CN220922040U

CN220922040U - Grinding fluid conveying device and grinding equipment

Info

Publication number: CN220922040U
Application number: CN202322744593.XU
Authority: CN
Inventors: 顾浩; 杨俊男; 闫晓晖
Original assignee: GTA Semiconductor Co Ltd
Current assignee: GTA Semiconductor Co Ltd
Priority date: 2023-10-12
Filing date: 2023-10-12
Publication date: 2024-05-10
Anticipated expiration: 2033-10-12

Abstract

The utility model provides a grinding fluid conveying device and grinding equipment. The grinding fluid conveying device comprises: fixing the arm; the grinding fluid conveying pipe is fixed on the surface of the fixed arm, and the surface of the grinding fluid conveying pipe far away from the fixed arm is provided with a plurality of spray holes which are axially distributed along the grinding fluid conveying pipe; the fixed ring is sleeved on the surface of the spray hole of the grinding fluid conveying pipe and is provided with at least one opening, and the aperture of the opening is smaller than that of the spray hole. Above-mentioned technical scheme through setting up the solid fixed ring that the cover was located the lapping liquid conveyer pipe, makes lapping liquid from the less solid fixed ring opening blowout in aperture, not only can save the quantity of lapping liquid, can also control lapping liquid spun direction, satisfies the lapping liquid cover demand on the lapping plate, avoids a large amount of lapping liquid to pile up in lapping plate edge, reduce cost. The design of the spray hole and the fixed ring can change the spray angle and the spray amount of the grinding fluid at will so as to meet various technologies.

Description

Grinding fluid conveying device and grinding equipment

Technical Field

The utility model relates to the field of semiconductors, in particular to a grinding fluid conveying device and grinding equipment.

Background

With the increasing size of semiconductor devices, as the deposition process with larger multi-layer interconnection or filling depth causes excessive fluctuation of the wafer surface, which causes difficulty in focusing the photolithography process, so that the control capability of line width is reduced, and the uniformity of line width on the whole wafer is reduced, chemical Mechanical Polishing (CMP) is introduced in the industry to planarize the wafer surface. After the semiconductor fabrication process enters the Sub-micron (Sub-micron) field, chemical mechanical polishing has become an indispensable fabrication process technology. A chemical mechanical polishing apparatus becomes one of important devices in a semiconductor process in a chemical mechanical polishing process.

Chemical mechanical polishing is the planarization of silicon wafers or other substrate materials during processing using chemical etching and mechanical forces. Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of a chemical polishing apparatus in the prior art, and fig. 2 is a schematic structural diagram of a polishing liquid arm in the prior art. As shown in fig. 1, the chemical polishing apparatus includes a polishing platen 11, a polishing liquid arm 12, and a conditioner 13. As shown in fig. 2, the polishing liquid arm 12 includes a fixed arm 21 and a polishing liquid pipe 22 for supplying polishing liquid to the polishing platen 11 (shown in fig. 1), and polishing liquid is supplied to the polishing platen 11 at a position outside the middle (a specific landing position depends on a process). As shown in fig. 1, since the grinding disc 11 rotates at a high speed during the grinding process, the grinding fluid falls down and is carried away by centrifugal force, the grinding fluid in the middle area of the grinding disc 11 needs to be uniformly smeared by swinging the trimmer 13, and the grinding fluid is distributed on the area of the grinding disc 11 as shown by a reference numeral 14. Meanwhile, in order to satisfy the polishing rate of the entire polishing disk 11, the flow rate of the polishing liquid must satisfy a certain flow rate. Most of the polishing liquid is accumulated at the edge of the polishing pad 11, resulting in waste.

The amount of polishing liquid is one of the important points of attention of each factory, and how to reduce the amount of polishing liquid and the cost is a problem.

Disclosure of Invention

The utility model aims to solve the technical problem of reducing the consumption of grinding fluid so as to reduce the production cost, and provides a grinding fluid conveying device and grinding equipment.

In order to solve the above problems, the present utility model provides a grinding fluid conveying device, including: fixing the arm; the grinding fluid conveying pipe is fixed on the surface of the fixed arm, and the surface of the grinding fluid conveying pipe far away from the fixed arm is provided with a plurality of spray holes which are axially distributed along the grinding fluid conveying pipe; the fixed ring is sleeved on the surface of the spray hole of the grinding fluid conveying pipe and is provided with at least one opening, and the aperture of the opening is smaller than that of the spray hole.

In some embodiments, the slurry delivery tube is secured to the stationary arm surface by a plurality of securing means axially aligned along the slurry delivery tube.

In some embodiments, the polishing liquid conveying device comprises four paths of polishing liquid conveying pipes, and the four paths of polishing liquid conveying pipes are mutually fixed on the surface of the fixed arm in parallel.

In some embodiments, the slurry delivery tube is secured to the front end tube via a tube expansion joint.

In some embodiments, a cross-sectional view of the nozzle along a radial direction of the polishing liquid delivery pipe is a sector, and a central angle of the sector is 90 °.

In some embodiments, the orifice has a diameter of 2.5mm.

In some embodiments, the aperture of the opening ranges from 0.5mm to 2mm.

In some embodiments, the retaining ring has a size that is larger than the size of the jet hole to jet the slurry from the opening of the retaining ring.

In some embodiments, the fixing ring is rotatably sleeved on the surface of the spraying hole of the grinding fluid conveying pipe so as to adjust the spraying angle of the grinding fluid.

In order to solve the problems, the utility model provides grinding equipment, which comprises the grinding fluid conveying device.

According to the technical scheme, the fixed ring sleeved on the surface of the spray hole of the grinding fluid conveying pipe is arranged, so that grinding fluid is sprayed out from the opening of the fixed ring with smaller aperture, the using amount of the grinding fluid can be saved, the spraying direction of the grinding fluid can be controlled, the grinding fluid covering requirement on the grinding disc is met, a large amount of grinding fluid is prevented from being accumulated at the edge of the grinding disc, and the cost is reduced. The design of the fixed ring and the spray holes can change the spraying angle and the spraying amount of the grinding fluid at will so as to meet various technologies.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described. It is apparent that the drawings in the following description are only some specific embodiments of the present utility model, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic diagram of a chemical polishing apparatus according to the prior art.

Fig. 2 is a schematic structural diagram of a polishing arm in the prior art.

Fig. 3 is a schematic side view of an embodiment of the polishing liquid conveying device according to the present utility model.

Fig. 4 is a schematic front view of an embodiment of the polishing liquid conveying device according to the present utility model.

Fig. 5 is a cross-sectional view taken along the direction AA' in fig. 3.

Fig. 6 is a schematic structural view of a fixing ring of the polishing liquid conveying device according to an embodiment of the utility model.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

Referring to fig. 3 to 4, fig. 3 is a schematic side view of an embodiment of a polishing liquid conveying device according to the present utility model, and fig. 4 is a schematic front view of an embodiment of a polishing liquid conveying device according to the present utility model. As shown in fig. 3 to 4, the polishing liquid conveying apparatus includes: a fixed arm 31, a polishing liquid conveying pipe 32 and a fixed ring 33. The grinding fluid conveying pipe 32 is fixed on the surface of the fixed arm 31, and the surface of the grinding fluid conveying pipe 32 far away from the fixed arm 31 is provided with a plurality of spray holes 321 which are axially distributed along the grinding fluid conveying pipe 32. The fixed ring 33 is sleeved on the surface of the nozzle 321 of the polishing liquid conveying pipe 32, the fixed ring 33 has at least one opening 331, and the aperture of the opening 331 is smaller than the aperture of the nozzle 321. It should be noted that only one fixing ring 33 is shown in fig. 3 as an example, and in practical use, each of the nozzle 321 has one fixing ring 33.

In some embodiments, the slurry delivery tube 32 is fixed to the surface of the fixed arm 31 by a plurality of fixing devices 34 axially arranged along the slurry delivery tube 32. In this embodiment, the fixing device 34 is a metal or non-metal buckle, and the grinding fluid conveying pipe 32 is detachably fixed on the surface of the fixing arm 31 under the action of mechanical force, so as to facilitate disassembly and replacement, thereby adapting to the requirements of different processes and reducing cleaning and maintenance costs.

In some embodiments, the slurry feed tube 32 is secured to the front end conduit 36 by a tube expansion joint 35. The pipe expanding connector 35 has better sealing connectivity, so as to avoid the problem of leakage of the grinding fluid conveying pipe 32 and the front end pipeline 36. And the pipe expanding interface 35 has simple structure, simple and convenient installation and operation, firm connection and capability of ensuring the reliability of the device.

Referring to fig. 4, in some embodiments, the polishing liquid conveying apparatus includes four polishing liquid conveying pipes 32, and the four polishing liquid conveying pipes 32 are fixed on the surface of the fixed arm 31 in parallel to each other. In this embodiment, four paths of the polishing liquid conveying pipes 32 are arranged along the horizontal direction, so that the polishing liquids of different pipelines do not affect each other when being sprayed out. In this embodiment, the polishing liquid delivery pipe 32 is a quarter pipe. The quarter tubes had a nominal diameter of 15 mm, an outer diameter of 20 mm and an inner diameter of 12.7 mm. The four-way pipe has different wall thicknesses of 2 mm, 2.3 mm and the like, and the inner diameter sizes of the pipes can be different.

Referring to fig. 5 to 6, fig. 5 is a cross-sectional view along AA' in fig. 3, and fig. 6 is a schematic structural view of a fixing ring of the polishing liquid conveying device according to an embodiment of the utility model. As shown in fig. 5 to 6, in some embodiments, the cross-sectional view of the nozzle 321 along the radial direction of the slurry delivery pipe 32 is a sector, and the central angle θ of the sector is 90 °. In this embodiment, the nozzle 321 is vertically downward, and each of the left and right directions is 45 °. The open spray holes 321 are arranged, so that the spraying range of the grinding fluid can be effectively enlarged, the spraying angle of the grinding fluid can be controlled, the requirement that the grinding fluid is uniformly distributed on the surface of the grinding disc can be met, and the grinding fluid can be uniformly distributed without a trimmer.

In some embodiments, the aperture of the nozzle 321 is 2.5mm, and the aperture of the opening 331 is in the range of 0.5mm to 2mm. In this embodiment, the aperture W1 of the opening 331 is 1mm. In other embodiments, the aperture W1 of the opening 331 may also be 0.5mm, 1.5mm, or 2mm. The fixed ring 33 with different apertures W1 of the opening 331 is selected to control the spraying speed of the polishing liquid in the process, so as to meet the requirements of different polishing processes.

In some embodiments, the fixing ring 33 is rotatably sleeved on the surface of the nozzle 321 of the polishing liquid conveying pipe 32, so as to adjust the polishing liquid spraying angle. In this embodiment, the fixing ring 33 may be rotated by any angle along the axial direction around the slurry delivery pipe 32, and the angle of the slurry discharge is controlled by adjusting the orientation of the opening 331. Since the discharge direction of the nozzle 321 of the polishing liquid delivery pipe 32 is adjusted to be 90 °, the discharge angle of the polishing liquid can be arbitrarily adjusted within the range defined by the nozzle 321 of the polishing liquid delivery pipe 32. In some embodiments, a plurality of openings 331 may be further disposed on the surface of the fixing ring 33, so that the polishing liquid is distributed more uniformly when being sprayed onto the polishing disc.

In some embodiments, the size of the fixed ring 33 is larger than the size of the nozzle 321, so that the polishing liquid is ejected from the opening 331 of the fixed ring 33, and the ejection direction and the ejection speed of the polishing liquid are controlled by the fixed ring 33.

Based on the same inventive concept, an embodiment of the present utility model also provides a grinding apparatus. The grinding apparatus includes: a polishing liquid conveying device; the polishing liquid conveying device is the polishing liquid conveying device shown in fig. 3 to 6, and is described in detail in the foregoing, and is not described herein.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

Generally, the terms may be understood, at least in part, from the usage in the context. For example, the term "one or more" as used herein, depending at least in part on the context, may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a feature, structure, or combination of features in a plural sense. Similarly, terms such as "a," "an," or "the" may also be construed to express singular usage or plural usage depending at least in part on the context. In addition, the term "based on" may be understood as not necessarily intended to express a set of exclusive factors, but may instead, depending at least in part on the context, allow for other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected/coupled" means not only that one component is directly coupled to another component, but also that one component is indirectly coupled to another component through intervening components.

It should be noted that the terms "comprising" and "having" and their variants are referred to in the document of the present utility model and are intended to cover non-exclusive inclusion. The terms "first," "second," and the like are used to distinguish similar objects and not necessarily to describe a particular order or sequence unless otherwise indicated by context, it should be understood that the data so used may be interchanged where appropriate. In addition, the embodiments of the present utility model and the features in the embodiments may be combined with each other without collision. In addition, in the above description, descriptions of well-known components and techniques are omitted so as to not unnecessarily obscure the present utility model. In the foregoing embodiments, each embodiment is mainly described for differences from other embodiments, and the same/similar parts between the embodiments are referred to each other.

The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.

Claims

1. A polishing liquid conveying apparatus, comprising:

Fixing the arm;

The grinding fluid conveying pipe is fixed on the surface of the fixed arm, and the surface of the grinding fluid conveying pipe far away from the fixed arm is provided with a plurality of spray holes which are axially distributed along the grinding fluid conveying pipe;

the fixed ring is sleeved on the surface of the spray hole of the grinding fluid conveying pipe and is provided with at least one opening, and the aperture of the opening is smaller than that of the spray hole.

2. The slurry delivery apparatus according to claim 1, wherein the slurry delivery pipe is fixed to the surface of the fixed arm by a plurality of fixing means arranged axially along the slurry delivery pipe.

3. The polishing liquid delivery device according to claim 1, wherein the polishing liquid delivery device comprises four polishing liquid delivery pipes, and the four polishing liquid delivery pipes are fixed to the surface of the fixed arm in parallel with each other.

4. The slurry delivery apparatus according to claim 1, wherein the slurry delivery pipe is fixed to the front end pipe via a pipe expansion joint.

5. The polishing liquid delivery apparatus according to claim 1, wherein a cross-sectional view of the nozzle hole in a radial direction of the polishing liquid delivery pipe is a sector, and a central angle of the sector is 90 °.

6. The polishing liquid delivery device according to claim 1, wherein the orifice has a diameter of 2.5mm.

7. The polishing liquid delivery device according to claim 1, wherein the aperture of the opening is in a range of 0.5mm to 2mm.

8. The slurry delivery device of claim 1, wherein the retaining ring has a size greater than the size of the jet hole such that slurry is jetted from the opening of the retaining ring.

9. The polishing liquid delivery device according to claim 1, wherein the fixing ring is rotatably sleeved on the surface of the nozzle of the polishing liquid delivery tube to adjust the polishing liquid ejection angle.

10. A polishing apparatus comprising the polishing liquid transporting device according to any one of claims 1 to 9.