CN220863040U - Flexible panel cutting platform - Google Patents

Abstract

The application provides a flexible panel cutting platform, and relates to the field of flexible panel laser cutting devices. The vacuum-pumping device comprises a plurality of single-chip adsorption areas, wherein a plurality of first adsorption holes are formed in the single-chip adsorption areas, and the first adsorption holes are communicated with the vacuum-pumping device; the cutting groove is formed in the periphery of the single adsorption area, and a first scrap hole is formed in the cutting groove and communicated with the vacuumizing device; the peripheral waste material area is arranged in the edge area of the outer side of the motherboard, a plurality of second adsorption holes are formed in the peripheral waste material area, and the second adsorption holes are communicated with the vacuumizing device. The technical problems that the deformation of a flexible panel, the cutting precision, the influence of the floatation of cutting waste particles in a machine on the operation and cleaning of the machine and the like caused by the fact that the vacuum chuck is adopted by an existing cutting platform are solved.

Description

Flexible panel cutting platform

Technical Field

The application relates to the field of flexible panel laser cutting devices, in particular to a flexible panel cutting platform.

Background

OLED display technology has the characteristics of self-luminescence, wide viewing angle, high contrast ratio, low power consumption and high response speed, and is widely applied to the production fields of various display devices ranging from smart watches to digital televisions. In the current preparation process of the OLED flexible panel, a plurality of flexible OLED display panels are often manufactured on a large glass substrate, the substrate is called a motherboard, and after the motherboard is manufactured, the motherboard is cut into single OLED display panels required by customers. One common solution is to remove the glass substrate of the motherboard and attach a large block of PET protective film, and then cut the glass substrate into OELD monolithic display panels on a cutting platform.

In the existing cutting platform, the vacuum chuck is adopted for adsorption, but the adsorption force of the vacuum chuck is large, the OLED is a flexible screen, the suction force can generate tiny deformation, the distance between the OLED and a laser galvanometer or a cutting head at the upper end is changed, and then the focal length is changed, so that the cutting precision is influenced. During the cutting process, a large amount of waste particles are generated, and the waste particles are generally collected through a dust removing unit arranged above a workbench, but the dust removing efficiency is extremely limited, and a large amount of particles float inside the machine, so that the operation and cleaning of the machine are influenced.

Disclosure of utility model

In view of the defects in the prior art, the application provides a flexible panel cutting platform to solve the technical problems that the existing cutting platform adopts vacuum chuck adsorption to cause deformation of a flexible panel to influence cutting precision, cutting scrap particles float in the machine to influence the operation and cleaning of the machine, and the like.

In order to achieve the above and other related objects, the present application provides a flexible panel cutting platform, comprising a plurality of single-chip adsorption areas, wherein a plurality of first adsorption holes are arranged in the single-chip adsorption areas, and the first adsorption holes are communicated with a vacuum pumping device; the cutting groove is formed in the periphery of the single adsorption area, and a first scrap hole is formed in the cutting groove and communicated with the vacuumizing device; the peripheral waste material area is arranged in the edge area of the outer side of the motherboard, a plurality of second adsorption holes are formed in the peripheral waste material area, and the second adsorption holes are communicated with the vacuumizing device.

In an embodiment of the present application, the cutting platform includes a cutting platform upper plate and a cutting platform lower plate; the cutting platform upper plate comprises a single adsorption area, a cutting groove, a mounting part and a peripheral waste area; the back side of the upper plate of the cutting platform corresponding to the single-piece adsorption area is provided with a first groove, the first groove is matched with the lower plate of the cutting platform to form a first vacuum cavity, and the first adsorption hole is communicated with the first vacuum cavity; the cutting grooves are arranged on the periphery of the single-piece adsorption area and are distributed on the upper plate of the cutting platform in a longitudinal and transverse mode; the mounting part is connected with the cutting platform upper plate and the cutting platform lower plate; the peripheral waste material area is provided with a second groove, and a second vacuum cavity is formed by the second groove and the lower plate of the cutting platform in a surrounding mode;

The lower plate of the cutting platform comprises a single vacuumizing hole channel and a waste hole channel; the single-piece vacuumizing pore canal is provided with a plurality of bifurcation holes, and the bifurcation holes are communicated with the first vacuum cavity; the dust removing pore canal is communicated with the first scrap hole.

In an embodiment of the present application, the monolithic evacuation duct penetrates the lower cutting deck plate along a length direction of the lower cutting deck plate.

In an embodiment of the present application, plugs are disposed at two ends of the monolithic vacuumizing channel, the plugs plug the monolithic vacuumizing channel, a first connector mounting hole is disposed at an inner side of the monolithic vacuumizing channel, and the monolithic vacuumizing channel is vacuumized through the first connector mounting hole.

In an embodiment of the present application, the dust removing hole penetrates through the lower plate of the cutting platform along the width direction of the lower plate of the cutting platform, and a second scrap hole corresponding to the first scrap hole is arranged on the dust removing hole.

In an embodiment of the present application, the lower plate of the cutting platform is further provided with a peripheral vacuumizing hole channel arranged along the length or width direction of the lower plate of the cutting platform, the peripheral vacuumizing hole channel is provided with a connecting hole communicated with the second vacuum cavity, and two ends of the peripheral vacuumizing hole channel are provided with second connector mounting holes.

In one embodiment of the present application, a plurality of first grooves along the length or width direction of the upper plate of the cutting platform are communicated

In an embodiment of the present application, in the monolithic adsorption zone, a density of the first adsorption holes is from small to large from a center of the monolithic adsorption zone toward a cutting groove.

In an embodiment of the application, a diameter of a side of the first adsorption hole near the motherboard is smaller than a diameter of a side of the first adsorption hole far from the motherboard.

In one embodiment of the present application, the peripheral waste area of the outer edge area of the motherboard is shaped like a Chinese character 'hui'.

The application has the beneficial effects that in combination with the prior art:

The existing cutting platform is adsorbed by adopting a vacuum chuck, and the adsorption force of the vacuum chuck is large, so that the flexible screen is deformed, and the cutting precision is affected. According to the application, the plurality of single-chip adsorption areas are arranged on the cutting platform, the plurality of first adsorption holes are arranged in the single-chip adsorption areas, the mother board is placed on the cutting platform and adsorbed through the first adsorption holes with the diameter far smaller than that of the vacuum chuck, the mother board is stressed and dispersed, the occurrence of obvious deformation is avoided, the distance between the mother board and the laser galvanometer or the cutting head at the upper end is kept stable, and the cutting precision is effectively improved.

The current cutting platform cutting produces a large amount of sweeps granule collect through laying the dust removal unit in the workstation top, and dust removal efficiency is low, and in the dust removal process, sweeps granule by cutting platform department upwards move, need stride across whole cutting working space, leads to a large amount of granule to float in the inside of machine. According to the application, the cutting groove is formed in the cutting platform, and the plurality of first scrap holes are formed in the cutting groove, so that the cutting groove is lower than the table top of the cutting platform, and the top surface of the cutting platform is prevented from being damaged by laser when the mother board is cut in the cutting process. The cutting groove is internally provided with the first scrap hole, scraps in the cutting process and after cutting are directly discharged through the first scrap hole, the scraps are discharged without passing through a cutting working interval, and the scraps only pass through the cutting platform table top, the first scrap hole in the cutting platform and the like, so that the phenomenon that the scraps float inside a machine is avoided, and the influence on the operation and cleaning of the machine is avoided.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of an exemplary cutting table top plate of the present application;

FIG. 2 is a schematic view of a portion of an exemplary cutting table top plate according to the present application;

FIG. 3 is a schematic diagram of an exemplary monolithic adsorption zone according to the present application;

FIG. 4 is a schematic cross-sectional view of an exemplary cutting table top plate of the present application;

FIG. 5 is a schematic view of an exemplary cutting table lower plate of the present application;

Fig. 6 is a schematic view of a lower plate portion of an exemplary cutting platform according to the present application.

Description of element reference numerals

1. Cutting the upper plate of the platform; 11. a monolithic adsorption zone; 111. a first adsorption hole; 112. a communication groove; 113. a first groove; 12. cutting a groove; 121. a first scrap hole; 13. a mounting part; 131. a boss; 132. a second threaded hole; 133. a first threaded hole; 14. a peripheral waste region; 141. a second adsorption hole; 2. cutting the lower plate of the platform; 21. a monolithic vacuumizing duct; 211. a bifurcation hole; 212. a first joint mounting hole; 214. a plug; 22. a dust removal duct; 221. a second scrap hole; 23. peripheral vacuumizing pore channels; 231. a second joint mounting hole; 232. a connection hole; 24. a first counterbore; 25. and a second counterbore.

Detailed Description

Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. It is also to be understood that the terminology used in the examples of the application is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the application. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.

Where numerical ranges are provided in the examples, it is understood that unless otherwise stated herein, both endpoints of each numerical range and any number between the two endpoints are significant both in the numerical range. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs and to which this application belongs, and any method, apparatus, or material of the prior art similar or equivalent to the methods, apparatus, or materials described in the examples of this application may be used to practice the application.

It should be understood that the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like are used in this specification for descriptive purposes only and not for purposes of limitation, and that the application may be practiced without materially departing from the novel teachings and without departing from the scope of the application.

In order to solve the problems that when the traditional OLED flexible panel is cut, the vacuum chuck is large in adsorption force, so that the flexible screen is deformed, the cutting precision is affected, and the sweeps particles float in the machine to affect the running and cleaning of the machine, the application provides a flexible panel cutting platform.

The flexible panel cutting platform comprises a cutting platform upper plate 1 and a cutting platform lower plate 2, wherein the cutting platform upper plate 1 and the cutting platform lower plate 2 are relatively fixed, and when cutting operation is carried out, a motherboard is placed on the cutting platform upper plate 1. The cutting platform upper plate 1 comprises a single-chip adsorption zone 11, a cutting groove 12, a peripheral waste zone 14 and a mounting part 13, and the cutting platform lower plate 2 comprises a single-chip vacuumizing hole 21, a dust removing hole 22 and a peripheral vacuumizing hole 23.

Referring to fig. 1, fig. 1 shows an exemplary upper cutting platform plate 1, where the back side of the upper cutting platform plate 1 is provided with a plurality of first grooves 113 with identical sizes, and the number of the first grooves 113 is determined according to the size of the upper cutting platform plate 1 and the cutting size of the motherboard, and typically tens or hundreds of first grooves can be provided. Each first groove 113 corresponds to one single adsorption area 11, and after the upper plate 1 of the cutting platform and the lower plate 2 of the cutting platform are relatively fixed, the first grooves 113 are closed to form a vacuum cavity. The first groove 113 is provided therein with a first adsorption hole 111, and the first adsorption hole 111 penetrates through the upper plate 1 of the cutting platform, and adsorbs the motherboard through the first adsorption hole 111.

Referring to fig. 3, fig. 3 illustrates an exemplary monolithic suction area 11, and in an exemplary embodiment, the density of the first suction holes 111 is from small to large from the center of the monolithic suction area 11 toward the cutting groove 12, that is, the first suction holes 111 near the center of the monolithic suction area 11 are distributed sparsely, and the first suction holes 111 near the periphery of the cutting groove 12 are distributed densely. The cutting is performed at the cutting slot 12, and more stable adsorption is required at the cutting slot 12, so that the flexible panel is ensured to be stable all the time during the cutting process and after the cutting is completed. The arrangement mode can ensure that the cutting area is effectively adsorbed, reduce the total number of the adsorption holes and reduce ineffective waste.

Referring to fig. 4, fig. 4 is a schematic cross-sectional view of an exemplary upper plate of the cutting table, in which in one embodiment, the diameter of the hole on the side of the first suction hole 111 near the top surface of the upper plate 1 of the cutting table is smaller, and the diameter of the hole near the back surface of the upper plate 1 of the cutting table is larger. On one hand, the efficiency of pumping air can be improved, and the required vacuum degree can be ensured to be quickly achieved; on the other hand, reduce the top surface and adsorb the area, guarantee the adsorption effect, promote cutting accuracy.

In one embodiment, a row of first grooves 113 along the length direction of the upper plate 1 of the cutting platform or a row of first grooves 113 along the width direction of the upper plate 1 of the cutting platform are communicated, preferably, the side wall of each first groove 113 is provided with a communicating groove 112, and the communicating grooves 112 are communicated with the first grooves 113 adjacent to the same row or the same row, so that the pressure intensity in the connected vacuum chambers is consistent, the adsorption stability is improved, and the vacuumizing speed is also improved. Preferably, the first grooves 113 along the width direction of the upper plate 1 of the cutting platform are communicated, so that the problem that the sealing is not tight due to the fact that the communicating area of the first grooves 113 is too long is avoided.

The laser cuts the mother board along the cutting groove 12, the cutting groove 12 is arranged on the periphery of the single-chip adsorption area 11, and the cutting groove 12 is vertically and horizontally distributed on the cutting platform upper board 1. The cutting groove 12 is a groove formed in the top surface of the cutting platform upper plate 1, and by providing the cutting groove 12, damage to the top surface of the cutting platform upper plate 1 by laser when cutting the mother plate can be avoided.

During the cutting process, the cutting slot 12 area may generate a large amount of scrap particles, which may not be timely cleaned and may affect the operation and cleaning of the machine. In an embodiment of the application, a plurality of first scrap holes 121 are formed in the bottom of the cutting groove 12, the first scrap holes 121 are communicated with a vacuumizing device, the vacuumizing device withdraws scraps in the cutting groove 12 from the first scrap holes 121, and the scraps are discharged without passing through a working space of the machine, so that the scraps are prevented from staying in the machine, the cleaning efficiency is effectively improved, and the cleanliness in the machine is ensured. Preferably, the first scrap holes 121 are provided at the bottom of the cutting receptacle 12 at equal intervals, so that effective cleaning of scraps in the cutting receptacle 12 can be ensured.

In an embodiment, the first scrap hole 121 is a waist-shaped hole, which is convenient for processing the first scrap hole 121 on one hand, and is more convenient for passing scraps on the other hand, so as to avoid accumulation of the scraps.

The peripheral waste area 14 is arranged in the outermost edge area of the motherboard, the back area of the upper plate 1 on the cutting platform corresponding to the peripheral waste area 14 adopts an integral square-shaped second groove, a second adsorption hole 141 is arranged in the second groove, and one end of the second adsorption hole 141, which is far away from the second groove, penetrates through the top surface of the upper plate 1 on the cutting platform. The second grooves form an integral second vacuum chamber after being closed, so that the outermost area of the mother board is stably adsorbed, and even if the cutting is completed, the mother board waste in the peripheral waste area 14 is adsorbed on the cutting-table upper board 1. The second adsorption holes 141 are uniformly distributed, and the second adsorption holes 141 are communicated with the vacuumizing device, so that stable vacuum degree is kept in a second vacuum cavity surrounded by the peripheral waste area 14 and the mother board after mother board processing and processing are completed.

Preferably, the second adsorption hole 141 has a larger diameter on the side closer to the second vacuum chamber than on the side farther from the second vacuum chamber. The diameters of both ends of the second adsorption hole 141 are different, and the evacuation speed may be increased.

The mounting part 13 is used for fixing the upper cutting platform plate 1 and the lower cutting platform plate 2, the mounting part 13 of the upper cutting platform plate 1 comprises a boss 131 arranged in the first groove 113, a first threaded hole 133 is formed in the boss 131, and a plurality of second threaded holes 132 are formed in the periphery of the back side of the upper cutting platform plate 1; the corresponding positions of the lower cutting platform plate 2 are respectively provided with a first counter bore 24 and a second counter bore 25, and the first counter bore 24 and the first threaded hole 133, the second counter bore 25 and the second threaded hole 132 are respectively connected through bolts or screws to fix the upper cutting platform plate 1 and the lower cutting platform plate 2.

Referring to fig. 6, fig. 6 is a schematic view illustrating a lower plate portion of an exemplary cutting table. The monolithic vacuumizing hole 21 is provided with a plurality of bifurcation holes 211, and the bifurcation holes 211 are communicated with the first groove 113, so that the first groove 113 is vacuumized, namely the monolithic adsorption zone 11 is vacuumized, and the mother board is adsorbed and fixed. The monolithic vacuum-pumping duct 21 penetrates the lower cutting platform plate 2 along the length or width direction of the lower cutting platform plate 2, and preferably, the monolithic vacuum-pumping duct 21 penetrates the lower cutting platform plate 2 along the length direction of the lower cutting platform plate 2. Plugs 214 are arranged at two ends of the single-chip vacuumizing channel 21, and the single-chip vacuumizing channel 21 is plugged by the plugs 214, so that air leakage of the single-chip vacuumizing channel 21 is avoided. The inner side of the single-chip vacuumizing hole 21 is provided with a first connector mounting hole 212, and the vacuumizing device is connected through the first connector mounting hole 212, so that the single-chip vacuumizing hole 21 is vacuumized.

The dust removing duct 22 is disposed perpendicular to the single vacuuming duct 21, and preferably, the dust removing duct 22 penetrates the lower cutting deck plate 2 in the width direction of the lower cutting deck plate 2. A second scrap hole 221 corresponding to the first scrap hole 121 is arranged in the dust removing duct 22, and scraps are discharged out of the machine through the first scrap hole 121, the second scrap hole 221 and the dust removing duct 22. Preferably, the second scrap hole 221 is a waist-shaped hole having the same size as the first scrap hole 121.

The peripheral evacuation channels 23 are arranged below the peripheral waste region 14 in the length or width direction of the lower cutting deck plate 2, preferably the peripheral evacuation channels 23 are arranged in the length direction of the lower cutting deck plate 2. The peripheral vacuumizing hole 23 is internally provided with a connecting hole 232, the connecting hole 232 connects the peripheral vacuumizing hole 23 with the peripheral waste area 14, preferably, the connecting hole 232 is a waist slot hole, the end part of the peripheral vacuumizing hole 23 is provided with a second connector mounting hole 231, the second connector mounting hole 231 is connected with a vacuumizing device, and the second connector mounting hole 231, the peripheral vacuumizing hole 23, the connecting hole 232 and the peripheral waste area 14 are communicated, so that the vacuumizing device can adsorb a mother board of the peripheral waste area 14.

The working mode is as follows: the mother board prevented from being on the cutting platform is divided into a single-chip area, a cutting area and a waste area. When in vacuumizing, the first connector mounting holes 212 of the single-chip vacuumizing hole channels 21 are connected to the single-chip adsorption area 11 of the upper plate 1 of the cutting platform through the plurality of bifurcation holes 211 in the single-chip vacuumizing hole channels 21, so that air in the single-chip adsorption area 11 is pumped away, and the mother board is adsorbed through the first adsorption holes 111 in the single-chip adsorption area 11. Similarly, the second connector mounting hole 231 is communicated to the peripheral waste region 14 of the upper plate 1 of the cutting platform through the connecting hole 232 in the peripheral vacuumizing hole 23, air in the peripheral waste region 14 is pumped away, and the edge of the motherboard is adsorbed through the second adsorption hole 141. In the same way, the mother board is adsorbed at the cutting groove 12. When cutting or cutting is accomplished, under the evacuation effect, the sweeps pass through first sweeps hole 121, second sweeps hole 221, dust removal pore 22 in proper order and discharge outside the machine, avoid the sweeps to stop in the machine work area, effectually guaranteed the inside cleanness of machine.

Compared with the prior art, the flexible panel cutting platform provided by the application has the advantages that the deformation of the mother board is smaller during adsorption, and the processing precision is improved; in the cutting process, the scraps generated by cutting are directly discharged into the machine through the cutting platform, so that the beneficial effect that the scraps pollute the space of the machine is avoided. Therefore, the application effectively overcomes some practical problems in the prior art, thereby having high utilization value and use significance. The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations of the application be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (10)

1. A flexible panel cutting deck, comprising:

The vacuum treatment device comprises a plurality of single-chip adsorption areas, wherein a plurality of first adsorption holes are formed in the single-chip adsorption areas, and the first adsorption holes are communicated with a vacuum-pumping device;

The cutting groove is arranged at the periphery of the single adsorption zone, a first scrap hole is formed in the cutting groove, and the first scrap hole is communicated with the vacuumizing device;

The peripheral waste material area is arranged in the edge area of the outer side of the motherboard, a plurality of second adsorption holes are formed in the peripheral waste material area, and the second adsorption holes are communicated with the vacuumizing device.

2. The flexible panel cutting deck of claim 1, wherein the cutting deck comprises a cutting deck upper plate, a cutting deck lower plate;

the cutting platform upper plate comprises a single adsorption area, a cutting groove, a mounting part and a peripheral waste area;

the back side of the upper plate of the cutting platform corresponding to the single-piece adsorption area is provided with a first groove, the first groove is matched with the lower plate of the cutting platform to form a first vacuum cavity, and the first adsorption hole is communicated with the first vacuum cavity;

The cutting grooves are arranged on the periphery of the single-piece adsorption area and are distributed on the upper plate of the cutting platform in a longitudinal and transverse mode;

the mounting part is connected with the cutting platform upper plate and the cutting platform lower plate;

The peripheral waste material area is provided with a second groove, and a second vacuum cavity is formed by the second groove and the lower plate of the cutting platform in a surrounding mode;

The lower plate of the cutting platform comprises a single vacuumizing duct and a dedusting duct;

the single-piece vacuumizing pore canal is provided with a plurality of bifurcation holes, and the bifurcation holes are communicated with the first vacuum cavity;

The dust removing pore canal is communicated with the first scrap hole.

3. The flexible panel cutting deck of claim 2 wherein the monolithic evacuation duct extends through the cutting deck lower plate along a length of the cutting deck lower plate.

4. A flexible panel cutting deck according to claim 3 wherein plugs are provided at both ends of the monolithic evacuation duct, the plugs plugging the monolithic evacuation duct, a first connector mounting hole is provided inside the monolithic evacuation duct, and the monolithic evacuation duct is evacuated through the first connector mounting hole.

5. The flexible panel cutting deck of claim 2 wherein said dust removal channel extends through said cutting deck lower plate in a width direction of said cutting deck lower plate, said dust removal channel having second crumb holes corresponding to said first crumb holes.

6. The flexible panel cutting deck of claim 2, wherein the cutting deck lower plate is further provided with a peripheral evacuation duct disposed along a length or width direction of the cutting deck lower plate, the peripheral evacuation duct is provided with a connection hole communicating with the second vacuum chamber, and two ends of the peripheral evacuation duct are provided with second joint mounting holes.

7. The flexible panel cutting deck of claim 2 wherein a plurality of first grooves along the length or width of the deck on the cutting deck are in communication.

8. The flexible panel cutting deck of claim 1, wherein the first suction holes are arranged in the single suction area from a center of the single suction area to a cutting groove direction at a density from small to large.

9. The flexible panel cutting deck of claim 1, wherein a diameter of a side of the first suction hole near the motherboard is smaller than a diameter of a side far from the motherboard.

10. The flexible panel cutting deck of claim 1 wherein the peripheral scrap area of the outboard edge area of the motherboard encloses a zigzag shape.