CN221039314U - Detection system of circuit bare board - Google Patents

Abstract

A detection system of a circuit bare board is used for detecting the circuit bare board and comprises a probe device, a transceiver antenna and a measuring device. The probe device is used for electrically contacting the circuit bare board. The measuring device comprises a switcher, an analyzer and a signal generator. The switcher is used for switching to enable the transceiver antenna to be electrically connected with the analyzer or the signal generator. The signal generator is electrically connected with the probe device to be electrically connected with the circuit bare board. The analyzer is electrically connected with the probe device to be electrically connected with the circuit bare board. The detection system can directly detect the circuit bare board by using the measuring device to electrically connect the circuit bare board through the probe device under the condition of no chip for detection, thereby directly obtaining the performance parameters of the circuit bare board and selecting out qualified circuit bare boards.

Description

Detection system of circuit bare board

Technical Field

The present utility model relates to a testing system, and more particularly to a testing system for a circuit bare board (bare circuit board).

Background

Most circuit boards in existing mobile devices (e.g., smartphones and tablet computers) have antennas to enable the mobile device to have wireless communication functionality. The circuit board with the antenna can be detected after the manufacture to confirm whether the antenna works normally. Before the detection, a chip for detection is required to be mounted on the circuit board, so that the chip is electrically connected with the antenna and controls the antenna to transmit and receive wireless signals, and the antenna is detected.

However, since the above-mentioned antenna is detected using a chip for detection, the existing method for detecting the antenna requires additional time and cost to pre-mount the chip for detection on the circuit board, so that the existing method for detecting the antenna for the circuit board is time-consuming and causes an increase in cost due to the requirement of the chip for detection. Moreover, the above-mentioned detection results cover the overall performance of the chip and the circuit board, and the industry can not directly know the electrical quality of the circuit board from the detection results.

Disclosure of utility model

At least one embodiment of the present utility model provides a system for inspecting a bare circuit board, which can directly inspect the circuit board on which the chip is not mounted.

The detection system provided by at least one embodiment of the utility model is used for detecting a circuit bare board, wherein the circuit bare board comprises an antenna and a connecting pad, and the antenna is electrically connected with the connecting pad. The detection system comprises a probe device, a transceiver antenna and a measuring device. The probe device is used for electrically contacting the connecting pad so as to be electrically connected with the antenna through the connecting pad. The measuring device comprises a switcher, an analyzer and a signal generator. The switcher is electrically connected with the receiving and transmitting antenna, the analyzer and the signal generator. The switcher is used for switching to enable the transceiver antenna to be electrically connected with the analyzer or the signal generator. The signal generator is electrically connected with the probe device. The analyzer is electrically connected with the probe device.

In at least one embodiment of the present utility model, the switch is further electrically connected to the probe device. The switcher is used for switching to enable the probe device to be electrically connected with the analyzer or the signal generator.

In at least one embodiment of the utility model, the measuring device further comprises a frequency converter. The frequency converter is electrically connected between the probe device and the analyzer and between the probe device and the signal generator.

In at least one embodiment of the utility model, the measuring device further comprises a frequency converter. The frequency converter is electrically connected between the switcher and the analyzer and between the switcher and the signal generator.

In at least one embodiment of the utility model, the analyzer is electrically connected to the signal generator.

In at least one embodiment of the present utility model, the detection system further comprises a stage. The bearing table comprises a bearing pad. The bearing pad of the bearing table is used for bearing the circuit bare board. The receiving and transmitting antenna is aligned with the antenna of the circuit bare board placed on the bearing pad, and a hollow space exists between the receiving and transmitting antenna and the bearing pad. The bearing pad is an electrical insulator.

In at least one embodiment of the present utility model, the probe device includes at least one of a probe card, a socket with spring probes, radio frequency probes, microelectromechanical system probes, and microelectromechanical system probe card.

In at least one embodiment of the present utility model, the detection system further includes an image sensor. The image sensor is used for capturing the overlooking image of the circuit bare board and identifying the position of the connecting pad according to the overlooking image.

In at least one embodiment of the present utility model, the detection system further includes a rangefinder, a driving device, and a control device. The distance meter, the driving device and the image sensor are electrically connected with the control device. The distance meter is used for sensing the height of the connecting pad and transmitting the sensed information to the control device. The driving device is connected with the probe device and controlled to move the probe device. The control device controls the driving device to move the probe device according to the overlook image captured by the image sensor and the information sensed by the range finder.

In at least one embodiment of the present utility model, the measuring device further comprises a second switch. The second switcher is electrically connected with the probe device, the analyzer and the signal generator. The second switcher is used for switching to enable the probe device to be electrically connected with the analyzer or the signal generator.

Based on the above, the detection system disclosed in the above embodiment can directly detect the antenna of the circuit bare board without a chip for detection. Compared with the existing detection method using the chip for detection, the detection system of the embodiment can directly detect the circuit board which is not provided with the chip, thereby having the advantages of reducing the cost and shortening the detection time.

Drawings

For a more complete understanding of the embodiments and advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

fig. 1 is a schematic diagram of a detection system for detecting a bare circuit board according to at least one embodiment of the present utility model.

Fig. 2 is a schematic diagram of the detection system of fig. 1 detecting a receiving path of a circuit bare board.

Fig. 3 is a schematic diagram of a detection system for detecting a bare circuit board according to another embodiment of the present utility model.

Fig. 4 is a schematic diagram of the detection system of fig. 3 detecting a receiving path of a circuit bare board.

[ Main element symbols description ]

1A,1b: detection system 11: bearing table

111: Load pad 112: support member

121,122: Probe device 13: transmitting-receiving antenna

14: Measuring device 141: signal generator

142: Analyzer 143: switching device

143A: first end 143b: second end

143C: third end 144: frequency converter

145: The second switcher 145a: first end

145B: second end 145c: third end

145D: fourth end 15: image sensor

16: Control device 17: distance measuring instrument

18: The driving device 19: reflection-free chamber

191: Wave absorbing material 100: circuit bare board

110: Pad 120: antenna

RS: reflected signal SA1: first signal

SA2: first radiation signal SA3: first test signal

SB1: second signal SB2: second radiation signal

SB3: second test signal

Detailed Description

Embodiments of the present utility model are discussed in detail below. However, it is to be understood that the embodiments provide many applicable concepts that can be embodied in a wide variety of specific contexts. The embodiments discussed and disclosed are merely illustrative and are not intended to limit the scope of the utility model.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the claims. Unless otherwise limited, the singular forms "a", "an" and "the" are intended to mean the plural forms as well.

Fig. 1 is a schematic diagram of a test system 1A for testing a circuit board 100 according to at least one embodiment of the present utility model. Referring to fig. 1, a detection system 1A is used for detecting a circuit bare board 100, wherein the circuit bare board 100 includes at least one pad 110 and at least one antenna 120. In the embodiment shown in fig. 1, the circuit bare board 100 may include a plurality of pads 110 and a plurality of antennas 120. In other embodiments, the circuit board 100 may include only one of the pads 110 and the antennas 120. The detection system 1A includes a stage 11, a plurality of probe devices 121 and 122, a transceiver antenna 13, a measuring device 14, an image sensor 15, and a control device 16.

In the present embodiment, the circuit bare board 100 may include a plurality of antennas 120 and an interlayer connection structure (not shown). The antennas 120 are electrically connected to at least some of the pads 110, respectively, wherein the pads 110 can be electrically connected to the antennas 120 through an interlayer connection structure, and the interlayer connection structure can include at least one of a conductive via (conductive through hole), a conductive blind via (conductive blind via), and a conductive buried via (conductive buried via).

The bare circuit board 100 is a circuit substrate on which no active devices are mounted. In other words, the electrical signal transmitted in the circuit substrate does not pass through any active device before any active device is mounted on the circuit board 100. In addition, the active device is, for example, a transistor or an integrated circuit (INTEGRATED CIRCUIT, IC) having at least one transistor, and the active device may also be a packaged chip (PACKAGED CHIP) or a bare die (die) that has not been packaged.

It should be noted that, although the circuit bare board 100 is a circuit substrate that is not provided with any active components, the circuit bare board 100 may have passive components, such as a capacitor, an inductor, or a resistor. For example, in other embodiments, the circuit board 100 may have embedded passive elements (embedded passive component), such as discrete elements (discrete component). Or at least one of the circuit layers of the circuit bare board 100 may form a passive element. For example, the wiring bare board 100 may have two adjacent wiring layers overlapped with each other to form a capacitor.

In addition, the circuit bare board 100 may be a working board (board) or a substrate strip (strip) of various sizes, and thus the circuit bare board 100 may include a plurality of circuit board units (units), wherein each circuit board unit includes at least one pad and at least one antenna. After inspection of the wiring board 100, the qualified wiring board 100 may be cut to separate the wiring board units. The bare circuit board 100 may also include only one circuit board unit without limitation.

In addition, the circuit bare board 100 may be a printed circuit board, a carrier, a flexible circuit board (flexible wiring board), or a flexible-RIGID WIRING board, and the circuit bare board 100 may include at least two circuit layers, wherein one circuit layer may be an antenna. Taking fig. 1 as an example, the lower wiring layer may include a plurality of antennas 120.

The carrying table 11 includes a carrying pad 111 and a supporting member 112, wherein the carrying pad 111 is connected to the supporting member 112 and is supported by the supporting member 112. In this embodiment, the support 112 may include a plurality of columns, for example three or four columns. The carrier pad 111 is used for receiving the circuit bare board 100 and is an electrical insulator. Further, the dielectric constant of the carrier pad 111 may be between 1 and 20, and the optimal dielectric constant of the carrier pad 111 is 1. The carrier pad 111 may include a polymer material. For example, a portion or all of the bearing pad 111 may be made of expanded polystyrene (Expanded Polystyrene, EPS, commonly known as Styrofoam). The size of the carrier pad 111 can be adjusted with the circuit bare board 100 to carry various sizes of working boards or base strips or circuit board units.

The probe devices 121 and 122 are used for electrically contacting the pads 110 to electrically connect the antenna 120 of the circuit bare board 100 via the pads 110. The probe devices 121 and 122 include at least one of a probe card (probe card), a socket (socket with pogo pin) with spring probes, a radio frequency probe (Radio Frequency probe, RF probe), a microelectromechanical system probe (microelectromechanical system probe, MEMS probe), and a microelectromechanical system probe card (microelectromechanical system probe card, MEMS probe card), wherein the radio frequency probe may be a GSG (Ground Signal Ground, GSG) probe, a GS (group Signal) probe, SG (Signal Ground) probe, or an SGS (Signal Ground Signal, SGS) probe.

The probe devices 121 and 122 in the present embodiment are two GSG probes, and the probe device 121 electrically contacts the pad 110 at the transmitting end of the antenna 120, and the probe device 122 electrically contacts the pad 110 at the receiving end of the antenna 120. The probe devices 121 and 122 are electrically connected to the antenna 120 through the pads 110.

The transceiver antenna 13 may be a horn antenna (horn antenna). The transceiver antenna 13 is spaced apart from the carrier 11, and a hollow space is provided between the transceiver antenna and the carrier pad 111. The transceiver antenna 13 is aligned with and directed toward the antenna 120 of the wiring bare board 100 placed on the carrier pad 111. Further, the distance between the transceiver antenna 13 and the antenna 120 of the wiring bare board 100 is the same as the far field distance for measuring the antenna 120.

The measuring device 14 includes a signal generator 141, an analyzer 142, and a switch 143. The signal generator 141 may be a vector signal generator (Vector Signal Generator, VSG) and is electrically connected to the probe device 121 to electrically connect the antenna 120 of the circuit board 100. The analyzer 142 may be a vector signal analyzer (Vector Signal Analyzer), a vector network analyzer (Vector Network Analyzer, VNA), or a time domain reflectometer (Time Domain Reflectometer, TDR), and is electrically connected to the probe device 122 to electrically connect to the antenna 120 of the circuit board 100. In addition, the signal generator 141 is electrically connected to the analyzer 142, so that signals can be transmitted between the signal generator 141 and the analyzer 142.

The switch 143 includes a first end 143a, a second end 143b and a third end 143c, wherein the first end 143a, the second end 143b and the third end 143c are electrically connected to the transceiver antenna 13, the signal generator 141 and the analyzer 142, respectively. The switch 143 is configured to switch between the first end 143a and the second end 143b or between the first end 143a and the third end 143c, so that the transceiver antenna 13 is electrically connected to the signal generator 141 or the transceiver antenna 13 is electrically connected to the analyzer 142. It should be noted that, the signal generator 141 and the analyzer 142 may be multi-channel devices, so that the probe device 121 and the switch 143 do not interfere with each other when the signal generator 141 is electrically connected to the probe device 121 and the switch 143 for detection, and the analyzer 142 is electrically connected to the probe device 122 and the switch 143 for detection, so that the probe device 122 and the switch 143 do not interfere with each other.

The measurement device 14 may further include a frequency converter 144. The frequency converter 144 is electrically connected between the probe device 121 and the signal generator 141, between the probe device 122 and the analyzer 142, and can convert the frequency of the signal generated by the signal generator 141 according to the frequency of the signal transmitted on the circuit board 100. Second, the frequency converter 144 can further convert the frequency of the signal transmitted on the circuit board 100 according to the frequency of the signal received by the analyzer 142. Further, the frequency converter 144 is also electrically connected between the switch 143 and the signal generator 141, between the switch 143 and the analyzer 142, and can convert the frequency of the signal generated by the signal generator 141 according to the frequency of the signal radiated by the transceiver antenna 13, and can convert the frequency of the signal output by the transceiver antenna 13 according to the frequency of the signal received by the analyzer 142. The frequency converter 144 may up-convert or down-convert the frequency of the signal.

The image sensor 15 is used for capturing a top view image of the circuit bare board 100, and further, the image sensor 15 can identify the position of the pad 110 according to the top view image. For example, the image sensor 15 may be a video camera or a still camera, and may have an image processor (image processor). The bare circuit board 100 may have a positioning mark (ALIGNMENT MARK, not shown), and the top view image captured by the image sensor 15 has an image of the positioning mark. The image processor of the image sensor 15 can identify the pad 110 according to the image of the positioning mark, so as to obtain the position of the pad 110.

The control device 16 is electrically connected to the signal generator 141, the analyzer 142 and the image sensor 15. The control device 16 is used for controlling the signal generator 141 to generate signals, judging the status of the circuit bare board 100 according to the signals measured by the analyzer 142, and controlling the image sensor 15 to capture the top view image of the circuit bare board 100. The control device 16 may be a computer such as a desktop, industrial or notebook computer. Or the control device 16 may be a microprocessor.

In addition, the detection system 1A may further include a distance meter 17 and a plurality of driving devices 18. The rangefinder 17 is electrically connected to the control device 16 and is used for sensing the height of the pads 110 on the circuit board 100. The distance meter 17 may be a contact type distance meter or a non-contact type distance meter, wherein the non-contact type distance meter may be an infrared laser distance meter for sensing the distance from itself to the pad 110 and transmitting the sensed distance information to the control device 16.

The driving devices 18 are electrically connected to the control device 16 (for simplifying the drawing, the connection between the driving devices 18 and the control device 16 is not shown), and are respectively connected to the probe devices 121 and 122 and capable of moving the probe devices 121 and 122. The driving device 18 is, for example, a stepping motor. The control device 16 can control the driving device 18 according to the top view image captured by the image sensor 15 and the distance sensed by the distance meter 17, so that the driving device 18 moves the probe devices 121 and 122 to the correct positions, and the probe devices 121 and 122 electrically contact the correct pads 110 to detect the antenna 120, thereby realizing automatic detection of the bare circuit board 100.

It should be noted that the carrying table 11, the probe devices 121 and 122, the transceiver antenna 13, the image sensor 15, the distance meter 17 and the driving device 18 may be placed in a non-reflective chamber 19, wherein the non-reflective chamber 19 is a space defined by a wave absorbing material 191. The bare circuit board 100 can be simulated to detect in free space without any substance when detecting without the reflective chamber 19, thereby accurately detecting the performance of the antenna 120.

When inspecting the circuit board 100, the control device 16 can control the driving device 18 according to the top view image captured by the image sensor 15 and the distance sensed by the distance meter 17, so as to move the probe devices 121 and 122 to the correct positions. Next, the control device 16 controls the signal generator 141 to generate the first signal SA1, and the first signal SA1 is up-converted by the frequency converter 144 and then transmitted to the probe device 121, and then transmitted to the antenna 120 through the pad 110.

The antenna 120 receives the first signal SA1 and radiates the first radiation signal SA2, and generates the reflected signal RS, wherein the first signal SA1 and the reflected signal RS are electrical signals, and the electrical signals can only be transmitted through a circuit and cannot be transmitted in a radiation manner, and the first radiation signal SA2 is transmitted in a radiation manner. The transceiver antenna 13 receives the first radiation signal SA2 and outputs a first test signal SA3, wherein the first test signal SA3 is also an electrical signal and can only be transmitted through a circuit. The first test signal SA3 is transmitted from the transceiver antenna 13 to the switch 143, wherein the switch 143 is switched to electrically connect the transceiver antenna 13 to the analyzer 142. The first test signal SA3 is switched and transmitted to the frequency converter 144 via the switch 143, and then is down-converted and transmitted to the analyzer 142.

The analyzer 142 receives the first test signal SA3 and measures. The analyzer 142 may be a vector signal analyzer to measure a performance parameter of the transmission path, such as an error vector magnitude (Error Vector Magnitude, EVM). In addition, the reflected signal RS is sent back to the frequency converter 144 via the probe apparatus 122 for down-conversion and then sent to the analyzer 142. Thus, the return loss (return loss) of the antenna 120 may be measured by using a vector network analyzer. The impedance of the antenna 120 may be measured by using a time domain reflectometer.

Fig. 2 is a schematic diagram of the inspection system 1A of fig. 1 inspecting the receiving path of the wiring bare board 100. Referring to fig. 1, when the analyzer 142 receives the first test signal SA3, the analyzer records the power of the first test signal SA3 as a power value, and transmits the power value to the signal generator 141. Referring to fig. 2, the signal generator 141 generates a second signal SB1, wherein the signal generator 141 generates the second signal SB1 according to the power value, such that the power of the second signal SB1 is the same as the power value. The second signal SB1 is up-converted by the frequency converter 144 and then transmitted to the switch 143, wherein the switch 143 is switched to electrically connect the signal generator 141 to the transceiver antenna 13.

The second signal SB1 is switched and transferred to the transmitting/receiving antenna 13 via the switch 143. The transceiver antenna 13 receives the second signal SB1 and radiates the second radiation signal SB2, wherein the second signal SB1 is an electrical signal and can only be transmitted through a line, and the second radiation signal SB2 is transmitted in a radiation manner. The antenna 120 receives the second radiation signal SB2 and outputs a second test signal SB3, wherein the second test signal SB3 is also an electrical signal.

The second test signal SB3 outputted from the antenna 120 is transmitted to the probe device 122 via the pad 110 and to the frequency converter 144. The second test signal SB3 is down-converted by the frequency converter 144 and then transmitted to the analyzer 142. Analyzer 142 receives and measures second test signal SB3, wherein analyzer 142 may be a vector signal analyzer to measure a performance parameter of the receive path or/and the full path, such as an error vector magnitude.

In addition, the order of measuring the performance parameters of the transmission path and the receiving path of the circuit bare board 100 may be changed, for example, the performance parameters of the receiving path of the circuit bare board 100 are measured first, and then the performance parameters of the transmission path and/or the complete path of the circuit bare board 100 are measured, without limitation. When the performance parameters of the receiving path of the circuit board 100 are measured, the signal generator 141 generates the second signal SB1 before generating the first signal SA1. When the analyzer 142 receives the second test signal SB3, it records the power of the second test signal SB3 as a power value, and transmits the power value to the signal generator 141. Next, the signal generator 141 generates the first signal SA1 according to the power value, so that the power of the first signal SA1 is the same as the power value.

It should be further noted that the switch 143 may be manually switched by a user or automatically switched by loading program codes, so that the transceiver antenna 13 is electrically connected to the signal generator 141 or the analyzer 142. When the performance parameter of the transmission path of the circuit board 100 is measured, the switch 143 is switched to electrically connect the transceiver antenna 13 to the analyzer 142, and when the performance parameter of the reception path of the circuit board 100 is measured, the switch 143 is switched to electrically connect the signal generator 141 to the transceiver antenna 13.

For example, when the switch 143 is automatically set and the transmission path of the circuit board 100 is measured, the switch 143 is set to switch the transceiver antenna 13 to be electrically connected to the analyzer 142, and when the analyzer 142 receives the first test signal SA3 or the signal generator 141 generates the second signal SB1, the switch 143 is triggered to switch the signal generator 141 to be electrically connected to the transceiver antenna 13.

On the other hand, when the switch 143 is set for automatic switching and the receiving path of the bare circuit board 100 is measured first, the switch 143 is set to switch so that the signal generator 141 is electrically connected to the transceiver antenna 13, and when the analyzer 142 receives the second test signal SB3 or the signal generator 141 is to generate the first signal SA1, it is set to trigger the switch 143 to switch to a condition that the transceiver antenna 13 is electrically connected to the analyzer 142.

Since the circuit board 100 is a circuit substrate that is not equipped with any active device, the current passing through the circuit board 100 does not pass through any active device, i.e., the first signal SA1, the first test signal SA3, the second signal SB1, and the second test signal SB3, before the circuit board 100 is equipped with any active device. Therefore, the control device 16 can directly know the electrical quality of the circuit bare board 100 according to the performance parameters of the transmission path, the receiving path and the complete path measured by the analyzer 142, so as to select the qualified circuit bare board 100.

From this, the inspection system 1A can directly inspect the circuit bare board 100 without using the conventional inspection chip, so as to pick out the qualified circuit bare board 100 and eliminate the unqualified circuit bare board 100. Compared with the existing detection method using the chip for detection, the detection system 1A of the present embodiment can eliminate the additional time and cost for installing the chip for detection, thereby having the advantages of reducing the cost and shortening the detection time.

Further, the performance parameters of the circuit board 100 measured by the inspection system 1A may be collected and analyzed by a communication system (not shown), such as a semiconductor device communication standard/generic device model (SEMI Equipment Communication Standard/Generic Equipment Model, SECS/GEM), to analyze the portion of the circuit board 100 to be modified.

Fig. 3 is a schematic diagram of a detecting system 1B detecting a circuit bare board 100 according to another embodiment of the present utility model, and fig. 4 is a schematic diagram of a detecting system 1B detecting a receiving path of the circuit bare board 100 of fig. 3. Referring to fig. 3 and 4, the detection system 1B of fig. 3 is similar to the detection system 1A of fig. 1, wherein elements having the same or similar functions are denoted by the same reference numerals.

The detection system 1B of fig. 3 is different from the detection system 1A of fig. 1 in that the measuring device 14 of the detection system 1B of fig. 3 further comprises a second switch 145. The second switch 145 includes a first end 145a, a second end 145b, a third end 145c and a fourth end 145d, wherein the first end 145a is electrically connected to the probe device 121, the second end 145b is electrically connected to the probe device 122, the third end 145c is electrically connected to the signal generator 141 through the frequency converter 144, and the fourth end 145d is electrically connected to the analyzer 142 through the frequency converter 144. The second switch 145 is configured to switch between the first end 145a and the third end 145c, or/and the second end 145b and the fourth end 145d, so that the probe device 121 is electrically connected to the signal generator 141, or/and the probe device 122 is electrically connected to the analyzer 142.

The inspection system 1B is similar to the inspection method of the inspection system 1A, and the control device 16 controls the signal generator 141 to generate the first signal SA1 when inspecting the performance parameter of the transmission path of the wiring bare board 100. The first signal SA1 is up-converted by the frequency converter 144 and then transmitted to the second switch 145, wherein the second switch 145 is switched to electrically connect the signal generator 141 to the probe apparatus 121. The first signal SA1 is transmitted to the probe device 121 via the second switch 145 and is transmitted to the antenna 120 via the pad 110.

The antenna 120 receives the first signal SA1 and radiates the first radiation signal SA2, and generates a reflected signal RS. The transceiver antenna 13 receives the first radiation signal SA2 and outputs a first test signal SA3. The first test signal SA3 is transmitted from the transceiver antenna 13 to the switch 143, and is switched by the switch 143 to be transmitted to the frequency converter 144 for down-conversion and then transmitted to the analyzer 142. The analyzer 142 receives the first test signal SA3 and measures, and the analyzer 142 may be a vector signal analyzer to measure a performance parameter of the transmission path of the circuit board 100, such as an error vector magnitude.

The reflected signal RS is transmitted back to the probe device 122 through the pad 110, is transmitted to the second switch 145 through the probe device 122, is transmitted to the frequency converter 144 through the second switch 145, and is down-converted to the analyzer 142. The return loss and impedance of the antenna 120 can be known by measuring the reflected signal RS.

When detecting the performance parameters of the receiving path or/and the complete path of the circuit board 100, the analyzer 142 receives the first test signal SA3 and records the power of the first test signal SA3 as a power value, and transmits the power value to the signal generator 141. The signal generator 141 may then generate the second signal SB1 according to the power value. The second signal SB1 is up-converted by the frequency converter 144, then transmitted to the switch 143, and switched by the switch 143 to be transmitted to the transceiver antenna 13. The transceiver antenna 13 receives the second signal SB1 and radiates the second radiation signal SB2, and the antenna 120 receives the second radiation signal SB2 and outputs the second test signal SB3.

The second test signal SB3 outputted from the antenna 120 is transmitted to the probe device 122 via the pad 110 and is transmitted to the second switch 145, wherein the second switch 145 is switched to electrically connect the probe device 122 to the analyzer 142. The second test signal SB3 is transmitted to the analyzer 142 via the second switch 145 after being down-converted by the frequency converter 144. The analyzer 142 receives the second test signal SB3 and measures, and the analyzer 142 may be a vector signal analyzer to measure a performance parameter of the received/full path, such as an error vector magnitude.

It should be noted that the switch 143 and the second switch 145 may be combined into the same apparatus, and are not limited thereto. When the same switcher detects, the detection process is not influenced and interfered by the respective switching of the multiple channels.

In summary, the inspection systems 1A and 1B disclosed in the above embodiments can directly use the measuring device 14 to electrically connect the circuit bare board 100 via the probe devices 121 and 122 to inspect the circuit bare board 100 under the condition that no chip for inspection is used, thereby directly obtaining the performance parameters of the circuit bare board 100 and selecting the qualified circuit bare board 100.

In addition, by using the switch 143 and the second switch 145 to switch the electrical connection relationship among the signal generator 141, the analyzer 142, the transceiver antenna 13 and the probe devices 121 and 122 for measurement, the amount of wiring or equipment required for installing the detection systems 1A and 1B can be reduced.

Although the present utility model has been described with reference to the above embodiments, it should be understood that the utility model is not limited thereto, but rather is capable of modification and variation without departing from the spirit and scope of the present utility model.

Claims (10)

1. The utility model provides a detecting system of circuit bare board for detect circuit bare board, wherein this circuit bare board includes antenna and pad, and this pad of this antenna electric connection, its characterized in that, this detecting system includes:

The probe device is used for electrically contacting the connecting pad so as to be electrically connected with the antenna through the connecting pad;

a transmitting/receiving antenna; and

The measuring device comprises a switcher, an analyzer and a signal generator, wherein the switcher is electrically connected with the transceiver antenna, the analyzer and the signal generator and is used for switching to enable the transceiver antenna to be electrically connected with the analyzer or the signal generator, the signal generator is electrically connected with the probe device, and the analyzer is electrically connected with the probe device.

2. The circuit board inspection system of claim 1, wherein the switch is further electrically connected to the probe device, and the switch is used for switching the probe device to be electrically connected to the analyzer or the signal generator.

3. The circuit board inspection system of claim 1, wherein the measuring device further comprises a frequency converter electrically connected between the probe device and the analyzer and between the probe device and the signal generator.

4. The circuit board inspection system of claim 1, wherein the measuring device further comprises a frequency converter electrically connected between the switch and the analyzer and between the switch and the signal generator.

5. The circuit board inspection system of claim 1, wherein the analyzer is electrically connected to the signal generator.

6. The system of claim 1, further comprising a carrier, the carrier comprising a carrier pad, the carrier pad of the carrier for receiving the circuit board, the transceiver antenna being aligned with the antenna of the circuit board disposed on the carrier pad, and a hollow space being provided between the transceiver antenna and the carrier pad, the carrier pad being an electrical insulator.

7. The circuit board inspection system of claim 1, wherein the probe device comprises at least one of a probe card, a socket with spring probes, radio frequency probes, microelectromechanical system probes, and microelectromechanical system probe card.

8. The system of claim 1, further comprising an image sensor for capturing a top view of the circuit board and identifying the location of the pad according to the top view.

9. The system of claim 8, further comprising a rangefinder, a driving device and a control device, wherein the rangefinder, the driving device and the image sensor are electrically connected to the control device, the rangefinder is used for sensing the height of the pad and transmitting sensed information to the control device, the driving device is connected to the probe device and controlled to move the probe device, and the control device controls the driving device to move the probe device according to the top view image captured by the image sensor and the information sensed by the rangefinder.

10. The circuit board inspection system of claim 1, wherein the measuring device further comprises a second switch electrically connected to the probe device, the analyzer and the signal generator, the second switch being configured to switch the probe device to be electrically connected to the analyzer or the signal generator.