CN221102028U - Wafer guide machine and wafer etching equipment - Google Patents

Abstract

The utility model provides a wafer guide machine and wafer etching equipment, wherein a driving assembly of the wafer guide machine, a transmission part, a pushing part, a travel sensor, a power supply circuit and a control element are arranged at the output end of the driving assembly; the power supply circuit is used for supplying power to the driving assembly, the driving assembly is used for driving the pushing piece through the transmission piece, the pushing piece is used for pushing the wafer, the travel sensor is used for sending out a position signal when detecting the pushing piece, and the control element is used for controlling the power supply circuit to be disconnected according to the position signal so that the power supply circuit stops supplying power to the driving assembly. The utility model can avoid the wafer from being scratched or broken, and improve the yield of the wafer.

Description

Wafer guide machine and wafer etching equipment

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a wafer guide machine and wafer etching equipment.

Background

Compared with the robot wafer transfer, the wafer guide machine has the advantages of high speed and the like, and can transfer the wafers in the original wafer box into a new wafer box in a shorter time (for example, within 1 minute).

The existing wafer guide machine lacks a device for detecting the stress of the wafer when the wafer is pushed, and when the situation that the slot is deformed or burrs exist in the slot exists in the wafer box, the wafer is easily scratched or broken in the process of pushing the wafer into the wafer box, so that the yield of the wafer is reduced.

In view of the above, the present utility model provides a new wafer guide and a wafer etching apparatus, so as to at least partially solve the above problems.

Disclosure of utility model

In the summary, a series of concepts in a simplified form are introduced, which will be further described in detail in the detailed description. The summary of the utility model is not intended to define the key features and essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In order to solve the problems existing at present, the present utility model provides a wafer guide machine, which includes: a drive assembly; the transmission piece is arranged at the output end of the driving assembly; the pushing piece is movably connected with the transmission piece; the stroke sensor is arranged on the transmission piece; the power supply circuit is electrically connected with the driving assembly and is used for supplying power to the driving assembly; the control element is respectively and electrically connected with the travel sensor and the power supply circuit; the driving assembly is used for driving the pushing piece through the transmission piece, the pushing piece is used for pushing the wafer, the travel sensor is used for sending out a position signal when detecting the pushing piece, and the control element is used for controlling the power supply circuit to break according to the position signal so that the power supply circuit stops supplying power to the driving assembly.

In some embodiments of the application, the wafer guide further comprises a threaded post disposed at an end of the travel sensor remote from the pusher, the threaded post for adjusting a spacing between the travel sensor and the pusher.

In some embodiments of the present application, the transmission member is provided with a linear bearing, and the pushing member is provided with a transmission shaft, and the transmission shaft is slidably disposed in the linear bearing.

In some embodiments of the application, the wafer guide further comprises an elastic member disposed between the transmission member and the pushing member.

In some embodiments of the present application, the number of the elastic members is plural, and the plural elastic members are uniformly disposed around the center of the transmission member.

In some embodiments of the present application, the number of the stroke sensors is plural, the plurality of the stroke sensors are uniformly disposed around the center of the transmission member, and each of the stroke sensors is disposed between two adjacent elastic members, respectively.

In some embodiments of the application, the control element comprises a relay and a contactor, the relay being electrically connected to the travel sensor and the contactor, respectively, the contactor being provided to the power supply circuit; the relay is used for being disconnected when the position signal is received, and the contactor is used for breaking the power supply circuit after the relay is disconnected.

In some embodiments of the application, the contactor comprises a contactor coil and a switch contact, wherein the contactor coil is arranged on the power supply circuit, the switch contact is arranged close to the contactor coil, and the contactor coil is used for controlling the switch contact to be opened after the relay is opened so as to break the power supply circuit.

In some embodiments of the application, the surface of the pusher facing the wafer is configured as a cambered surface.

According to yet another aspect of the present application, there is provided a wafer etching apparatus comprising the wafer guide of any one of the above.

According to the wafer guide machine and the wafer etching equipment provided by the embodiment of the application, the pushing piece is movably connected with the transmission piece, when the situation that the slot is deformed or burrs exist in the slot exists in the wafer box, the wafer is limited by the wafer box, the pushing piece can be applied with a reaction force to enable the pushing piece to move in the opposite direction, when the pushing piece moves to be detected by the stroke sensor, the control element can control the power supply circuit to be disconnected according to the position signal sent by the stroke sensor, so that the power supply circuit stops supplying power to the driving assembly, the pushing piece stops pushing the wafer to enter the wafer box, and therefore, the wafer can be prevented from being scratched or broken in the process of pushing the wafer into the wafer box, and the yield of the wafer is improved.

Drawings

The following drawings are included to provide an understanding of the utility model and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the utility model and their description to explain the principles of the utility model.

Fig. 1 is a schematic diagram of a wafer guide pushing a wafer according to an embodiment of the present utility model.

Fig. 2 is a schematic diagram of a wafer guide pushing a wafer into a cassette according to one embodiment of the present utility model.

Fig. 3 shows an enlarged partial schematic view of a wafer guide according to one embodiment of the utility model.

Fig. 4 shows a schematic diagram of the structure of a power supply circuit according to an embodiment of the present utility model.

Fig. 5 shows a schematic diagram of the structure of a power supply circuit according to an embodiment of the present utility model.

In the accompanying drawings:

100. a wafer guide;

110. an electric cylinder;

111. a motor;

112. a servo amplifier;

120. an output shaft;

130. A transmission member;

140. a pushing member;

151. A stroke sensor;

152. A threaded column;

160. an elastic member;

171. A relay;

1721. A contactor coil;

1722. A switch contact;

173. A proximity switch;

200. a wafer;

300. A wafer cassette.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present utility model. It will be apparent, however, to one skilled in the art that the utility model may be practiced without one or more of these details. In other instances, well-known features have not been described in detail in order to avoid obscuring the utility model.

It should be understood that the present utility model may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art. In the drawings, the size of layers and regions, as well as the relative sizes, may be exaggerated for clarity. Like numbers refer to like elements throughout.

It will be understood that when an element or layer is referred to as being "on," "adjacent," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present utility model.

Spatially relative terms, such as "under," "below," "beneath," "under," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In the following description, for a thorough understanding of the present utility model, detailed steps and structures will be presented in order to illustrate the technical solution presented by the present utility model. Preferred embodiments of the present utility model are described in detail below, however, the present utility model may have other embodiments in addition to these detailed descriptions.

A wafer guide 100 according to one embodiment of the present application is described below with reference to fig. 1-5. Wafer guide 100 includes: the driving assembly, the transmission piece 130, the pushing piece 140, the travel sensor 151, the power supply circuit and the control element, wherein the transmission piece 130 is arranged at the output end of the driving assembly, the pushing piece 140 is movably connected with the transmission piece 130, the travel sensor 151 is arranged on the transmission piece 130, the power supply circuit is electrically connected with the driving assembly, and the control element is respectively electrically connected with the travel sensor 151 and the power supply circuit; the power supply circuit is used for supplying power to the driving assembly, the driving assembly is used for driving the pushing member 140 through the transmission member 130, the pushing member 140 is used for pushing the wafer 200, the travel sensor 151 is used for sending out a position signal when the pushing member 140 is detected, and the control element is used for controlling the power supply circuit to be disconnected according to the position signal, so that the power supply circuit stops supplying power to the driving assembly.

Specifically, the driving assembly is powered by the power supply circuit, and when the driving assembly is operated, the driving assembly transmits the driving force to the pushing member 140 through the transmission member 130, so that the pushing member 140 pushes the wafer 200 into the wafer box 300. When the slots are deformed or burrs exist in the wafer cassette during the process of the wafer 200 entering the wafer cassette 300, the wafer 200 is limited by the wafer cassette 300 and a reaction force is applied to the pushing member 140. Because the pushing member 140 is movably connected with the transmission member 130, the pushing member 140 moves in the opposite direction under the action of the reaction force applied by the wafer 200, and when the pushing member 140 moves in the opposite direction to a certain stroke, the stroke sensor 151 detects the pushing member 140. When the travel sensor 151 detects the pushing member 140, the travel sensor 151 sends a position signal to the control element, and the control element controls the power supply circuit to be disconnected after receiving the position signal, so that the power supply circuit stops supplying power to the driving assembly, the driving assembly stops driving the pushing member 140 after power failure, the pushing member 140 does not continue pushing the wafer 200, and the wafer 200 stops entering the wafer box 300, thereby avoiding the wafer 200 from being scratched or broken, and improving the yield of the wafer 200.

Based on this, the present application provides a wafer guide 100 capable of avoiding scratches or chipping of the wafer 200 during pushing of the wafer 200 into the cassette 300. According to the wafer guide machine 100 of the present application, by movably connecting the pushing member 140 with the transmission member 130, when the wafer box has a slot deformation or a burr exists in the slot, the wafer 200 is limited by the wafer box 300, a reaction force is applied to the pushing member 140 to move the pushing member 140 in the opposite direction, and when the pushing member 140 moves to be detected by the stroke sensor 151, the control element can control the power supply circuit to be disconnected according to the position signal sent by the stroke sensor 151, so that the power supply circuit stops supplying power to the driving assembly, and the pushing member 140 stops pushing the wafer 200 to enter the wafer box 300, thereby avoiding the wafer 200 from being scratched or broken in the process of pushing the wafer 200 into the wafer box 300, and improving the yield of the wafer 200.

In one example, the drive assembly includes an electric cylinder 110 and an output shaft 120, the electric cylinder 110 being electrically connected to a power supply circuit, an output of the electric cylinder 110 being connected to an input of the output shaft 120, an output of the output shaft 120 being connected to a transmission 130.

Specifically, the electric cylinder 110 is supplied with power by a power supply circuit to operate the electric cylinder 110. The electric cylinder 110 is a modularized product designed by integrating a servo motor and a screw rod, and when the electric cylinder 110 operates, the rotary motion of the servo motor can be converted into linear motion, and then the transmission member 130 is driven to linearly move through the output shaft 120, and the transmission member 130 further drives the pushing member 140 to linearly move, so that the pushing member 140 applies an entering pushing force to the wafer 200.

Illustratively, as shown in fig. 4, the servo motor may include a motor 111 and a servo amplifier 112, the power supply circuit includes a live wire L and a neutral wire N, the live wire L and the neutral wire N are respectively connected to a first end and a second end of the servo amplifier 112, the first end and the second end of the servo amplifier 112 are respectively connected to the first end and the second end of the motor 111, the servo amplifier 112 may receive a control signal and amplify the control signal into a strong electric signal capable of controlling the motor 111 to rotate in a forward direction or a reverse direction, and the motor 111 is controlled to rotate in a forward direction or a reverse direction.

The power supply circuit may provide a corresponding power supply voltage, depending on the actual power consumption of the servo motor 112. Illustratively, the voltage of the hot line L may be 24V and the voltage of the neutral line N may be 0V.

In addition, as shown in fig. 4, the live wire L and the neutral wire N may be further provided with knife switches QS, where the knife switches QS may switch on or off the power supply circuit according to the rated current of the power supply circuit, so as to protect the power supply circuit.

In one example, the power supply circuit may be implemented as a direct current circuit or an alternating current circuit, depending on the type of electric cylinder 110. For example, when the electric cylinder 110 is a dc electric cylinder 110, the power supply circuit may be a dc electric circuit, and when the electric cylinder 110 is an ac electric cylinder 110, the power supply circuit may be an ac electric circuit.

In one example, the control element includes a relay 171 and a contactor, the relay 171 being electrically connected to the stroke sensor 151 and the contactor, respectively, the contactor being provided to the power supply circuit; wherein the relay 171 is configured to open upon receipt of the position signal, and the contactor is configured to open the power supply circuit after the relay 171 is opened.

Illustratively, as shown in fig. 5, a first end A1 of the relay 171 may be electrically connected to a live wire L of the power supply circuit and the stroke sensor 151, a second end A2 of the relay 171 may be electrically connected to a first end B1 of the contactor, a second end B2 of the contactor may be electrically connected to a neutral wire N of the power supply circuit, and after receiving a position signal sent by the stroke sensor 151, the relay 171 turns off the contactor due to the disconnection of a normally closed contact in itself, and the power supply circuit is disconnected after the disconnection of the contactor, so that the power supply circuit stops supplying power to the driving assembly.

In one example, the contactor includes a contactor coil 1721 and a switch contact 1722 disposed on the power supply circuit, the switch contact 1722 disposed proximate to the contactor coil 1721, the contactor coil 1721 for controlling the switch contact 1722 to open after the relay 171 opens to open the power supply circuit.

Illustratively, as shown in fig. 5, the first end B1 of the contactor coil 1721 is electrically connected to the second end A2 of the relay 171, the second end B2 of the contactor coil 1721 is electrically connected to the neutral line N of the power supply circuit, the switch contact 1722 is disposed close to the contactor coil 1721, the first end B1 of the switch contact 1722 is electrically connected to the live line L of the power supply circuit, the second end B2 of the switch contact 1722 is electrically connected to the neutral line N of the power supply circuit, the relay 171, after receiving the position signal sent by the stroke sensor 151, opens the normally closed contact in itself to cause the contactor coil 1721 to lose electricity, the magnetic field is not generated after the contactor coil 1721 is in electricity, and the switch contact 1722 is opened, so that the power supply circuit is disconnected and stops supplying power to the driving assembly.

Illustratively, as shown in fig. 5, the second end B2 of the switch contact 1722 may be electrically connected to the proximity switch 173 first, and further electrically connected to the neutral line N of the power supply circuit through the proximity switch 173.

In one example, the transmission member 130 is provided with a linear bearing, and the pushing member 140 is provided with a transmission shaft slidably disposed in the linear bearing.

Specifically, the linear bearing is a linear motion system, and is used for matching a linear stroke with a transmission shaft, so that the transmission member 130 is movably connected with the pushing member 140. When the transmission member 130 drives the transmission shaft to move towards the wafer 200 through the linear bearing, the transmission shaft can drive the pushing member 140 to apply a driving force to the wafer 200; when the slot is deformed or burrs exist in the slot, the wafer 200 is limited by the wafer box 300 to apply a reaction force to the pushing member 140, the pushing member 140 drives the transmission shaft to move back to the wafer 200, the distance between the pushing member 140 and the transmission member 130 is shortened, and when the distance is shortened to a preset distance length, the stroke sensor 151 can detect the pushing member 140, so that a position signal is sent.

The preset interval length is that the pushing member 140 enters the detection range of the stroke sensor 151, and may be determined according to the actual situation, which is not limited.

In one example, as shown in fig. 3, the wafer guide 100 further includes an elastic member 160, and the elastic member 160 is disposed between the transmission member 130 and the pushing member 140.

Specifically, during the process that the wafer 200 is limited by the wafer cassette 300 and applies a reaction force to the pushing member 140, the pushing member 140 moves toward the driving member 130 under the action of the reaction force applied by the wafer 200, so as to drive the elastic member 160 to compress, and when the elastic member 160 is compressed to a preset compression degree, the stroke sensor 151 can detect the pushing member 140. The preset compression degree may be determined according to practical situations, for example, the preset compression degree may be 1mm or more of compression of the elastic member 160, and the like, which is not limited.

In addition, it should be noted that, only when the reaction force applied by the wafer 200 exceeds the preset force value, the pushing member 140 moves toward the driving member 130 under the action of the reaction force. It will be appreciated that the preset force value may also be determined according to the actual situation, and this is not limited.

In one example, the number of the elastic members 160 may be plural, and the plurality of elastic members 160 are uniformly disposed around the center of the driving member 130. Specifically, during the process that the wafer 200 is restricted by the wafer cassette 300 and the reaction force is applied to the pusher 140, the reaction force applied to the pusher 140 is not necessarily uniform, and the interval between the driver 130 and the pusher 140 is not equal everywhere, for example, the interval between the upper side of the driver 130 and the pusher 140 is smaller than the interval between the lower side of the driver 130 and the pusher 140, the compression degree of the elastic member 160 located at the upper side of the driver 130 is greater than the compression degree of the elastic member 160 located at the lower side of the driver 130, and at this time, the stroke sensor 151 can detect the pusher 140 as long as the compression degree of the elastic member 160 located at the upper side of the driver 130 reaches the preset compression degree.

In an exemplary embodiment, four elastic members 160 are disposed between the transmission member 130 and the pushing member 140 in fig. 1, the four elastic members 160 are disposed at four corner positions of the transmission member 130, and the stroke sensor 151 can detect the pushing member 140 as long as the compression degree of one elastic member 160 reaches the preset compression degree during the movement of the pushing member 140 towards the transmission member 130 under the reaction force exerted by the wafer 200.

Of course, the above is merely an example of four elastic members 160 disposed at four corners of the driving member 130, and it is understood that other numbers and positions of the elastic members 140 are also possible, which is not limited in the present application.

In one example, the elastic member 160 may be a spring, a shrapnel, or the like, which is not limited. Taking the elastic member 160 as an example, the spring may be sleeved on the outer circumferential surface of the transmission shaft.

In one example, as shown in fig. 3, the wafer guide 100 further includes a threaded post 152, the threaded post 152 being disposed at an end of the travel sensor 151 remote from the pusher 140, the threaded post 152 being used to adjust the spacing between the travel sensor 151 and the pusher 140.

Illustratively, the end of the stroke sensor 151 facing the pushing direction is the first end of the stroke sensor 151, the end of the stroke sensor 151 facing away from the pushing direction is the second end of the stroke sensor 151, the threaded post 152 is disposed at the first end of the stroke sensor 151, and by rotating the threaded post 152, the distance between the second end of the stroke sensor 151 and the pushing member 140 can be adjusted, so that the stroke sensor 151 can timely detect that the wafer 200 is limited by the wafer box 300, so as to avoid that the distance between the second end of the stroke sensor 151 and the pushing member 140 is too far, the wafer 200 is scratched due to excessive stress or the pushing member 140 is not yet detected by the broken piece stroke sensor 151, or the distance between the second end of the stroke sensor 151 and the pushing member 140 is too close, when the pushing member 140 receives the reaction force applied by the wafer 200, the distance between the pushing member 140 and the driving member 130 is not yet shortened to a specified extent, and the pushing member 140 has been detected by the sensor 151.

In one example, the number of the stroke sensors 151 may be plural, the plurality of the stroke sensors 150 are uniformly disposed around the center of the transmission member 130, and each of the stroke sensors 151 is disposed between two adjacent elastic members 160, respectively. Specifically, as described above, in the process that the wafer 200 is restricted by the wafer cassette 300 to apply the reaction force to the pusher 140, the reaction force applied to the pusher 140 is not necessarily uniform, the distance between the pusher 140 and the driver 130 is not equal everywhere, for example, the distance between the upper side of the driver 130 and the pusher 140 is smaller than the distance between the lower side of the driver 130 and the pusher 140, when the pusher 140 moves in the opposite direction to a certain stroke, there is a case that the distance between the upper side of the driver 130 and the pusher 140 is smaller than or equal to the preset interval length, but the distance between the lower side of the driver 130 and the pusher 140 is still greater than the preset interval length, at this time, the stroke sensor 151 disposed on the upper side of the driver 130 may detect the position of the pusher 140, and a position signal is generated, so that the pusher 140 does not continue pushing the wafer 200 any more, and the wafer 200 is prevented from being scratched or broken.

Illustratively, the transmission member 130 in fig. 1 is provided with four stroke sensors 151, the stroke sensors 151 are respectively disposed at four sides of the transmission member 130, and each stroke sensor 151 is respectively disposed between two adjacent elastic members 160. In the process that the pushing member 140 moves towards the transmission member 130 under the action of the reaction force applied by the wafer 200, as long as one stroke sensor 151 detects that the distance between the transmission member 130 and the pushing member 140 reaches the preset interval length, the stroke sensor 151 can send out a position signal, so that the pushing member 140 does not continue pushing the wafer 200 any more, and the wafer 200 is prevented from being scratched or broken.

Of course, the above is merely an example in which four stroke sensors 151 are disposed on four sides of the transmission member 130, and it is understood that other numbers and positions of the elastic members 140 are also possible, which is not limited in this regard.

In one example, the surface of pusher member 140 facing wafer 200 is configured as a cambered surface.

Specifically, the surface of the pusher member 140 facing the wafer 200 may be configured as a curved surface that mates with the sidewall of the wafer 200, such that the pusher member 140 may achieve a tight fit with the wafer 200 to better apply a pushing force to the wafer 200.

Illustratively, the surface of the pusher member 140 facing the wafer 200 may be configured as an arcuate surface.

According to yet another aspect of the present application, there is also provided a wafer etching apparatus. The wafer etching apparatus includes a wafer guide.

The wafer guide may be implemented as the wafer guide 100 described above, and reference may be made to the above description, which is not repeated herein.

In summary, according to the wafer guide machine and the wafer etching device provided by the embodiments of the present application, by movably connecting the pushing member with the transmission member, when the slot is deformed in the wafer box or burrs exist in the slot, the wafer is limited by the wafer box, a reaction force is applied to the pushing member to move the pushing member in the opposite direction, and when the pushing member moves to be detected by the stroke sensor, the control element can control the power supply circuit to be disconnected according to the position signal sent by the stroke sensor, so that the power supply circuit stops supplying power to the driving assembly, and the pushing member stops pushing the wafer into the wafer box, thereby avoiding wafer scratches or fragments in the process of pushing the wafer into the wafer box, and improving the yield of the wafer.

Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the above illustrative embodiments are merely illustrative and are not intended to limit the scope of the present application thereto. Various changes and modifications may be made therein by one of ordinary skill in the art without departing from the scope and spirit of the application. All such changes and modifications are intended to be included within the scope of the present application as set forth in the appended claims.

Similarly, it should be appreciated that in order to streamline the application and aid in understanding one or more of the various application aspects, various features of the application are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the application. However, the method of the present application should not be construed as reflecting the following intent: i.e., the claimed application requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this application.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

It should be noted that the above-mentioned embodiments illustrate rather than limit the application, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names.

Claims (10)

1. A wafer guide, the wafer guide comprising:

A drive assembly;

the transmission piece is arranged at the output end of the driving assembly;

The pushing piece is movably connected with the transmission piece;

the stroke sensor is arranged on the transmission piece;

the power supply circuit is electrically connected with the driving assembly and is used for supplying power to the driving assembly;

The control element is respectively and electrically connected with the travel sensor and the power supply circuit;

the driving assembly is used for driving the pushing piece through the transmission piece, the pushing piece is used for pushing the wafer, the travel sensor is used for sending out a position signal when detecting the pushing piece, and the control element is used for controlling the power supply circuit to break according to the position signal so that the power supply circuit stops supplying power to the driving assembly.

2. The wafer guide of claim 1, further comprising a threaded post disposed at an end of the travel sensor remote from the pusher, the threaded post for adjusting a spacing between the travel sensor and the pusher.

3. The wafer guide apparatus of claim 1, wherein the transmission member is provided with a linear bearing, the pusher member is provided with a transmission shaft, and the transmission shaft is slidably disposed in the linear bearing.

4. The wafer guide according to any of claims 1-3, further comprising an elastic member disposed between the transmission member and the pusher member.

5. The wafer guide apparatus of claim 4, wherein the number of elastic members is plural, and the plural elastic members are uniformly disposed around the center of the transmission member.

6. The wafer guide apparatus of claim 5, wherein the number of the stroke sensors is plural, the plurality of the stroke sensors are uniformly disposed around the center of the transmission member, and each of the stroke sensors is disposed between two adjacent elastic members, respectively.

7. The wafer guide apparatus of claim 1, wherein the control element comprises a relay and a contactor, the relay being electrically connected to the travel sensor and the contactor, respectively, the contactor being disposed in the power supply circuit;

The relay is used for being disconnected when the position signal is received, and the contactor is used for breaking the power supply circuit after the relay is disconnected.

8. The wafer guide apparatus of claim 7, wherein the contactor comprises a contactor coil and a switch contact disposed on the power circuit, the switch contact disposed proximate to the contactor coil, the contactor coil to control the switch contact to open after the relay opens to break the power circuit.

9. The wafer guide apparatus of claim 1, wherein a surface of the pusher facing the wafer is configured as a cambered surface.

10. A wafer etching apparatus, characterized in that it comprises a wafer guide as claimed in any one of claims 1 to 9.