CN221101359U - Portable computer heat abstractor - Google Patents
Portable computer heat abstractor Download PDFInfo
- Publication number
- CN221101359U CN221101359U CN202322572900.0U CN202322572900U CN221101359U CN 221101359 U CN221101359 U CN 221101359U CN 202322572900 U CN202322572900 U CN 202322572900U CN 221101359 U CN221101359 U CN 221101359U
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- groups
- placing
- heat dissipation
- battens
- lath
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 210000001503 joint Anatomy 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000003032 molecular docking Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a portable computer heat dissipation device, comprising: the support and the cooling mechanism, the support is including placing lath and supporting lath, place lath symmetry and be provided with two sets of, supporting lath is two sets of in two sets of equal fixedly connected with of lath bottoms of placing, four sets of supporting laths are rectangular distribution, one of them sets of lath of placing is close to another one set of two sets of butt joint posts of one side fixedly connected with of placing lath, another set of lath of placing is just to the position of two sets of butt joint posts all open has the butt joint groove, two sets of butt joint posts insert two sets of butt joint inslot respectively, the cooling mechanism includes the heat dissipation fan, go-between and reference column, its beneficial effect is: the device is wholly assembled, and the device occupies the space size through the disassembling device when carrying the device, so that the device is convenient to carry, and the device can be assembled only by inserting the radiating mechanism after butting two groups of placing strips during assembly, and the disassembling can be completed through the reverse step operation, so that the device is convenient to disassemble and easy to use.
Description
Technical Field
The present disclosure relates to heat dissipation devices, and particularly to a portable computer heat dissipation device.
Background
Notebook computers are a common type of computer, and because of the size and weight requirements of notebook computers, the heat dissipation system is generally smaller and simplified than a desktop computer, which means that the volume and heat dissipation capacity of the components such as the heat sink, the fan, and the heat dissipation tube are limited, so many users use the heat dissipation device to provide additional heat dissipation support for the notebook computer when using the notebook computer.
The existing notebook radiator mainly comprises a supporting seat and a cooling fan, so that the supporting surface of the supporting seat is usually larger than the bottom of the notebook computer in order to ensure stable support of the notebook computer, and because most of the existing supporting seats adopt an integrated design, the occupied space is larger, and the carrying is inconvenient, therefore, a portable computer cooling device is needed to solve the problems.
Disclosure of utility model
This section is intended to outline some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description of the utility model and in the title of the utility model, which may not be used to limit the scope of the utility model.
The present utility model has been made in view of the above-mentioned problems with a portable computer heat sink.
Therefore, the utility model aims to provide a portable computer heat dissipation device which is used for solving the problems that the existing notebook computer heat dissipation device occupies a large space and is inconvenient to carry.
In order to solve the technical problems, the utility model provides the following technical scheme: a portable computer heat sink comprising:
the support comprises placing battens and supporting battens, wherein two groups of the placing battens are symmetrically arranged, two groups of the supporting battens are fixedly connected to the bottoms of the two groups of the placing battens, four groups of the supporting battens are in rectangular distribution, two groups of butt joint columns are fixedly connected to one side, close to the other group of the placing battens, of one group of the placing battens, butt joint grooves are formed in the position, opposite to the two groups of the butt joint columns, of the other group of the placing battens, and the two groups of the butt joint columns are inserted into the two groups of the butt joint grooves respectively;
The heat dissipation mechanism comprises a heat dissipation fan, a connecting ring and positioning columns, wherein the connecting ring is sleeved on the outer side of the heat dissipation fan and is fixedly connected with the heat dissipation fan, four groups of positioning columns are fixedly connected with the bottom of the connecting ring and uniformly distributed around the connecting ring, one side adjacent to each of the placing battens is provided with an arc-shaped groove, the arc-shaped grooves of the placing battens are spliced into round holes matched with the size of the heat dissipation fan, the heat dissipation fan penetrates through the round holes, the positions of the two groups of placing battens, which are opposite to the connecting ring, are provided with embedded grooves, the two groups of embedded grooves are spliced into grooves matched with the connecting ring, the connecting ring is embedded into the grooves, the positions, opposite to the positioning columns of the placing battens are provided with positioning holes, and the four groups of positioning columns are respectively inserted into the four groups of positioning holes.
As a preferred embodiment of the portable computer heat dissipating device of the present utility model, the following applies: two groups of baffle plates are fixedly connected to the tops of the placing battens, and the two groups of baffle plates are respectively positioned on two sides of the placing battens in the width direction.
As a preferred embodiment of the portable computer heat dissipating device of the present utility model, the following applies: two sets of place the lath top and all inlay and be equipped with the slipmat, slipmat and place the lath and correspond the position and all offer a plurality of groups of louvres.
As a preferred embodiment of the portable computer heat dissipating device of the present utility model, the following applies: the heat dissipation mechanism further comprises a grid plate, the grid plate is fixedly connected to the top of the heat dissipation fan, and the heat dissipation fan, the connecting ring and the axis of the grid plate are overlapped.
As a preferred embodiment of the portable computer heat dissipating device of the present utility model, the following applies: the butt joint post and the locating post end are both provided with chamfers.
As a preferred embodiment of the portable computer heat dissipating device of the present utility model, the following applies: the placing battens and the supporting battens are made of plastic materials, and the height of the supporting battens is larger than that of the heat dissipation fan.
The utility model has the beneficial effects that: the device is wholly assembled, and the device occupies the space size through the disassembling device when carrying the device, so that the device is convenient to carry, and the device can be assembled only by inserting the radiating mechanism after butting two groups of placing strips during assembly, and the disassembling can be completed through the reverse step operation, so that the device is convenient to disassemble and easy to use.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
fig. 1 is a schematic perspective view of a portable computer heat dissipating device according to the present utility model.
Fig. 2 is a schematic diagram illustrating a disassembled structure of a portable computer heat dissipating device according to the present utility model.
Fig. 3 is an enlarged view of the structure of the area a in fig. 2 according to the present utility model.
Fig. 4 is a schematic bottom view of a portable computer heat dissipating device according to the present utility model.
Description of the drawings: 100. a support; 101. placing the battens; 101a, butt-joint columns; 101b, a butt joint groove; 101c, an embedding groove; 101d, positioning holes; 102. a support slat; 103. a baffle; 104. an anti-slip pad; 200. a heat dissipation mechanism; 201. a heat dissipation fan; 202. a connecting ring; 203. positioning columns; 204. a grid plate.
Detailed Description
In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present utility model is not limited to the specific embodiments disclosed below.
Further, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the utility model. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Further, in describing the embodiments of the present utility model in detail, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of description, and the schematic is only an example, which should not limit the scope of protection of the present utility model. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
Referring to fig. 1-4, for one embodiment of the present utility model, there is provided a portable computer heat sink comprising:
the support 100 comprises two groups of placing battens 101 and supporting battens 102, wherein the placing battens 101 are symmetrically provided with two groups of supporting battens 102, two groups of supporting battens 102 are fixedly connected to the bottoms of the two groups of placing battens 101, four groups of supporting battens 102 are distributed in a rectangular shape, one side, close to the other group of placing battens 101, of one group of placing battens 101 is fixedly connected with two groups of docking posts 101a, the other group of placing battens 101 are provided with docking slots 101b at positions opposite to the two groups of docking posts 101a, and the two groups of docking posts 101a are respectively inserted into the two groups of docking slots 101 b;
The heat dissipation mechanism 200 comprises a heat dissipation fan 201, a connecting ring 202 and positioning columns 203, wherein the connecting ring 202 is sleeved outside the heat dissipation fan 201 and is fixedly connected with the heat dissipation fan 201, four groups of positioning columns 203 are fixedly connected to the bottom of the connecting ring 202, the four groups of positioning columns 203 are uniformly distributed around the connecting ring 202, one side, adjacent to the two groups of placing battens 101, of each positioning column is provided with an arc-shaped groove, the arc-shaped grooves of the two groups of placing battens 101 are spliced into a round hole matched with the size of the heat dissipation fan 201, the heat dissipation fan 201 penetrates through the round hole, the positions, opposite to the connecting ring 202, of the two groups of placing battens 101 are respectively provided with an embedded groove 101c, the two groups of embedded grooves 101c are spliced into grooves matched with the connecting ring 202, the connecting ring 202 is embedded into the grooves, the positions, opposite to the two groups of placing battens 101 and the positioning columns 203 are respectively provided with positioning holes 101d, and the four groups of positioning columns 203 are respectively inserted into the four groups of positioning holes 101d.
It should be noted that, two groups of baffle plates 103 are fixedly connected to the tops of two groups of placing battens 101, the two groups of baffle plates 103 are respectively located at two sides of the width direction of the placing battens 101, the two groups of baffle plates 103 are used for preventing a computer from slipping, anti-slip pads 104 are embedded in the tops of the two groups of placing battens 101, a plurality of groups of heat dissipation holes are formed in the positions of the anti-slip pads 104 corresponding to the placing battens 101, the anti-slip pads 104 are used for improving the stability of the computer, and the heat dissipation holes are used for improving the heat dissipation capacity of the device and reducing the overall weight of the device.
In addition, the heat dissipation mechanism 200 further comprises a grid plate 204, the grid plate 204 is fixedly connected to the top of the heat dissipation fan 201, the grid plate 204 is used for protecting the heat dissipation fan 201, the connecting ring 202 and the grid plate 204 are arranged in an axis superposition mode, the structural stability of the device is guaranteed, the end portions of the butt joint columns 101a and the positioning columns 203 are provided with chamfers, the chamfers are used for facilitating assembly of the device, the placing battens 101 and the supporting battens 102 are made of plastic materials, the whole weight of the device can be reduced by the plastic materials, the device is convenient to carry, the supporting battens 102 are higher than the heat dissipation fan 201, and the heat dissipation fan 201 can be guaranteed to dissipate heat normally.
Working principle: when the device is disassembled, as shown in fig. 2, the heat dissipation fan 201 is propped against the bottom, the heat dissipation mechanism 200 can be taken out, after the heat dissipation mechanism 200 is taken out, as the four groups of positioning posts 203 are not used for clamping the two groups of placing battens 101, the two groups of placing battens 101 can be separated, the two groups of placing battens 101 are pulled reversely, the two groups of placing battens 101 are separated, the device is disassembled, the occupied space of the device can be reduced, and the device is convenient to carry;
When the device is assembled, two groups of butt-joint posts 101a are inserted into two groups of butt-joint grooves 101b, two groups of placing battens 101 are in butt joint, four groups of positioning posts 203 are aligned with four groups of positioning holes 101d respectively, a heat dissipation fan 201 is inserted into round holes spliced by circular arc grooves of the two groups of placing battens 101, four groups of positioning posts 203 are inserted into four groups of positioning holes 101d respectively, the device is assembled, a computer is placed on the top of the two groups of placing battens 101, and the connecting ring 202 is electrified to dissipate heat of the computer.
It should be noted that the above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present utility model may be modified or substituted without departing from the spirit and scope of the technical solution of the present utility model, which is intended to be covered in the scope of the claims of the present utility model.
Claims (6)
1. A portable computer heat sink, comprising:
The support (100) comprises two placing battens (101) and supporting battens (102), wherein the two placing battens (101) are symmetrically provided with two groups, the two groups of supporting battens (102) are fixedly connected with the bottoms of the two groups of placing battens (101), the four groups of supporting battens (102) are distributed in a rectangular shape, one side, close to the other group of placing battens (101), of one group of placing battens (101) is fixedly connected with two groups of butt joint columns (101 a), the other group of placing battens (101) are opposite to the two groups of butt joint columns (101 a), butt joint grooves (101 b) are formed in the positions, facing the two groups of butt joint columns (101 a), of the two groups of butt joint columns (101 a) are inserted into the two groups of butt joint grooves (101 b) respectively;
The heat dissipation mechanism (200) comprises a heat dissipation fan (201), a connecting ring (202) and positioning columns (203), wherein the connecting ring (202) is sleeved outside the heat dissipation fan (201) and is fixedly connected with the heat dissipation fan (201), four groups of positioning columns (203) are fixedly connected with the bottom of the connecting ring (202), the four groups of positioning columns (203) are uniformly distributed around the connecting ring (202), two groups of positioning columns (203) are respectively provided with circular arc grooves on one adjacent side of each positioning column (101), the two groups of circular arc grooves of each positioning column (101) are spliced into round holes matched with the size of the heat dissipation fan (201), the heat dissipation fan (201) penetrates through the round holes, the two groups of positioning columns (101) are respectively provided with embedded grooves (101 c) corresponding to the positions of the connecting ring (202), the two groups of embedded grooves (101 c) are spliced into grooves matched with the connecting ring (202), the positions, opposite to each group of positioning columns (203) are respectively provided with positioning holes (101 d), and the four groups of positioning columns (203) are respectively inserted into the four groups of positioning columns (101 d).
2. A portable computer heat sink as defined in claim 1, wherein: two groups of baffle plates (103) are fixedly connected to the tops of the two groups of placing battens (101), and the two groups of baffle plates (103) are respectively located at two sides of the placing battens (101) in the width direction.
3. A portable computer heat sink as defined in claim 1, wherein: two sets of place lath (101) tops all inlay and are equipped with slipmat (104), slipmat (104) all have seted up a plurality of groups of louvres with placing lath (101) corresponding position.
4. A portable computer heat sink as defined in claim 1, wherein: the heat dissipation mechanism (200) further comprises a grid plate (204), the grid plate (204) is fixedly connected to the top of the heat dissipation fan (201), and the axes of the heat dissipation fan (201), the connecting ring (202) and the grid plate (204) are overlapped.
5. A portable computer heat sink as defined in claim 1, wherein: the butt joint column (101 a) and the positioning column (203) are provided with chamfers at the ends.
6. A portable computer heat sink according to any one of claims 1 to 5, wherein: the placing lath (101) and the supporting lath (102) are made of plastic materials, and the height of the supporting lath (102) is larger than that of the heat dissipation fan (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322572900.0U CN221101359U (en) | 2023-09-21 | 2023-09-21 | Portable computer heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322572900.0U CN221101359U (en) | 2023-09-21 | 2023-09-21 | Portable computer heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221101359U true CN221101359U (en) | 2024-06-07 |
Family
ID=91317099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322572900.0U Active CN221101359U (en) | 2023-09-21 | 2023-09-21 | Portable computer heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221101359U (en) |
-
2023
- 2023-09-21 CN CN202322572900.0U patent/CN221101359U/en active Active
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