CN220797408U - Honeycomb structure temperature control device - Google Patents
Honeycomb structure temperature control device Download PDFInfo
- Publication number
- CN220797408U CN220797408U CN202322251761.1U CN202322251761U CN220797408U CN 220797408 U CN220797408 U CN 220797408U CN 202322251761 U CN202322251761 U CN 202322251761U CN 220797408 U CN220797408 U CN 220797408U
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- China
- Prior art keywords
- heat sink
- honeycomb
- honeycomb heat
- water
- frequency doubling
- Prior art date
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 47
- 239000013078 crystal Substances 0.000 claims abstract description 39
- 230000000712 assembly Effects 0.000 claims abstract description 6
- 238000000429 assembly Methods 0.000 claims abstract description 6
- 238000005057 refrigeration Methods 0.000 abstract description 13
- 230000004907 flux Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Abstract
The utility model belongs to the technical field of lasers, in particular to a honeycomb structure temperature control device which comprises a frequency doubling crystal, wherein the bottom of the frequency doubling crystal is fixedly connected with a heat conducting block, the bottom of the heat conducting block is fixedly provided with a plurality of groups of honeycomb heat sink assemblies, the middle of each group of honeycomb heat sink assemblies is fixedly provided with a semiconductor refrigerating sheet, a passage is formed in the honeycomb heat sink, and two ends of the honeycomb heat sink form a closed circuit through a pipeline. According to the utility model, through circulating water in the first honeycomb, the semiconductor refrigerating sheet only cools the water in the first honeycomb, the water in the pipeline between the water circulation fixing seat and the water circulation inlet seat carries out cold-heat exchange with air temperature, the water in the first honeycomb is not easy to freeze, ice is prevented from being generated during refrigeration, water stain marks are formed on the end face of the frequency doubling crystal after the ice is melted, wave light flux is shielded, and the laser frequency doubling device is damaged.
Description
Technical Field
The utility model relates to the technical field of lasers, in particular to a honeycomb structure temperature control device.
Background
The existing temperature control device for the frequency doubling crystal of the solid laser with high frequency and high power mainly realizes the temperature neutralization of the sharply increased temperature of the crystal during the operation of the frequency doubling crystal by using three parts of a heat sink, a clinging frequency doubling crystal, a temperature sensor embedded on a honeycomb heat sink and a semiconductor refrigerating sheet, wherein the heat sink is coupled at two sides of the frequency doubling crystal, the temperature sensor is tightly attached to the frequency doubling crystal, the temperature of the crystal is sharply increased during the operation of the frequency doubling crystal, the normal temperature of the operation of the frequency doubling crystal is realized, the semiconductor refrigerating sheet is commanded to work and refrigerate when the temperature sensor detects that the temperature of the frequency doubling crystal is increased to a preset high temperature point during the operation of the laser, the temperature neutralization and the temperature reduction are realized through the honeycomb heat sink, and the temperature sensor detects that the temperature is reduced to the preset temperature point, the semiconductor refrigerating sheet is commanded to stop working, and the operation is reciprocally performed.
However, in the process of controlling the temperature of the laser according to the technical scheme, at least the following technical problems are found:
1. the semiconductor refrigerating sheet is used for refrigerating, and needs to be indirectly transmitted to the frequency doubling crystal through the heat sink, so that heat cannot be immediately dissipated, the temperature of the frequency doubling crystal can be continuously increased, the frequency doubling efficiency is reduced due to overhigh temperature, and the stability of output energy is affected.
2. Ice can be generated when the refrigerating temperature of the semiconductor refrigerating sheet is too low, and the ice melts to form water stain marks on the end face of the frequency doubling crystal, so that the light flux of the fundamental wave light is shielded, and the energy output of the frequency doubling laser is influenced.
Disclosure of Invention
Based on this, it is necessary to provide a honeycomb structure temperature control device for solving the problem that the semiconductor refrigerating sheet in the prior art cannot timely cool down and ice is generated due to too low refrigerating temperature.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model relates to a honeycomb structure temperature control device which comprises a frequency doubling crystal, wherein the bottom of the frequency doubling crystal is fixedly connected with a heat conducting block, the bottom of the heat conducting block is fixedly provided with a plurality of groups of honeycomb heat sink assemblies, the middle of each group of honeycomb heat sink assemblies is fixedly provided with a semiconductor refrigerating sheet, the inside of each honeycomb heat sink is provided with a passage, and the two ends of each honeycomb heat sink are connected through a pipeline to form a closed circuit and are internally communicated with water.
Further, the honeycomb heat sink component comprises a first honeycomb heat sink and a second honeycomb heat sink, the two sides of the semiconductor refrigerating sheet are respectively a radiating surface and a working surface, the side part of the first honeycomb heat sink is fixedly connected with the working surface of the semiconductor refrigerating sheet, the second honeycomb heat sink is fixedly connected with the radiating surface of the semiconductor refrigerating sheet, and the pipeline is arranged between the first honeycomb heat sink and the second honeycomb heat sink.
Further, the side surface area of the first honeycomb heat sink and the side surface area of the second honeycomb heat sink are the same as the side surface area of the semiconductor refrigerating sheet.
Furthermore, the side parts of the first honeycomb heat sinks are provided with V-shaped grooves, two V-shaped grooves form a prismatic shape, the heat conducting blocks are arranged in the V-shaped grooves of the two first honeycomb heat sinks in different groups, and the area of the heat conducting blocks is larger than that of the frequency doubling crystal.
Further, temperature sensors are fixedly installed on the inner walls of the first honeycomb heat sink and the second honeycomb heat sink, the temperature sensors are electrically connected with a controller, and the controller is electrically connected with an electromagnetic water valve.
Furthermore, the electromagnetic water valve is arranged on the pipelines at the two ends of the honeycomb heat sink, and the pipeline is fixedly provided with a water pump.
Furthermore, the end parts of the first honeycomb heat sink and the second honeycomb heat sink are fixedly connected with a water circulation inlet seat, the other ends of the first honeycomb heat sink and the second honeycomb heat sink are fixedly connected with a water circulation fixing seat, and the semiconductor refrigerating sheet is fixedly arranged between the water circulation fixing seat and the water circulation inlet seat.
Compared with the prior art, the utility model has the beneficial effects that:
1. when the laser frequency doubling device is started, the first honeycomb heat sink water carries out temperature cold-heat exchange on the frequency doubling crystal, the heated water circularly flows to the pipeline through the water circularly flowing in the first honeycomb heat sink and carries out cold-heat exchange with air, so that the frequency doubling crystal is continuously cooled, the semiconductor refrigerating sheet is prevented from transmitting temperature to the frequency doubling crystal through the heat sink, the frequency doubling efficiency is reduced due to overheating of the frequency doubling crystal due to slow cooling effect, and the stability of output energy is influenced.
2. According to the utility model, in the refrigerating process of the semiconductor refrigerating sheet, the semiconductor refrigerating sheet only cools the water in the first honeycomb to indirectly reduce the temperature of the frequency doubling crystal, the water in the first honeycomb circularly flows to avoid freezing of the water, and the water moves to the pipeline to perform cold-heat exchange with the air temperature, so that the water in the first honeycomb is not easy to freeze, ice generated by refrigerating the semiconductor refrigerating sheet is avoided, water stain marks are formed on the end face of the frequency doubling crystal after the ice is melted, and the damage to the laser frequency doubling device caused by wave luminous flux is shielded.
Drawings
The disclosure of the present utility model is described with reference to the accompanying drawings. It should be understood that the drawings are for purposes of illustration only and are not intended to limit the scope of the present utility model in which like reference numerals are used to designate like parts.
Wherein:
FIG. 1 is a schematic perspective view of a honeycomb structure temperature control device according to the present utility model;
FIG. 2 is a schematic cross-sectional view of a second honeycomb heat sink structure of the present utility model;
fig. 3 is a schematic cross-sectional view of a first honeycomb heat sink structure according to the present utility model.
The reference numerals in the drawings indicate: 1. a water circulation fixing seat; 2. water is circulated into the seat; 3. a first honeycomb heat sink; 4. a semiconductor refrigeration sheet; 5. an electromagnetic water valve; 6. a controller; 7. a temperature sensor; 8. a heat conduction block; 9. a frequency doubling crystal; 10. a second honeycomb heat sink.
Detailed Description
It is to be understood that, according to the technical solution of the present utility model, those skilled in the art may propose various alternative structural modes and implementation modes without changing the true spirit of the present utility model. Accordingly, the following detailed description and drawings are merely illustrative of the utility model and are not intended to be exhaustive or to limit the utility model to the precise form disclosed.
Example 1
The utility model introduces a honeycomb structure temperature control device, as shown in figure 1, comprising a water circulation fixing seat 1, wherein a plurality of groups of honeycomb heat sink components are fixedly arranged on the side part of the water circulation fixing seat 1, a semiconductor refrigerating sheet 4 is fixedly arranged in the middle of each group of honeycomb heat sink components, the semiconductor refrigerating sheet 4 is used for refrigerating, the cooling effect is realized, a passage is formed in the honeycomb heat sink, and two ends of the honeycomb heat sink form a closed circuit through a pipeline.
As shown in fig. 2, the two sides of the semiconductor refrigeration piece 4 are a heat dissipation surface and a working surface respectively, two ends of the first honeycomb heat sink 3 and the second honeycomb heat sink 10 are fixedly connected with a pipeline, the honeycomb heat sink assembly comprises the first honeycomb heat sink 3 and the second honeycomb heat sink 10, the side part of the first honeycomb heat sink 3 is fixedly connected with the working surface of the semiconductor refrigeration piece 4, the second honeycomb heat sink 10 is fixedly connected with the heat dissipation surface of the semiconductor refrigeration piece 4, the side surface area of the first honeycomb heat sink 3, the side surface area of the second honeycomb heat sink 10 are the same as the side surface area of the semiconductor refrigeration piece 4, the semiconductor refrigeration piece 4 is completely attached to the shape of the first honeycomb heat sink 3, the second honeycomb heat sink 10 has better refrigeration effect, and the second honeycomb heat sink 10 dissipates heat for the semiconductor refrigeration piece 4.
As shown in fig. 3, the side parts of the two groups of honeycomb heat sink components are fixedly connected with a heat conducting block 8 together, the other side of the heat conducting block 8 is fixedly provided with a frequency doubling crystal 9, the side parts of the first honeycomb heat sinks 3 are provided with V-shaped grooves, the two V-shaped grooves form a prismatic shape, the heat conducting block 8 is arranged in the V-shaped grooves of the two first honeycomb heat sinks 3 in different groups, the area of the heat conducting block 8 is larger than that of the frequency doubling crystal 9, heat conduction can be better carried out, when a laser frequency doubling light path is started, fundamental wave light starts to be converted into frequency doubling light, the frequency doubling crystal 9 starts to locally heat, the heat conducting block 8 is attached to the frequency doubling crystal 9 to absorb heat emitted by the frequency doubling crystal, the heat conducting block 8 conducts the heat to the first honeycomb heat sinks 3, the semiconductor refrigerating sheet 4 is used for refrigerating, and the heat attached to the first heat sinks 3 at the working surface of the semiconductor refrigerating sheet is reduced, so that the heat of the frequency doubling crystal 9 is reduced.
The end parts of the first honeycomb heat sink 3 and the second honeycomb heat sink 10 are fixedly connected with a water circulation inlet seat 2, the other ends of the first honeycomb heat sink 3 and the second honeycomb heat sink 10 are fixedly connected with a water circulation fixing seat 1, the side part of the water circulation inlet seat 2 is fixedly connected with an electromagnetic water valve 5, a semiconductor refrigerating sheet 4 is fixedly arranged between the water circulation fixing seat 1 and the water circulation inlet seat 2, the water circulation fixing seat 1 and the water circulation inlet seat 2 are connected through a pipeline, and a water pump and the electromagnetic water valve 5 are arranged on the pipeline.
According to the honeycomb structure temperature control device introduced in the embodiment, when a laser is started, the controller 6 controls the electromagnetic water valve 5 at the first honeycomb heat sink 3 where the heat radiating surface is contacted to be opened, so that water is filled in the first honeycomb heat sink 3 where the heat radiating surface is contacted, the semiconductor refrigerating piece 4 dissipates heat, when the temperature sensor 7 detects that the temperature of the first honeycomb heat sink 3 rises to a preset value, the temperature sensor 7 transmits data to the controller 6, the semiconductor refrigerating piece 4 refrigerates, before the semiconductor refrigerating piece 4 has a refrigerating effect, the temperature exchange is carried out between the water in the first honeycomb heat sink 3 and the frequency doubling crystal 9 to cool, and the water in the first honeycomb heat sink 3 is circulated, so that the temperature of the water in the first honeycomb heat sink 3 is prevented from being too high, the temperature of the semiconductor refrigerating piece 4 is firstly cooled, the phenomenon that the frequency doubling crystal is too high due to untimely refrigerating of the semiconductor refrigerating piece, the frequency doubling efficiency is reduced, and the stability of output energy is influenced is avoided.
Example two
As shown in fig. 2, temperature sensors 7 are fixedly installed on the inner walls of the first honeycomb heat sink 3 and the second honeycomb heat sink 10, the temperature sensors 7 are electrically connected with a controller 6, the controller 6 is electrically connected with an electromagnetic water valve 5, the temperature of each first honeycomb heat sink 3 is sensed through the temperature sensors 7, sensed temperature data are transmitted to the controller 6, when the temperature of the first honeycomb heat sink 3 reaches a set value, the controller 6 controls a semiconductor refrigerating sheet 4 to refrigerate, and meanwhile, the controller 6 controls the electromagnetic water valve 5 at the first honeycomb heat sink 3 contacted with a radiating surface to be opened, so that the interior of the first honeycomb heat sink 3 contacted with the radiating surface is filled with water.
In this embodiment, a honeycomb structure temperature control device is described, when the semiconductor refrigeration sheet 4 operates, because the water inside the first honeycomb heat sink 3 circulates circularly, the semiconductor refrigeration sheet 4 only reduces the temperature of the water inside the first honeycomb heat sink 3, and the pipeline of the water circulation exchanges heat with air temperature, so that the water inside the first honeycomb heat sink 3 cannot be frozen, ice can not be generated on the surface of the first honeycomb heat sink 3, ice generated when the semiconductor refrigeration sheet cools is avoided, water stain marks are formed on the end surface of the frequency doubling crystal, the light flux of wave light is blocked, and the laser frequency doubling device is damaged, so that the semiconductor refrigeration sheet 4 can cool with lower temperature, and a better cooling effect is generated on the frequency doubling crystal 9.
In the description of the present utility model, it should be understood that the terms "center," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of the present utility model.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. A honeycomb structure temperature control device is characterized in that: the heat-conducting device comprises a frequency doubling crystal (9), wherein a heat-conducting block (8) is fixedly connected to the bottom of the frequency doubling crystal (9), a plurality of groups of honeycomb heat sink assemblies are fixedly arranged at the bottom of the heat-conducting block (8), semiconductor refrigerating sheets (4) are fixedly arranged in the middle of each group of honeycomb heat sink assemblies, a passage is formed in the honeycomb heat sink, and two ends of the passage form a closed circuit through a pipeline and are internally communicated with water.
2. A honeycomb structure temperature control apparatus according to claim 1, wherein: the honeycomb heat sink assembly comprises a first honeycomb heat sink (3) and a second honeycomb heat sink (10), two sides of the semiconductor refrigerating sheet (4) are a radiating surface and a working surface respectively, the side part of the first honeycomb heat sink (3) is fixedly connected with the working surface of the semiconductor refrigerating sheet (4), the second honeycomb heat sink (10) is fixedly connected with the radiating surface of the semiconductor refrigerating sheet (4), and the passage is formed in the first honeycomb heat sink (3) and the second honeycomb heat sink (10).
3. A honeycomb structure temperature control apparatus according to claim 2, wherein: the side surface area of the first honeycomb heat sink (3) and the side surface area of the second honeycomb heat sink (10) are the same as the side surface area of the semiconductor refrigerating sheet (4).
4. A honeycomb structure temperature control apparatus according to claim 3, wherein: v-shaped grooves are formed in the side parts of the first honeycomb heat sinks (3), two V-shaped grooves form a prismatic shape, the heat conducting blocks (8) are arranged in the V-shaped grooves of the two first honeycomb heat sinks (3) in different groups, and the area of each heat conducting block (8) is larger than that of the frequency doubling crystal (9).
5. A honeycomb structure temperature control apparatus according to claim 2, wherein: the inner walls of the first honeycomb heat sink (3) and the second honeycomb heat sink (10) are fixedly provided with temperature sensors (7), the temperature sensors (7) are electrically connected with a controller (6), and the controller (6) is electrically connected with an electromagnetic water valve (5).
6. The honeycomb structure temperature control device according to claim 5, wherein: the electromagnetic water valve (5) is arranged on pipelines at two ends of the honeycomb heat sink, and the pipeline is fixedly provided with a water pump.
7. The honeycomb structure temperature control device according to claim 6, wherein: the semiconductor refrigerating device is characterized in that one ends of the first honeycomb heat sink (3) and the second honeycomb heat sink (10) are fixedly connected with a water circulation inlet seat (2), the other ends of the first honeycomb heat sink (3) and the second honeycomb heat sink (10) are fixedly connected with a water circulation fixing seat (1), and the semiconductor refrigerating sheet (4) is fixedly arranged between the water circulation fixing seat (1) and the water circulation inlet seat (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322251761.1U CN220797408U (en) | 2023-08-22 | 2023-08-22 | Honeycomb structure temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322251761.1U CN220797408U (en) | 2023-08-22 | 2023-08-22 | Honeycomb structure temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220797408U true CN220797408U (en) | 2024-04-16 |
Family
ID=90664203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322251761.1U Active CN220797408U (en) | 2023-08-22 | 2023-08-22 | Honeycomb structure temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220797408U (en) |
-
2023
- 2023-08-22 CN CN202322251761.1U patent/CN220797408U/en active Active
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| GR01 | Patent grant |