CN221101410U

CN221101410U - Fingerprint module and electronic equipment

Info

Publication number: CN221101410U
Application number: CN202322492295.6U
Authority: CN
Inventors: 刘文拯; 刘凯
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2023-09-12
Filing date: 2023-09-12
Publication date: 2024-06-07
Anticipated expiration: 2033-09-12

Abstract

The embodiment of the application provides a fingerprint module and electronic equipment, the fingerprint module comprises: the ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, wherein a second electrode layer is arranged on the substrate, one side of the acoustic layer is electrically connected with the second electrode layer, the other side of the acoustic layer is electrically connected with one side of the first electrode layer, and the protective layer covers the other side of the first electrode layer; the substrate is provided with a first electric connection area, the first electrode layer and the second electrode layer are respectively and electrically connected with the first electric connection area, the circuit board is provided with a second electric connection area, and the first electric connection area is electrically connected with the second electric connection area through a conductive adhesive layer; the circuit board is electrically connected with the processing unit outside the fingerprint module, the acoustic layer is used for transmitting ultrasonic signals and receiving ultrasonic signals reflected by an external structure, and the ultrasonic sensor is used for converting the ultrasonic signals received by the acoustic layer into electric signals and sending the electric signals to the processing unit through the circuit board. The fingerprint module has higher applicability.

Description

Fingerprint module and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of fingerprint modules, in particular to a fingerprint module and electronic equipment.

Background

With the development of consumer electronics industry, including but not limited to, the development of display screens for mobile communication devices toward full-screen, consumers have increased and decreased demand for off-screen fingerprint recognition technology. There are two main types of off-screen fingerprint recognition schemes disclosed: the first is an optical solution and the second is an ultrasonic solution. The performance of the optical fingerprint module is greatly affected by the light transmittance of the screen, and the optical transmittance of the screen is reduced along with the improvement of the wiring complexity in the display screen and the development of the flexible screen scheme, so that the optical fingerprint scheme cannot meet the application requirements. The ultrasonic fingerprint module is not dependent on the optical transmissivity of the screen, and is a good alternative.

The pixel circuit of the ultrasonic sensor in the existing ultrasonic fingerprint scheme is formed on a glass substrate by adopting a thin film transistor process.

However, the pixel integration level of the ultrasonic sensor manufactured by the thin film transistor process is low, the stability is poor, the driving performance is poor, the size of the ultrasonic sensor is large, the occupied space of the ultrasonic fingerprint module is large, and the requirement of the mobile terminal on the space utilization rate cannot be met, so that a new technical scheme of the ultrasonic fingerprint module is needed to meet the requirement of the application of the current under-screen fingerprint identification.

Disclosure of utility model

In view of the above, an embodiment of the present application provides a fingerprint module and an electronic device to at least partially solve the above-mentioned problems.

According to a first aspect of an embodiment of the present application, there is provided a fingerprint module, including: an ultrasonic sensor and a circuit board; the ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, wherein a second electrode layer is arranged on the substrate, one side of the acoustic layer is electrically connected with the second electrode layer, the other side of the acoustic layer is electrically connected with one side of the first electrode layer, the protective layer covers the other side of the first electrode layer, the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in a range of [44 mu m,50 mu m ], and the thickness of the substrate is in a range of [85 mu m,115 mu m ]; the substrate is provided with a first electric connection area, the first electrode layer and the second electrode layer are respectively and electrically connected with the first electric connection area, the circuit board is provided with a second electric connection area, and the first electric connection area and the second electric connection area are electrically connected through a conductive adhesive layer; the circuit board is electrically connected with a processing unit outside the fingerprint module, the acoustic layer is used for transmitting ultrasonic signals and receiving ultrasonic signals reflected by an external structure, the ultrasonic sensor is used for converting the ultrasonic signals received by the acoustic layer into electric signals and sending the electric signals to the processing unit through the circuit board so that the processing unit can conduct fingerprint identification based on the electric signals, and the frequency range of the ultrasonic signals transmitted by the acoustic layer is [9MHz,11MHz ].

According to a second aspect of an embodiment of the present application, there is provided an electronic device including: the fingerprint module is arranged on the back of the screen, and the processing unit is electrically connected with a circuit board in the fingerprint module.

According to the fingerprint module provided by the embodiment of the application, the fingerprint module comprises the ultrasonic sensor and the circuit board, the ultrasonic sensor comprises the acoustic layer, the substrate, the first electrode layer and the protective layer, the ultrasonic sensor can transmit and receive reflected ultrasonic signals through the acoustic layer, the ultrasonic signal received by the acoustic layer can be converted into an electric signal, and the electric signal is transmitted to the processing unit outside the fingerprint module through the circuit board, so that the ultrasonic fingerprint identification can be completed.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

FIG. 1 is a schematic diagram of a fingerprint module according to an embodiment of the present application;

FIG. 2 is a schematic view of a substrate of an ultrasonic sensor according to an embodiment of the present application;

FIG. 3 is a schematic view of a first electrical connection region according to an embodiment of the present application;

FIG. 4 is a schematic illustration of an adhesive layer provided in accordance with an embodiment of the present application;

FIG. 5 is a schematic diagram of a circuit board according to an embodiment of the present application;

FIG. 6 is a schematic diagram of an electronic device according to an embodiment of the present application;

Fig. 7 is a schematic diagram of a specific application scenario of a fingerprint module provided in an embodiment of the present application;

FIG. 8 is a front view of a connection relationship between a fingerprint module and a non-folding screen according to an embodiment of the present application;

FIG. 9 is a cross-sectional view of a connection relationship between a fingerprint module and a non-folding screen according to an embodiment of the present application;

FIG. 10 is a front view of another fingerprint module connected to a non-folding screen according to an embodiment of the present application;

FIG. 11 is a cross-sectional view of another connection relationship between a fingerprint module and a non-folding screen according to an embodiment of the present application;

FIG. 12 is a front view of a connection between a fingerprint module and a folding screen according to an embodiment of the present application;

FIG. 13 is a cross-sectional view of a connection between a fingerprint module and a folding screen according to an embodiment of the present application;

FIG. 14 is a front view of another fingerprint module connected to a folding screen according to an embodiment of the present application;

Fig. 15 is a cross-sectional view of another connection relationship between a fingerprint module and a folding screen according to an embodiment of the present application.

Detailed Description

In order to better understand the technical solutions in the embodiments of the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the present application, shall fall within the scope of protection of the embodiments of the present application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "in response to a determination" depending on the context.

Fig. 1 is a schematic diagram of a fingerprint module according to an embodiment of the present application, and as shown in fig. 1, a fingerprint module 100 includes: an ultrasonic sensor 101 and a circuit board 102.

The ultrasonic sensor 101 includes a substrate 1011, an acoustic layer 1013, a first electrode layer 1014, and a protective layer 1015, a second electrode layer 1012 is provided on the substrate 1011, one side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, the other side of the acoustic layer 1013 is electrically connected to one side of the first electrode layer 1014, the protective layer 1015 covers the other side of the first electrode layer 1014, wherein the sum of thicknesses of the acoustic layer 1013, the first electrode layer 1014, and the protective layer 1015 ranges from [44 μm,50 μm ], and the thickness of the substrate 1011 ranges from [85 μm,115 μm ]. The substrate 1011 is provided with a first electrical connection region 1016, the first electrode layer 1014 and the second electrode layer 1012 are electrically connected to the first electrical connection region 1016, respectively, the circuit board 102 is provided with a second electrical connection region 1021, and the first electrical connection region 1016 and the second electrical connection region 1021 are electrically connected by the conductive adhesive layer 103.

The circuit board 102 is electrically connected with a processing unit outside the fingerprint module 100, the acoustic layer 1013 is configured to transmit an ultrasonic signal and receive the ultrasonic signal reflected by an external structure, the ultrasonic sensor 101 is configured to convert the ultrasonic signal received by the acoustic layer 1013 into an electrical signal, and send the electrical signal to the processing unit through the circuit board 102, so that the processing unit performs fingerprint recognition based on the electrical signal, wherein a frequency range of the ultrasonic signal transmitted by the acoustic layer 1013 is [9mhz,11mhz ].

The substrate 1011 of the ultrasonic sensor 101 is a silicon substrate, the substrate 1011 is provided with the second electrode layer 1012, and the second electrode layer 1012 and the substrate 1011 may be integrally formed, for example: the second electrode layer 1012 may be a transistor formed over a silicon substrate, and the second electrode layer 1012 may be a metal plate provided over the substrate 1011. One side of the acoustic layer 1013 is electrically connected to the second electrode layer 1012, the other side of the acoustic layer 1013 is electrically connected to the first electrode layer 1014, and the first electrode layer 1014 may be a conductive metal layer, for example: a conductive metal layer such as a silver layer or a copper layer. Alternatively, taking the first electrode layer 1014 as an example of a silver layer, one or more layers of silver paste may be coated on the other side of the acoustic layer 1013 to form the first electrode layer 1014.

The ultrasonic sensor 101 further includes a protective layer 1015, and the protective layer 1015 covers the other side of the first electrode layer 1014. The protective layer 1015 may prevent oxidation of the first electrode layer 1014 (e.g., a silver layer formed of silver paste) or degradation of the performance of the acoustic layer 1013, and the protective layer 1015 may also act as an insulating layer to prevent shorting between the first electrode layer 1014 and other structures.

The acoustic layer 1013 may transmit an ultrasonic signal and receive an ultrasonic signal reflected by an external structure. In an exemplary application scenario, the external structure may be a finger of a user (referring to the example shown in fig. 7, where the finger is denoted by reference numeral 300), the fingerprint module 100 may be used for under-screen fingerprint recognition, after the user touches a specific area of the screen with the finger, the acoustic layer 1013 of the ultrasonic sensor 101 in the fingerprint module 100 emits an ultrasonic signal, the user's finger reflects at least a part of the ultrasonic signal, and the acoustic layer 1013 receives the ultrasonic signal reflected back by the user's finger.

The ultrasonic sensor 101 may process the ultrasonic signal received by the acoustic layer 1013 into an electrical signal. Alternatively, an ultrasonic signal processing circuit is formed on the substrate 1011 in the ultrasonic sensor 101, and the ultrasonic signal processing circuit may process a received ultrasonic signal into an electric signal. After the ultrasonic sensor 101 processes the received ultrasonic signal into an electrical signal, the electrical signal may be transmitted to a processing unit external to the fingerprint module 100 through the circuit board 102, so that the processing unit can perform fingerprint recognition based on the electrical signal.

The conductive adhesive layer 103 may be any conductive adhesive layer 103 structure, for example: may be a conductive adhesive. In some alternative embodiments, the conductive adhesive layer 103 may be an anisotropic conductive film (Anisotropic Conductive Film, ACF). The anisotropic conductive adhesive film has the characteristics of vertical conduction and parallel non-conduction. Through anisotropic conductive adhesive film (i.e., conductive adhesive layer 103), first electrical connection area 1016 of ultrasonic sensor 101 can be reliably electrically connected with second electrical connection area 1021 on circuit board 102, and both can be electrically connected in a pressing manner, so that complexity of manufacturing process of fingerprint module 100 is simplified, and application requirements can be met more conveniently. Optionally, the anisotropic conductive film has a thickness of 1-5 μm after being laminated by the first electric connection region 1016 and the second electric connection region 1021.

Optionally, as shown in fig. 1, after the first electrical connection region 1016 and the second electrical connection region 1021 are electrically connected by the conductive adhesive layer 103 (e.g., anisotropic conductive adhesive film), a protective adhesive (e.g., protective adhesive 105 shown in fig. 9, 11, 13, and 15) is covered on a side of the conductive adhesive layer 103 beyond the substrate, and the protective adhesive is in contact with at least the substrate 1011, the conductive adhesive layer 103, and the circuit board 102.

The portion of the conductive adhesive layer 103 beyond the substrate 1011 can be protected by the protective paste, damage to the portion of the conductive adhesive layer 103 beyond the substrate 1011 can be prevented, and short-circuiting due to exposure of the portion of the conductive adhesive layer 103 to the outside can be prevented, and the circuit board 102 can be prevented from being separated from the ultrasonic sensor 101 due to contact of the protective paste with the substrate 1011 and the circuit board 102 (for example, as shown in fig. 9, 11, 13 and 15), improving stability.

The fingerprint module 100 may be mounted on an electronic device in use. The embodiment of the application does not limit the types of electronic equipment, and the electronic equipment can comprise, but is not limited to, mobile phones, tablet computers and the like, or can also be other electronic equipment needing fingerprint identification functions. The processing unit may be any processing unit external to the fingerprint module 100, and optionally, the processing unit may be a processing unit in the electronic device, which will be described in detail below, and will not be described in detail herein.

In the embodiment of the application, the fingerprint module 100 comprises the ultrasonic sensor 101 and the circuit board 102, the ultrasonic sensor 101 comprises the acoustic layer 1013, the substrate 1011, the first electrode layer 1014 and the protective layer 1015, the ultrasonic signals received by the acoustic layer 1013 can be transmitted and received by the acoustic layer 1013, the ultrasonic sensor 101 can convert the ultrasonic signals received by the acoustic layer 1013 into electric signals, and the electric signals are transmitted to the processing unit outside the fingerprint module 100 by the circuit board 102, thereby completing the ultrasonic fingerprint recognition.

In one possible implementation, the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014, and the protective layer 1015 is 47 μm, the thickness of the substrate 1011 is 90 μm, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 10MHz.

In the embodiment of the present application, the sum of the thicknesses of the acoustic layer 1013, the first electrode layer 1014 and the protective layer 1015 is 40 μm, and the thickness of the substrate 1011 is 90 μm, so that the performance and thickness of the ultrasonic sensor 101 can be balanced, the minimum thickness can be maintained under the condition of low performance attenuation, and the frequency of the ultrasonic signal emitted by the acoustic layer 1013 is 10MHz, so that the ultrasonic sensor 101 and the electronic device with the thicknesses penetrated by the ultrasonic waves can be realized, and the fingerprint module 100 can be suitable for electronic devices with high space utilization requirements (such as devices requiring fingerprint identification, such as mobile phones and tablet computers), so that the fingerprint module 100 has high applicability and can meet the application requirements of the electronic devices.

Fig. 2 is a schematic diagram of a substrate of an ultrasonic sensor according to an embodiment of the present application, as shown in fig. 2, the second electrode layer 1012 includes a plurality of complementary metal oxide semiconductors 10111 formed on the substrate 1011, and at least part of the complementary metal oxide semiconductors 10111 in the plurality of complementary metal oxide semiconductors 10111 are electrically connected to one side of the acoustic layer 1013. The first electrode layer 1014 and the second electrode layer 1012 may provide the acoustic layer 1013 with voltages required to transmit and receive ultrasonic signals.

The substrate 1011 includes a plurality of complementary metal oxide semiconductors (Complementary Metal Oxide Semiconductor, CMOS) 10111, at least some of the CMOS are distributed in a matrix form to form a second electrode layer 1012, a voltage difference can be formed between the second electrode layer 1012 and the first electrode layer 1014, so that the power can be supplied to the acoustic layer 1013, each CMOS corresponds to a "pixel" when fingerprint identification is performed, after the acoustic layer 1013 receives an ultrasonic signal reflected by an external structure (such as a finger), the voltage signal converted by each CMOS is different according to the intensity of the ultrasonic signal, the ultrasonic signal processing circuit of the ultrasonic sensor 101 calculates the voltage signal of each CMOS through an algorithm, and sends each voltage signal to the processing unit, and the processing unit processes and outputs a fingerprint image based on each voltage signal to perform fingerprint identification.

In an example, as shown in fig. 2, the substrate 1011 has an identification area AA and a non-identification area NAA, wherein the identification area AA is an area on the ultrasonic sensor 101 capable of fingerprint identification, at least part of the acoustic layer 1013 is located within the identification area AA, the second electrode layer 1012 is formed by at least part of the CMOS tube located in the identification area AA, the non-identification area NAA is an area on the ultrasonic sensor 101 incapable of fingerprint identification, which includes an area other than the identification area AA, and the non-identification area NAA may be used to carry some other component of the ultrasonic sensor 101, such as the first electrical connection area 1016. The size of the identification area AA is not particularly limited, and the application can meet the requirement.

Alternatively, the first electrode layer 1014 may be electrically connected to a ground line on the circuit board 102 through the first electrical connection region 1016, whereby the first electrode layer 1014 may serve as a cathode layer to ground, the second electrode layer 1012 may serve as an anode layer, and a voltage difference may be formed between the second electrode layer 1012 and the first electrode layer 1014 when an external press is received (e.g., when finger-pressed for fingerprint recognition), at which time the power may be supplied to the acoustic layer 1013 to supply the voltage required for transmitting and receiving an ultrasonic signal to the acoustic layer 1013.

In one example, the acoustic layer 1013 in the present application may comprise a piezoelectric material. The piezoelectric material of the acoustic layer 1013 may be supplied with a voltage through the first electrode layer 1014 and the second electrode layer 1012, so that the acoustic layer 1013 may emit an ultrasonic signal and receive an ultrasonic signal reflected by an external structure based on a piezoelectric effect of the piezoelectric material. Alternatively, the piezoelectric material of the acoustic layer 1013 may be a film layer, which may be made using a coating process. The piezoelectric material is not limited in the present application, and for example, the piezoelectric material may be polyvinylidene fluoride (Polyvinylidene fluoride, PVDF) material, including but not limited to PVDF and its copolymers. Based on this, the acoustic layer 1013 of the present application includes a PVDF material layer, which can effectively meet the requirements of emitting an ultrasonic signal and receiving an ultrasonic signal reflected by an external structure.

In the embodiment of the present application, the second electrode layer 1012 includes a plurality of CMOS formed on the substrate 1011, whereby the acoustic layer 1013 can be supplied with power through the second electrode layer 1012 and the first electrode layer 1014, and since the ultrasonic sensor 101 is a CMOS ultrasonic sensor 101. Compared with the ultrasonic sensor 101 manufactured by the thin film transistor process, the pixel integration level of the CMOS ultrasonic sensor 101 is higher, the stability is higher, and the driving performance is better, and the CMOS ultrasonic sensor 101 is manufactured based on the CMOS process, the size is smaller, and the second electrode layer 1012 is a plurality of CMOS formed on the substrate 1011, so that the second electrode layer 1012 does not need to be additionally arranged, the thickness is thinner, and the application requirements of the electronic device on the performance and the space can be simultaneously satisfied.

In one possible implementation, as shown in fig. 1 and 2, the first electrical connection region 1016 is located on the same side of the substrate 1011 as the second electrode layer 1012.

In the embodiment of the present application, the first electrical connection region 1016 and the second electrode layer 1012 are located on the same side of the substrate 1011, so that the second electrode layer 1012 formed on the substrate 1011 can be electrically connected to the first electrical connection region without requiring complicated wiring, and the first electrical connection region 1016 and the first electrode layer 1014 can be electrically connected, and the formation process of the ultrasonic sensor 101 can be made simpler because complicated wiring is not required.

Fig. 3 is a schematic diagram of a first electrical connection area provided in an embodiment of the present application, as shown in fig. 3, the first electrical connection area 1016 includes a plurality of pins 10161 arranged side by side, a width W of each pin 10161 in the plurality of pins 10161 is 0.09mm, a length L of each pin 10161 ranges from [0.3mm,0.385mm ], a distance N between two adjacent pins 10161 is 0.07mm, and at least a portion of the plurality of pins 10161 is electrically connected to the second electrical connection area 1021.

Alternatively, a passivation layer may be formed on the substrate 1011 of the ultrasonic sensor 101. The first electrical connection region 1016 may be fabricated in the present application in either manner 1 or manner 2 as follows:

Mode 1: a layer of RDL trace may be formed on the passivation layer surface of the substrate 1011 of the ultrasonic sensor 101 by a redistribution layer (Redistribution Layer, RDL) process, where one end of the RDL trace is electrically connected to the outgoing line location of the ultrasonic sensor 101 where the outgoing line is required, and the RDL trace may form the pin 10161 of the first electrical connection region 1016.

Mode 2: the area for forming the plurality of pins 10161 of the first electrical connection region 1016 may be increased in advance under the appearance position of the ultrasonic sensor 101 at the time of chip design of the ultrasonic sensor 101, and the passivation layer surface of the substrate 1011 of the ultrasonic sensor 101 is windowed to expose the area, and then a conductive layer of an appropriate thickness (the manner of providing the conductive layer is not limited here, and may be implemented by Au plating or the like) is provided on the area to form the pins 10161 of the first electrical connection region 1016.

Both of these ways may be used to create a first electrical connection region 1016 comprising a plurality of pins 10161, which may be selected as desired, and the application is not limited in this regard. Of course, the first electrical connection region 1016 including the plurality of pins 10161 may be formed in other manners, which are not limiting in this disclosure.

Alternatively, the surface of the lead 10161, i.e., the connection side of the lead 10161 and the conductive adhesive layer 103, may be provided with a conductive plating layer, which may be made into a conductive film shape. Because the pins 10161 are recessed to a certain extent (e.g., 1 μm to 2 μm) under the influence of some manufacturing processes when the pins 10161 are manufactured, the conductive plating layer is additionally arranged on the pins 10161 in the application, which is favorable for protecting the pins 10161, and can raise the recesses of the pins 10161, so that the requirements of the pins 10161 for electrical connection through the conductive adhesive layer 103 (e.g., ACF conductive adhesive film) can be better adapted.

The application does not limit the material of the conductive coating and can meet the requirement. Optionally, the conductive plating layer includes at least one of an ITO (Indium Tin Oxides, indium tin metal oxide) plating layer, a Ti plating layer (i.e., titanium plating layer), a Ni plating layer (i.e., nickel plating layer), an Ag plating layer (i.e., silver plating layer), an Au plating layer (i.e., gold plating layer).

In the embodiment of the present application, the first electrical connection area 1016 includes a plurality of pins 10161, the width W of each pin 10161 is 0.09mm, the length L of each pin 10161 ranges from [0.3mm,0.385mm ], and the distance N between two adjacent pins 10161 is 0.07mm, so that the first electrical connection area 1016 and the second electrical connection area 1021 can be electrically connected, and a certain distance N is provided between two adjacent pins 10161 in the embodiment of the present application, so that the heat dissipation function of the pins 10161 can be improved, and overheating of the first electrical connection area 1016 can be avoided.

In one possible implementation, the fingerprint module 100 further includes: an adhesive layer 104. Fig. 4 is a schematic diagram of an adhesive layer provided in an embodiment of the present application, as shown in fig. 4, the adhesive layer 104 includes a first double sided tape 1041, a first copper foil layer 1042 and a second double sided tape 1043, one side of the first copper foil layer 1042 is adhered to one side of the first double sided tape 1041, the other side of the first copper foil layer 1042 is adhered to one side of the second double sided tape 1043, the other side of the second double sided tape 1043 is adhered to a substrate 1011, and the second double sided tape 1043 and the acoustic layer 1013 are respectively located on two sides of the substrate 1011. The other side of the first double sided tape 1041 may be adhered to an electronic device outside the fingerprint module 100.

In the embodiment of the present application, the fingerprint module 100 further includes the adhesive layer 104, and the adhesive layer 104 can bond the fingerprint module 100 to an electronic device, and since the adhesive layer 104 includes the first double sided tape 1041, the first copper foil layer 1042 and the second double sided tape 1043, the adhesive layer 104 has higher strength and can buffer and insulate between the fingerprint module 100 and an external electronic device.

In one possible implementation, the thickness of the first double sided tape 1041 in the adhesive layer 104 is 6 μm, the thickness of the first copper foil layer 1042 is 6 μm, and the thickness of the second double sided tape 1043 is 3 μm; or the thickness of the first double sided tape 1041 is 6 μm, the thickness of the first copper foil layer 1042 is 35 μm, and the thickness of the second double sided tape 1043 is 6 μm; or the thickness of the first double sided tape 1041 is 6 μm, the thickness of the first copper foil layer 1042 is 16 μm, and the thickness of the second double sided tape 1043 is 6 μm.

In the embodiment of the present application, the adhesive layer 104 may be a double-sided tape with different thickness according to different electronic devices, for example: for ultrathin electronic equipment, the first double-sided adhesive 1041 with the thickness of 6 μm, the first copper foil layer 1042 with the thickness of 6 μm and the second double-sided adhesive 1043 with the thickness of 3 μm can be selected, so that the fingerprint module 100 can be adhered to different electronic equipment, and the requirements of different adhesive thicknesses and different adhesive strengths can be met, and the applicability is higher.

Fig. 5 is a schematic diagram of a circuit board according to an embodiment of the present application, and as shown in fig. 5, a circuit board 102 includes a flexible circuit board, where the flexible circuit board includes a first cover film 1022, a first copper-deposition layer 1023, a second copper foil layer 1024, a base material layer 1025, a third copper foil layer 1026, a second copper-deposition layer 1027, and a second cover film 1028. One side of the first cover film 1022 is attached to one side of the first copper deposition layer 1023, the other side of the first copper deposition layer 1023 is attached to one side of the second copper foil layer 1024, the other side of the second copper foil layer 1024 is attached to one side of the base material layer 1025, the other side of the base material layer 1025 is attached to one side of the third copper foil layer 1026, the other side of the third copper foil layer 1026 is attached to one side of the second copper deposition layer 1027, and the other side of the second copper deposition layer 1027 is attached to one side of the second cover film 1028.

At one end of the circuit board 102, the first cover film 1022, the first copper-deposition layer 1023, and the second copper foil layer 1024 are retracted relative to the substrate layer 1025 by a first distance h1, the third copper foil layer 1026 and the second copper-deposition layer 1027 are retracted relative to the substrate layer 1025 by a second distance h2, the second cover film 1028 is retracted relative to the substrate layer 1025 by a third distance h3, the first distance h1 is greater than the second distance h2, and the third distance h3 is greater than the second distance h2, wherein the second cover film 1028 is retracted relative to the third copper foil layer 1026 and the second copper-deposition layer 1027 to form a second electrical connection region 1021.

Alternatively, as shown in fig. 5, a electroless nickel plating process may be performed on the second electric connection region 1021 formed by retracting the second cover film 1028 with respect to the third copper foil layer 1026 and the second copper deposit 1027, and a plating layer 1029 may be formed on the exposed second copper deposit 1027 to prevent rust corrosion of the exposed second copper deposit 1027.

In the embodiment of the present application, the circuit board 102 may include the flexible circuit board 102, so that the space requirement of the electronic device is ensured by bending the circuit board 102 during the connection, and the first cover film 1022, the first copper foil layer 1023 and the second copper foil layer 1024 are retracted by a first distance h1 relative to the substrate layer 1025, so that the reliability of the flexible circuit board 102 may be improved, the third copper foil layer 1026 and the second copper foil layer 1027 are retracted by a second distance h2 relative to the substrate layer 1025, so that the edge of the circuit board 102 may be flattened during the cutting of the circuit board 102, and the second cover film 1028 is retracted by a second electrical connection area 1021 relative to the third copper foil layer 1026 and the second copper foil layer 1027, so that the circuit board 102 and the first electrical connection area 1016 may be electrically connected through the conductive adhesive layer 103, and the conductivity is improved.

Fig. 6 is a schematic diagram of an electronic device according to an embodiment of the present application. As shown in fig. 6, the electronic device 200 includes: the processing unit 210, and the fingerprint module 100 in any of the above embodiments. Specifically, the processing unit 210 may be a "processing unit external to the fingerprint module 100" in the foregoing fingerprint module 100 embodiment, where the processing unit 210 is electrically connected to a circuit board in the fingerprint module 100, and the processing unit 210 may receive an electrical signal sent by an ultrasonic sensor in the fingerprint module 100 through the circuit board, and perform fingerprint identification based on the electrical signal. The processing unit 210 may include at least one chip capable of data processing, such as CPU, GPU, MCU, DSP, FPGA or the like.

Optionally, when fingerprint identification is performed based on the electrical signal, the processing unit 210 in the present application may process the electrical signal through an image processing circuit and/or an image processing algorithm to generate a fingerprint image, and compare the fingerprint image with a pre-stored fingerprint image to implement the fingerprint identification function.

The application is not limited to the type of electronic device 200, and the electronic device 200 may include, but is not limited to, a mobile phone, a tablet computer, etc., or may be other electronic devices that require fingerprint recognition functions, such as a fingerprint lock, etc.

The embodiment of the application does not limit the setting position of the fingerprint module 100 on the electronic device 200, and can be set at any suitable position according to the requirement. Optionally, the electronic device 200 may include a screen 220, and the fingerprint module 100 may be disposed on a back surface of the screen 220. The fingerprint module 100 is arranged on the back of the screen 220, so that an off-screen fingerprint identification function can be realized, for example, the off-screen fingerprint identification function can be used for an off-screen fingerprint unlocking function, an off-screen fingerprint payment function and the like of the electronic equipment 200 (including but not limited to a mobile phone).

The screen 220 in the present application may be any kind of screen including, but not limited to, an LCD screen, an LED screen, an OLED screen, etc. The screen 220 may be a non-folding screen or a non-folding screen, and the present application is not limited herein.

Fig. 7 is a schematic diagram of a specific application scenario of a fingerprint module provided in an embodiment of the present application, as shown in fig. 7, a user may use a finger 300 to enter a fingerprint in a specific area on the front surface of a screen 220.

The installation of the fingerprint module 100 under the screen 220 is not limited in the present application, for example: as shown in fig. 7, the fingerprint module 100 may be adhered to the back of the screen 220 by an adhesive layer 104. In the application, the bonding layer 104 can ensure that the fingerprint module 100 is bonded on the back of the screen 220, so as to maintain the mounting stability of the fingerprint module 100 on the electronic device 200, and facilitate the electronic device 200 to utilize the functions of the fingerprint module 100.

In one possible implementation, referring to fig. 8 and 9, and 10 and 11, for the screen 220 of the electronic device 200 to be a non-folded screen, the screen 220 includes a screen substrate 221 and a buffer layer 222, the buffer layer 222 is mounted on the screen substrate 221, and the buffer layer 222 is used for buffering the screen 220; the buffer layer 222 is provided with a first through hole 2221, and the substrate of the ultrasonic sensor passes through the first through hole 2221 and is adhered to the screen substrate 221, and the fingerprint module 100 is adhered to the screen substrate 221 through the adhesive layer 104.

Specifically, the buffer layer 222 and the screen substrate 221 may form the rear surface of the screen 220. The buffer layer 222 buffers the screen 220 (non-folded screen), and the characteristics of the non-folded screen are such that the screen 220 requires a buffering action of the buffer layer 222 to reduce the impact the screen 220 receives. The cushioning layer 222 may generally be formed of a flexible structure, and it should be understood that the cushioning layer 222 may be selected from a variety of structures for different screens 220, and the application is not limited, as the cushioning layer 222 may comprise foam or the like in some embodiments.

Alternatively, the buffer layer 222 may be the same as or similar to the color of the first double-sided tape 1041 of the adhesive layer 104, so that the electronic device 200 has better appearance and display effect when the buffer layer 222 is provided with the first through hole 2221, and is more attractive as a whole. Further optionally, the aforementioned first double sided adhesive 1041 (i.e. the double sided adhesive tape for a screen) may be black, so that the adhesive layer 104 can play a role of shading, which can effectively improve the problem of poor screen display caused by the first through holes 2221 formed in the buffer layer 222.

In the embodiment of the present application, the buffer layer 222 for buffering the screen 220 is provided with the first through hole 2221, a part of the screen substrate 221 is exposed from the first through hole 2221, and the adhesive layer 104 bonds the substrate of the ultrasonic sensor to the screen substrate 221 exposed from the first through hole 2221, so that the blocking and absorbing effects of the buffer layer 222 on the ultrasonic signal sent and received by the ultrasonic sensor 101 of the fingerprint module 100 can be reduced, thereby improving the use effect of the fingerprint module 100, and meeting the application requirements of the fingerprint module 100 in the electronic device 200 with a non-folding screen.

Alternatively, for an electronic device that is not a folding screen, the adhesive layer 104 may be selected from a first double sided adhesive of 6 μm thickness, a first copper foil layer of 6 μm thickness, and a second double sided adhesive of 3 μm thickness.

Fig. 8 to 11 are schematic diagrams illustrating a connection relationship between a fingerprint module and a non-folding screen according to an embodiment of the present application.

The first through hole 2221 may be of a size and shape as needed, and the present application is not limited in any way. Referring to fig. 8 and 9, and fig. 10 and 11, the outer contour of the first through hole 2221 is larger than the outer contour of the adhesive layer 104 and also larger than the outer contour of the ultrasonic sensor 101 of the fingerprint module 100. The shape of the first through hole 2221 is a rounded rectangle in the examples shown in fig. 8 and 10, but this is merely an example, and it may be made into a regular shape such as a rectangle, a circle, a regular polygon, or the like, or an irregular shape.

In a possible implementation manner, in the electronic device 200, the screen 220 is a non-folded screen, and the electronic device 200 further includes a first light shielding structure 230 and a first fixing structure 241, where the first light shielding structure 230 is used to cover a gap formed between an edge of the adhesive layer 104 and an edge of the first through hole 2221, and the first fixing structure 241 is used to fix the edge of the ultrasonic sensor 101 on the adhesive layer 104.

For example, in some exemplary embodiments, referring to fig. 8 and 9, in the electronic device 200, the screen 220 is a non-folded screen, the gap B between the edge of the adhesive layer 104 and the edge of the first through hole 2221 is not less than 0.1mm, and the first perpendicular projection of the ultrasonic sensor 101 toward the adhesive layer 104 in the thickness direction of the acoustic layer 1013 is located within the adhesive layer 104, the gap C between the edge of the first perpendicular projection and the edge of the adhesive layer 104 is not less than 0.5mm, and the electronic device 200 further includes a first light shielding structure 230 and a first fixing structure 241, wherein the first light shielding structure 230 is used to cover a gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221, and the first fixing structure 241 is used to fix the edge of the ultrasonic sensor 101 on the adhesive layer 104.

Specifically, when the gap B between the edge of the adhesive layer 104 and the edge of the first through hole 2221 is not less than 0.1mm, at which time the outer contour of the adhesive layer 104 does not exceed the outer contour of the first through hole 2221 as shown in fig. 8 and 9, a portion of the screen substrate 221 of the screen 220 (non-folded screen) may be exposed from the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221, and the screen 220 may be exposed, so that the light leakage condition may occur, based on such a structure, the present application may cover the gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221 by the first light shielding structure 230, thereby improving the adverse effects caused by the light leakage of the screen 220 on the display effect of the screen 220 and the appearance of the electronic device 200; in the thickness direction of the acoustic layer 1013, the first vertical projection of the ultrasonic sensor 101 toward the adhesive layer 104 is located in the adhesive layer 104, when the clearance C between the edge of the first vertical projection and the edge of the adhesive layer 104 is more than or equal to 0.5mm, and the outer contour of the adhesive layer 104 exceeds the outer contour of the ultrasonic sensor 101 too much, so that the application is based on such a structure, on the other hand, the edge of the ultrasonic sensor 101 can be fixed on the adhesive layer 104 through the first fixing structure 241, and the stability of the fingerprint module 100 installed on the electronic device 200 is improved; in still another aspect, in this structure of the present application, the edge of the ultrasonic sensor 101 is fixed on the adhesive layer 104 by the first fixing structure 241, so that the fingerprint module 100 is convenient to be detached from the electronic device 200, and the screen 220 is less likely to be damaged, and reworking installation of the fingerprint module 100 of the electronic device 200 is also facilitated.

Alternatively, any suitable light shielding structure may be used for the first light shielding structure 230, so long as the requirement can be satisfied. For example, the first light shielding structure 230 may include a light shielding glue, and the light shielding function may be achieved by dispensing the light shielding glue at a gap formed between the edge of the adhesive layer 104 and the edge of the first through hole 2221, so that the cured light shielding glue covers the gap. Optionally, the cure shrinkage of the opacifying adhesive is less than 3%. The screen 220 is easily pulled when the curing shrinkage rate of the shading adhesive is too large, so that the display effect of the screen 220 is poor, and the problem of poor display effect of the screen 220 caused by pulling the screen 220 by the shading adhesive can be better avoided by selecting the shading adhesive with the curing shrinkage rate of less than 3% as the first shading structure 230. The application does not limit the types of the shading adhesive and can meet the requirements. For example, the light-shielding adhesive may employ at least one of a UV-curable adhesive (e.g., a UV-curable adhesive, i.e., a shadowless adhesive, which requires curing by irradiation with ultraviolet light), an adhesive curable by UV and moisture, a low-temperature-curable adhesive (e.g., a low temperature means less than 100 ℃).

Alternatively, any suitable fixing structure may be used for the first fixing structure 241, so long as the requirement can be satisfied. For example, the first fixing structure 241 may include a fixing adhesive, and the function of fixing the edge of the ultrasonic sensor 101 to the adhesive layer 104 may be achieved by dispensing the fixing adhesive at the edge of the ultrasonic sensor 101 and the adhesive layer 104. Optionally, the cure shrinkage of the fixing glue is less than 3%. The screen 220 is easily pulled when the curing shrinkage rate of the fixing adhesive is too large, so that the display effect of the screen 220 is poor, and the fixing adhesive with the curing shrinkage rate of less than 3% is selected as the first fixing structure 241 in the application, so that the problem of poor display effect of the screen 220 caused by pulling the screen 220 by the fixing adhesive can be well avoided. The application does not limit the types of the fixing glue and can meet the requirements. For example, the fixing adhesive may employ at least one of a UV-curable adhesive (e.g., a UV-curable adhesive, i.e., a shadowless adhesive, which is required to be cured by irradiation of ultraviolet light), an adhesive cured by UV as well as moisture, a low-temperature-curable adhesive (e.g., a low temperature means less than 100 ℃).

Therefore, in some embodiments of the present application, the fingerprint module 100 may be mounted between the screens 220 (non-folded screens) by dispensing the adhesive twice (i.e., the light shielding adhesive (i.e., the first light shielding structure 230) and the fixing adhesive (i.e., the first fixing structure 241)) so as to satisfy the requirements of light shielding and module fixing.

Or in other alternative embodiments, in which the screen 220 is a non-folding screen, the electronic device 200 further includes a second securing structure 242, the second securing structure 242 being used to secure an edge of the ultrasonic sensor 101 to the screen substrate 221.

For example, in some exemplary embodiments, referring to fig. 10 and 11, in the electronic device 200, the screen 220 is an unfolded screen, a second vertical projection of the ultrasonic sensor 101 toward the screen substrate 221 along the thickness direction of the acoustic layer 1013 is located in the first through hole 2221, a gap D between an edge of the second vertical projection and an edge of the first through hole 2221 is not smaller than 0.5mm, and an edge of the adhesive layer 104 does not exceed an edge of an adhesive surface of the fingerprint module 100 that forms an adhesive with the adhesive layer 104, and the electronic device 200 further includes a second fixing structure 242, the second fixing structure 242 being used to fix the edge of the ultrasonic sensor 101 to the screen substrate 221.

Specifically, along the thickness direction of the acoustic layer 1013, the second vertical projection of the ultrasonic sensor 101 toward the screen substrate 221 is located in the first through hole 2221, the gap D between the edge of the second vertical projection and the edge of the first through hole 2221 is not smaller than or equal to 0.5mm, and the edge of the adhesive layer 104 does not exceed the edge of the adhesive surface on the fingerprint module 100, which forms an adhesive bond with the adhesive layer 104, at this time, the edge of the ultrasonic sensor 101 is fixed on the screen substrate 221 directly by using the second fixing structure 242, and based on such a structure, on one hand, the edge of the ultrasonic sensor 101 can be fixed on the screen substrate 221 by using the second fixing structure 242, so that the stability of the fingerprint module 100 mounted on the electronic device 200 is improved; on the other hand, the second fixing structure 242 can also improve the light leakage of the screen to a certain extent, so as to realize the light shielding effect and improve the adverse effect caused by the light leakage of the screen 220 on the display effect of the screen 220 and the appearance of the electronic device 200; on the other hand, the manufacturing process of the electronic device 200 is simplified because the light shielding structure is not separately provided.

Alternatively, any suitable fixing structure may be used for the second fixing structure 242, so long as the requirement can be satisfied. For example, the second fixing structure 242 may include a fixing paste, and the function of fixing the edge of the ultrasonic sensor 101 to the screen substrate 221 may be achieved by dispensing the fixing paste at the edge of the ultrasonic sensor 101 and the screen substrate 221 (for example, the fixing paste may be dispensed to the edge of the first through hole 2221). Optionally, the cure shrinkage of the fixing glue is less than 3%. The screen 220 is easily pulled when the curing shrinkage rate of the fixing adhesive is too large, so that the display effect of the screen 220 is poor, and the fixing adhesive with the curing shrinkage rate of less than 3% is selected as the second fixing structure 242 in the application, so that the problem of poor display effect of the screen 220 caused by pulling the screen 220 by the fixing adhesive can be well avoided. The application does not limit the types of the fixing glue and can meet the requirements. For example, the fixing adhesive may employ at least one of a UV-curable adhesive (e.g., a UV-curable adhesive, i.e., a shadowless adhesive, which is required to be cured by irradiation of ultraviolet light), an adhesive cured by UV as well as moisture, a low-temperature-curable adhesive (e.g., a low temperature means less than 100 ℃).

Therefore, in some embodiments of the present application, the fingerprint module 100 may be mounted between the screens 220 (non-folding screens) by dispensing the adhesive (i.e., the aforementioned fixing adhesive (i.e., the second fixing structure 242)), which takes into account the requirements of light shielding and module fixing.

Fig. 12 to 15 are schematic diagrams illustrating a connection relationship between a fingerprint module and a folding screen according to an embodiment of the present application.

In some alternative embodiments, referring to fig. 12 to 15, for the screen 220 of the electronic device 200 to be a folding screen, the screen 220 includes a support piece 223, the support piece 223 being used to support the screen 220; the fingerprint module 100 is adhered to the support sheet 223 by the adhesive layer 104.

In particular, the support sheet 223 may form a back surface of the screen 220. The support sheet 223 supports the screen 220 (folded screen), and the characteristics of the folded screen are such that the screen 220 requires a supporting action of the support sheet 223 to improve stability. The folded screen generally does not need to be provided with a buffer layer alone, so that there is no problem in that the buffer layer affects the ultrasonic signals transmitted and received by the ultrasonic sensor 101 of the fingerprint module 100. The supporting piece 223 may be made of a plastic material, such as a metal material, for example, in some alternative embodiments, the supporting piece 223 may be a supporting steel sheet, or in other embodiments, may be a supporting copper sheet, etc., which is not limited herein. Of course, other suitable materials for the support sheet 223 may be used as desired.

Alternatively, for the electronic device with a folding screen, when the supporting sheet 223 is made of titanium alloy or other metal materials, the adhesive layer 104 is a first double-sided adhesive tape with a thickness of 6 μm, a first copper foil layer with a thickness of 35 μm, and a second double-sided adhesive tape with a thickness of 6 μm. When the supporting sheet 223 is made of carbon fiber, the adhesive layer 104 is a first double-sided adhesive tape with a thickness of 6 μm, a first copper foil layer with a thickness of 16 μm, and a second double-sided adhesive tape with a thickness of 6 μm.

According to the application, the fingerprint module 100 is adhered to the supporting piece 223 for supporting the screen 220 through the adhesive layer 104, so that the fingerprint module 100 can be adhered to the back of the screen 220 on the basis of not affecting the functions of sending and receiving ultrasonic signals of the fingerprint module 100, the using effect of the fingerprint module 100 can be improved, and the application requirement of the fingerprint module 100 in the electronic equipment 200 with the folding screen can be met.

In some alternative embodiments, the screen 220 of the electronic device 200 is a folded screen, and the electronic device 200 further includes a third fixing structure 243, where the third fixing structure 243 is used to fix the edge of the ultrasonic sensor 101 to the adhesive layer 104.

For example, in some exemplary embodiments, referring to fig. 12 and 13, in the electronic device 200, the screen 220 is a folded screen, a first vertical projection of the ultrasonic sensor 101 toward the adhesive layer 104 is located in the adhesive layer 104 along a thickness direction of the acoustic layer 1013, a gap C between an edge of the first vertical projection and an edge of the adhesive layer 104 is 0.5mm or more, and the electronic device 200 further includes a third fixing structure 243 for fixing the edge of the ultrasonic sensor 101 to the adhesive layer 104.

Specifically, along the thickness direction of the acoustic layer 1013, the first vertical projection of the ultrasonic sensor 101 toward the adhesive layer 104 is located in the adhesive layer 104, the clearance C between the edge of the first vertical projection and the edge of the adhesive layer 104 is greater than or equal to 0.5mm, and the outer contour of the adhesive layer 104 exceeds the outer contour of the ultrasonic sensor 101 too much, so the present application is based on this structure, on one hand, the edge of the ultrasonic sensor 101 can be fixed on the adhesive layer 104 by the third fixing structure 243, and the stability of the fingerprint module 100 mounted on the electronic device 200 is improved; on the other hand, in this structure of the present application, the edge of the ultrasonic sensor 101 is fixed on the adhesive layer 104 by the third fixing structure 243, so that the fingerprint module 100 is convenient to be detached from the electronic device 200, the screen 220 is less prone to be damaged, and reworking and installation of the fingerprint module 100 of the electronic device 200 are also facilitated.

Alternatively, any suitable fixing structure may be used for the third fixing structure 243, so long as the requirement can be satisfied. For example, the third fixing structure 243 may include a fixing adhesive, and the function of fixing the edge of the ultrasonic sensor 101 to the adhesive layer 104 may be achieved by dispensing the fixing adhesive at the edge of the ultrasonic sensor 101 and the adhesive layer 104. Optionally, the cure shrinkage of the fixing glue is less than 3%. The screen 220 is easily pulled when the curing shrinkage rate of the fixing adhesive is too large, so that the display effect of the screen 220 is poor, and the fixing adhesive with the curing shrinkage rate less than 3% is selected as the third fixing structure 243 in the application, so that the problem of poor display effect of the screen 220 caused by pulling the screen 220 by the fixing adhesive can be well avoided. The application does not limit the types of the fixing glue and can meet the requirements. For example, the fixing adhesive may employ at least one of a UV-curable adhesive (e.g., a UV-curable adhesive, i.e., a shadowless adhesive, which is required to be cured by irradiation of ultraviolet light), an adhesive cured by UV as well as moisture, a low-temperature-curable adhesive (e.g., a low temperature means less than 100 ℃).

Therefore, in some embodiments of the present application, the fingerprint module 100 may be mounted between the screens 220 (folded screens) by dispensing the adhesive once (i.e., the aforementioned fixing adhesive (i.e., the third fixing structure 243)), which takes into account the requirements of shading and module fixing.

Or in other alternative embodiments, the electronic device 200 wherein the screen 220 is a folded screen, the electronic device 200 further comprises a fourth fastening structure 244, the fourth fastening structure 244 being configured to fasten the edge of the ultrasonic sensor 101 to the support sheet 223.

For example, in some exemplary embodiments, referring to fig. 14 and 15, in the electronic device 200, the screen 220 is a folded screen, and the edge of the adhesive layer 104 does not exceed the edge of the adhesive surface of the fingerprint module 100 that forms an adhesive with the adhesive layer 104, that is, the edge of the adhesive layer 104 does not exceed the edge of the ultrasonic sensor 101, and the electronic device 200 further includes a fourth fixing structure 244, where the fourth fixing structure 244 is used to fix the edge of the ultrasonic sensor 101 to the supporting sheet 223.

Specifically, the edge of the adhesive layer 104 does not exceed the edge of the adhesive surface of the fingerprint module 100 that forms an adhesive with the adhesive layer 104, and in the present application, the edge of the ultrasonic sensor 101 may be fixed on the supporting sheet 223 by the fourth fixing structure 244, so as to improve the stability of the fingerprint module 100 installed on the electronic device 200.

Alternatively, any suitable fixing structure may be used for the fourth fixing structure 244, so long as the requirement can be satisfied. For example, the fourth fixing structure 244 may include a fixing adhesive, and the function of fixing the edge of the ultrasonic sensor 101 to the support sheet 223 may be achieved by dispensing the fixing adhesive at the edge of the ultrasonic sensor 101 and the support sheet 223. Optionally, the cure shrinkage of the fixing glue is less than 3%. The fixing adhesive with the curing shrinkage rate smaller than 3% is selected as the fourth fixing structure 244, so that the problem of poor display effect of the screen 220 caused by pulling the screen 220 by the fixing adhesive can be well avoided. The application does not limit the types of the fixing glue and can meet the requirements. For example, the fixing adhesive may employ at least one of a UV-curable adhesive (e.g., a UV-curable adhesive, i.e., a shadowless adhesive, an adhesive which needs to be cured by irradiation of ultraviolet light), a UV-and moisture-curable adhesive, a low-temperature-curable adhesive (e.g., a low temperature means less than 100 ℃).

Therefore, in some embodiments of the present application, the fingerprint module 100 may be mounted between the screens 220 (folded screens) by dispensing the adhesive once (i.e., the aforementioned fixing adhesive (i.e., the fourth fixing structure 244)), which takes into account the requirements of shading and module fixing.

Alternatively, as shown in fig. 9, 11, 13 and 15, after the first electrical connection region 1016 and the second electrical connection region 1021 are electrically connected through the conductive adhesive layer 103 (e.g., ACF conductive adhesive film), a protective adhesive 105 may be added outside the conductive adhesive layer 103 to protect the conductive adhesive layer 103.

It should be noted that, according to implementation requirements, each component/step described in the embodiments of the present application may be split into more components/steps, or two or more components/steps or part of operations of the components/steps may be combined into new components/steps, so as to achieve the objects of the embodiments of the present application.

Those of ordinary skill in the art will appreciate that the elements and method steps of the examples described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or as a combination of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the embodiments of the present application.

The above embodiments are only for illustrating the embodiments of the present application, but not for limiting the embodiments of the present application, and various changes and modifications may be made by one skilled in the relevant art without departing from the spirit and scope of the embodiments of the present application, so that all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of the embodiments of the present application should be defined by the claims.

Claims

1. A fingerprint module, comprising: an ultrasonic sensor and a circuit board;

The ultrasonic sensor comprises a substrate, an acoustic layer, a first electrode layer and a protective layer, wherein a second electrode layer is arranged on the substrate, one side of the acoustic layer is electrically connected with the second electrode layer, the other side of the acoustic layer is electrically connected with one side of the first electrode layer, the protective layer covers the other side of the first electrode layer, the sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is in a range of [44 mu m,50 mu m ], and the thickness of the substrate is in a range of [85 mu m,115 mu m ];

The substrate is provided with a first electric connection area, the first electrode layer and the second electrode layer are respectively and electrically connected with the first electric connection area, the circuit board is provided with a second electric connection area, and the first electric connection area and the second electric connection area are electrically connected through a conductive adhesive layer;

The circuit board is electrically connected with a processing unit outside the fingerprint module, the acoustic layer is used for transmitting ultrasonic signals and receiving ultrasonic signals reflected by an external structure, the ultrasonic sensor is used for converting the ultrasonic signals received by the acoustic layer into electric signals and sending the electric signals to the processing unit through the circuit board so that the processing unit can conduct fingerprint identification based on the electric signals, and the frequency range of the ultrasonic signals transmitted by the acoustic layer is [9MHz,11MHz ].

2. The fingerprint module of claim 1, wherein the fingerprint module comprises a plurality of fingerprint modules,

The sum of the thicknesses of the acoustic layer, the first electrode layer and the protective layer is 47 mu m, the thickness of the substrate is 90 mu m, and the frequency of an ultrasonic signal emitted by the acoustic layer is 10MHz.

3. The fingerprint module of claim 1, wherein the fingerprint module comprises a plurality of fingerprint modules,

The second electrode layer includes a plurality of complementary metal oxide semiconductors formed on the substrate, at least a portion of the plurality of complementary metal oxide semiconductors being electrically connected to one side of the acoustic layer;

The first electrode layer and the second electrode layer are used for providing the acoustic layer with voltages required for transmitting and receiving ultrasonic signals.

4. The fingerprint module of claim 1, wherein the first electrical connection region and the second electrode layer are on the same side of the substrate.

5. The fingerprint module of claim 1, wherein the first electrical connection area includes a plurality of pins arranged side by side, each of the plurality of pins having a width of 0.09mm, a length of the pins ranging from [0.3mm,0.385mm ], and a distance between two adjacent pins of 0.07mm;

At least a portion of the plurality of pins is electrically connected with the second electrical connection region.

6. The fingerprint module of claim 5, wherein the fingerprint module comprises a plurality of fingerprint modules,

And the pins are provided with conductive plating layers, wherein the conductive plating layers are arranged on the connection sides of the pins and the conductive adhesive layer.

7. The fingerprint module of claim 1, wherein the fingerprint module further comprises: an adhesive layer;

the bonding layer comprises a first double-sided adhesive tape, a first copper foil layer and a second double-sided adhesive tape, one side of the first copper foil layer is bonded with one side of the first double-sided adhesive tape, the other side of the first copper foil layer is bonded with one side of the second double-sided adhesive tape, the other side of the second double-sided adhesive tape is bonded with the substrate, and the second double-sided adhesive tape and the acoustic layer are respectively positioned on two sides of the substrate;

And the other side of the first double-sided adhesive tape is adhered to electronic equipment outside the fingerprint module.

8. The fingerprint module of claim 7, wherein the fingerprint module comprises a plurality of fingerprint modules,

The thickness of the first double-sided adhesive tape is 6 mu m, the thickness of the first copper foil layer is 6 mu m, and the thickness of the second double-sided adhesive tape is 3 mu m;

Or alternatively

The thickness of the first double-sided adhesive tape is 6 mu m, the thickness of the first copper foil layer is 35 mu m, and the thickness of the second double-sided adhesive tape is 6 mu m;

Or alternatively

The thickness of the first double faced adhesive tape is 6 mu m, the thickness of the first copper foil layer is 16 mu m, and the thickness of the second double faced adhesive tape is 6 mu m.

9. The fingerprint module of claim 1, wherein the conductive adhesive layer comprises anisotropic conductive adhesive having a thickness of 3 μm.

10. The fingerprint module of claim 1, wherein a side of the conductive adhesive layer beyond the substrate is covered with a protective adhesive, the protective adhesive being in contact with at least the substrate, the conductive adhesive layer, and the circuit board.

11. The fingerprint module of any one of claims 1-10, wherein the circuit board comprises a flexible circuit board comprising a first coverlay, a first copper foil layer, a second copper foil layer, a substrate layer, a third copper foil layer, a second copper foil layer, and a second coverlay;

One side of the first covering film is attached to one side of the first copper deposition layer, the other side of the first copper deposition layer is attached to one side of the second copper foil layer, the other side of the second copper foil layer is attached to one side of the base material layer, the other side of the base material layer is attached to one side of the third copper foil layer, the other side of the third copper foil layer is attached to one side of the second copper deposition layer, and the other side of the second copper deposition layer is attached to one side of the second covering film;

At one end of the flexible circuit board, the first cover film, the first copper-deposition layer and the second copper foil layer are retracted relative to the base material layer by a first distance, the third copper foil layer and the second copper-deposition layer are retracted relative to the base material layer by a second distance, the second cover film is retracted relative to the base material layer by a third distance, the first distance is greater than the second distance, and the third distance is greater than the second distance, wherein the second cover film is retracted relative to the third copper foil layer and the second copper-deposition layer to form the second electrical connection region.

12. An electronic device, comprising: a processing unit, a screen, and a fingerprint module according to any one of claims 1-11;

The fingerprint module is arranged on the back of the screen, and the processing unit is electrically connected with the circuit board in the fingerprint module.

13. The electronic device of claim 12, wherein the screen is a non-folding screen, the screen comprising a screen substrate and a buffer layer attached, the buffer layer for buffering the screen;

The buffer layer is provided with a first through hole, and the ultrasonic sensor included in the fingerprint module passes through the first through hole and is adhered to the screen substrate through the adhesive layer.

14. The electronic device of claim 13, wherein the buffer layer is the same color as the first double sided tape included in the adhesive layer.

15. The electronic device of claim 13, wherein the electronic device comprises a memory device,

The electronic device further comprises a first shading structure and a first fixing structure, wherein the first shading structure is used for covering a gap formed between the edge of the bonding layer and the edge of the first through hole, and the first fixing structure is used for fixing the edge of the ultrasonic sensor on the bonding layer.

16. The electronic device of claim 15, wherein the electronic device comprises a memory device,

The first shading structure comprises shading glue, and the curing shrinkage rate of the shading glue is less than 3%.

17. The electronic device of claim 15, wherein the electronic device comprises a memory device,

The first fixing structure comprises fixing glue, and the curing shrinkage rate of the fixing glue is less than 3%.

18. The electronic device of claim 13, wherein the electronic device comprises a memory device,

The electronic device further includes a second fixing structure for fixing an edge of the ultrasonic sensor to the screen substrate.

19. The electronic device of claim 12, wherein the screen is a folded screen, the screen comprising a support sheet for supporting the screen;

the ultrasonic sensor that fingerprint module includes is through the adhesive linkage bonding on the backing sheet.

20. The electronic device of claim 19, wherein the electronic device comprises a memory device,

The electronic device further includes a third fixing structure for fixing an edge of the ultrasonic sensor to the adhesive layer.

21. The electronic device of claim 19, wherein the electronic device comprises a memory device,

The electronic device further comprises a fourth fixing structure, wherein the fourth fixing structure is used for fixing the edge of the ultrasonic sensor on the supporting sheet.

22. The electronic device of claim 21, wherein an edge of the adhesive layer does not exceed an edge of the ultrasonic sensor.