CN220864408U

CN220864408U - Wafer splitting device

Info

Publication number: CN220864408U
Application number: CN202322681101.7U
Authority: CN
Inventors: 刘畅; 罗俊一
Original assignee: GTA Semiconductor Co Ltd
Current assignee: GTA Semiconductor Co Ltd
Priority date: 2023-10-07
Filing date: 2023-10-07
Publication date: 2024-04-30
Anticipated expiration: 2033-10-07

Abstract

The application provides a wafer splitting device which comprises a base, a fluent strip, two clamping arms, a cutter device and a back plate. The fluent strip is mounted on the susceptor for supporting the wafer. Each clamping arm comprises a fixed seat, a multi-degree-of-freedom mechanical arm and clamping jaws, the two fixed seats are all arranged on the base, the multi-degree-of-freedom mechanical arm is arranged on each fixed seat, and the clamping jaws used for clamping wafers are arranged at the tail ends of the multi-degree-of-freedom mechanical arms. The cutter device comprises a cutter seat and a cutter head, the cutter seat is arranged on the base and is positioned on one side of the fluent strip, the cutter head is arranged on the cutter seat in a movable mode, the moving direction of the cutter head is perpendicular to the fluent strip, and the height of the cutter head just exceeds the height of the fluent strip. The backboard is closely attached to the fluent strip, and the cutter device and the backboard are opposite to each other and are respectively positioned on two sides of the fluent strip. The wafer splitting device can more effectively control the tearing strength of the wafer sample, reduce the problem of sample collapse and is beneficial to obtaining the expected wafer sample.

Description

Wafer splitting device

Technical Field

The application relates to the technical field of semiconductor failure analysis, in particular to a wafer splitting device.

Background

In the failure analysis of semiconductor devices, it is a very common method to analyze the cross-sectional morphology of a specific pattern on a wafer. In order to perform failure analysis on a wafer (silicon wafer), it is necessary to sample the wafer, and it is a relatively common method to perform fracture sampling on the wafer.

In the existing wafer splitting mode, a diamond tungsten pen is often used, the surface is scratched gently at the edge of a wafer near a target, and then the two hands are directly torn to obtain a sample for analysis. In the mode, the scratch and the tearing are actions which are not easy to control, and meanwhile, if the wafer is in a small size or an asymmetric shape, the tearing direction and strength are more difficult to control, and on one hand, the sample is easy to collapse and fly and the material is wasted due to direct tearing of both hands, and on the other hand, the impact generated by the impact can possibly lead to failure and cause section pollution.

Disclosure of Invention

The embodiment of the application aims to provide a wafer splitting device which can more effectively control the tearing strength of a wafer sample, reduce the problem of sample collapse and is beneficial to obtaining a desired wafer sample.

The application provides a wafer splitting device which comprises a base, a fluent strip, two clamping arms, a cutter device and a back plate. The fluent strip is mounted on the susceptor for supporting the wafer. Each clamping arm comprises a fixed seat, a multi-degree-of-freedom mechanical arm and clamping jaws, the two fixed seats are all arranged on the base, the multi-degree-of-freedom mechanical arm is arranged on each fixed seat, and the clamping jaws used for clamping wafers are arranged at the tail ends of the multi-degree-of-freedom mechanical arms. The cutter device comprises a cutter seat and a cutter head, the cutter seat is arranged on the base and is positioned on one side of the fluent strip, the cutter head is arranged on the cutter seat in a movable mode, the moving direction of the cutter head is perpendicular to the fluent strip, and the height of the cutter head just exceeds the height of the fluent strip. The backboard is closely attached to the fluent strip, and the cutter device and the backboard are opposite to each other and are respectively positioned on two sides of the fluent strip.

In one embodiment, the fluent strip comprises a first strip seat, a second strip seat and a rotating shaft; the first strip-shaped seat is provided with first rotating shaft grooves arrayed along the length direction of the first strip-shaped seat, the second strip-shaped seat is provided with second rotating shaft grooves arrayed along the length direction of the second strip-shaped seat, and after the first strip-shaped seat and the second strip-shaped seat are spliced, the first rotating shaft grooves and the second rotating shaft grooves are spliced in a one-to-one correspondence manner to form rotating shaft grooves for accommodating rotating shafts; the rotating shaft is rotatably arranged in the rotating shaft groove, and at least part of the rotating shaft is exposed out of the top of the rotating shaft groove.

In one embodiment, the first strip-shaped seat is provided with a protruding part, and the second strip-shaped seat is provided with a recessed part; when the first strip-shaped seat and the second strip-shaped seat are combined, the protruding part is inserted into the concave part.

In one embodiment, the wafer breaking device further comprises a sliding rail assembly, wherein the sliding rail assembly is installed on the base and is parallel to the fluent strip; the fixing seat of the clamping arm is installed on the sliding rail component in a sliding mode through a sliding block.

In one embodiment, a multiple degree of freedom robotic arm includes a first support arm, a second support arm, a first drive joint, and a second drive joint: the first end of the second support arm is arranged on the first support arm through a first driving joint, and the rotation axis of the first driving joint is in the vertical direction; the clamping jaw is installed at the second end of second support arm through the second drive joint, and the axis of rotation of second drive joint is vertical direction.

In one embodiment, the first support arm is provided with a vertically movable lifting device.

In one embodiment, the jaw includes a jaw seat and a locking member; a clamping groove is formed in one side wall of the clamping jaw seat, and the upper end and the lower end of the clamping groove respectively penetrate through the clamping jaw seat; the side wall of the clamping jaw seat is provided with a plurality of threaded holes which penetrate through, and the locking piece is matched with the threaded holes; when clamping the wafer, the edge of the wafer is placed in the clamping groove, and the locking piece is screwed into the clamping groove through the threaded hole so as to clamp the wafer.

In one embodiment, a buffer layer is provided against the inner wall of the clamping groove.

In one embodiment, the buffer layer is a polyurethane cushion layer.

In one embodiment, the locking member is an organic screw.

Compared with the prior art, the application has the beneficial effects that at least:

In the application, the wafer is supported by the fluent strips, and the supporting force is more uniform. In the process of scribing the wafer by the tool bit, the wafer is clamped by the multi-degree-of-freedom mechanical arm more flexibly and stably, and the clamping position of the wafer can be flexibly adjusted by means of each joint of the multi-degree-of-freedom mechanical arm. Meanwhile, when the wafer is torn, the multi-degree-of-freedom mechanical arm is easier to control the tearing force and direction than manual work, and the multi-degree-of-freedom mechanical arm can play a certain damping effect, so that the sample is effectively protected, the wafer sample collapse phenomenon is reduced, and the cross section pollution problem after wafer splitting is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of a wafer dicing apparatus according to an embodiment of the application;

FIG. 2 is a block diagram illustrating a wafer handling apparatus according to an embodiment of the present application;

FIG. 3 is an exploded view of one fluent strip of the wafer sliver apparatus, according to one embodiment of the present application;

FIG. 4 is a block diagram of a fluent strip after splicing of a wafer sliver apparatus according to an embodiment of the present application;

FIG. 5 is a block diagram of a clamping arm of a wafer fragment device in accordance with an embodiment of the present application;

FIG. 6 is a side view block diagram of a clamping arm of a wafer fragment device in accordance with an embodiment of the present application;

FIG. 7 is a top view of a wafer handling device according to an embodiment of the present application;

FIG. 8 is an enlarged view of a partial structure at A in FIG. 7;

FIG. 9 is a block diagram of a cutter device of the wafer fragment device according to an embodiment of the present application;

Fig. 10 is an enlarged view of a partial structure at B in fig. 9.

In the figure: 10. a base; 20. fluent strips; 21. a first strip-shaped seat; 211. a first spindle groove; 212. a boss; 22. a second strip-shaped seat; 221. a second rotating shaft groove; 222. a recessed portion; 23. a rotating shaft; 24. a rotating shaft groove; 30. a clamping arm; 31. a fixing seat; 32. a multi-degree-of-freedom mechanical arm; 321. a first support arm; 322. a second support arm; 323. a first drive joint; 324. a second drive joint; 33. a clamping jaw; 331. a clamping jaw seat; 3311. a clamping groove; 332. a locking member; 3321. a buffer layer; 34. a slide block; 40. a cutter device; 41. a tool apron; 42. a cutter head; 43. a limit component; 431. a support block; 432. a slide bar; 433. a compacting head; 434. a spring; 50. a back plate; m, neutral gear; 60. a slide rail assembly; 100. and (3) a wafer.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

As shown in fig. 1 and 2, the present embodiment provides a wafer breaking device, which includes a base 10, a fluent strip 20, a clamping arm 30, a cutter device 40 and a back plate 50.

The base 10 can be provided with a mounting position, the mounting position can be a groove structure or a mounting hole structure, and the bottom of the base 10 can be provided with a magnetic structure so as to be convenient to adsorb on other structures. The fluent strip 20 is mounted on the susceptor 10 for supporting a wafer. The underside of the fluent strip 20 may be provided with protrusions that snap into a recessed structure on the mounting location of the base 10 or be mounted to a mounting hole structure of the base 10 by means of a bolt-and-nut fastener.

Each clamping arm 30 comprises a fixed seat 31, a multi-degree-of-freedom mechanical arm 32 and clamping jaws 33, wherein both fixed seats 31 are arranged on the base 10, each fixed seat 31 is provided with a multi-degree-of-freedom mechanical arm 32, and the tail end of each multi-degree-of-freedom mechanical arm 32 is provided with a clamping jaw 33 for clamping a wafer. The cutter device 40 comprises a cutter seat 41 and a cutter head 42, the cutter seat 41 is arranged on the base 10 and is positioned on one side of the fluent strip 20, the cutter head 42 is movably arranged on the cutter seat 41, the moving direction of the cutter head 42 is perpendicular to the fluent strip 20, and the height of the cutter head 42 is just beyond the height of the fluent strip 20. The back plate 50 is closely attached to the fluent strip 20, and the cutter device 40 and the back plate 50 are opposite to each other and are respectively positioned on two sides of the fluent strip 20.

In the breaking operation, as shown in fig. 7 and 2, the clamping jaws 33 of the two clamping arms 30 clamp the left and right sides of the rectangular wafer 100, the bottom of the wafer 100 is placed on the fluent strip 20, the fluent strip 20 provides support for the wafer 100, and the bottom of the wafer 100 is located opposite to the tool bit 42. Thereafter, the tool bit 42 moves in a direction approaching the fluent strip 20, the tool bit presses against the bottom of the wafer 100, the back plate 50 supports the wafer 100, and the tool bit 42 scratches or leaves scratches on the bottom surface of the wafer 100 under the action of the tool bit 42. Then, the tool bit 42 is withdrawn, the two multi-degree-of-freedom mechanical arms 32 apply force together, and a backward force is applied from the two side edges of the wafer 100 to simulate the action of manual tearing, so that the wafer is split from the scratch or the scratch, and further wafer splitting is realized.

In this embodiment, the wafer 100 is supported by the fluent strip 20, so that the supporting force is more uniform. In the process of scratching the tool bit 42, the multi-degree-of-freedom mechanical arm 32 clamps the wafer more flexibly and stably, and the clamping position of the wafer 100 can be adjusted by means of each joint of the multi-degree-of-freedom mechanical arm 32. Meanwhile, when the wafer 100 is torn, the multi-degree-of-freedom mechanical arm 32 is easier to control the tearing force and direction than manual work, and the multi-degree-of-freedom mechanical arm 32 can play a certain damping role, so that a sample is effectively protected, the phenomenon that the wafer sample is broken and flies is reduced, and the problem of cross section pollution after wafer breaking is solved.

In this embodiment, as shown in fig. 1, a neutral gear M penetrating from front to rear may be provided at a position where the back plate 50 faces the cutter head 42. For example, when processing some wafer samples with a smaller thickness, the tool bit 42 is easy to directly crash the sample when cutting into the sample, at this time, the tool bit 42 may crash the sample and move forward a distance under the action of inertia, at this time, the neutral gear M just provides a moving space for the inertial movement of the tool bit 42, so as to avoid the tool bit from crashing.

In the present embodiment, as shown in fig. 3 and 4, the fluent strip 20 includes a first strip seat 21, a second strip seat 22, and a rotation shaft 23. The first strip-shaped seat 21 is provided with a first rotating shaft groove 211 which is arrayed along the length direction of the first strip-shaped seat, the second strip-shaped seat 22 is provided with a second rotating shaft groove 221 which is arrayed along the length direction of the second strip-shaped seat, and after the first strip-shaped seat 21 and the second strip-shaped seat 22 are spliced, the first rotating shaft groove 211 and the second rotating shaft groove 221 are spliced in one-to-one correspondence to form a rotating shaft groove 24 for accommodating the rotating shaft 23. The rotating shaft 23 is rotatably installed in the rotating shaft groove 24, and at least a portion of the rotating shaft 23 is exposed from the top of the rotating shaft groove 24.

In this embodiment, the pitch of the rotation shafts 23 of the fluent strip 20 is as small as possible, for example, may be 0.5mm to 5mm at a minimum. In this embodiment, the interval between the adjacent rotating shafts 23 is 1mm, and the uniform support of the wafer sample is realized by the millimeter-scale interval.

In this embodiment, the magnetic attraction structure may be disposed on each of the splicing surfaces of the first strip-shaped seat 21 and the second strip-shaped seat 22, so that the two are easier to align during splicing, and the spliced structure is more stable by the magnetic attraction force.

In this embodiment, the first strip seat 21 and the second strip seat 22 may be polytetrafluoroethylene engineering plastics, which has the advantages of acid and alkali corrosion resistance, organic solvent resistance, high lubrication non-viscosity, electrical insulation, good aging resistance, and the like. The material of the rotating shaft 23 can be polyurethane rotating shaft, friction exists between the rotating shaft 23 and the wafer sample and scraps for a long time, and the polyurethane rotating shaft has the advantages of oil resistance, wear resistance, aging resistance, high hardness, elasticity and the like.

In this embodiment, as shown in fig. 3, the first strip-shaped seat 21 is provided with a protruding portion 212, and the second strip-shaped seat 22 is provided with a recessed portion 222; the protrusion 212 is inserted into the recess 222 when the first bar-shaped seat 21 and the second bar-shaped seat 22 are combined. The provision of the protruding portion 212 and the recessed portion 222 facilitates the split alignment of the first strip seat 21 and the second strip seat 22. The end of the protruding portion 212 may be provided with a first magnetic attraction member, and the inner bottom of the recess 222 may be provided with a second magnetic attraction member, where the first magnetic attraction member and the second magnetic attraction member attract each other when the protruding portion 212 is inserted into the recess 222.

In this embodiment, as shown in fig. 1, 2, 5 and 6, the wafer breaking device may further include a slide rail assembly 60, where the slide rail assembly 60 is mounted on the base 10, and the slide rail assembly 60 is parallel to the fluency strip 20. The sliding rail assembly 60 may be a synchronous belt assembly, a screw module, or other devices capable of realizing linear displacement. The fixed seat 31 of the clamping arm 30 is slidably mounted on the slide rail assembly 60 by a slider 34.

The slide rail assembly 60 can adjust the distance between the two clamping arms 30, so that the wafer sample with wider width can be accommodated.

In this embodiment, as shown in fig. 5 and 6, the multiple degree of freedom mechanical arm 32 may include a first support arm 321, a second support arm 322, a first driving joint 323, and a second driving joint 324: the first support arm 321 is mounted on the fixed seat 31, the first end of the second support arm 322 is mounted on the first support arm 321 through the first driving joint 323, and the rotation axis of the first driving joint 323 is in the vertical direction; the clamping jaw 33 is mounted at the second end of the second support arm 322 by a second drive joint 324, the axis of rotation of the second drive joint 324 being in a vertical direction.

In this embodiment, as shown in fig. 5 and 6, the first support arm 321 is provided with a lifting device capable of vertically moving, so that the heights of the clamping jaws 33 on the two clamping arms 30 can be adjusted, and thus, the higher wafer sample can be accommodated.

In this embodiment, as shown in fig. 6, the jaw 33 includes a jaw seat 331 and a locking member 332. A clamping groove 3311 is formed in a side wall of the clamping jaw seat 331, and the upper end and the lower end of the clamping groove 3311 respectively penetrate through the clamping jaw seat 331. The side wall of the clamping jaw seat 331 is provided with a plurality of threaded holes which penetrate through, and the locking piece 332 is matched with the threaded holes; when clamping a wafer, the edge of the wafer is placed in the clamping groove 3311 and the locking member 332 is screwed into the clamping groove 3311 through the screw hole to clamp the wafer.

In this embodiment, as shown in fig. 8, a buffer layer 3321 is provided closely to the inner wall of the holding groove 3311 to play a role in shock absorption. The buffer layer 3321 can be a polyurethane cushion layer, has certain elasticity, can reduce the risk of wafer cracking at the wafer clamping position, plays a role in shock absorption, effectively protects the wafer from being separated from the clamping jaw 33 after cracking, and further can reduce the collision and reduce the sample loss. The locking member 332 may be an organic screw, and has a certain elasticity, and also can play a role in damping, and achieve a better clamping effect on the wafer.

In this embodiment, as shown in fig. 9 and 10, the cutter device 40 may further include two limiting assemblies 43, the two limiting assemblies 43 are separately disposed on two sides of the cutter head 42, and both the two limiting assemblies 43 and the cutter head 42 are mounted on the cutter seat 41. Each limiting assembly 43 comprises a supporting block 431, a sliding rod 432, a pressing head 433 and a spring 434, wherein a through hole extending along the displacement direction of the cutter head 42 and penetrating through the supporting block 431 is formed in the supporting block 431, the sliding rod 432 is limited to slide in the through hole of the supporting block 431, the front end and the rear end of the sliding rod 432 extend out of the through hole of the supporting block 431, and the pressing head 433 is mounted at the front end of the sliding rod 432. The material of the pressing head 433 is preferably a material having elasticity, such as polyurethane elastic material. A spring 434 is arranged between the pressing head 433 and the supporting block 431, and the spring 434 is sleeved on the sliding rod 432, and the spring 434 gives a force for separating the pressing head 433 and the supporting block 431 from each other. In the normal state, i.e., when the tool bit 42 is not in contact with the wafer, the pressing head 433 is forward of the distance of the tool bit 42.

When the tool apron 41 moves towards the direction approaching to the fluent strip 20, the tool bit 42 is driven to move towards the direction approaching to the wafer 100, the pressing heads 433 on two sides of the tool bit 42 firstly contact the surface of the wafer 100, and as the tool apron 41 moves forwards, the pressing heads 433 press the surface of the wafer 100 under the action of the springs 434 to form a limiting effect on the top position of the wafer 100, and then the clamping effect of the two clamping arms 30 is matched, so that the wafer 100 is kept stable. The tool holder 41 continues to move forward, eventually the tool bit 42 contacts the wafer, the scribing operation is completed, and then the tool bit is withdrawn in the reverse direction.

Therefore, the two limiting assemblies 43 on the cutter device 40 perform positioning and clamping from the bottom of the wafer, so that the wafer is prevented from sliding or moving when the cutter head 42 contacts the wafer, and the scribing position of the cutter head 42 is prevented from being incorrect, so that the subsequent wafer cannot be cracked as expected.

The displacement of the tool holder 41 may be achieved by pushing the tool holder 41 along a linear rail by means of an air cylinder, a hydraulic cylinder, an electric push rod, or the like. The tool holder 41 may be directly mounted on a linear displacement device such as a timing belt module or a screw module, and the displacement operation of the slide holder 44 may be directly driven by the linear displacement device.

The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer dicing apparatus, comprising:

a base (10);

a fluent strip (20) mounted on the base (10) for supporting a wafer;

The two clamping arms (30), each clamping arm (30) comprises a fixed seat (31), a multi-degree-of-freedom mechanical arm (32) and clamping jaws (33), the two fixed seats (31) are all arranged on the base (10), each fixed seat (31) is provided with one multi-degree-of-freedom mechanical arm (32), and the tail end of each multi-degree-of-freedom mechanical arm (32) is provided with one clamping jaw (33) for clamping a wafer;

A cutter device (40) comprising a cutter seat (41) and a cutter head (42), wherein the cutter seat (41) is arranged on the base (10) and is positioned on one side of the fluent strip (20), the cutter head (42) is movably arranged on the cutter seat (41), the moving direction of the cutter head (42) is perpendicular to the fluent strip (20), and the height of the cutter head (42) meets the height just exceeding the fluent strip (20);

The backboard (50) is closely attached to the fluent strip (20), and the cutter device (40) and the backboard (50) are opposite to each other and are respectively positioned on two sides of the fluent strip (20).

2. Wafer breaking device according to claim 1, characterized in that the fluent strip (20) comprises a first strip seat (21), a second strip seat (22) and a spindle (23);

The first strip-shaped seat (21) is provided with first rotating shaft grooves (211) which are arrayed along the length direction of the first strip-shaped seat, the second strip-shaped seat (22) is provided with second rotating shaft grooves (221) which are arrayed along the length direction of the second strip-shaped seat, and after the first strip-shaped seat (21) and the second strip-shaped seat (22) are spliced, the first rotating shaft grooves (211) and the second rotating shaft grooves (221) are spliced in one-to-one correspondence to form rotating shaft grooves (24) for accommodating the rotating shafts (23);

The rotating shaft (23) is rotatably arranged in the rotating shaft groove (24), and at least part of the rotating shaft (23) is exposed out of the top of the rotating shaft groove (24).

3. Wafer breaking device according to claim 2, characterized in that the first strip-shaped seat (21) is provided with a protruding part (212) and the second strip-shaped seat (22) is provided with a recessed part (222); the protruding portion (212) is inserted into the recessed portion (222) when the first strip-shaped seat (21) and the second strip-shaped seat (22) are assembled.

4. The wafer cleaving device according to claim 1, further comprising a slide rail assembly (60), the slide rail assembly (60) being mounted on the base (10) and the slide rail assembly (60) being parallel to the fluent strip (20);

The fixed seat (31) of the clamping arm (30) is slidably mounted on the sliding rail assembly (60) through a sliding block (34).

5. The wafer fragment device according to claim 1, wherein the multiple degree of freedom mechanical arm (32) comprises a first support arm (321), a second support arm (322), a first drive joint (323), and a second drive joint (324):

The first support arm (321) is mounted on the fixed seat (31), the first end of the second support arm (322) is mounted on the first support arm (321) through the first driving joint (323), and the rotation axis of the first driving joint (323) is in a vertical direction;

The clamping jaw (33) is mounted at the second end of the second supporting arm (322) through the second driving joint (324), and the rotation axis of the second driving joint (324) is in the vertical direction.

6. The wafer dicing apparatus according to claim 5, wherein the first support arm (321) is provided with a vertically movable lifting device.

7. Wafer fragment device according to any one of claims 1 to 6, wherein the clamping jaw (33) comprises a clamping jaw seat (331) and a locking member (332);

A clamping groove (3311) is formed in one side wall of the clamping jaw seat (331), and the upper end and the lower end of the clamping groove (3311) respectively penetrate through the clamping jaw seat (331);

A plurality of threaded holes penetrating through the side wall of the clamping jaw seat (331) are formed in the side wall of the clamping jaw seat, and the locking piece (332) is matched with the threaded holes; when clamping a wafer, the edge of the wafer is placed in the clamping groove (3311), and the locking member (332) is screwed into the clamping groove (3311) through the threaded hole to clamp the wafer.

8. The wafer dicing apparatus according to claim 7, wherein a buffer layer (3321) is provided in close contact with an inner wall of the holding groove (3311).

9. The wafer cleaving device of claim 8, wherein the buffer layer (3321) is a polyurethane cushion layer.

10. The wafer cleaving apparatus of claim 7, wherein the locking member (332) is an organic screw.