CN221102080U

CN221102080U - Power device

Info

Publication number: CN221102080U
Application number: CN202322819584.2U
Authority: CN
Inventors: 段金炽; 廖光朝
Original assignee: Chongqing Yuntong Technology Co ltd
Current assignee: Chongqing Yuntong Technology Co ltd
Priority date: 2023-10-20
Filing date: 2023-10-20
Publication date: 2024-06-07
Anticipated expiration: 2033-10-20

Abstract

The utility model discloses a power device, relates to the technical field of power semiconductors, and solves the problems that the heat dissipation effect of the power device is poor and parasitic loss is increased easily due to the fact that wire bonding is adopted in the existing power device package. The device comprises a top plate, a bottom plate, a plurality of power chips and a plurality of elastic components; the bottom plate is a first DBC plate; each power chip is fixed on the bottom plate and is electrically connected with the top plate through an elastic component; the bottom plate is connected with the top plate through an elastic component. According to the utility model, the elastic component is connected with the bottom plate and the top plate, and the elastic component is connected with the power chip and the top plate on the bottom plate, so that the conduction between the bottom plate and the top plate of the power device is realized, and the input and output current can flow through the top plate, so that part of heat generated by the current is conducted onto the top plate, and the bottom plate is matched with the top plate, so that double-sided heat dissipation is realized, the heat dissipation effect is improved, meanwhile, the parasitic loss generated by wire bonding can be reduced by the elastic component, and the reliability of the power device is improved.

Description

Power device

Technical Field

The utility model relates to the technical field of power semiconductors, in particular to a power device.

Background

The power device is a core component of the electric automobile inverter, and the packaging technology of the power device has a crucial influence on the system performance and reliability. With the development trend of power devices, the power devices are high-density, high-power and miniaturized, which causes the problems of large temperature difference between a chip and a radiating surface of a power module, parasitic loss caused by adopting wire bonding, high manufacturing cost and the like.

In conventional power device packages, the top of the power semiconductor device is used only for making electrical connections, while the bottom is typically connected to the DBC substrate for electrical connection and thermal conduction. The interconnection method used in the power module package generally adopts a wire bonding mode, and the asymmetric package structure has a series of defects of large parasitic electrical parameters, bending of a die under the action of thermal stress and the like. Although wire bonding has some improvements in the art, such as using Cu wire or Al ribbon wire bonding instead of Al wire, wire bonding remains the weakest link in the power device due to the relatively low strength of the connection due to the high thermal stress at the connection point. Meanwhile, the top heat dissipation of the power device cannot be achieved by the wire bonding mode, and in addition, corresponding equipment and process are needed for wire bonding, so that the manufacturing cost of the power device is high.

In carrying out the present utility model, the applicant has found that at least the following problems exist in the prior art:

Wire bonding is adopted in the existing power device package, so that poor heat dissipation effect of the power device is easily caused, and parasitic loss is increased.

Disclosure of utility model

The utility model aims to provide a power device, which solves the technical problems that the heat dissipation effect of the power device is poor and parasitic loss is increased easily caused by adopting wire bonding in the existing power device package in the prior art. The preferred technical solutions of the technical solutions provided by the present utility model can produce a plurality of technical effects described below.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The utility model provides a power device which comprises a top plate, a bottom plate, a plurality of power chips and a plurality of elastic components, wherein the top plate is provided with a plurality of first power chips; the bottom plate is a first DBC plate; each power chip is fixed on the bottom plate and is electrically connected with the top plate through one elastic component; the bottom plate is connected with the top plate through the elastic component.

Preferably, the top plate is a second DBC plate; the first DBC plate is arranged corresponding to the second DBC plate.

Preferably, the power supply further comprises a first power terminal and a second power terminal; the first power terminal is fixed on the bottom plate, and the second power terminal is fixed on the second DBC board of the top plate.

Preferably, the first power terminal is disposed at a first end of the power device, and the second power terminal is disposed at a second end of the power device.

Preferably, the materials of the first power terminal and the second power terminal are copper and/or aluminum.

Preferably, the structure of the first power terminal is S-shaped or Z-shaped, and the structure of the second power terminal is S-shaped or Z-shaped.

Preferably, the elastic component is a spring and/or a shrapnel.

Preferably, the packaging resin is further included, and the packaging resin is used for filling a power space formed between the bottom plate and the top plate.

Preferably, the encapsulation resin is an epoxy resin.

Preferably, the power chip is an IGBT chip or a MOSFET chip.

By implementing one of the technical schemes, the utility model has the following advantages or beneficial effects:

According to the utility model, the elastic component is connected with the bottom plate and the top plate, and the elastic component is connected with the power chip and the top plate on the bottom plate, so that the conduction between the bottom plate and the top plate of the power device is realized, and the input and output current can flow through the top plate, so that part of heat generated by the current is conducted onto the top plate, and the bottom plate is matched with the top plate, so that double-sided heat dissipation is realized, the heat dissipation effect is improved, meanwhile, the parasitic loss generated by wire bonding can be reduced by the elastic component, and the reliability of the power device is improved.

Drawings

For a clearer description of the technical solutions of embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art, in which:

Fig. 1 is a schematic diagram of a power device according to an embodiment of the present utility model.

In the figure: 1. a top plate; 2. a bottom plate; 3. a power chip; 4. an elastic member; 5. a first power terminal; 6. a second power terminal; 7. and (5) encapsulating the resin.

Detailed Description

For a better understanding of the objects, technical solutions and advantages of the present utility model, reference should be made to the various exemplary embodiments described hereinafter with reference to the accompanying drawings, which form a part hereof, and in which are described various exemplary embodiments which may be employed in practicing the present utility model. The same reference numbers in different drawings identify the same or similar elements unless expressly stated otherwise. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. It is to be understood that they are merely examples of processes, methods, apparatuses, etc. that are consistent with certain aspects of the present disclosure as detailed in the appended claims, other embodiments may be utilized, or structural and functional modifications may be made to the embodiments set forth herein without departing from the scope and spirit of the present disclosure.

In the description of the present utility model, it should be understood that the terms "center," "longitudinal," "transverse," and the like are used in an orientation or positional relationship based on that shown in the drawings, and are merely for convenience in describing the present utility model and to simplify the description, rather than to indicate or imply that the elements referred to must have a particular orientation, be constructed and operate in a particular orientation. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "plurality" means two or more. The terms "connected," "coupled" and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, communicatively connected, directly connected, indirectly connected via intermediaries, or may be in communication with each other between two elements or in an interaction relationship between the two elements. The term "and/or" includes any and all combinations of one or more of the associated listed items. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In order to illustrate the technical solutions of the present utility model, the following description is made by specific embodiments, only the portions related to the embodiments of the present utility model are shown.

Embodiment one:

As shown in fig. 1, the present utility model provides a power device including a top plate 1, a bottom plate 2, a plurality of power chips 3, and a plurality of elastic members 4. The bottom board 2 is a first DBC board, each power chip 3 is fixed on the bottom board 2, and each power chip 3 is electrically connected with the top board 1 through an elastic component 4. The bottom plate 2 is connected to the top plate 1 by an elastic member 4. Specifically, connect bottom plate 2 and roof 1 through elastomeric element 4, realize switching on between bottom plate 2 and the roof 1, on diverting the roof 1 with the some heat that power device during operation produced, be convenient for realize the double-sided heat dissipation of power device, improve the radiating effect. Meanwhile, the elastic component 4 replaces the traditional power module in a wire bonding mode, parasitic loss generated by wire bonding can be reduced, extra purchase or self-grinding wire bonding equipment is not needed, the manufacturing cost and the process flow of the power device are reduced, and the manufacturing efficiency is improved. Each power chip 3 on the bottom plate 2 is electrically connected with the top plate 1 through an elastic component 4, conduction between the power chip 3 and the top plate 1 is achieved, when the power device works, input and output currents flow to the top plate 1 from the power chip 3, heat generated by the currents passing through the top plate 1 can be dissipated through the top plate 1, one face of the first DBC plate, where the power chip is welded, is used for power transmission, one face of the first DBC plate, where the power chip is not welded, is used for dissipating heat, therefore double-sided heat dissipation of the power device is achieved, heat dissipation effect is improved, burning loss of the power device due to overhigh temperature is avoided, and parasitic loss generated by wire bonding can be reduced.

Each power chip 3 is fixed on the bottom plate 2 through welding by using welding flux, the welding flux is preferably solder paste or soldering lug, and the solder paste has good welding performance, so that the power chips 3 can be stably fixed on the bottom plate 2, and the service life of the power device is prolonged. The bottom plate 2 is a first DBC plate, has good thermal performance and strong heat diffusion capability when carrying the power chip 3, and the power chip 3 is welded on the DBC plate, so that the thermal resistance can be reduced, and the heat dissipation effect of the power device can be improved. Meanwhile, the DBC board also has the characteristic of strong current carrying capacity, and the power capacity of the power device can be improved.

According to the utility model, the elastic component 4 is connected with the bottom plate 2 and the top plate 1, and the elastic component 4 is connected with the power chip 3 and the top plate 1 on the bottom plate 2, so that the conduction between the bottom plate 2 and the top plate 1 of the power device is realized, and the input and output current can flow through the top plate 1, so that part of heat generated by the current is conducted onto the top plate 1, and the bottom plate 2 is matched with the top plate 1, so that double-sided heat dissipation is realized, the heat dissipation effect is improved, meanwhile, the parasitic loss generated by wire bonding can be reduced by the elastic component 4, and the reliability of the power device is improved.

As an alternative embodiment, the top plate 1 is a second DBC plate, and the first DBC plate is disposed corresponding to the second DBC plate. Specifically, the top plate 1 is a second DBC plate, has good thermal performance and strong heat diffusion capability, and is convenient for the top plate 1 to dissipate heat when the bottom plate 2 is conducted with the top plate 1. Preferably, the first DBC board and the second DBC board are disposed correspondingly, so that the elastic component 4 is convenient for connecting the first DBC board and the second DBC board, and the elastic component 4 is convenient for connecting the power chip 3 of the first DBC board and the second DBC board. The first DBC plate and the second DBC plate comprise a DBC first copper layer, a DBC ceramic layer and a DBC second copper layer, and the DBC first copper layer and the DBC second copper layer are respectively arranged on two sides of the DBC ceramic layer. In addition, the heat dissipation plate can be arranged on the first DBC plate and the second DBC plate externally, so that the heat dissipation effect of the first DBC plate and the second DBC plate can be improved, and the heat dissipation capacity of the power device is improved.

As an alternative embodiment, a first power terminal 5 and a second power terminal 6 are further included, the first power terminal 5 being fixed on the bottom plate 2, the second power terminal 6 being fixed on the second DBC board of the top plate 1. Specifically, the first power terminal 5 and the second power terminal 6 are arranged on the power device, so that the power device is convenient to be connected with other external electrical structures, and the power device can realize current input and output. The primary function of the first power terminal 5 and the second power terminal 6 is to connect high power current and conductive material, ensuring the safety and stability of current transmission. The first power terminal 5 is soldered to the bottom plate 2 by solder paste or soldering tab, the second power terminal 6 is soldered to the top plate 1 by solder paste or soldering tab, and the first power terminal 5 and the second power terminal 6 extend out of the bottom plate 2 and the top plate 1 for power output and input from the outside.

As an alternative embodiment, the first power terminal 5 is arranged at a first end of the power device and the second power terminal 6 is arranged at a second end of the power device. Specifically, the positions of the first power terminal 5 and the second power terminal 6 are set according to the actual application scene, preferably, the first power terminal 5 is arranged at the first end of the power device, the second power terminal 6 is arranged at the second end of the power device, the power input end of the power device is conveniently connected with the outside, and the power output end of the power device is connected with the outside.

As an alternative embodiment, the materials of the first power terminal 5 and the second power terminal 6 are copper and/or aluminum. In particular, the first power terminal 5 and the second power terminal 6 are preferably copper and/or aluminum. Copper has good ductility, electrical conductivity and thermal conductivity. Aluminum has good heat conducting property, good strength, ductility, formability and easy processing. In addition, the first power terminal 5 and the second power terminal 6 may be made of a solderable metal material such as copper alloy, aluminum alloy, electro-gold, nickel, tin, silver, or the like.

As an alternative embodiment, the first power terminal 5 has an S-shaped or Z-shaped structure, and the second power terminal 6 has an S-shaped or Z-shaped structure. Specifically, the structure of the first power terminal 5 is set to be S-shaped or Z-shaped, the structure of the second power terminal 6 is set to be S-shaped or Z-shaped, so that the first power terminal 5 and the second power terminal 6 can be conveniently extended out of the power space formed between the top plate 1 and the bottom plate 2 (as described in the afternoon), and meanwhile, the structure of the first power terminal 5 and the second power terminal 6 can be conveniently connected with the outside, and the structure of the first power terminal and the second power terminal 6 can be set according to actual requirements. The first power terminal 5 and the second power terminal 6 may have a structure of S shape at the same time, or a structure of Z shape at the same time, or one power terminal may have a structure of S shape and the other power terminal may have a Z shape.

As an alternative embodiment, the elastic member 4 is a spring and/or a shrapnel. Specifically, the elastic member 4 is a spring and/or a shrapnel, and can support the top plate 1, and the top plate 1 is not easy to bend under the action of thermal stress. Meanwhile, the connection strength between the spring and the top plate 1, the bottom plate 2 or the power chip 3 can be enhanced, the thermal stress at the connection part of the spring and the top plate 1, the bottom plate 2 or the power chip 3 is reduced, and the reliability of the power device is ensured.

As an alternative embodiment, an encapsulation resin 7 is further included, the encapsulation resin 7 being used to fill the power space formed between the bottom plate 2 and the top plate 1. Specifically, the bottom plate 2 and the top plate 1 are separately arranged to form a power space therebetween, and the power chip 3 and the elastic component 4 are both arranged on the power space. After the power chip 3, the first power terminal 5, the second power terminal 6 and the elastic member 4 are welded, the bottom plate 2 and the top plate 1 are fixed by a jig, and then the power space is encapsulated by the encapsulation resin 7.

As an alternative embodiment, the encapsulation resin 7 is an epoxy resin. Specifically, the epoxy resin has better heat resistance and electrical insulation, and can ensure the encapsulation effect.

As an alternative embodiment, the power chip 3 is an IGBT chip or a MOSFET chip. Specifically, the IGBT chip combines the input characteristics of a BJT (bipolar junction transistor ) and the output characteristics of a MOS (Metal-Oxide-semiconductor field-Effect Transistor).

The embodiment is a specific example only and does not suggest one such implementation of the utility model.

The foregoing is only illustrative of the preferred embodiments of the utility model, and it will be appreciated by those skilled in the art that various changes in the features and embodiments may be made and equivalents may be substituted without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. The power device is characterized by comprising a top plate (1), a bottom plate (2), a plurality of power chips (3) and a plurality of elastic components (4); the bottom plate (2) is a first DBC plate; each power chip (3) is fixed on the bottom plate (2), and each power chip (3) is electrically connected with the top plate (1) through one elastic component (4); the bottom plate (2) is connected with the top plate (1) through the elastic component (4).

2. The power device according to claim 1, characterized in that the top plate (1) is a second DBC plate; the first DBC plate is arranged corresponding to the second DBC plate.

3. The power device according to claim 2, further comprising a first power terminal (5) and a second power terminal (6); the first power terminal (5) is fixed on the bottom plate (2), and the second power terminal (6) is fixed on the second DBC board of the top plate (1).

4. A power device according to claim 3, characterized in that the first power terminal (5) is arranged at a first end of the power device and the second power terminal (6) is arranged at a second end of the power device.

5. The power device according to claim 4, characterized in that the material of the first power terminal (5) and the second power terminal (6) is copper and/or aluminum.

6. The power device according to claim 4, characterized in that the first power terminal (5) has an S-or Z-shaped structure and the second power terminal (6) has an S-or Z-shaped structure.

7. The power device according to claim 1, characterized in that the elastic member (4) is a spring and/or a shrapnel.

8. The power device according to claim 1, further comprising an encapsulation resin (7), the encapsulation resin (7) being used to fill a power space formed between the bottom plate (2) and the top plate (1).

9. The power device according to claim 8, characterized in that the encapsulation resin (7) is an epoxy resin.

10. A power device according to any of claims 1-9, characterized in that the power chip (3) is an IGBT chip or a MOSFET chip.