CN220926793U - Temperature control device, bearing device and biological molecule detection system - Google Patents
Temperature control device, bearing device and biological molecule detection system Download PDFInfo
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- CN220926793U CN220926793U CN202322585393.4U CN202322585393U CN220926793U CN 220926793 U CN220926793 U CN 220926793U CN 202322585393 U CN202322585393 U CN 202322585393U CN 220926793 U CN220926793 U CN 220926793U
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Abstract
The utility model relates to the technical field of biomolecule detection systems, in particular to a temperature control device, a bearing device and a biomolecule detection system. The temperature control device comprises a carrying platform, a temperature control assembly and a heat radiation structure, wherein the temperature control assembly comprises a mounting frame, a thermoelectric refrigerator and a heat conduction substrate, the mounting frame is detachably connected to the carrying platform, a mounting cavity is formed in the mounting frame, the thermoelectric refrigerator is contained in the mounting cavity, the heat conduction substrate is detachably connected to the mounting frame and covers one side, far away from the carrying platform, of the mounting cavity, and two opposite sides of the thermoelectric refrigerator are respectively in contact with the carrying platform and the heat conduction substrate; the heat dissipation structure is connected to one side of the heat conduction substrate far away from the thermoelectric cooler. In the temperature control device of this embodiment, through adopting the mode assembly mounting bracket of detachable connection, thermoelectric cooler and heat conduction base plate to form the control by temperature change subassembly, when thermoelectric cooler breaks down, only need demolish the heat conduction base plate or separate mounting bracket and microscope carrier, can dismantle the change to thermoelectric cooler, simple structure, the dismouting is convenient.
Description
Technical Field
The utility model relates to the technical field of biomolecule detection systems, in particular to a temperature control device, a bearing device and a biomolecule detection system.
Background
The temperature control module in the biomolecule detection system needs to meet the requirements of high precision and large-scale temperature adjustment. The thermoelectric cooler (TEC) modules commonly used at present may have service life attenuated or damaged due to long-time high-strength operation and need to be replaced in time. However, in the existing biomolecule detection system, a series of components are required to be disassembled to replace the TEC module, so that the disassembly and assembly are inconvenient, and the service efficiency of the biomolecule detection system is affected.
Therefore, there is a need for an improvement to the above-described problems to change the current situation.
Disclosure of utility model
The utility model provides a temperature control device, a bearing device and a biomolecule detection system, which are used for solving the problem that a temperature control module in the existing biomolecule detection system is inconvenient to assemble and disassemble.
The utility model provides a temperature control device, which comprises:
A carrier;
the temperature control assembly comprises a mounting frame, a thermoelectric cooler and a heat conducting substrate, wherein the mounting frame is detachably connected to the carrying platform, a mounting cavity is formed in the mounting frame, the thermoelectric cooler is accommodated in the mounting cavity, the heat conducting substrate is detachably connected to the mounting frame and covers one side, far away from the carrying platform, of the mounting cavity, and the two opposite sides of the thermoelectric cooler are respectively in contact with the carrying platform and the heat conducting substrate; and
And the heat dissipation structure is connected to one side of the heat conduction substrate far away from the thermoelectric cooler.
According to one embodiment of the present utility model, the temperature control device further includes a heat conductor filled in a gap between the stage and the thermoelectric refrigerator, and/or the heat conductor is filled in a gap between the heat conductive substrate and the thermoelectric refrigerator;
optionally, the thermal conductor comprises at least one of a thermally conductive silicone grease, a phase change thermally conductive paste;
Optionally, the temperature control device further comprises a heat insulation board detachably connected to the carrying platform, the heat insulation board surrounds the temperature control assembly, and the heat dissipation structure is detachably connected to the heat insulation board and covers one side, away from the carrying platform, of the heat insulation board.
According to one embodiment of the utility model, the heat dissipation structure comprises a heat dissipation groove and a fixing piece, wherein the heat dissipation groove is in contact with the heat conduction substrate, the fixing piece is provided with a fixing screw and a compression spring, the fixing screw penetrates through the heat dissipation groove and is connected with the heat insulation plate, the compression spring is arranged on one side, away from the temperature control assembly, of the heat dissipation groove and is connected with the fixing screw, and the compression spring is used for driving the heat dissipation groove to be pressed and connected with one side, away from the thermoelectric refrigerator, of the heat conduction substrate.
According to one embodiment of the utility model, a heat dissipation runner is arranged in the heat dissipation groove, a liquid inlet hole and a liquid outlet hole which are respectively communicated with the heat dissipation runner are arranged in the heat dissipation structure, and the heat dissipation runner comprises a first runner, a middle runner and a second runner which are communicated with each other; the first flow channel is communicated with the liquid inlet; the middle runner is communicated with the first runner and is positioned at one side of the first runner; the second flow channel is respectively communicated with the middle flow channel and the liquid outlet hole, and is positioned at one side of the middle flow channel, which faces the first flow channel; the liquid inlet holes and the liquid outlet holes are respectively arranged on the same side of the heat dissipation groove, the first flow channel and the second flow channel are symmetrically arranged, and orthographic projections of the heat dissipation flow channels on the heat dissipation groove are uniformly distributed in the heat dissipation groove;
Optionally, the intermediate runner comprises at least one curved section, the curved section being arranged in a curved configuration within the heat dissipating structure such that the intermediate runner forms a comb-shaped runner inside the heat dissipating structure;
Optionally, the middle runner further comprises a connecting section, one end of the connecting section is communicated with the bending section, the other end of the connecting section is communicated with the first runner or the second runner, and the connecting section is arranged along a straight line direction and is attached to one side of the bending section;
Optionally, the first flow channel and the second flow channel are centrosymmetric along the midpoint of the connecting line of the liquid inlet hole and the liquid outlet hole, and the first flow channel and the second flow channel are respectively communicated with the middle flow channel;
Optionally, the middle flow channel comprises at least two communicated bending sections, wherein a liquid inlet of one bending section is communicated with the first flow channel, a liquid outlet of the other bending section is communicated with the second flow channel, and the two bending sections are in comb-shaped layout;
optionally, the heat dissipation structure has a dimension in a first direction greater than a dimension thereof in a second direction, the first direction is perpendicular to the second direction, the first flow channel and the second flow channel are symmetrically arranged, the first flow channel and the second flow channel are respectively arranged around the liquid inlet hole and the liquid outlet hole, the middle flow channel comprises at least two bending sections, and the middle flow channel integral structure extends along the first direction;
Optionally, the first flow channel is at least partially arranged in a bending way, and the orthographic projection of the liquid inlet on the heat dissipation structure is at least partially positioned in the first flow channel;
and/or the second flow passage is at least partially arranged in a bending way, and the orthographic projection of the liquid outlet on the heat dissipation structure is at least partially positioned in the second flow passage.
According to one embodiment of the utility model, the heat dissipation structure comprises a heat dissipation frame and a fan, wherein the heat dissipation frame is in contact with the thermoelectric refrigerator, an air guide groove is formed in one side of the heat dissipation frame away from the thermoelectric refrigerator, and the fan is arranged on one side of the air guide groove and used for driving external air flow to flow through the air guide groove;
optionally, the heat dissipation frame comprises a heat conduction part and a plurality of heat dissipation fins which are connected, the plurality of heat dissipation fins are arranged at intervals to form the air guide groove, one side of the heat conduction part is in contact with the thermoelectric refrigerator, and the heat dissipation fins are arranged on one side of the heat conduction part far away from the thermoelectric refrigerator;
Optionally, the heat dissipation structure further comprises a wind shield, a wind guide cavity is arranged in the wind shield, an air inlet communicated with the wind guide cavity is formed in the side wall of the wind shield, the heat dissipation frame is contained in the wind guide cavity, and the fan cover is arranged on the outer side of the air inlet.
According to one embodiment of the utility model, the temperature control assembly further comprises a temperature control switch, wherein the temperature control switch is inserted into the carrier and used for acquiring a temperature signal of the carrier;
And/or the temperature control assembly further comprises a thermistor, and the thermistor is inserted into the carrier and is in contact with the carrier.
According to one embodiment of the utility model, the mounting frame is provided with a clamping groove, the clamping groove is communicated with the side wall of the mounting cavity, the heat conducting substrate is at least partially accommodated in the mounting cavity and the clamping groove, and the heat conducting substrate is matched with the clamping groove in a clamping way;
And/or a countersink is formed in one side, far away from the thermoelectric cooler, of the heat conducting substrate, the heat conducting substrate is connected with the mounting frame through countersink fasteners, and the countersink fasteners are accommodated in the countersink.
The utility model also provides a bearing device, which comprises:
the temperature control device according to any one of the above; and
The bearing structure is connected to the carrying platform of the temperature control device, and one side, far away from the temperature control assembly, of the bearing structure is provided with a containing groove, and the bearing structure is used for bearing chips.
According to one embodiment of the utility model, the bearing structure comprises a bearing piece and a positioning piece, wherein the accommodating groove is arranged on one side of the bearing piece, the carrying platform is connected to the bearing piece, and the positioning piece is arranged on the carrying platform; the chip is provided with at least one positioning hole matched with the positioning piece.
The utility model also provides a biomolecule detection system, which comprises the temperature control device or the bearing device.
The embodiment of the utility model has the following beneficial effects:
In the temperature control device of this embodiment, through adopting the mode assembly mounting bracket of detachable connection, thermoelectric cooler and heat conduction base plate to form the control by temperature change subassembly, when thermoelectric cooler breaks down, only need demolish the heat conduction base plate or separate mounting bracket and microscope carrier, can dismantle the change to thermoelectric cooler, simple structure, the dismouting is convenient. In addition, the temperature control device of the embodiment is respectively matched with the carrying platform and the heat dissipation structure by arranging the temperature control assembly, the temperature control assembly can control the temperature of the carrying platform, and the heat dissipation structure can dissipate heat of a thermoelectric refrigerator in the temperature control assembly.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
FIG. 1 is a schematic view of a carrying device according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a portion of a carrying device according to an embodiment of the present utility model;
FIG. 3 is an exploded view of a carrier in an embodiment of the utility model;
FIG. 4 is an exploded view of a temperature control assembly in an embodiment of the present utility model;
FIG. 5 is a schematic diagram of a heat dissipating structure according to another embodiment of the present utility model;
FIG. 6 is an exploded view of a heat dissipating structure in another embodiment of the present utility model;
FIG. 7 is a schematic view of a heat sink in another embodiment of the utility model;
Reference numerals:
10. A carrying device; 100. a temperature control device; 110. a carrier; 111. a mounting hole; 120. a temperature control assembly; 121. a mounting frame; 1211. a mounting cavity; 1212. a clamping groove; 122. a thermoelectric cooler; 123. a thermally conductive substrate; 124. a temperature control switch; 125. a thermistor; 130. a heat dissipation structure; 131. a heat sink; 1311. a liquid inlet hole; 1312. a liquid outlet hole; 1313. a first flow passage; 1314. an intermediate flow passage; 13141. a curved section; 13142. a connection section; 1315. a second flow passage; 132. a fixing member; 1321. a fixing screw; 1322. a compression spring; 133. a heat dissipation frame; 1331. a heat conduction part; 1332. a heat radiation fin; 1333. an air guide groove; 134. a fan; 135. a wind shield; 1351. an air guide cavity; 1352. an air inlet hole; 140. a heat insulating plate; 200. a load bearing structure; 210. a carrier; 211. a receiving groove; 220. a positioning piece; 300. a manifold; 20. a chip; 201. and positioning holes.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, an embodiment of the present utility model provides a temperature control device 100, which includes a carrier 110, a temperature control component 120, and a heat dissipation structure 130, wherein the carrier 110 is used for supporting a chip 20; the temperature control assembly 120 comprises a mounting frame 121, a thermoelectric cooler 122 and a heat conducting substrate 123, wherein the mounting frame 121 is detachably connected to the carrier 110, a mounting cavity 1211 is formed in the mounting frame 121, the thermoelectric cooler 122 is accommodated in the mounting cavity 1211, the heat conducting substrate 123 is detachably connected to the mounting frame 121 and covers one side, far away from the carrier 110, of the mounting cavity 1211, and two opposite sides of the thermoelectric cooler 122 are respectively contacted with the carrier 110 and the heat conducting substrate 123; the heat dissipation structure 130 is connected to a side of the thermally conductive substrate 123 remote from the thermoelectric cooler 122.
In the temperature control device 100 of the present embodiment, the mounting frame 121, the thermoelectric cooler 122 and the heat conducting substrate 123 are assembled in a detachable connection manner to form the temperature control assembly 120, when the thermoelectric cooler 122 fails, the thermoelectric cooler 122 can be disassembled and replaced only by disassembling the heat conducting substrate 123 or separating the mounting frame 121 from the carrier 110, so that the temperature control device has a simple structure and is convenient and rapid to disassemble and assemble. In addition, in the temperature control device 100 of the present embodiment, by setting the temperature control component 120 to cooperate with the carrier 110 and the heat dissipation structure 130, the temperature control component 120 can control the temperature of the carrier 110, and the heat dissipation structure 130 can dissipate heat of the thermoelectric cooler 122 in the temperature control component 120.
In an embodiment, temperature control device 100 further includes a heat conductor filled in the gap between stage 110 and thermoelectric cooler 122, and/or a heat conductor filled in the gap between thermally conductive substrate 123 and thermoelectric cooler 122.
By arranging the heat conductors in the gaps between the carrier 110 and the thermoelectric cooler 122 and between the thermoelectric cooler 122 and the heat conducting substrate 123, the heat conductors can be coated on two opposite sides of the thermoelectric cooler 122 (or on one side of the carrier 110 facing the thermoelectric cooler 122 or on one side of the heat conducting substrate 123 facing the thermoelectric cooler 122) in the assembly process, so that the thermoelectric cooler 122 is filled in the gap between the two through the heat conductors after being attached to other elements, and therefore, the heat conduction effect between the thermoelectric cooler 122 and the carrier 110 and the heat conducting substrate 123 respectively can be ensured, and the heat conduction effect of the temperature control device is improved.
Specifically, in some embodiments, the thermal conductor comprises at least one of a thermally conductive silicone grease, a phase change thermally conductive paste.
It should be noted that the phase change thermal paste is a thermal conductive material based on a phase change material and capable of performing a physical state change at a specific temperature. The phase-change heat-conducting paste comprises the following main components: phase change materials, thermally conductive materials, filler materials, and the like. The phase change material is the most important component in the phase change heat conduction paste, absorbs and releases heat when the state of the phase change heat conduction paste changes, and can rapidly conduct heat. In the coating process, the phase-change heat-conducting paste is coated on the thermoelectric cooler 122, the carrier 110 or the heat-conducting substrate 123, and the solvent in the phase-change heat-conducting paste is volatilized through air drying, so that after the thermoelectric cooler 122 generates heat, the phase-change heat-conducting paste can be subjected to phase change and filled in gaps between the thermoelectric cooler 122 and other components under the action of self hydraulic force, and the use is convenient. Meanwhile, the heat-conducting silicone grease is also a common heat-conducting material, is prepared by mixing an organosilicon compound and high-purity metal oxide, is similar to phase-change heat-conducting paste in use mode, and does not need to wait for volatilization in the coating process.
Specifically, referring to fig. 1 to 3, the temperature control device 100 further includes a heat insulation board 140, the heat insulation board 140 is detachably connected to the carrier 110, the heat insulation board 140 is disposed around the temperature control assembly 120, and the heat dissipation structure 130 is detachably connected to the heat insulation board 140 and covers a side of the heat insulation board 140 away from the carrier 110.
Therefore, the heat insulation board 140 can be used as a mounting carrier of the temperature control assembly 120 to position the temperature control assembly 120, by arranging the thermoelectric cooler 122 inside the heat insulation board 140, when the thermoelectric cooler 122 needs to be controlled to reach a preset temperature, the heat insulation board 140 can also avoid the thermoelectric cooler 122 from exchanging temperature with the external environment on the premise that the thermoelectric cooler 122 conducts heat and dissipates heat through the heat conducting base plate 123 and the heat dissipating structure 130, for example, when the thermoelectric cooler 122 cools down, the heat insulation board 140 can avoid the external heat from being excessively conducted to the thermoelectric cooler 122 to affect the refrigeration effect of the thermoelectric cooler 122, and when the thermoelectric cooler 122 needs to be heated, the heat insulation board 140 can avoid the heat emitted by the thermoelectric cooler 122 from escaping. Because the temperature control assembly 120 is installed inside the heat insulation plate 140, when the thermoelectric cooler 122 is disassembled, the thermoelectric cooler 122 can be exposed to the external environment only by sequentially disassembling the heat dissipation structure 130 and the heat conduction substrate 123, the heat insulation plate 140 is not required to be disassembled, and the disassembly and the assembly are convenient.
Referring to fig. 1 and 3, in an embodiment, the heat dissipating structure 130 includes a heat dissipating slot 131 and a fixing member 132, the heat dissipating slot 131 contacts the heat conducting substrate 123, the fixing member 132 includes a fixing screw 1321 and a compression spring 1322, the fixing screw 1321 is disposed through the heat dissipating slot 131 and connected to the heat insulating plate 140, the compression spring 1322 is disposed on a side of the heat dissipating slot 131 away from the temperature control assembly 120 and connected to the fixing screw 1321, and the compression spring 1322 is used for driving the heat dissipating slot 131 to be pressed against a side of the heat conducting substrate 123 away from the thermoelectric cooler 122.
In the temperature control device 100 of the present embodiment, while the fixing screw 1321 is penetrating through the heat dissipation groove 131 and connected with the heat insulation plate 140, the compression spring 1322 is installed on the side of the heat dissipation groove 131 far away from the temperature control assembly 120 and connected with the fixing screw 1321, the fixing screw 1321 can position the installation of the compression spring 1322, and meanwhile, one end of the compression spring 1322 far away from the heat dissipation groove 131 can be abutted against the screw head of the fixing screw 1321; through the tight connection of the fixing piece 132 and the compression spring 1322, the heat dissipation groove 131 can be driven to be propped against the heat conduction substrate 123, so that good contact between the heat dissipation groove 131 and the heat conduction substrate 123 is ensured, and therefore the heat dissipation effect is maximized, and in some embodiments, a heat conductor can be arranged between the heat dissipation groove 131 and the heat conduction substrate 123 to improve the heat conduction effect between the heat dissipation groove 131 and the heat conduction substrate 123. In particular, the compression spring 1322 may be a coil spring.
Specifically, referring to fig. 3 to 7, the heat dissipation structure 130 is provided with a liquid inlet 1311 and a liquid outlet 1312 respectively connected to the heat dissipation channels; specifically, the heat dissipation flow channels include a first flow channel 1313, an intermediate flow channel 1314, and a second flow channel 1315; the first flow channel 1313 is communicated with the liquid inlet hole 1311; the middle runner 1314 is communicated with the first runner 1313 and is positioned at one side of the first runner 1313; the second flow channel 1315 is respectively connected to the middle flow channel 1314 and the liquid outlet hole 1312, and the second flow channel 1315 is located at one side of the middle flow channel 1314 facing the first flow channel 1313; the liquid inlet holes 1311 and the liquid outlet holes 1312 are respectively disposed on the same side of the heat dissipation structure 130, the first flow channels 1313 and the second flow channels 1315 are symmetrically disposed, and orthographic projections of the heat dissipation flow channels on the heat dissipation structure 130 are uniformly distributed in the heat dissipation structure 130.
In the heat dissipation structure 130 of the present embodiment, by disposing the first flow channel 1313 and the second flow channel 1315 on the same side of the middle flow channel 1314, the flowing length of the cooling liquid in the heat dissipation flow channel can be increased as much as possible to increase the heat absorption amount of the cooling liquid, thereby improving the heat dissipation effect of the heat dissipation structure 130; meanwhile, by arranging the liquid inlet 1311 and the liquid outlet 1312 on the same side of the heat dissipation structure 130, the overall structural layout of the heat dissipation structure 130 can be facilitated.
In one embodiment, the intermediate runner 1314 includes at least one curved section 13141, and the curved section 13141 is arranged in a curved configuration within the heat dissipating structure 130 such that the intermediate runner 1314 forms a comb-shaped runner inside the heat dissipating structure 130.
In the present embodiment, the curved sections 13141 are in an arcuate shape and repeatedly bent, so that the internal structure of the heat dissipation structure 130 forms a blocking structure that is staggered with each other, and the blocking structure cooperates with the middle flow passage 1314 to form a flow passage of a comb structure inside the heat dissipation structure 130; by the arrangement, the coverage rate of the heat dissipation flow channel on the orthographic projection of the heat dissipation structure 130 can be improved, so that the heat dissipation efficiency of the heat dissipation structure 130 is improved.
In another embodiment, the middle runner 1314 further includes a connecting section 13142, one end of the connecting section 13142 is connected to the curved section 13141, the other end of the connecting section 13142 is connected to the first runner 1313 or the second runner 1315, and the connecting section 13142 is arranged along a straight line direction and attached to one side of the curved section 13141.
In this embodiment, by providing the connection section 13142 and the curved section 13141 to connect, the flow rate of the cooling liquid in the connection section 13142 can be increased, so that the heat in the heat dissipation structure 130 can be more quickly and uniformly conducted to other low temperature positions of the heat dissipation structure 130, thereby improving the heat conduction effect of the heat dissipation structure 130.
In yet another embodiment, the first flow channel 1313 is at least partially curved, and the orthographic projection of the liquid inlet 1311 on the heat dissipating structure 130 is at least partially located inside the first flow channel 1313; and/or the second flow channel 1315 is at least partially curved, and the orthographic projection of the liquid inlet 1311 on the heat dissipating structure 130 is at least partially located inside the second flow channel 1315.
By arranging the first fluid channel 1313 at least partially around the fluid inlet 1311, when the heat dissipating structure 130 conducts heat with an external heat source (i.e. an object to be dissipated), after the cooling fluid enters the first fluid channel 1313 through the fluid inlet 1311, the flow path length of the cooling fluid in the first fluid channel 1313 can be increased, so as to increase the heat received by the cooling fluid, and since the first fluid channel 1313 is arranged around the fluid inlet 1311, the overlapping area between the orthographic projection of the first fluid channel 1313 on the heat dissipating structure 130 and the external heat source can be increased, so that the heat conducting effect and the heat dissipating effect of the heat dissipating structure 130 can be further improved; meanwhile, by arranging the first fluid channel 1313 to at least partially surround the fluid inlet 1311, the overall structure of the first fluid channel 1313 and the fluid inlet 1311 can be more compact, so as to meet the compact design requirement of the heat dissipation structure 130. Similarly, by surrounding the second flow channel 1315 around the liquid outlet hole 1312, the flow path length of the cooling liquid in the second flow channel 1315 can be increased to increase the heat output by the cooling liquid, and meanwhile, the overlapping area between the second flow channel 1315 and an external heat source can be increased, so that the overall structure of the second flow channel 1315 and the liquid outlet hole 1312 is compact, and details are omitted here.
It should be noted that "orthographic projection" herein refers to orthographic projection of the heat dissipation flow channel on the heat dissipation structure 130 along a direction perpendicular to the hot surface of the heat dissipation structure 130, that is, the projection manner shown in fig. 7. In this embodiment, the heat dissipation structure 130 has a flat surface and is used for contacting with an external member to achieve a heat dissipation effect, and by positioning the orthographic projection of the liquid inlet 1311 on the heat dissipation structure 130 at least partially inside the first flow channel 1313 and the orthographic projection of the liquid outlet 1312 on the heat dissipation structure 130 at least partially inside the second flow channel 1315, the heat dissipation flow channel can have a longer path to surround the liquid inlet 1311 and the liquid outlet 1312, so as to improve the heat exchange heat between the cooling liquid and the heat dissipation structure 130, thereby improving the heat dissipation effect of the heat dissipation structure 130.
Specifically, referring to fig. 7 (a), in the first embodiment, the middle flow channel 1314 includes at least two curved sections 13141, and the two curved sections 13141 are attached to each other and connected to the first flow channel 1313 and the second flow channel 1315, respectively, so that the two curved sections 13141 are combined to form a comb-shaped curved flow channel structure, and when the cooling liquid is transported inside the middle flow channel 1314, the cooling liquid can sequentially pass through the two curved sections 13141, so as to prolong the flow path length of the cooling liquid, by such arrangement, the heat dissipation and heat conduction effects of the heat dissipation structure 130 can be improved, and the overall structure of the heat dissipation structure 130 is compact, so that the miniaturization of the heat dissipation structure 130 can be realized.
Referring to fig. 7 (b), in the second embodiment, the intermediate flow passage 1314 includes at least one curved section 13141 and a connecting section 13142, and the connecting section 13142 is connected between the second flow passage 1315 (the first flow passage 1313) and the curved section 13141, so that, when the first flow passage 1313 in the present embodiment is used as a flow passage of the inlet liquid, the cooling liquid can be quickly discharged from the second flow passage 1315 through the connecting section 13142 after passing through the curved section 13141, thereby reducing the accumulation amount of heat in the heat dissipation structure 130 and improving the heat dissipation effect of the heat dissipation structure 130.
Referring to fig. 7 (c), in the third embodiment, the first flow channel 1313 and the second flow channel 1315 are symmetrically arranged, and the first flow channel 1313 and the second flow channel 1315 are respectively arranged around the liquid inlet hole 1311 and the liquid outlet hole 1312, and the middle flow channel 1314 includes at least two curved sections 13141 which are arranged in a fitting manner, so that heat can be uniformly distributed on the surface of the heat dissipation structure 130, and the heat dissipation effect of the heat dissipation structure 130 is improved.
It should be noted that, the length of the heat dissipating structure 130 in the first embodiment and the second embodiment may be half of that of the heat dissipating structure 130 in the third embodiment, so that when the heat dissipating structure 130 in the third embodiment needs to be replaced by the heat dissipating structure 130 in the first embodiment and/or the second embodiment, the heat dissipating structures 130 in the first embodiment or the second embodiment may be arranged side by side so as to cover the surface of the external heat source as much as possible; in other embodiments, a corresponding number of heat dissipation structures 130 may be selected according to practical requirements, so that the heat dissipation structures 130 can fully cover the surface of the external heat source. Specifically, in the present embodiment, the thermoelectric cooler 122 is a semiconductor thermoelectric cooler 122, and the external heat source may be a hot end of the thermoelectric cooler 122.
Referring to fig. 7 (d), in the fourth embodiment, the first flow channel 1313 and the second flow channel 1315 are centrosymmetric along the midpoint of the line connecting the liquid inlet 1311 and the liquid outlet 1312, and the first flow channel 1313 and the second flow channel 1315 are respectively communicated with the middle flow channel 1314; in this way, the first flow channel 1313 and the second flow channel 1315 can respectively surround the liquid inlet hole 1311 and the liquid outlet hole 1312, so as to prolong the path length of the cooling liquid in the heat dissipation structure 130, and meanwhile, by staggering a plurality of flow channel separators, an intermediate flow channel 1314 with a plurality of bending sections 13141 can be formed, so that the heat dissipation effect of the heat dissipation structure 130 can be improved.
Referring to fig. 5 and 6, in another embodiment, the heat dissipation structure 130 includes a heat dissipation frame 133 and a fan 134, the heat dissipation frame 133 contacts the thermoelectric refrigerator 122, a wind guiding slot 1333 is formed on a side of the heat dissipation frame 133 away from the thermoelectric refrigerator 122, and the fan 134 is disposed on a side of the wind guiding slot 1333 and is used for driving the external airflow to flow through the wind guiding slot 1333.
In this embodiment, the chip is connected to the heat dissipating frame 133 through the thermoelectric cooler 122 and conducts heat, when the thermoelectric cooler 122 is used for cooling the chip, the heat of the thermoelectric cooler 122 can be conducted to the heat dissipating frame 133, and the fan 134 is started to drive the external air to flow through the heat dissipating frame 133 and discharge the heat; when the chip needs to be cooled, the heat conduction function of the thermoelectric cooler 122 can be realized by arranging the heat dissipation frame 133 to be matched with the fan 134, so that the temperature control function of the temperature control assembly 120 on the chip can be realized.
Specifically, heat dissipation frame 133 includes a heat conduction portion 1331 and a plurality of heat dissipation fins 1332 connected, and a plurality of heat dissipation fins 1332 are arranged at intervals to form a wind guiding groove 1333, one side of heat conduction portion 1331 is in contact with thermoelectric cooler 122, and heat dissipation fins 1332 are arranged on one side of heat conduction portion 1331 away from thermoelectric cooler 122.
It is understood that the air guide grooves 1333 for air flow are formed by the heat radiating fins 1332 being spaced apart from each other, and at this time, the entire heat radiating area of the heat radiating frame 133 can be increased by providing a plurality of heat radiating fins 1332, thereby improving the heat radiating effect of the heat radiating frame 133.
In an embodiment, the heat dissipation structure 130 further includes a wind shield 135, the wind shield 135 is provided with an air guiding cavity 1351, an air inlet 1352 connected to the air guiding cavity 1351 is provided on a side wall of the wind shield 135, the heat dissipation frame 133 is accommodated in the air guiding cavity 1351, and the fan 134 is covered outside the air inlet 1352.
In this embodiment, the wind shield 135 is used as a mounting carrier for accommodating the heat dissipation frame 133 and the fixed fan 134, and at this time, by disposing the heat dissipation frame 133 in the wind guiding cavity 1351 of the wind shield 135, the flow direction of the external airflow can be guided, so that the external airflow can flow along the direction of the wind guiding slot 1333, thereby improving the heat transfer efficiency of the airflow.
Further, referring to fig. 3 and 4, the temperature control assembly 120 further includes a temperature control switch 124, where the temperature control switch 124 is inserted into the carrier 110 and is used to obtain a temperature signal of the carrier 110; and/or the temperature control assembly 120 further includes a thermistor 125, wherein the thermistor 125 is inserted into the carrier 110 and contacts the carrier 110.
In one embodiment, temperature control switch 124 cooperates with thermistor 125, of course, temperature control assembly 120 also includes a temperature control circuit for controlling thermoelectric cooler 122; when the temperature control is performed by using the thermistor 125 and the temperature control switch 124, a feedback control method is generally adopted. The temperature control switch 124 performs control according to the real-time temperature change detected by the thermistor 125. When the temperature exceeds the preset range, the temperature control switch 124 turns on or off the heating or cooling device by the control circuit to restore the temperature to the preset range. Meanwhile, the thermistor 125 continuously detects the temperature and feeds back the detection result to the temperature control switch 124. This enables the temperature controlled switch 124 to adjust the control strategy based on actual temperature changes to ensure that the system is operating in an optimal state. Therefore, the thermistor 125 and the temperature control switch 124 cooperate with each other, which not only ensures temperature accuracy, but also improves stability and reliability of temperature control.
Specifically, the temperature control switch 124 is an electronic switch capable of directly controlling the temperature, and functions to switch the circuit according to a preset temperature value. When the temperature is higher than the set value, the temperature control switch 124 will automatically open the control circuit to adjust the thermoelectric cooler 122, so as to cool the system; conversely, when the temperature is lower than the set value, the temperature control switch 124 will close the control circuit to heat the system. The thermistor 125 is a device whose resistance value varies with a temperature change, and whose resistance value is inversely proportional to the temperature. As the temperature increases, the resistance value of the thermistor 125 decreases and vice versa. The thermistor 125 can be used to detect temperature changes, such as in a thermometer. The thermistor 125 can control the temperature of the thermoelectric cooler 122 through a temperature control circuit. In some embodiments, temperature control switch 124 and thermistor 125 may also be used alone to perform the temperature control function of temperature control device 100.
Referring to fig. 4, in a preferred embodiment, the mounting frame 121 is provided with a clamping groove 1212, the clamping groove 1212 is communicated with a side wall of the mounting cavity 1211, the heat conducting substrate 123 is at least partially accommodated in the mounting cavity 1211 and the clamping groove 1212, and the heat conducting substrate 123 is matched with the clamping groove 1212 in a clamping way; and/or a countersunk hole is formed in one side, far away from the thermoelectric cooler 122, of the heat conducting base plate 123, the heat conducting base plate 123 is connected with the mounting frame 121 through countersunk fasteners, and the countersunk fasteners are accommodated in the countersunk hole.
When the temperature control assembly 120 of the embodiment is assembled, the clamping groove 1212 can be aligned with the end portion of the heat conducting substrate 123, then the heat conducting substrate 123 is inserted into the clamping groove 1212, the whole heat conducting substrate 123 is accommodated in the mounting cavity 1211, the heat conducting substrate 123 can be mounted and positioned by matching the clamping groove 1212 with the heat conducting substrate 123, and meanwhile, the combined structure of the heat conducting substrate 123 and the mounting frame 121 is compact.
In addition, through setting up the counter bore in the side that heat conduction base plate 123 kept away from thermoelectric cooler 122, after heat conduction base plate 123 passes through counter fastener and is connected with mounting bracket 121, the big end holding of counter fastener is in the counter bore to make the surface flush of heat conduction base plate 123, the heat radiation structure 130 of being convenient for is installed with heat conduction base plate 123 laminating, and makes temperature control subassembly 120 and heat radiation structure 130 integrated configuration more compact simultaneously. Specifically, countersunk fasteners include, but are not limited to countersunk screws and countersunk rivets.
The present utility model further provides a carrying device 10, which includes the temperature control device 100 and the carrying structure 200 in any of the foregoing embodiments, where the carrying structure 200 is connected to the carrier 110 of the temperature control device 100, and a receiving slot 211 for receiving the chip 20 is formed on a side of the carrying structure 200 away from the temperature control component 120.
When the chip 20 is mounted by using the carrying device 10, the chip 20 can be positioned by the accommodating groove 211 formed in the carrying structure 200, and meanwhile, since the chip 20 is accommodated in the accommodating groove 211, the carrying structure 200 has the smallest thickness dimension as possible after the chip 20 is mounted, so that the carrying structure 200 is compact.
It can be understood that, by providing the temperature control device 100 in any of the above embodiments in the carrying device 10 of the present embodiment, the temperature control device 100 forms the temperature control assembly 120 by assembling the mounting frame 121, the thermoelectric cooler 122 and the heat conducting substrate 123 in a detachable connection manner, and when the thermoelectric cooler 122 fails, the thermoelectric cooler 122 can be disassembled and replaced only by removing the heat conducting substrate 123 or separating the mounting frame 121 from the carrying platform 110, so that the convenience of replacing the thermoelectric cooler 122 by the carrying device 10 is improved.
Specifically, referring to fig. 3, the carrying structure 200 includes a carrying member 210 and a positioning member 220, the accommodating groove 211 is disposed on one side of the carrying member 210, the carrying platform 110 is connected to the carrying member 210, and the positioning member 220 is disposed on the carrying platform 110; the chip 20 is provided with at least one positioning hole 201 which is matched with the positioning piece 220.
Referring to fig. 1 to 3, in the present embodiment, the number of the positioning members 220 is two, and the two positioning members 220 are respectively disposed on two opposite sides of the carrier 110, the chip 20 is provided with two positioning holes 201 respectively corresponding to the two positioning members 220, the two sets of positioning members 220 and the positioning holes 201 cooperate to limit the movement freedom of the chip 20 in the X direction and the Y direction and the rotation freedom along the Z direction, and at this time, the chip 20 can be precisely positioned by cooperating the chip 20 with the accommodating groove 211 and cooperating the positioning members 220 with the positioning holes 201. When the chip 20 is mounted on the bearing structure 200, firstly, the positioning hole 201 of the chip 20 is aligned with the positioning piece 220, and then the chip 20 is sleeved on the positioning piece 220 through the positioning hole 201, so that the mounting of the positioning piece 220 and the positioning hole 201 can be completed; in the preferred embodiment, the positioning member 220 comprises a ball portion and a connecting portion, wherein the connecting portion is connected to the ball portion and the carrier 210, respectively, and the positioning hole 201 can be in sliding contact with the surface of the ball portion to guide the mounting of the chip 20 when the chip 20 is assembled, so as to improve the mounting convenience of the chip 20.
The utility model also provides a biomolecule detection system comprising the temperature control device 100 of any of the embodiments described above, or the carrier device 10 of any of the embodiments described above.
It can be appreciated that, in the biomolecule detecting system of the present embodiment, by providing the temperature control device 100 or the carrying device 10 in any one of the above embodiments, the temperature control device 100 can control the temperature of the chip 20, and meanwhile, the thermoelectric cooler 122 can be conveniently assembled and disassembled, so that when maintenance is required for the thermoelectric cooler 122, the shutdown time of the biomolecule detecting system can be reduced.
In an embodiment, the carrier 10 further includes a manifold 300, where the manifold 300 is connected to the heat insulation board 140 or the carrier 210, and when the chip 20 is connected to the carrier structure 200, the manifold 300 is connected to the infusion hole of the chip 20 through a pipeline, and the reaction solution or other solution is injected into the flow channel of the chip 20 through the manifold 300.
In this embodiment, the biomolecule detection system may be a gene sequencer, and the gene detection function of the biomolecule detection system may be achieved by injecting a reaction solution or other solutions into the chip 20 through the manifold 300.
Further, the carrier 110 is provided with a mounting hole 111, and the manifold 300 is inserted into the mounting hole 111.
By the cooperation of the manifold 300 and the mounting holes 111, the assembly between the carrier 110 and the manifold 300 can be positioned, while the combined structure of the two is compact. Specifically, the carrier 110 is provided with two mounting holes 111 and is respectively located at two opposite sides of the carrier 110, the number of the manifolds 300 is also two, and the two manifolds 300 are respectively connected with the two mounting holes 111 correspondingly; so configured, two manifolds 300 may be used to fill and drain, respectively, the chip 20 when the chip 20 is connected to the carrier structure 200.
In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.
In embodiments of the utility model, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. A temperature control device, comprising:
A carrier;
the temperature control assembly comprises a mounting frame, a thermoelectric cooler and a heat conducting substrate, wherein the mounting frame is detachably connected to the carrying platform, a mounting cavity is formed in the mounting frame, the thermoelectric cooler is accommodated in the mounting cavity, the heat conducting substrate is detachably connected to the mounting frame and covers one side, far away from the carrying platform, of the mounting cavity, and the two opposite sides of the thermoelectric cooler are respectively in contact with the carrying platform and the heat conducting substrate; and
And the heat dissipation structure is connected to one side of the heat conduction substrate far away from the thermoelectric cooler.
2. The temperature control device of claim 1, further comprising a thermal conductor filled in a gap between the stage and the thermoelectric cooler, and/or filled in a gap between the thermally conductive substrate and the thermoelectric cooler;
optionally, the thermal conductor comprises at least one of a thermally conductive silicone grease, a phase change thermally conductive paste;
Optionally, the temperature control device further comprises a heat insulation board detachably connected to the carrying platform, the heat insulation board surrounds the temperature control assembly, and the heat dissipation structure is detachably connected to the heat insulation board and covers one side, away from the carrying platform, of the heat insulation board.
3. The temperature control device of claim 2, wherein the heat dissipating structure comprises a heat dissipating groove and a fixing member, the heat dissipating groove is in contact with the heat conducting substrate, the fixing member is provided with a fixing screw and a compression spring, the fixing screw penetrates through the heat dissipating groove and is connected with the heat insulating plate, the compression spring is arranged on one side of the heat dissipating groove away from the temperature control assembly and is connected with the fixing screw, and the compression spring is used for driving the heat dissipating groove to be pressed against one side of the heat conducting substrate away from the thermoelectric cooler.
4. The temperature control device according to claim 3, wherein a heat dissipation runner is formed in the heat dissipation groove, the heat dissipation structure is provided with a liquid inlet and a liquid outlet respectively communicated with the heat dissipation runner, and the heat dissipation runner comprises a first runner, a middle runner and a second runner which are communicated with each other; the first flow channel is communicated with the liquid inlet; the middle runner is communicated with the first runner and is positioned at one side of the first runner; the second flow channel is respectively communicated with the middle flow channel and the liquid outlet hole, and is positioned at one side of the middle flow channel, which faces the first flow channel; the liquid inlet holes and the liquid outlet holes are respectively arranged on the same side of the heat dissipation groove, the first flow channel and the second flow channel are symmetrically arranged, and orthographic projections of the heat dissipation flow channels on the heat dissipation groove are uniformly distributed in the heat dissipation groove;
Optionally, the intermediate runner comprises at least one curved section, the curved section being arranged in a curved configuration within the heat dissipating structure such that the intermediate runner forms a comb-shaped runner inside the heat dissipating structure;
Optionally, the middle runner further comprises a connecting section, one end of the connecting section is communicated with the bending section, the other end of the connecting section is communicated with the first runner or the second runner, and the connecting section is arranged along a straight line direction and is attached to one side of the bending section;
Optionally, the first flow channel and the second flow channel are centrosymmetric along the midpoint of the connecting line of the liquid inlet hole and the liquid outlet hole, and the first flow channel and the second flow channel are respectively communicated with the middle flow channel;
Optionally, the middle flow channel comprises at least two communicated bending sections, wherein a liquid inlet of one bending section is communicated with the first flow channel, a liquid outlet of the other bending section is communicated with the second flow channel, and the two bending sections are in comb-shaped layout;
optionally, the heat dissipation structure has a dimension in a first direction greater than a dimension thereof in a second direction, the first direction is perpendicular to the second direction, the first flow channel and the second flow channel are symmetrically arranged, the first flow channel and the second flow channel are respectively arranged around the liquid inlet hole and the liquid outlet hole, the middle flow channel comprises at least two bending sections, and the middle flow channel integral structure extends along the first direction;
Optionally, the first flow channel is at least partially arranged in a bending way, and the orthographic projection of the liquid inlet on the heat dissipation structure is at least partially positioned in the first flow channel;
and/or the second flow passage is at least partially arranged in a bending way, and the orthographic projection of the liquid outlet on the heat dissipation structure is at least partially positioned in the second flow passage.
5. The temperature control device according to any one of claims 1 to 4, wherein the heat radiation structure comprises a heat radiation frame and a fan, the heat radiation frame is in contact with the thermoelectric refrigerator, a wind guide groove is formed in one side of the heat radiation frame away from the thermoelectric refrigerator, and the fan is arranged on one side of the wind guide groove and used for driving external airflow to flow through the wind guide groove;
optionally, the heat dissipation frame comprises a heat conduction part and a plurality of heat dissipation fins which are connected, the plurality of heat dissipation fins are arranged at intervals to form the air guide groove, one side of the heat conduction part is in contact with the thermoelectric refrigerator, and the heat dissipation fins are arranged on one side of the heat conduction part far away from the thermoelectric refrigerator;
Optionally, the heat dissipation structure further comprises a wind shield, a wind guide cavity is arranged in the wind shield, an air inlet communicated with the wind guide cavity is formed in the side wall of the wind shield, the heat dissipation frame is contained in the wind guide cavity, and the fan cover is arranged on the outer side of the air inlet.
6. The temperature control device of claim 1, wherein the temperature control assembly further comprises a temperature control switch, the temperature control switch being inserted into the carrier and configured to obtain a temperature signal of the carrier;
And/or the temperature control assembly further comprises a thermistor, and the thermistor is inserted into the carrier and is in contact with the carrier.
7. The temperature control device according to claim 1, wherein the mounting frame is provided with a clamping groove, the clamping groove is communicated with the side wall of the mounting cavity, the heat conducting substrate is at least partially accommodated in the mounting cavity and the clamping groove, and the heat conducting substrate is matched with the clamping groove in a clamping way;
And/or a countersink is formed in one side, far away from the thermoelectric cooler, of the heat conducting substrate, the heat conducting substrate is connected with the mounting frame through countersink fasteners, and the countersink fasteners are accommodated in the countersink.
8. A load carrying apparatus comprising:
The temperature control device of any one of claims 1-7; and
The bearing structure is connected to the carrying platform of the temperature control device, and one side, far away from the temperature control assembly, of the bearing structure is provided with a containing groove, and the bearing structure is used for bearing chips.
9. The carrier of claim 8, wherein the carrier structure comprises a carrier and a positioning member, the receiving slot is disposed on one side of the carrier, the carrier is connected to the carrier, and the positioning member is disposed on the carrier; the chip is provided with at least one positioning hole matched with the positioning piece.
10. A biomolecule detection system comprising a temperature control device according to any one of claims 1-7 or a carrier device according to any one of claims 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322585393.4U CN220926793U (en) | 2023-09-21 | 2023-09-21 | Temperature control device, bearing device and biological molecule detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322585393.4U CN220926793U (en) | 2023-09-21 | 2023-09-21 | Temperature control device, bearing device and biological molecule detection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220926793U true CN220926793U (en) | 2024-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322585393.4U Active CN220926793U (en) | 2023-09-21 | 2023-09-21 | Temperature control device, bearing device and biological molecule detection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220926793U (en) |
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2023
- 2023-09-21 CN CN202322585393.4U patent/CN220926793U/en active Active
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