CN221058440U - Speaker module and electronic device - Google Patents
Speaker module and electronic device Download PDFInfo
- Publication number
- CN221058440U CN221058440U CN202323019914.6U CN202323019914U CN221058440U CN 221058440 U CN221058440 U CN 221058440U CN 202323019914 U CN202323019914 U CN 202323019914U CN 221058440 U CN221058440 U CN 221058440U
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- magnetic element
- coil
- speaker module
- circuit board
- dielectric layer
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- -1 polytetrafluoroethylene Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
A speaker module and an electronic device. The loudspeaker module comprises a circuit board, a first magnetic element and a second magnetic element, wherein the circuit board comprises a main body part and a vibrating part which are connected, the vibrating part comprises a first surface and a second surface which are oppositely arranged, a part of the first surface is sunken to form a spiral first groove, the vibrating part further comprises a spiral first coil, the first coil and the first groove are arranged at staggered intervals, the first magnetic element is close to the first surface, the second magnetic element is close to the second surface, and the first magnetic element and the second magnetic element are configured to drive the vibrating part to vibrate along the direction perpendicular to the first surface.
Description
Technical Field
The present disclosure relates to speaker modules, and particularly to a speaker module and an electronic device.
Background
A speaker is a device that converts an electrical signal into an acoustic signal. Speakers are widely used in electronic products requiring sound production, such as mobile phones, notebook computers, MP3 players, headphones, and the like. The existing loudspeaker is an independent element arranged on a circuit board, and has limited size reduction, which is not beneficial to miniaturization of electronic products.
Disclosure of utility model
In view of the above, the present application provides a speaker module and an electronic device that are advantageous for miniaturization.
The first aspect of the application provides a loudspeaker module, which comprises a circuit board, a first magnetic element and a second magnetic element, wherein the circuit board comprises a main body part and a vibrating part which are connected, the vibrating part comprises a first surface and a second surface which are oppositely arranged, a part of the first surface is sunken to form a spiral first groove, the vibrating part also comprises a spiral first coil, the first coil and the first groove are arranged at staggered intervals, the first magnetic element is arranged close to the first surface, the second magnetic element is arranged close to the second surface, and the first magnetic element and the second magnetic element are configured to drive the vibrating part to vibrate along a direction perpendicular to the first surface.
In some embodiments, a partial depression of the second surface forms a helical second groove that is aligned with the first coil.
In some embodiments, the vibration portion further comprises a helical second coil aligned with the first groove.
In some embodiments, the second coil is exposed at the second surface, and an exposed surface of the second coil is flush with the second surface.
In some embodiments, the first coil is exposed at the first surface, and an exposed surface of the first coil is flush with the first surface.
In some embodiments, the body portion and the vibration portion are integrally formed.
In some embodiments, the speaker module further includes a first support and a second support, the first magnetic element is supported on the circuit board by the first support and spaced apart from the vibration part by a predetermined distance, and the second magnetic element is supported on the circuit board by the second support and spaced apart from the vibration part by a predetermined distance.
In some embodiments, the first magnetic element and the second magnetic element are both permanent magnets.
In some embodiments, the first magnetic element and the second magnetic element are each ring-shaped or plate-shaped.
The second aspect of the present application provides an electronic device, including any one of the above speaker modules.
According to the application, the vibrating part of the circuit board is matched with the first magnetic element and the second magnetic element to form the loudspeaker, so that no additional vibrating diaphragm, shell and the like are required, and miniaturization is facilitated; and through setting up spiral first recess for under the same effort, vibration portion more easily vibrates from top to bottom.
Drawings
Fig. 1 is a schematic cross-sectional view of a speaker module according to an embodiment of the application.
Fig. 2 is a top view of a vibration part of the circuit board shown in fig. 1.
FIG. 3 is a schematic cross-sectional view of a vibration portion of a circuit board according to an embodiment of the present application
Description of the main reference signs
Speaker module 100
Circuit board 10
First magnetic element 20
Second magnetic element 30
Body 11
Vibration part 12
First dielectric layer 111
Conductive trace layer 112
First surface 12a
Second surface 12b
First groove 12a1
Second groove 12b1
First coil 121
Second coil 122
Second dielectric layer 123
First support 41
Second support member 42
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The following description of the embodiments of the present application will clearly and specifically describe the technical solutions of the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In addition, the dimensions or thicknesses of various components, layers may be exaggerated in the drawings for brevity and clarity. Like numbers refer to like elements throughout. As used herein, the term "and/or," "and/or" includes any and all combinations of one or more of the associated listed items. In addition, it should be understood that when element a is referred to as "connecting" element B, element a may be directly connected to element B, or intermediate element C may be present and element a and element B may be indirectly connected to each other.
Further, the use of "may" when describing embodiments of the present application refers to "one or more embodiments of the present application".
The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting of the application. As used herein, the singular is intended to include the plural as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, values, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, values, steps, operations, elements, components, and/or groups thereof.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Referring to fig. 1, an embodiment of the application provides a speaker module 100, which includes a circuit board 10, and a first magnetic element 20 and a second magnetic element 30 disposed on opposite sides of the circuit board 10. The first magnetic element 20 and the second magnetic element 30 are arranged at intervals from the circuit board 10 so as to reserve a vibration space for the circuit board 10 to vibrate.
The circuit board 10 includes a main body 11 and a vibration part 12, and the main body 11 is connected to the vibration part 12 and integrally formed. The vibration part 12 is located between the first magnetic element 20 and the second magnetic element 30, and is configured to vibrate under the magnetic field generated by the first magnetic element 20 and the second magnetic element 30. The vibrating portion 12, the first magnetic element 20, and the second magnetic element 30 constitute a speaker.
The main body 11 includes a first dielectric layer 111 and a conductive line layer 112 that are stacked. The first dielectric layer 111 is used to support the conductive trace layer 112, and the conductive trace layer 112 is used to electrically connect with an external power source or electronic device. The number of the first dielectric layer 111 and the conductive line layer 112 is not limited in the present application, and may be set according to actual needs. When the number of the conductive line layers 112 is plural, the adjacent conductive line layers 112 are electrically insulated by the first dielectric layer 111 and electrically connected by the conductive structure penetrating through the first dielectric layer 111. The conductive structures may be conductive vias formed by a plating process or conductive pillars formed by a via-fill process. In the present embodiment, the number of the first dielectric layers 111 is one, the number of the conductive circuit layers 112 is two, and the two conductive circuit layers 112 are disposed on two opposite surfaces of the first dielectric layers 111.
The vibrating portion 12 includes a first surface 12a and a second surface 12b that are disposed opposite to each other. A portion of the first surface 12a is recessed toward the second surface 12b to form a first groove 12a1. A portion of the second surface 12b is recessed toward the first surface 12a to form a second groove 12b1. The first grooves 12a1 and the second grooves 12b1 are alternately arranged at intervals. Referring to fig. 2, the first groove 12a1 is spiral when viewed in a direction perpendicular to the first surface 12 a. It will be appreciated that the second grooves 12b1 are correspondingly spiral. In other embodiments, the second groove 12b1 may be omitted.
Referring to fig. 1 and 2, the vibration part 12 further includes a first coil 121, a second coil 122, and a second dielectric layer 123. The first coil 121 and the second coil 122 are each spiral-shaped as viewed in a direction perpendicular to the first surface 12 a. The two exposed surfaces of the second dielectric layer 123 serve as the first surface 12a and the second surface 12b, respectively. The first coil 121 is disposed on a side of the first surface 12a of the second dielectric layer 123, and is staggered with the first grooves 12a1 at intervals, and aligned with the second grooves 12b1. The second coil 122 is disposed on the side of the second surface 12b of the second dielectric layer 123, and is staggered with the second grooves 12b1 at intervals, and the first grooves 12a1 are aligned. The number of the first coil 121, the second coil 122, and the second dielectric layer 123 may be set according to actual needs. In the present embodiment, the number of the first coil 121, the second coil 122, and the second dielectric layer 123 is one, the first coil 121 and the second coil 122 are respectively disposed on the first surface 12a and the second surface 12b of the second dielectric layer 123, the first surface 12a is recessed to form a first groove 12a1 penetrating through a portion of the second dielectric layer 123, and the second surface 12b is recessed to form a second groove 12b1 penetrating through a portion of the second dielectric layer 123.
Referring to fig. 3, in another embodiment, the number of the first coil 121, the second coil 122, and the second dielectric layer 123 is plural. The plurality of first coils 121 are disposed between the first surface 12a of the second dielectric layer 123 and the bottom wall of the second recess 12b1. The plurality of second coils 122 are disposed between the second surface 12b of the second dielectric layer 123 and the bottom wall of the first recess 12a 1. The adjacent first coils 121, the adjacent first and second coils 121 and 122, and the adjacent second coils 122 are electrically insulated by respective second dielectric layers 123. The portions of the second dielectric layers 123 that extend beyond the first coil 121 or the second coil 122 are combined with each other to form a dielectric layer integral body, and the portions of the outer surface of the dielectric layer integral body that are recessed inward through the dielectric layer integral body form the corresponding first grooves 12a1 or second grooves 12b1.
Referring to fig. 1, in some embodiments, the first coil 121 and the second coil 122 are exposed outside the first surface 12a and the second surface 12b, respectively, and an exposed surface of the first coil 121 exposed outside the second dielectric layer 123 is flush with the first surface 12a, and an exposed surface of the second coil 122 exposed outside the second dielectric layer 123 is flush with the second surface 12 b. In other embodiments, the exposed surface of the first coil 121 is convex or concave with respect to the first surface 12a, the exposed surface of the second coil 122 is convex or concave with respect to the second surface 12b, or the first coil 121 and the second coil 122 are buried in the second dielectric layer 123.
In some embodiments, the second dielectric layer 123 is coplanar with and integrally formed with the first dielectric layer 111, and the first coil 121 and the second coil 122 are respectively coplanar with and integrally formed with the respective conductive trace layers 112.
The vibrating portion 12 has flexibility so that the vibrating portion 12 can vibrate up and down in a direction perpendicular to the first surface 12 a. The second dielectric layer 123 is made of a flexible material. In some embodiments, the second dielectric layer 123 includes at least one of a liquid crystal high molecular polymer, polytetrafluoroethylene, polyetheretherketone, polyphenylene oxide, polyimide, polyethylene terephthalate, polyethylene naphthalate, or polyethylene.
In some embodiments, the body portion 11 is flexible. The first dielectric layer 111 is made of a flexible material. The first dielectric layer 111 includes at least one of liquid crystal high molecular polymer, polytetrafluoroethylene, polyetheretherketone, polyphenylene oxide, polyimide, polyethylene terephthalate, polyethylene naphthalate, or polyethylene. The material of the first dielectric layer 111 having flexibility may be the same as or different from the material of the second dielectric layer having flexibility. In other embodiments, the body portion 11 has rigidity, and the first dielectric layer 111 may be made of a rigid material. For example, the material of the first dielectric layer 111 is a prepreg including glass fibers and epoxy resin.
The first magnetic element 20 is disposed proximate to the first surface 12a and spaced a predetermined distance from the first surface 12a, and the first magnetic element 20 covers at least a portion of the vibrating portion 12. The second magnetic element 30 is disposed proximate to the second surface 12b and spaced a predetermined distance from the second surface 12b, and the second magnetic element 30 covers at least a portion of the vibrating portion 12. In some embodiments, the first magnetic element 20 is annular and covers the first recess 12a1 and the first coil 121, and the second magnetic element 30 is annular and covers the second recess 12b1 and the second coil 122. In other embodiments, the first and second magnetic elements 20, 30 are each plate-shaped and cover the entire first and second surfaces 12a, 12b, respectively. The first magnetic element 20 and the second magnetic element 30 are permanent magnets, and opposite ends of the first magnetic element 20 and the second magnetic element 30 have different magnetic poles to form a driving magnetic circuit. For example, the end of the first magnetic element 20 facing the vibration portion 12 is an S-pole, and the end of the second magnetic element 30 facing the vibration portion 12 is an N-pole.
Referring to fig. 1, in some embodiments, the first magnetic element 20 is supported and fixed on the circuit board 10 by a first support 41, and the second magnetic element 30 is supported and fixed on the circuit board 10 by a second support 42. The first support 41 and the second support 42 may each be a bracket.
The first coil 121 and the second coil 122 are each electrically connected to the main body 11 so that the first coil 121 and the second coil 122 are in communication with a power source. When the first coil 121 and/or the second coil 122 are energized, the first coil 121 and/or the second coil 122 can drive the vibration portion 12 to vibrate up and down under the action of the magnetic fields generated by the first magnetic element 20 and the second magnetic element 30. In other embodiments, the second coil 122 may be omitted, and only the force generated by the first coil 121 drives the vibration part 12 to vibrate up and down.
Another embodiment of the present application provides an electronic device, including the speaker module 100 described above. The electronic device may be, but is not limited to, a mobile phone, a notebook computer, an MP3 player, a headset, etc.
According to the application, the vibrating part 12 of the circuit board 10 is matched with the first magnetic element 20 and the second magnetic element 30 to form the loudspeaker, so that no additional vibrating diaphragm, shell and the like are required, and miniaturization is facilitated; and by providing the spiral first groove 12a1 and/or the spiral second groove 12b1, the vibrating portion 12 is made to vibrate up and down more easily under the same force.
The present application is not limited to the above-mentioned embodiments, but is capable of other and obvious modifications and equivalents of the above-mentioned embodiments, which will be apparent to those skilled in the art from consideration of the present application without departing from the scope of the present application.
Claims (10)
1. The utility model provides a speaker module, its characterized in that includes circuit board, first magnetic element and second magnetic element, the circuit board is including main part and the vibrating portion that is connected, the vibrating portion is including relative first surface and the second surface that sets up, and the partial recess of first surface forms spiral first recess, the vibrating portion still includes spiral first coil, first coil with the crisscross interval setting of first recess, first magnetic element is close to first surface setting, second magnetic element is close to second surface setting, first magnetic element with second magnetic element is configured to be used for driving the vibrating portion is along the direction perpendicular to first surface vibration.
2. The speaker module of claim 1, wherein a portion of the second surface is recessed to form a spiral second groove, the second groove aligned with the first coil.
3. The speaker module of claim 2, wherein the vibration portion further comprises a spiral-shaped second coil aligned with the first groove.
4. The speaker module of claim 3, wherein the second coil is exposed at the second surface, and an exposed surface of the second coil is flush with the second surface.
5. The speaker module of claim 1, wherein the first coil is exposed at the first surface, and wherein an exposed surface of the first coil is flush with the first surface.
6. The speaker module of claim 1, wherein the body portion and the vibration portion are integrally formed.
7. The speaker module of claim 1, further comprising a first support and a second support, the first magnetic element being supported on the circuit board by the first support and spaced a predetermined distance from the vibration portion, the second magnetic element being supported on the circuit board by the second support and spaced a predetermined distance from the vibration portion.
8. The speaker module of claim 1, wherein the first magnetic element and the second magnetic element are both permanent magnets.
9. The speaker module of claim 1, wherein the first magnetic element and the second magnetic element are each ring-shaped or plate-shaped.
10. An electronic device comprising a speaker module according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323019914.6U CN221058440U (en) | 2023-11-08 | 2023-11-08 | Speaker module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323019914.6U CN221058440U (en) | 2023-11-08 | 2023-11-08 | Speaker module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221058440U true CN221058440U (en) | 2024-05-31 |
Family
ID=91203910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323019914.6U Active CN221058440U (en) | 2023-11-08 | 2023-11-08 | Speaker module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221058440U (en) |
-
2023
- 2023-11-08 CN CN202323019914.6U patent/CN221058440U/en active Active
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