CN221057411U - Semiconductor chip packaging structure - Google Patents
Semiconductor chip packaging structure Download PDFInfo
- Publication number
- CN221057411U CN221057411U CN202322201300.3U CN202322201300U CN221057411U CN 221057411 U CN221057411 U CN 221057411U CN 202322201300 U CN202322201300 U CN 202322201300U CN 221057411 U CN221057411 U CN 221057411U
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- Prior art keywords
- semiconductor chip
- heat
- heat dissipation
- substrate body
- packaging structure
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor chips, and provides a semiconductor chip packaging structure which comprises a substrate body, a semiconductor chip body and a sealing cover, wherein a mounting groove is formed in the center of the inside of the substrate body, the semiconductor chip body is integrally mounted in the mounting groove, the sealing cover is mounted at the top of the substrate body, a heat dissipation mechanism is mounted at the top of the substrate body, and the bottom of the heat dissipation mechanism is pressed at the top of the semiconductor chip body. Through the design of cooling mechanism, the two-thirds structure of whole radiating fin extends to packaging structure's outside, and heat can effectively conduct and give off to reduce the temperature of semiconductor chip, improve work efficiency and the stability of chip, radiating fin wears the design of export and sealed heat conduction rubber ring can prevent outside dust effectively, wraps up in the outside of radiating fin grafting end simultaneously, can ensure the maximize of radiating effect.
Description
Technical Field
The utility model relates to the technical field of semiconductor chips, in particular to a semiconductor chip packaging structure.
Background
And (3) a semiconductor chip: the semiconductor device which is manufactured by etching and wiring on the semiconductor sheet and can realize certain functions has poor packaging effect of the traditional semiconductor chip, so that heat cannot be quickly and effectively radiated after the semiconductor chip is packaged, the heat cannot be radiated through air heat transfer, and the heat conductivity coefficient of the air is small, so that the defects of unobvious radiating effect and low radiating efficiency exist, and meanwhile, the semiconductor chip is easy to contact with excessive external dust after being packaged, so that the practicability is reduced.
The utility model provides a semiconductor chip packaging structure for 202221724903.0, includes base plate body, encapsulation mechanism and heat dissipation dustproof mechanism, encapsulation mechanism sets up at the top of base plate body, heat dissipation dustproof mechanism sets up on the base plate body, encapsulation mechanism includes the mounting groove, the top at the base plate body is seted up to the mounting groove, the bottom of mounting groove inner wall is provided with the semiconductor chip body. According to the utility model, through the mutual matching of the mounting groove, the limiting block, the fixing rod, the protective cover, the sliding block, the fixing groove, the connecting rod, the pull plate, the buffer spring, the positioning block, the positioning groove, the semiconductor refrigerating sheet, the heat conducting glue, the radiating sheet and the radiating hole, the packaging of the semiconductor chip is ensured, the heat radiation and dust prevention performance of the semiconductor chip is improved, the heat generated by the semiconductor chip can be rapidly discharged, the heat radiation effect of the semiconductor chip is improved, and meanwhile, the heat radiation effect of the substrate body is improved, and the practicability is improved.
However, in the packaging structure, external dust can invade the inside at the radiating holes, dust can be fully accumulated in the inside in the long-time use process, the subsequent radiating effect is further influenced, and the radiating fins are arranged in the packaging structure, so that the radiating effect is not obvious.
Therefore, the present disclosure provides a semiconductor chip package structure to solve the above-mentioned problems.
Disclosure of utility model
In order to overcome the defects in the prior art, the utility model aims to provide a semiconductor chip packaging structure.
In order to achieve the purpose, the technical scheme of the utility model is realized as follows: the utility model provides a semiconductor chip packaging structure, includes base plate body, semiconductor chip body and closing cap, the inside center of base plate body is provided with the mounting groove, the semiconductor chip body integral erection in the inside of mounting groove, the closing cap install in the top of base plate body, heat dissipation mechanism is installed at base plate body top, heat dissipation mechanism bottom compress tightly in the top of semiconductor chip body.
Preferably, the heat dissipation mechanism comprises a heat conduction rubber pad and a heat dissipation fin, the heat conduction rubber pad is adhered to the surface of the semiconductor chip body, the heat dissipation fin is provided with a plurality of heat dissipation fins which are transversely and parallelly distributed inside the top end of the sealing cover, the bottom ends of the heat dissipation fins are tightly pressed on the top of the heat conduction rubber pad, and two thirds of the heat dissipation fins are located outside the sealing cover.
Preferably, the plurality of radiating fins are specifically arranged inside the plurality of radiating fin penetrating holes formed in the top of the cover.
Preferably, a sealing heat-conducting rubber ring is arranged on the inner side of the port of each radiating fin penetrating opening, and the sealing heat-conducting rubber ring is sealed on the side face of the radiating fin penetrating end.
Preferably, the upper port of the substrate body is arranged in a step shape, the butt joint end of the sealing cover and the substrate body is arranged in a shape matched with the upper end of the sealing cover, and the butt joint end of the sealing cover and the substrate body is further locked by a screw.
Preferably, limit blocks are arranged at the positions, close to the periphery, of the bottom of the inner groove of the mounting groove, and the inner sides of the limit blocks are propped against the side edges of the semiconductor chip body.
Preferably, a plurality of pins are equidistantly arranged on two sides of the substrate body, and one ends of the inner sides of the pins are electrically connected with the semiconductor chip body.
The beneficial effects of the utility model are as follows:
The heat dissipation effect is excellent: through the design of heat dissipation mechanism, the two-thirds structure of whole radiating fin extends to packaging structure's outside, and heat can effectively conduct and give off to reduce the temperature of semiconductor chip, improve the work efficiency and the stability of chip.
The sealing performance is good: the design of the radiating fin through-outlet and the sealing heat-conducting rubber ring can effectively prevent invasion of external dust, and meanwhile, the radiating fin through-outlet and the sealing heat-conducting rubber ring are wrapped on the outer side of the radiating fin plug-in end, so that maximization of radiating effect can be ensured.
Drawings
In the drawings:
FIG. 1 is a schematic view of a semi-cut structure of the present utility model;
FIG. 2 is a schematic view of the top structure of the closure of the present utility model;
FIG. 3 is a schematic diagram of a heat dissipation mechanism according to the present utility model;
Reference numerals illustrate:
1. A substrate body; 2. a mounting groove; 3. a semiconductor chip body; 4. a limiting block; 5. pins; 6. a cover; 7. a heat dissipation mechanism; 61. a heat radiation fin penetrating opening; 62. sealing the heat-conducting rubber ring; 71. a heat conducting rubber pad; 72. and a heat radiating fin.
Detailed Description
The present utility model will now be described in further detail with reference to the drawings and examples, wherein it is apparent that the examples described are only some, but not all, of the examples of the utility model. Embodiments of the utility model and features of the embodiments may be combined with each other without conflict. All other embodiments, based on the embodiments of the utility model, which would be apparent to one of ordinary skill in the art without inventive effort are within the scope of the utility model.
It should be noted that, in the embodiment of the present utility model, directional indications (such as up, down, left, right, front, and rear … …) are referred to, and the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, "a plurality of" means two or more. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed by the utility model.
Referring to fig. 1-3 of the specification, the utility model provides a semiconductor chip package structure, which comprises a substrate body 1, a semiconductor chip body 3 and a cover 6, and is characterized in that a mounting groove 2 is arranged in the center of the inside of the substrate body 1, the semiconductor chip body 3 is integrally mounted in the mounting groove 2, the cover 6 is mounted at the top of the substrate body 1, a heat dissipation mechanism 7 is mounted at the top of the substrate body 1, and the bottom of the heat dissipation mechanism 7 is pressed at the top of the semiconductor chip body 3.
The design and processing of the mounting groove 2 may be adjusted according to the size and shape of the semiconductor chip to ensure that the semiconductor chip body 3 can be completely mounted therein.
The semiconductor chip body 3 is placed inside the mounting groove 2, ensuring that it is in close contact with the substrate body 1. The semiconductor chip body 3 may be fixed using a suitable adhesive or soldering technique to ensure stability and reliability thereof.
The cover 6 is placed on top of the substrate body 1 and ensures a shape fit with the top of the substrate body 1. Screws or other fixing means may be used to firmly fix the cover 6 to the substrate body 1 to ensure structural stability and reliability.
A heat dissipation mechanism 7 is mounted on top of the substrate body 1, which may be achieved by welding, gluing or other suitable fixing means. The heat dissipation mechanism 7 may adopt a combination structure of the heat conductive rubber pad 71 and the heat dissipation fins 72, so as to ensure that heat can be effectively conducted and dissipated.
The thermal pad 71 is adhered to the surface of the semiconductor chip body 3 to ensure that heat can be efficiently transferred from the semiconductor chip body 3 to the heat dissipation fins 72. A thermally conductive adhesive or other thermally conductive medium may be used to achieve efficient heat transfer.
The heat radiating fin 72 has a plurality of sheet-like structures arranged in parallel in the lateral direction, and these fins are mounted inside the top end of the cover 6. The heat radiating fins 72 are ensured to be in close contact with the cover 6, and the bottom thereof is pressed against the top of the heat conductive rubber pad 71. This ensures that heat can be efficiently transferred from the thermal pad 71 to the heat radiating fins 72.
The plurality of heat radiating fins 72 are specifically provided inside the plurality of heat radiating fin passing-through holes 61 provided at the top of the cover 6.
Depending on design requirements, a plurality of heat dissipation fin through-holes 61 are provided at the top of the cover 6, and heat dissipation fins 72 are specifically provided inside these through-holes. Ensuring that the heat radiating fins 72 closely fit the shape of the through-hole 61 to maximize the heat radiating effect.
A sealing heat-conducting rubber ring 62 is arranged on the inner side of the port of each radiating fin penetrating port 61.
In order to prevent the entry of the external environment, the inside of the port of each fin through-outlet 61 is provided with a sealing heat conductive rubber ring 62. These sealing heat conducting gaskets 62 are tightly sealed to the sides of the penetrating ends of the heat dissipating fins 72 to ensure heat conduction through the surfaces of the heat dissipating fins.
The upper port of the base plate body 1 is in a ladder shape, and the sealing cover 6 is matched with the butt joint end of the base plate body 1.
In order to provide better connection and stability, the upper port of the substrate body 1 is designed in a stepped manner. The abutting end of the cover 6 and the base plate body 1 has a shape adapted to the upper end thereof to ensure tight connection and provide structural stability. The connection of the cover 6 and the substrate body 1 may be further locked using screws or other fastening means.
A plurality of pins 5 are equidistantly arranged on two sides of the substrate body 1.
A plurality of pins 5 are equidistantly disposed on two sides of the substrate body 1, and are used for electrically connecting with the semiconductor chip body 3. The number and layout of the pins 5 can be optimally designed according to specific requirements to ensure reliable signal transmission and electrical connection.
When the heat conducting device is used, a large amount of heat can be generated when the chip works, and after the heat is generated, the heat conducting rubber pad is adhered to the surface of the chip, so that the heat conducting device can effectively conduct the heat. The heat is conducted to the radiating fins through the heat conducting rubber pads, the radiating fins are provided with large-area surfaces, and the heat is rapidly transferred to the surrounding environment through the functions of diffusion and convection. The radiating fins are designed with a plurality of sheet structures which are transversely and parallelly arranged, so that the surface area is increased, and the radiating capacity of heat is enhanced. The heat radiating fins are arranged at the top of the chip through the sealing cover, and two thirds of the heat radiating fins are arranged outside, so that the temperature difference between the heat radiating fins and the surrounding environment promotes natural convection of heat, and the heat can be effectively radiated from the heat radiating structure. If external heat dissipating devices (such as fans or fins) are present, heat dissipation efficiency can be further increased, accelerating heat conduction and dissipation.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The utility model provides a semiconductor chip packaging structure, includes base plate body (1), semiconductor chip body (3) and closing cap (6), its characterized in that, the inside center of base plate body (1) is provided with mounting groove (2), semiconductor chip body (3) integral erection in the inside of mounting groove (2), closing cap (6) install in the top of base plate body (1), heat dissipation mechanism (7) are installed at base plate body (1) top, heat dissipation mechanism (7) bottom compress tightly in the top of semiconductor chip body (3);
The heat dissipation mechanism (7) comprises a heat conduction rubber pad (71) and heat dissipation fins (72), the heat conduction rubber pad (71) is adhered to the surface of the semiconductor chip body (3), the heat dissipation fins (72) are arranged in the top end of the sealing cover (6) in a plurality of transversely parallel mode, the bottom ends of the heat dissipation fins (72) are pressed to the top of the heat conduction rubber pad (71), and two-thirds of the heat dissipation fins (72) are arranged outside the sealing cover (6).
2. A semiconductor chip package according to claim 1, wherein a plurality of the heat dissipation fins (72) are provided in particular inside a plurality of heat dissipation fin through-holes (61) provided at the top of the cover (6).
3. A semiconductor chip package according to claim 2, wherein a sealing heat conductive rubber ring (62) is provided inside the port of each of the heat radiating fin penetrating openings (61), and the sealing heat conductive rubber ring (62) is sealed to the side of the penetrating end of the heat radiating fin (72).
4. The semiconductor chip packaging structure according to claim 1, wherein the upper port of the substrate body (1) is provided in a stepped shape, the abutting end of the cover (6) and the substrate body (1) is provided in a shape adapted to the upper end thereof, and the abutting ends of the cover (6) and the substrate body (1) are further locked by screws.
5. The semiconductor chip packaging structure according to claim 1, wherein limiting blocks (4) are arranged at the positions, close to the periphery, of the inner groove bottom of the mounting groove (2), and the inner sides of the limiting blocks (4) are abutted against the side edges of the semiconductor chip body (3).
6. The semiconductor chip packaging structure according to claim 1, wherein a plurality of pins (5) are equidistantly arranged on two sides of the substrate body (1), and one end of the inner side of each of the plurality of pins (5) is electrically connected with the semiconductor chip body (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322201300.3U CN221057411U (en) | 2023-08-16 | 2023-08-16 | Semiconductor chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322201300.3U CN221057411U (en) | 2023-08-16 | 2023-08-16 | Semiconductor chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221057411U true CN221057411U (en) | 2024-05-31 |
Family
ID=91198230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322201300.3U Active CN221057411U (en) | 2023-08-16 | 2023-08-16 | Semiconductor chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221057411U (en) |
-
2023
- 2023-08-16 CN CN202322201300.3U patent/CN221057411U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240606 Address after: 200120, Room 601, No. 26, Lane 848, Huanlin West Road, Pudong New Area, Shanghai Patentee after: He Junju Country or region after: China Address before: Room 108, Building 3, No. 36 Xiecun Road, Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province, 215000 Patentee before: Suzhou Yunkuo Automation Technology Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240628 Address after: 200120 building C, No. 888, Huanhu West 2nd Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai Peining Integrated Circuit Design Co.,Ltd. Country or region after: China Address before: 200120, Room 601, No. 26, Lane 848, Huanlin West Road, Pudong New Area, Shanghai Patentee before: He Junju Country or region before: China |