water tank.
Preferably, the top of the circulating water tank is connected with a water pump, and the output end of the water pump is communicated with the bottom of the circulating cooling box through a pipeline.
Preferably, the heat absorbing surface of the semiconductor refrigeration sheet is embedded in the inner cavity of the circulating water tank, and the heat releasing surface of the semiconductor refrigeration sheet is connected with radiating fins.
Preferably, a dust screen is arranged on the outer side of the radiating fin, and the dust screen is detachably arranged on the surface of the shell.
In another aspect, the present utility model provides a capacitor charger, including the heat dissipation device.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, through the arrangement of the structures such as the flow guide assembly, the buffer assembly and the cooling assembly, the air blowing can be carried out on the inside of the shell of the capacitor charger through the flow guide fan in the connecting frame, so that the flow guide effect is achieved, and the internal heat is blown out for heat dissipation; the guide rod at the bottom of the installation frame can guide the installation frame, and the buffer spring sleeved on the surface of the guide rod can play a role in buffer protection in the process of carrying or collision; the liquid for internal cooling of the circulating water tank is conveyed to the inside of the circulating cooling box through the water pump, flows in cooperation with the first connecting pipe, takes away heat absorbed by the heat dissipation plate through the heat conducting fin at the bottom, and can ensure that the liquid for internal cooling of the circulating water tank is cooled through the semiconductor refrigerating fin at one side of the circulating water tank, so that the continuous heat dissipation cooling effect is ensured.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a filter frame according to the present utility model;
FIG. 3 is a schematic view of the circulation tank of the present utility model;
FIG. 4 is a schematic view of a mounting frame structure of the present utility model;
FIG. 5 is a schematic view of a guide bar structure according to the present utility model;
Fig. 6 is a schematic view of the circulation cooling box structure of the present utility model.
In the figure: 1. a housing; 2. an external interface; 3. a connection frame; 4. a clamping cylinder; 5. a diversion fan; 6. a filter frame; 7. a clamping rod; 8. a mounting frame; 9. a carrier; 10. a backing plate; 11. a guide rod; 12. a baffle; 13. a buffer spring; 14. a positioning plate; 15. a circulating cooling box; 16. a connecting pipe; 17. a water pump; 18. a connecting pipe; 19. a partition plate; 20. a heat dissipation plate; 21. a heat conductive sheet; 22. a circulation water tank; 23. a semiconductor refrigeration sheet; 24. a heat radiation fin; 25. a dust-proof net.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, the present utility model provides: the heat dissipating device comprises a shell 1, wherein a connecting frame 3 is arranged on the outer surface of the shell 1, a flow guiding component is arranged in the connecting frame 3 and comprises a flow guiding fan 5, and an European filter frame 6 is connected to the outer side of the flow guiding fan 5; the locating plate 14 of connecting at the casing 1 inner wall, the surface sliding connection of locating plate 14 has buffer assembly's installing frame 8, and the internal surface of installing frame 8 is connected with and bears frame 9, and the below that bears frame 9 is provided with the cooling subassembly, and the bottom of the circulation cooling box 15 of cooling subassembly is connected with circulation water tank 22, and one side of circulation water tank 22 inlays and is equipped with semiconductor refrigeration piece 23.
It is worth noting that, through the cooperation setting of water conservancy diversion subassembly, buffer unit and cooling subassembly structure, can improve the inside air flow of electric capacity charger to strengthen the radiating effect to the charger, guarantee that the charger working process in-process can not cause operational environment high temperature high heat, further reduce the condition emergence that the reduction even damage appears in interior component performance.
Specifically, the water conservancy diversion subassembly still includes: a clamping cylinder 4 connected to the inner wall of the connecting frame 3 and a clamping rod 7 connected to the surface of the filtering frame 6; wherein, the surface activity cartridge of clamping lever 7 is inside card section of thick bamboo 4, and guide fan 5 demountable installation is at the inner wall of connecting frame 3. The connecting frame 3 is used for installing the diversion fan 5 and has a bearing structure for the filtering frame 6, and the filtering frame 6 can be installed on the connecting frame 3 through the clamping cylinder 4 by the clamping rod 7 so as to filter the diversion air flow.
The cushioning assembly further includes: a base plate 10 connected to the bottom of the mounting frame 8, and a guide rod 11 connected to the bottom of the base plate 10; wherein, guide bar 11 sliding connection locating plate 14's surface, baffle 12 is installed to the bottom of guide bar 11 below locating plate 14. The surface cover of guide bar 11 is equipped with buffer spring 13, and buffer spring 13's top is connected with the bottom of backing plate 10, and buffer spring 13's bottom is connected on the surface of locating plate 14.
Further, the mounting frame 8 is a component for mounting the mounting frame 9, the mounting frame 9 is an effect of matching the mounting frame 8 to bear elements of the capacitor charger, the guide rod 11 is a structure for guiding the mounting frame 8, the positioning plate 14 is a structure for bearing the mounting frame 8, the baffle 12 is a structure for preventing the guide rod 11 from falling off, the buffer spring 13 is a buffer effect for the mounting frame 8, and the buffer effect is achieved when the capacitor charger is carried or collided.
The cooling assembly further includes: a partition plate 19 connected to the top of the circulation cooling box 15, and a heat dissipation plate 20 provided on the top of the partition plate 19; wherein, the bottom of heating panel 20 is connected with heat conducting strip 21, and heat conducting strip 21 passes through baffle 19 cartridge in circulation cooling box 15 inside.
In addition, the circulation cooling box 15 is a structure for cooling and circulating cooling liquid, the partition plate 19 is a structure for bearing the heat dissipation plate 20, the heat dissipation plate 20 is an effect of absorbing heat to elements, and the heat conduction sheet 21 is used for transmitting the heat absorbed by the heat dissipation plate 20 into the circulation cooling box 15 and dissipating heat in cooperation with the cooling liquid inside.
The circulating cooling boxes 15 are connected through first connecting pipes 16, the bottoms of the circulating cooling boxes 15 are connected with second connecting pipes 18, and the bottoms of the second connecting pipes 18 are communicated with a circulating water tank 22. The top of the circulating water tank 22 is connected with a water pump 17, and the output end of the water pump 17 is communicated with the bottom of the circulating cooling box 15 through a pipeline. The first connection pipe 16 is a pipe that circulates between the circulation cooling boxes 15, the circulation water tank 22 is configured to store cooling water, and the water pump 17 is configured to convey the cooling water.
The heat absorbing surface of the semiconductor refrigeration piece 23 is embedded in the inner cavity of the circulating water tank 22, and the heat dissipating fins 24 are connected with the heat dissipating surface of the semiconductor refrigeration piece 23. The outside of radiating fin 24 is provided with dust screen 25, and dust screen 25 demountable installation is at the surface of casing 1, and the surface of casing 1 is provided with external interface 2, and external interface 2 has two ports to be used for external power and external equipment that needs to charge.
Preferably, the semiconductor cooling fin 23 is a function of cooling the cooling liquid in the circulation tank 22, the heat radiation fin 24 is a structure for radiating heat from the semiconductor cooling fin 23, and the dust screen 25 is a structure for dust-preventing the position of the air discharge groove.
In another aspect, the present utility model provides a capacitor charger, including a heat dissipating device as set forth in the above embodiments.
The air flow guiding fan 5 in the connecting frame 3 can blow air to the inside of the shell 1 of the capacitor charger, plays a role in guiding air and blows out internal heat for heat dissipation; the guide rod 11 at the bottom of the installation frame 8 can play a role in guiding the installation frame 8, and the buffer spring 13 sleeved on the surface of the guide rod 11 can play a role in buffer protection in the process of carrying or collision; the liquid for cooling the inside of the circulating water tank 22 is conveyed to the inside of the circulating cooling box 15 through the water pump 17, flows in cooperation with the first connecting pipe 16, takes away the heat absorbed by the heat dissipation plate 20 through the heat conduction sheet 21 at the bottom, and can ensure the cooling of the liquid for cooling the inside of the circulating water tank 22 through the semiconductor refrigerating sheet 23 at one side of the circulating water tank 22, so that the continuous heat dissipation cooling effect is ensured; in the working process of the charger, the high temperature and high heat of the working environment can not be caused, and the performance of the internal elements is further reduced, and even the internal elements are damaged.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A heat sink, comprising:
The device comprises a shell (1), wherein a connecting frame (3) is arranged on the outer surface of the shell (1), a flow guide assembly is arranged in the connecting frame (3), the flow guide assembly comprises a flow guide fan (5), and a filtering frame (6) is connected to the outer side of the flow guide fan (5);
Connect locating plate (14) of casing (1) inner wall, the surface sliding connection of locating plate (14) has buffer assembly's installing frame (8), the internal surface of installing frame (8) is connected with bears frame (9), the below of bearing frame (9) is provided with cooling subassembly, the bottom of cooling subassembly's circulation cooling box (15) is connected with circulation water tank (22), one side of circulation water tank (22) is inlayed and is equipped with semiconductor refrigeration piece (23).
2. A heat sink according to claim 1, wherein: the flow directing assembly further comprises:
a clamping cylinder (4) connected to the inner wall of the connecting frame (3), and
A clamping rod (7) connected with the surface of the filter frame (6);
The surface of the clamping rod (7) is movably inserted into the clamping cylinder (4), and the flow guide fan (5) is detachably arranged on the inner wall of the connecting frame (3).
3. A heat sink according to claim 1, wherein: the cushioning assembly further includes:
A backing plate (10) connected to the bottom of the mounting frame (8), and
A guide rod (11) connected to the bottom of the base plate (10);
The guide rod (11) is connected with the surface of the positioning plate (14) in a sliding mode, and the baffle plate (12) is arranged below the positioning plate (14) at the bottom end of the guide rod (11).
4. A heat sink according to claim 3, wherein: the surface cover of guide bar (11) is equipped with buffer spring (13), the top of buffer spring (13) is connected with the bottom of backing plate (10), the bottom of buffer spring (13) is connected on the surface of locating plate (14).
5. A heat sink according to claim 1, wherein: the cooling assembly further comprises:
a baffle plate (19) connected with the top of the circulating cooling box (15), and
A heat radiating plate (20) provided on the top of the partition plate (19);
The bottom of the heat dissipation plate (20) is connected with a heat conduction sheet (21), and the heat conduction sheet (21) is inserted into the circulation cooling box (15) through a partition plate (19).
6. A heat sink as defined in claim 5, wherein: the circulating cooling boxes (15) are connected through first connecting pipes (16), the bottoms of the circulating cooling boxes (15) are connected with second connecting pipes (18), and the bottoms of the second connecting pipes (18) are communicated with a circulating water tank (22).
7. A heat sink as defined in claim 6, wherein: the top of the circulating water tank (22) is connected with a water pump (17), and the output end of the water pump (17) is communicated with the bottom of the circulating cooling box (15) through a pipeline.
8. A heat sink according to claim 1, wherein: the heat absorption surface of the semiconductor refrigeration piece (23) is embedded in the inner cavity of the circulating water tank (22), and the heat release surface of the semiconductor refrigeration piece (23) is connected with a radiating fin (24).
9. A heat sink as defined in claim 8, wherein: the outer side of the radiating fin (24) is provided with a dustproof net (25), and the dustproof net (25) is detachably arranged on the surface of the shell (1).
10. A capacitor charger, characterized by: a heat sink comprising the device of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323051608.0U CN221103919U (en) | 2023-11-10 | 2023-11-10 | Heat abstractor and electric capacity charger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323051608.0U CN221103919U (en) | 2023-11-10 | 2023-11-10 | Heat abstractor and electric capacity charger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221103919U true CN221103919U (en) | 2024-06-07 |
Family
ID=91310358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323051608.0U Active CN221103919U (en) | 2023-11-10 | 2023-11-10 | Heat abstractor and electric capacity charger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221103919U (en) |
-
2023
- 2023-11-10 CN CN202323051608.0U patent/CN221103919U/en active Active
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