CN220893905U

CN220893905U - Wafer characterization sample preparation device

Info

Publication number: CN220893905U
Application number: CN202322260478.5U
Authority: CN
Inventors: 胡维; 邱旋; 孙同享; 严锐
Original assignee: Wuhan Ruijing Laser Chip Technology Co ltd
Current assignee: Wuhan Ruijing Laser Chip Technology Co ltd
Priority date: 2023-08-22
Filing date: 2023-08-22
Publication date: 2024-05-03
Anticipated expiration: 2033-08-22

Abstract

The utility model provides a wafer characterization sample preparation device which comprises a first base, a marking device, a second base and a roller device, wherein a working area is arranged on the first base and is used for placing a wafer sample; the marking device is arranged on the first base and can move on the first base along a first direction and a second direction so as to cut and mark the wafer sample, wherein the first direction is the length direction of the first base, and the second direction is the width direction of the first base; the second base is positioned below the wafer sample and corresponds to the cutting mark, the roller device is positioned above the wafer sample, and the wafer sample is cut along the rolling of the cutting mark, so that the wafer characterization sample is obtained. The technical scheme of the utility model can ensure the cutting accuracy, is compatible with complete wafer samples with different sizes and irregular fragment samples, does not need to carry out size pretreatment on the wafer samples and introduce a fixed-point cutting machine, and reduces the preparation process and the preparation cost.

Description

Wafer characterization sample preparation device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer characterization sample preparation device.

Background

Characterization testing of semiconductor materials plays a vital role in the process development and production of modern semiconductor devices, and analysis and measurement signals are analyzed to obtain material components, structures and the like through detection of physical properties or physical and chemical property parameters and changes thereof of the characterization materials, so that understanding of the relationship between the structure and the performance and the components of the materials is a basis for improving the performance of the devices. Meanwhile, the characterization test technology is also widely applied to failure positioning analysis of semiconductor devices, and the single defects in semiconductor materials and devices are detected at present with very high spatial resolution, and particularly, a high-resolution electron microscope can provide morphology and composition information about structural defects. In the characterization test process of semiconductor materials, particularly wafers, the accuracy of structure and component analysis is determined by the quality of sample preparation. For example, when sampling a wafer sample to test electron mobility, it is common to select different areas to intercept square samples of the same size. When the surface or section morphology and composition analysis are carried out on the sample in the specific area of the wafer, a certain size needs to be cut off to meet the requirements of the scanning electron microscope stage, and meanwhile, the sample observation area is ensured to avoid pollution.

Sample preparation for current characterization testing of wafers includes: firstly, manual cutting is usually carried out by stacking a steel ruler on a wafer, scribing along the ruler by using a diamond pen, and finally breaking the wafer along the line by hands, but the characterization sample of the wafer prepared by manual cutting is inaccurate. Secondly, adopt the fixed point cutting machine to cut, as chinese patent CN202793872U discloses a wafer sample preparation template device of fixed point cutting machine, include: a calibration component having at least one straight line; the positioning component is strip-shaped and is connected with the calibration component; the marks comprise a first mark and a second mark used for positioning in a first direction, a third mark and a fourth mark used for positioning in a second direction, and the first mark, the second mark, the third mark and the fourth mark are all positioned on the positioning component; sample wells for determining target locations. The template preparation device is used for preparing a proper wafer sample in advance, and then a fixed-point cutting machine is used for cutting to obtain a wafer characterization sample. However, the technical scheme is still insufficient, is limited by the cutting direction of the fixed point cutting machine, cannot accurately cut along the lattice direction, and needs to pre-treat the wafer sample according to the fixed point cutting machine in advance, so that the wafer sample meets the use size of the fixed point cutting machine, and the complexity and the preparation cost of the preparation process are increased.

Disclosure of utility model

In view of this, the utility model provides a wafer characterization sample preparation device to solve the problems that the wafer characterization sample preparation device in the prior art is difficult to be compatible with wafer samples of different sizes and increases the complexity of the preparation process.

The technical scheme of the utility model is realized as follows:

the utility model provides a wafer characterization sample preparation device, which comprises a first base, a marking device, a roller device and a second base,

The first base is provided with a working area, and the working area is used for placing a wafer sample;

The marking device is arranged on the first base and can move on the first base along a first direction and a second direction so as to cut and mark the wafer sample, wherein the first direction is the length direction of the first base, and the second direction is the width direction of the first base;

The second base is positioned under the wafer sample and corresponds to the cutting mark,

The roller device is positioned above the wafer sample and rolls along the cutting mark so as to cut the wafer sample and obtain a wafer characterization sample.

On the basis of the above technical solution, preferably, the marking device includes a first rail and a second rail,

Two ends of the first track are movably connected with the first base and move on the first base along a second direction;

Two ends of the second track are movably connected with the first base and move on the first base along a first direction;

the first track intersects the second track.

On the basis of the technical scheme, the device further comprises a first fixing clamp and a second fixing clamp, wherein the first fixing clamp is in sliding connection with the first rail, and the second fixing clamp is in sliding connection with the first rail.

On the basis of the technical scheme, the marking pen is preferably further arranged, and the marking pen is fixed on the first fixing clamp and/or the second fixing clamp.

On the basis of the technical scheme, preferably, the marking pen is a diamond pen.

On the basis of the above technical scheme, preferably, the first base is provided with a graduated scale, and the graduated scale is arranged along a first direction and a second direction.

On the basis of the above technical solution, preferably, the second base is prismatic, and the length of the second base is greater than the maximum diameter of the wafer sample.

On the basis of the technical scheme, preferably, the section of the second base is an equilateral triangle, and the side length of the equilateral triangle is 0.5-1.5 mm.

On the basis of the technical proposal, preferably, the roller device comprises a roller part and a hand-held part,

A positioning groove is formed in the middle of the roller part, and the width of the positioning groove is smaller than or equal to the width of the section of the second base;

the handheld part is connected with two ends of the roller part.

On the basis of the above technical scheme, preferably, the wafer sample processing device further comprises a heat stripping film, wherein the heat stripping film is arranged between the wafer sample and the second base and is attached to the surface of the wafer sample.

Compared with the prior art, the wafer characterization sample preparation device has the following beneficial effects:

(1) The wafer sample is cut and marked by arranging the first track and the second track on the first base, and the wafer characterization sample is prepared by cutting the sample along the cutting mark by adopting the roller device, so that the wafer characterization sample is compatible with the whole wafer samples with different sizes and irregular fragment samples while the cutting accuracy is ensured, the wafer sample is not required to be subjected to size pretreatment and a fixed-point cutting machine is not required to be introduced, and the preparation procedure and the preparation cost are reduced;

(2) The second base is arranged as a fulcrum of the wafer sample in the cutting process, so that the sliding of the wafer sample can be effectively prevented, and the edge damage of the wafer material during unwinding is avoided, and the cross section observation of the sample is influenced;

(3) By arranging the thermal stripping film on the surface of the wafer sample, the surface of the wafer sample can be protected from being polluted, and the separation of the wafer characterization sample and the film is facilitated.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of a wafer characterization sample preparation apparatus of the present utility model;

FIG. 2 is a block diagram of a roller assembly of the present utility model;

Fig. 3 is a structural view of a second base of the present utility model.

Reference numerals

1. A first base; 11. a graduated scale; 2. a marking device; 21. a first track; 22. a second track; 23. a first fixing clip; 24. a second fixing clip; 25. a marker pen; 26. a fixation sheath; 3. a second base; 4. a roller device; 41. a roller part; 401. a positioning groove; 42. a hand-held part; 5. and (3) a wafer sample.

Detailed Description

The following description of the embodiments of the present utility model will clearly and fully describe the technical aspects of the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.

As shown in fig. 1-3, the wafer characterization sample preparation device of the present utility model includes a first base 1, a marking device 2, a roller device 4 and a second base 3, where the first base 1 is a frame type, a working area is arranged in the middle of the first base 1, the working area is hollow and is used for placing a wafer sample 5, and the wafer sample 5 can move in the working area at will; the marking device 2 is arranged on the first base 1, the end part of the marking device 2 is movably connected with the first base 1, specifically, the marking device 2 can move on the first base 1 along a first direction and a second direction, and cutting marks are carried out on the wafer sample 5 through the movement of the first direction and the second direction, wherein the first direction is the length direction of the first base 1, and the second direction is the width direction of the first base 1; the second base 3 is located below the wafer sample 5 and corresponds to the dicing marks on the wafer sample 5, and the roller device 4 is located above the wafer sample 5 and rolls along the dicing marks thereof, thereby dicing the wafer sample 5. When in use, the wafer sample 5 is firstly placed in the working area on the first base 1, the marking device 2 is adjusted to the wafer sample 5, and cutting marking is carried out on the wafer sample 5 by the movement of the marking device 2 in the first direction and the second direction according to the use requirement. After marking, the wafer sample 5 is placed on the second base 3, so that the direction of the second base 3 is consistent with that of the cutting mark, then the roller device 4 is placed above the wafer sample 5, and the handheld roller device 4 rolls along one end of the cutting mark to the other end until all the cutting marks are rolled, so that the wafer sample 5 is cut according to the cutting mark, and a wafer characterization sample is obtained.

As a preferred embodiment, the marking device 2 comprises a first rail 21 and a second rail 22, wherein both ends of the first rail 21 are movably connected to the first base 1 and move on the first base 1 in the second direction. The two ends of the second rail 22 are movably connected with the first base 1, and move on the first base 1 along the first direction, and the first rail 21 and the second rail 22 intersect. Specifically, both ends of the first track 21 and both ends of the second track 22 are movably connected with the first base 1 through the fixing sheath 26, and the first track 21 can move on the first base 1 along the second direction or the second track 22 can move on the first base 1 along the first direction by adjusting the fixing sheath 26, so that the marking device 2 is promoted to meet the position and size requirements of different wafer samples 5 according to the use requirement, the wafer characterization sample preparation device is prevented from being limited by the cutting direction and the position and size of the wafer samples 5, and the applicability of the preparation device is improved.

Specifically, the first rail 21 may have one end fixed and the other end movable in the second direction on the first base 1; or both ends of the first rail 21 are simultaneously moved in the second direction on the first base 1; the second rail 22 may have one end fixed and the other end movable in the first direction on the first base 1; or both ends of the first rail 21 are simultaneously moved on the first base 1 in the first direction, so that the marking device 2 can be caused to cover the whole working area by the movement of the first rail 21 and the second rail 22 to meet different cutting directions of the wafer sample 5.

Further, the marking device 2 further comprises a first fixing clip 23 and a second fixing clip 24, wherein the first fixing clip 23 is slidably connected with the first rail 21, and the second fixing clip 24 is slidably connected with the second rail 22. In one embodiment, one end of the first fixing clip 23 is sleeved on the first rail 21, and one end of the second fixing clip 24 is sleeved on the first rail 21, and in use, the first fixing clip 23 and the second fixing clip 24 slide on the first rail 21 and the second rail 22 respectively. In another embodiment, sliding rails are arranged on one sides of the first rail 21 and the second rail 22, sliding grooves matched with the sliding rails of the first rail 21 and the second rail 22 are arranged at one ends of the first fixing clip 23 and the second fixing clip 24, and sliding connection of the first fixing clip 23 and the second fixing clip 24 on the first rail 21 and the second rail 22 is achieved through the sliding rails and the sliding grooves.

Further, the utility model also comprises a marker pen 25, wherein the marker pen 25 is fixed on the first fixing clamp 23 and/or the second fixing clamp 24, preferably, the marker pen 25 is provided with two, and the two marker pens 25 are detachably fixed on the first fixing clamp 23 and the second fixing clamp 24, so that the marker pen 25 is convenient to detach and maintain. The marking pen 25 is driven to slide on the surface of the wafer sample 5 to mark by sliding the first fixing clamp 23 and the second fixing clamp 24 on the first track 21 and the second track 22 respectively so as to cut and mark. The marking pen 25 can be a diamond pen, is made of natural diamond or artificial diamond, and has the characteristics of wear resistance and high trimming efficiency; the contact angle between the marker pen 25 and the wafer sample 5 can be adjusted, and the marker pen 25 is inclined at a certain angle to scribe the surface of the wafer sample 5.

As a preferred embodiment, the first base 1 is provided with a scale 11, and the scale 11 is disposed along the first direction and the second direction, respectively. When sampling the wafer sample 5 to test the electron mobility, generally selecting square samples with the same size from different areas; when the surface or section of the wafer sample in a specific area is analyzed for morphology and composition, the cut size is required to be determined according to the requirements of the scanning electron microscope stage, so that a user can conveniently mark and cut the wafer sample 5 according to the size requirement by arranging the graduated scale 11 on the first base 1 so as to meet different requirements, and the preparation accuracy of the wafer characterization sample is further improved.

As a preferred embodiment, the second susceptor 3 is prismatic, and the length of the second susceptor 3 is greater than the maximum diameter of the wafer sample 5. The second base 3 is set to be prismatic, the second base 3 is placed below the wafer sample 5 to be cut, the edge is caused to correspond to the cutting mark on the wafer sample 5, a certain pressure is kept to roll along the cutting mark through the roller device 4, in the rolling process, the prismatic edge of the second base 3 is caused to form a cutting tool, and the wafer sample 5 is caused to break along the cutting mark through the back and forth rolling of the roller device 4 on the wafer sample 5. Meanwhile, the second base 3 is adopted as a fulcrum, so that sliding between the wafer sample 5 and the second base 3 during cutting can be effectively prevented, edge damage during unwinding of wafer materials is avoided, and cross section observation of the sample is influenced.

Further, the second base 3 is provided in a triangular prism shape, the cross section of the second base 3 is an equilateral triangle, and the side length of the equilateral triangle is 0.5-1.5 mm. By setting the second base 3 to be triangular prism-shaped and the cross section to be equilateral triangle, the included angle of the edge is promoted to be 60 degrees, at the moment, the wafer sample 5 is placed above the edge, the cutting efficiency can be improved when the roller device 4 is used for rolling, and if the included angle of the edge is too large, the cutting angle is more abrupt, and the cutting efficiency is promoted to be lower; if the included angle of the edge is too small, the cutting angle is too sharp, and after the roller device 4 presses down the wafer sample 5 during cutting, the position of the roller device is close to the lower part of the second base 3, so that the pressure is difficult to concentrate at the edge position, and the cutting efficiency is further affected.

As a preferred embodiment, the wafer sample processing apparatus further comprises a thermal release film, wherein the thermal release film is arranged between the wafer sample 5 and the second base 3 and is adhered to the surface of the wafer sample 5. The thermal stripping film is attached to the surface of the wafer sample 5, so that the surface of the wafer sample 5 can be prevented from being polluted; meanwhile, the heat stripping film can be stripped by heating, so that the separation of the wafer sample 5 and the film is facilitated.

As a preferred embodiment, the roller device 4 includes a roller portion 41 and a holding portion 42, a positioning groove 401 is provided in the middle of the roller portion 41, the width of the positioning groove 401 is smaller than or equal to the width of the cross section of the second base 3, and the holding portion 42 is connected to both ends of the roller portion 41. Specifically, the roller portion 41 is composed of two rollers, the end portions of the two rollers are parallel and opposite, and a gap exists between the two rollers, wherein the gap is the positioning groove 401, and when the rollers are used, the cutting mark on the wafer sample 5 is placed in the positioning groove 401, and the two rollers are located on two sides of the cutting mark to roll back and forth. One end of the two rollers, which is far away from the positioning groove 401, is connected with the holding part 42, and the holding part 42 is provided with a handle, so that a user can hold the roller device 4 for rolling.

When the device is used, the wafer sample 5 is attached to the heat stripping film with the front face facing downwards, then the wafer sample is placed in the working area of the first base 1, the first track 21 is adjusted to be under corresponding scales according to the position and the size requirement of the wafer sample 5, the included angle between the marking pen 25 on the track and the surface of the wafer sample 5 is adjusted and fixed, and the wafer sample 5 is uniformly scratched along the second direction; then adjusting the second track 22 to the corresponding scale, adjusting the included angle between the marking pen 25 on the track and the surface of the wafer sample 5, fixing, and uniformly marking the surface of the wafer sample 5 along the first direction until all cutting marks on the wafer sample 5 are completed; then placing the marked wafer sample 5 above the second base 3, wherein the surface attached to the heat stripping film faces the second base 3, enabling the second base 3 to correspond to the cutting mark on the wafer sample 5, keeping the direction consistent, then enabling a user to hold the roller device 4 to roll on the wafer sample 5 according to the track of the cutting mark, keeping the pressure to roll from one end to the other end of the cutting mark, repeating the above actions until all scribing lines are rolled, and finishing cutting of the wafer sample 5 according to the cutting mark; and finally, placing the sample with the heat stripping film on a heating table, and after heating for a sufficient time at a certain temperature, separating the wafer sample 5 from the heat stripping film, so that a vacuum suction pen can be used for picking up a corresponding wafer characterization sample.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. The wafer characterization sample preparation device is characterized in that: comprises a first base (1), a marking device (2), a second base (3) and a roller device (4),

A working area is arranged on the first base (1) and is used for placing a wafer sample (5);

The marking device (2) is arranged on the first base (1), the marking device (2) can move on the first base (1) along a first direction and a second direction so as to perform cutting marking on the wafer sample (5), the first direction is the length direction of the first base (1), and the second direction is the width direction of the first base (1);

the second base (3) is positioned below the wafer sample (5) and corresponds to the cutting mark,

The roller device (4) is positioned above the wafer sample (5) and rolls along the cutting mark so as to cut the wafer sample (5) to obtain a wafer characterization sample.

2. The wafer characterization sample preparation device of claim 1, wherein: the marking device (2) comprises a first track (21) and a second track (22),

Two ends of the first track (21) are movably connected with the first base (1) and move on the first base (1) along a second direction;

two ends of the second track (22) are movably connected with the first base (1) and move on the first base (1) along a first direction;

The first track (21) intersects the second track (22).

3. A wafer characterization sample preparation device according to claim 2, wherein: the device further comprises a first fixing clamp (23) and a second fixing clamp (24), wherein the first fixing clamp (23) is in sliding connection with the first rail (21), and the second fixing clamp (24) is in sliding connection with the first rail (21).

4. A wafer characterization sample preparation device according to claim 3, wherein: and a marker (25), wherein the marker (25) is fixed on the first fixing clamp (23) and/or the second fixing clamp (24).

5. The wafer characterization sample preparation device of claim 4, wherein: the marking pen (25) is a diamond pen.

6. The wafer characterization sample preparation device of claim 1, wherein: the first base (1) is provided with a graduated scale (11), and the graduated scale (11) is arranged along a first direction and a second direction.

7. The wafer characterization sample preparation device of claim 1, wherein: the second base (3) is prismatic, and the length of the second base (3) is larger than the maximum diameter of the wafer sample (5).

8. The wafer characterization sample preparation device of claim 7, wherein: the section of the second base (3) is an equilateral triangle, and the side length of the equilateral triangle is 0.5-1.5 mm.

9. The wafer characterization sample preparation device of claim 1, wherein: the roller device (4) comprises a roller part (41) and a hand-held part (42),

A positioning groove (401) is formed in the middle of the roller part (41), and the width of the positioning groove (401) is smaller than or equal to the width of the section of the second base (3);

the hand-held part (42) is connected with two ends of the roller part (41).

10. The wafer characterization sample preparation device of claim 1, wherein: the wafer test device further comprises a heat stripping film, wherein the heat stripping film is arranged between the wafer sample (5) and the second base (3) and is attached to the surface of the wafer sample (5).