CN220838513U - Laser cutting device - Google Patents

Abstract

The utility model relates to a laser cutting device which comprises a frame module, a cutting module arranged on the frame module, wherein the cutting module comprises a laser generator and a light path unit which are arranged on the frame module and are mutually communicated, a Z-axis unit arranged on the frame module, a cutting unit which is arranged on the Z-axis unit in a sliding manner, is driven by the Z-axis unit to move up and down and is communicated with the light path unit, and an air suction unit which is arranged on the frame module and is used for generating negative pressure air suction, wherein laser emitted by the laser generator enters the cutting unit after being reflected and expanded by the light path unit, and the cutting unit is used for cutting a workpiece to be processed after combining and focusing the laser. The utility model enhances the control of the stability and displacement precision of the cutting unit while realizing the purpose of laser cutting, and improves the alignment precision and focusing precision of the cutting unit.

Description

Laser cutting device

Technical Field

The utility model relates to the field of laser processing, in particular to a laser cutting device.

Background

The laser cutting machine utilizes the laser emitted by the laser generator, and focuses the laser into laser beams with high power density to irradiate the surface of the workpiece through the light path system, so that the cutting of the workpiece is completed. However, in the prior art, the cutting device of the laser cutting machine directly utilizes the laser generator to cut the workpiece, and although the workpiece is subjected to beam expansion and focusing of the optical path system, the corresponding stable control device is lacked, so that the stability and controllability of the cutting process are reduced, and the problem of inaccurate focusing alignment is easy to occur. The utility model discloses a curved transparent piece cutting method, electronic equipment, laser cutting equipment and medium as disclosed in Chinese patent application CN116475587A, wherein the laser cutting equipment comprises a laser emitting assembly, a clamp assembly, a driving device and the electronic equipment as described in the technical scheme, wherein the electronic equipment is in communication connection with the laser emitting assembly and the driving device, and the laser emitting assembly is used for emitting laser; the clamp assembly is arranged corresponding to the focusing assembly and is used for fixing the curved transparent piece; the driving device is connected with the clamp assembly and is used for driving the clamp assembly to move and rotate; the laser emission component comprises a laser, a beam expander and a reflecting mirror, wherein the laser is used for emitting laser to form first emitted light; the beam expander is arranged along the emission direction of the first light path and is used for expanding and amplifying the first emitted light to obtain expanded light; the reflector is arranged between the beam expanding light and the focusing assembly and is used for adjusting the path of the beam expanding light. The metal material cutting device based on dynamic shaping of the laser beam comprises a laser, a collimating mirror, a focusing mirror and a cutting nozzle, wherein the laser, the collimating mirror and the focusing mirror are sequentially arranged along a light path, the cutting nozzle is arranged below the focusing mirror, the laser is used for providing the laser beam, the collimating mirror and the focusing mirror are respectively used for collimating and focusing the laser beam, and the cutting nozzle is used for allowing the laser beam and cutting gas to pass through; the cutting device also comprises a laser beam dynamic shaping mechanism which is arranged between the collimating mirror and the focusing mirror or is connected with the collimating mirror or the focusing mirror and is used for dynamically shaping the collimated laser beam, so that the focus of the laser beam reciprocates in the slit of the workpiece to be cut along the optical axis direction and simultaneously acts on the workpiece to be cut together with the cutting gas input into the cutting nozzle, and the cutting of the workpiece to be cut is realized. Both the above two patents utilize a laser generator and an optical path system to cut a workpiece, but the corresponding stable control devices are also lacking, so that the stability, controllability and alignment precision in the cutting process are reduced.

In view of the above, the present utility model provides a laser cutting device, which is provided with a laser generator, an optical path unit, a cutting unit, a Z-axis unit, and other components, so as to achieve the purpose of laser cutting, and simultaneously enhance the control of stability and displacement accuracy of the cutting unit, and simultaneously enhance the alignment accuracy and focusing accuracy of the cutting unit by using the cooperation of a scanning positioning unit, a focus height measuring unit, and the Z-axis unit, thereby enhancing the quality of laser cutting.

Disclosure of utility model

The utility model aims to provide a laser cutting device to solve the defects in the prior art, and the technical problems to be solved by the utility model are realized by the following technical scheme.

The utility model provides a laser cutting device, includes the frame module, set up in cutting module on the frame module, its improvement lies in: the cutting module comprises a laser generator and a light path unit which are arranged on the frame module and are mutually communicated, a Z-axis unit arranged on the frame module, a cutting unit which is arranged on the Z-axis unit in a sliding manner and is driven by the Z-axis unit to move up and down and be communicated with the light path unit, and an air suction unit which is arranged on the frame module and is used for generating negative pressure air suction, wherein laser emitted by the laser generator enters the cutting unit after being reflected and expanded by the light path unit, and the cutting unit cuts a workpiece to be processed after the laser is combined and focused.

Preferably, the light path unit includes a beam expander and a plurality of reflectors, the laser emitted by the laser generator enters the beam expander after being reflected by the reflectors, the beam expander expands the laser, and the expanded laser enters the cutting unit after being reflected by the reflectors.

Preferably, the optical path unit further comprises an optical path dust cover, and the optical path unit and the cutting unit are in sealing connection through the optical path dust cover.

Preferably, the Z-axis unit comprises a Z-axis mounting plate arranged on the frame module, a Z-axis driver and a Z-axis sliding rail arranged on the Z-axis mounting plate, and a Z-axis sliding plate arranged on the Z-axis sliding rail in a sliding manner, the cutting unit is arranged on the Z-axis sliding plate, and the Z-axis sliding plate is driven by the Z-axis driver to slide along the Z-axis sliding rail so as to drive the cutting unit to move up and down relative to the Z-axis unit.

Preferably, the Z-axis unit further comprises a Z-axis grating ruler and a Z-axis reader matched with the Z-axis grating ruler, and the Z-axis reader synchronously moves along with the Z-axis sliding plate.

Preferably, the cutting unit comprises a cutting installation box arranged on the Z-axis unit in a sliding manner, a cutting field lens arranged on the cutting installation box, and a cutting beam combining lens communicated with the cutting field lens, wherein laser beam after beam expansion through the light path unit enters the cutting unit and is combined and focused by the cutting field lens and the cutting beam combining lens to cut a workpiece to be processed.

Preferably, the cutting module further comprises a scanning positioning unit arranged on the cutting unit, the scanning positioning unit comprises a CCD camera for scanning the workpiece to be processed, and the CCD camera is used for adjusting the position relative to the cutting unit through a scanning adjusting module.

Preferably, the scanning adjustment module comprises a positioning installation frame arranged on the cutting unit, a positioning adjustment fixing block arranged on the positioning installation frame, a positioning longitudinal moving block arranged on the positioning adjustment fixing block in a sliding manner, a positioning transverse moving block arranged on the positioning longitudinal moving block in a sliding manner, and a positioning installation plate arranged on the positioning transverse moving block, wherein the CCD camera is arranged on the positioning installation plate, the positioning longitudinal moving block is arranged on the positioning adjustment fixing block, the positioning longitudinal adjusting rod is used for adjusting the position of the positioning adjustment fixing block, and the positioning transverse moving block is arranged on the positioning longitudinal moving block, and the positioning transverse adjusting rod is arranged on the positioning longitudinal moving block.

Preferably, the cutting module further comprises a focus altimeter arranged on the cutting unit, the focus altimeter comprises a focus altimeter, and the focus altimeter is used for adjusting the position relative to the cutting unit through an altimeter adjusting module.

Preferably, the height measurement adjusting module comprises a height measurement adjusting fixed block arranged on the cutting unit, a height measurement longitudinal moving block arranged on the height measurement adjusting fixed block in a sliding manner, a height measurement transverse moving block arranged on the height measurement longitudinal moving block in a sliding manner, and a height measurement mounting plate arranged on the height measurement transverse moving block, wherein the focus height measuring instrument is arranged on the height measurement mounting plate, the height measurement longitudinal moving block is adjusted to be opposite to the position of the height measurement adjusting fixed block through a height measurement longitudinal adjusting rod arranged on the height measurement adjusting fixed block, and the height measurement transverse moving block is adjusted to be opposite to the position of the height measurement longitudinal moving block through a height measurement transverse adjusting rod arranged on the height measurement longitudinal moving block.

Compared with the prior art, the laser cutting device has the advantages that the laser cutting device is provided with the laser generator, the light path unit, the cutting unit, the Z-axis unit and other parts, so that the stability and displacement precision of the cutting unit are improved while the laser cutting purpose is achieved, and meanwhile, the alignment precision and focusing precision of the cutting unit are improved by utilizing the cooperation of the scanning positioning unit, the focus height measuring unit and the Z-axis unit, so that the laser cutting quality is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of the structure of the optical path unit in the present utility model;

FIG. 3 is a schematic view of the structure of the Z-axis unit according to the present utility model;

FIG. 4 is a schematic diagram of the structure of the cutting unit and the scanning and positioning unit according to the present utility model;

FIG. 5 is a schematic diagram of a scanning and positioning unit according to the present utility model;

FIG. 6 is a schematic view of a focus elevation unit according to the present utility model;

FIG. 7 is a schematic view of the structure of the present utility model in use;

The reference numerals in the drawings are in turn:

1. The device comprises a frame module, 2, a platform module, 3, a cutting module, 31, a laser generator, 32, an optical path unit, 321, a beam expander, 322, an optical path dust cover, 33, a Z-axis unit, 331, a Z-axis mounting plate, 332, a Z-axis driver, 333, a Z-axis sliding rail, 334, a Z-axis sliding plate, 335, a Z-axis grating ruler, 336, a Z-axis reader, 34, a cutting unit, 341, a cutting mounting box, 342, a cutting field lens, 343, a cutting beam combiner, 35, a scanning positioning unit, 351, a positioning mounting frame, 352, a positioning adjustment fixing block, 353, a positioning longitudinal moving block, 354, a positioning longitudinal adjusting rod, 355, a positioning transverse moving block, 356, a positioning transverse adjusting rod, 357, a positioning mounting plate, 358, a CCD camera, 36, a focus height measuring unit, 361, a height measuring adjustment fixing block, 362, a height measuring longitudinal adjusting rod, 364, a height measuring transverse moving block, 365, a height measuring transverse adjusting rod, 366, a height measuring mounting plate, 367, a focus measuring instrument, 37 and a suction unit.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

Example 1:

Referring to fig. 1 to 7, a laser cutting device, comprising a frame module 1, a cutting module 3 disposed on the frame module 1, the improvement is that: the cutting module 3 comprises a laser generator 31 and an optical path unit 32 which are arranged on the frame module 1 and are mutually communicated, a Z-axis unit 33 arranged on the frame module 1, a cutting unit 34 which is arranged on the Z-axis unit 33 in a sliding manner and is driven by the Z-axis unit 33 to move up and down and is communicated with the optical path unit 32, and an air suction unit 37 which is arranged on the frame module 1 and is used for generating negative pressure air suction, wherein laser emitted by the laser generator 31 enters the cutting unit 34 after being reflected and expanded by the optical path unit 32, and the cutting unit 34 cuts a workpiece to be processed after combining and focusing the laser.

In this embodiment, the rack module 1 is configured to carry the cutting module 3, and the cutting module 3 is configured to perform a cutting operation on a workpiece to be processed; the laser generator 31 is used for generating laser, and the cutting unit 34 is used for performing laser cutting on a workpiece to be processed; the light path unit 32 is configured to reflect and expand the laser beam emitted by the laser generator, so that the laser beam can smoothly enter the light path unit 32 and the cutting unit 34, and meanwhile, a laser beam with a preset spot diameter is obtained through beam expansion, that is, the diameter of a spot formed by the focused laser beam after beam expansion accords with a preset value; the Z-axis unit 33 is configured to drive the cutting unit 34 to move up and down and keep a fixed position, so as to avoid the problems that the cutting unit 34 is not aligned in place and slides down after being aligned in the moving process, thereby enhancing the control of the displacement precision and stability of the cutting unit, and simultaneously, utilizing the Z-axis unit 33 to enable the cutting unit 34 to reach a proper height, so that the laser focus of the cutting unit 34 is located at the position to be cut of the workpiece to be processed; the air suction unit 37 is used for forming negative pressure air flow to blow off molten materials and/or suck off waste gas and waste materials generated in the cutting process.

Further, referring to fig. 5, the cutting module 3 further includes a scanning positioning unit 35 disposed on the cutting unit 34, the scanning positioning unit 35 includes a CCD camera 358 for scanning the workpiece to be processed, and the CCD camera 358 adjusts the position relative to the cutting unit 34 through a scanning adjustment module.

Further, the scanning adjustment module comprises a positioning mounting frame 351 arranged on the cutting unit 34, a positioning adjustment fixing block 352 arranged on the positioning mounting frame 351, a positioning longitudinal moving block 353 arranged on the positioning adjustment fixing block 352 in a sliding manner, a positioning transverse moving block 355 arranged on the positioning longitudinal moving block 353 in a sliding manner, a positioning mounting plate 357 arranged on the positioning transverse moving block 355, and a CCD camera 358 arranged on the positioning mounting plate 357, wherein the positioning longitudinal moving block 353 adjusts the position relative to the positioning adjustment fixing block 352 through a positioning longitudinal adjusting rod 354 arranged on the positioning adjustment fixing block 352, and the positioning transverse moving block 355 adjusts the position relative to the positioning longitudinal moving block 353 through a positioning transverse adjusting rod 356 arranged on the positioning longitudinal moving block 353.

In this embodiment, the scanning positioning unit 35 is configured to scan a workpiece to be processed to form a cutting path for a cutting operation; the position of the CCD camera 358 relative to the cutting unit 34 can be finely adjusted by setting the scanning adjustment module, and the movement of the Z-axis unit 33 is matched, so that the CCD camera 358 can clearly scan the workpiece to be processed, and the alignment precision of the cutting unit 34 can be improved.

Further, referring to fig. 6, the cutting module 3 further includes a focus height measuring unit 36 disposed on the cutting unit 34, and the focus height measuring unit 36 includes a focus height measuring instrument 367, and the focus height measuring instrument 367 adjusts a position relative to the cutting unit 34 through a height measuring adjustment module.

Further, the height measurement adjusting module comprises a height measurement fixed block 361 arranged on the cutting unit 34, a height measurement longitudinal moving block 362 arranged on the height measurement fixed block 361 in a sliding manner, a height measurement transverse moving block 364 arranged on the height measurement longitudinal moving block 362 in a sliding manner, and a height measurement mounting plate 366 arranged on the height measurement transverse moving block 364, the focus height measurer 367 is arranged on the height measurement mounting plate 366, the position of the height measurement longitudinal moving block 362 relative to the height measurement fixed block 361 is adjusted through a height measurement longitudinal adjusting rod 363 arranged on the height measurement fixed block 361, and the position of the height measurement transverse moving block 364 relative to the height measurement longitudinal moving block 362 is adjusted through a height measurement transverse adjusting rod 365 arranged on the height measurement longitudinal moving block 362.

In this embodiment, the focus height measurement unit 36 is configured to determine whether the cutting unit 34 is at a suitable height position, so as to ensure that the laser focus of the cutting unit 34 is at a position of a workpiece to be processed, and cooperate with the movement of the Z-axis unit 33 to improve the focusing precision of the cutting unit 34; the height measurement adjusting module is used for fine-adjusting the position of the focus height gauge 367 relative to the cutting unit 34, and simultaneously matching with the movement of the Z-axis unit 33 to further improve the focusing precision of the cutting unit 34.

In specific use of this embodiment, referring to fig. 7, the Y-axis, X-axis, T-axis and R-axis units of the platform module 1 and the Z-axis unit 33 of the cutting module 3 move synchronously, and at the same time the CCD camera 358 of the scanning and positioning unit 35 scans the workpiece to be processed to form a cutting path, and then the five axes continue to move synchronously, and the cutting unit 34 performs cutting operation on the workpiece to be processed.

Example 2:

On the basis of embodiment 1, further, referring to fig. 2, the optical path unit 32 includes a beam expander 321 and a plurality of mirrors, the laser beam emitted by the laser generator 31 is reflected by the mirrors and enters the beam expander 321, the beam expander 321 expands the laser beam, and the expanded laser beam enters the cutting unit 34 after being reflected by the mirrors.

Further, the optical path unit 32 further includes an optical path dust cover 322, and the optical path unit 32 and the cutting unit 34 are connected in a sealed manner through the optical path dust cover 322.

The present embodiment can prevent dust and the like from entering the optical path unit 32 and the cutter unit 34 by providing the optical path dust cover 332, thereby ensuring the cleaning of the inside.

Referring to fig. 3, the Z-axis unit 33 includes a Z-axis mounting plate 331 disposed on the rack module 1, a Z-axis driver 332 and a Z-axis sliding rail 333 disposed on the Z-axis mounting plate 331, and a Z-axis sliding plate 334 slidably disposed on the Z-axis sliding rail 333, the cutting unit 34 is disposed on the Z-axis sliding plate 334, and the Z-axis sliding plate 334 slides along the Z-axis sliding rail 333 under the driving of the Z-axis driver 332 to drive the cutting unit 34 to move up and down relative to the Z-axis unit 33.

Further, the Z-axis unit 33 further includes a Z-axis grating ruler 335, and a Z-axis reader 336 that is matched with the Z-axis optical grating ruler 335, and the Z-axis reader 336 moves synchronously with the Z-axis sliding plate 334.

In this embodiment, the moving distance and position of the Z-axis sliding plate 334 can be accurately measured and positioned by setting the Z-axis grating ruler 335 and the Z-axis reader 336, and when the moving distance and position of the Z-axis sliding plate 334 do not match the preset value, the moving distance and position of the Z-axis sliding plate 334 are corrected and compensated by the feedback of the Z-axis grating ruler 335 and the Z-axis reader 336.

Further, referring to fig. 4, the cutting unit 34 includes a cutting mounting box 341 slidably disposed on the Z-axis unit 33, a cutting field lens 342 disposed on the cutting mounting box 341, and a cutting beam combining lens 342 communicated with the cutting field lens 342, and the laser beam after being expanded by the optical path unit 32 enters the cutting unit 34 and is combined and focused by the cutting field lens 342 and the cutting beam combining lens 342 to cut the workpiece to be processed.

It should be noted that the foregoing detailed description is exemplary and is intended to provide further explanation of the application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly indicates otherwise. Furthermore, it will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or groups thereof.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Spatially relative terms, such as "above … …," "above … …," "upper surface on … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations "above … …" and "below … …". The device may also be positioned in other different ways, such as rotated 90 degrees or at other orientations, and the spatially relative descriptors used herein interpreted accordingly.

In the above detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, like numerals typically identify like components unless context indicates otherwise. The illustrated embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. The utility model provides a laser cutting device, includes frame module (1), set up in cutting module (3) on frame module (1), its characterized in that: the cutting module (3) comprises a laser generator (31) and an optical path unit (32) which are arranged on the frame module (1) and are mutually communicated, a Z-axis unit (33) arranged on the frame module (1), a cutting unit (34) which is arranged on the Z-axis unit (33) in a sliding manner, is driven by the Z-axis unit (33) to move up and down and is communicated with the optical path unit (32), and an air suction unit (37) which is arranged on the frame module (1) and is used for generating negative pressure air suction, wherein laser emitted by the laser generator (31) enters the cutting unit (34) after being reflected and expanded by the optical path unit (32), and the cutting unit (34) cuts a workpiece to be processed after the laser is combined and focused.

2. A laser cutting device according to claim 1, wherein: the light path unit (32) comprises a beam expander (321) and a plurality of reflectors, laser emitted by the laser generator (31) enters the beam expander (321) after being reflected by the reflectors, the beam expander (321) expands laser beams, and the laser beams after being expanded enter the cutting unit (34) after being reflected by the reflectors.

3. A laser cutting apparatus according to claim 2, wherein: the optical path unit (32) further comprises an optical path dust cover (322), and the optical path unit (32) and the cutting unit (34) are in sealing connection through the optical path dust cover (322).

4. A laser cutting device according to claim 1, wherein: the Z-axis unit (33) comprises a Z-axis mounting plate (331) arranged on the frame module (1), a Z-axis driver (332) and a Z-axis sliding rail (333) arranged on the Z-axis mounting plate (331), and a Z-axis sliding plate (334) arranged on the Z-axis sliding rail (333) in a sliding manner, the cutting unit (34) is arranged on the Z-axis sliding plate (334), and the Z-axis sliding plate (334) is driven by the Z-axis driver (332) to slide along the Z-axis sliding rail (333) so as to drive the cutting unit (34) to move up and down relative to the Z-axis unit (33).

5. A laser cutting apparatus according to claim 4, wherein: the Z-axis unit (33) further comprises a Z-axis grating ruler (335) and a Z-axis reader (336) matched with the Z-axis grating ruler (335), and the Z-axis reader (336) moves synchronously with the Z-axis sliding plate (334).

6. A laser cutting device according to claim 1, wherein: the cutting unit (34) comprises a cutting installation box (341) arranged on the Z-axis unit (33) in a sliding mode, a cutting field lens (342) arranged on the cutting installation box (341), and a cutting beam combining lens (343) communicated with the cutting field lens (342), wherein laser beams expanded by the light path unit (32) enter the cutting unit (34) and then are combined and focused by the cutting field lens (342) and the cutting beam combining lens (343) to cut a workpiece to be processed.

7. A laser cutting device according to claim 1, wherein: the cutting module (3) further comprises a scanning positioning unit (35) arranged on the cutting unit (34), the scanning positioning unit (35) comprises a CCD camera (358) for scanning the workpiece to be processed, and the CCD camera (358) is used for adjusting the position relative to the cutting unit (34) through a scanning adjusting module.

8. A laser cutting apparatus according to claim 7, wherein: the scanning regulation module is including locating location mounting bracket (351) on cutting unit (34), locate location regulation fixed block (352) on location mounting bracket (351), slide locate location longitudinal movement piece (353) on location regulation fixed block (352), slide locate location transverse movement piece (355) on location longitudinal movement piece (353), locate location mounting panel (357) on location transverse movement piece (355), CCD camera (358) are located on location mounting panel (357), location longitudinal movement piece (353) are through locating location longitudinal movement pole (354) on location regulation fixed block (352) are adjusted for the position of location regulation fixed block (352), location transverse movement piece (355) are through locating location transverse movement pole (356) on location longitudinal movement piece (353) are adjusted for the position of location longitudinal movement piece (353).

9. A laser cutting device according to claim 1, wherein: the cutting module (3) further comprises a focus height measuring unit (36) arranged on the cutting unit (34), the focus height measuring unit (36) comprises a focus height measuring instrument (367), and the focus height measuring instrument (367) is used for adjusting the position relative to the cutting unit (34) through a height measuring adjusting module.

10. A laser cutting apparatus according to claim 9, wherein: the height measurement adjusting module comprises a height measurement adjusting fixed block (361) arranged on the cutting unit (34), a height measurement longitudinal moving block (362) arranged on the height measurement adjusting fixed block (361) in a sliding mode, a height measurement transverse moving block (364) arranged on the height measurement longitudinal moving block (362) in a sliding mode, and a height measurement mounting plate (366) arranged on the height measurement transverse moving block (364), wherein the focus height measuring instrument (367) is arranged on the height measurement mounting plate (366), the height measurement longitudinal moving block (362) is adjusted relative to the position of the height measurement adjusting fixed block (361) through a height measurement longitudinal adjusting rod (363) arranged on the height measurement adjusting fixed block (361), and the height measurement transverse moving block (364) is adjusted relative to the position of the height measurement longitudinal moving block (362) through a height measurement transverse adjusting rod (365) arranged on the height measurement longitudinal moving block (362).