CN220776363U - Heat radiation structure of multi-heat source system - Google Patents
Heat radiation structure of multi-heat source system Download PDFInfo
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- CN220776363U CN220776363U CN202322404077.2U CN202322404077U CN220776363U CN 220776363 U CN220776363 U CN 220776363U CN 202322404077 U CN202322404077 U CN 202322404077U CN 220776363 U CN220776363 U CN 220776363U
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- heat
- fan
- heat source
- heat dissipation
- substrate
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- 230000005855 radiation Effects 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation structure of a multi-heat source system, which comprises a main board and a heat radiation module covered on the main board; the main board comprises a first heat source and a second heat source; the heat radiation module comprises a heat radiation substrate, heat radiation fins, a heat pipe and a fan; the first heat source is attached to the back surface of the heat dissipation substrate, one end of the heat pipe is connected with the first heat source, and the other end of the heat pipe is connected with the heat dissipation fins; the heat dissipation substrate is provided with a vent hole aligned with the second heat source, the fan is fixed on the front surface of the heat dissipation substrate, the heat dissipation substrate is used as an upper cover plate of the fan at the same time, the air inlet end of the fan is aligned with the vent hole, and the air outlet end of the fan is aligned with the heat dissipation fins. According to the utility model, the heat exchange is carried out by contacting the heat radiating substrate with the main board, the convection heat exchange is carried out by fully utilizing the air inlet flow of the fan and the air flow in the fan, the main board and the heat radiating substrate, and the heat radiating efficiency of the multi-heat source system is improved.
Description
Technical Field
The utility model relates to the technical field of electronic game equipment, in particular to a heat dissipation structure of a multi-heat source system.
Background
With the development of the era, handheld electronic game devices (such as portable game machines) have greatly advanced in aspects of game plots, image quality, music and the like, and bring better game experience to wide players. However, the game devices have the advantages that the functions of hardware are rich and perfect, the power consumption of the whole game device is higher and higher, the integrated functions of the game device are more and scattered, and the heat dissipation becomes a troublesome problem of the game device due to the fact that the space of the whole game device is limited.
Disclosure of Invention
The present utility model is directed to a heat dissipation structure of a multi-heat source system, so as to solve the above-mentioned problems in the prior art. In order to achieve the above purpose, the present utility model provides the following technical solutions:
a heat dissipation structure of a multi-heat source system comprises a main board and a heat dissipation module covered on the main board; the main board comprises a first heat source and a second heat source; the heat radiation module comprises a heat radiation substrate, heat radiation fins, a heat pipe and a fan; the first heat source is attached to the back surface of the heat dissipation substrate, one end of the heat pipe is connected with the first heat source, and the other end of the heat pipe is connected with the heat dissipation fins; the heat dissipation substrate is provided with a vent hole aligned with the second heat source, the fan is fixed on the front surface of the heat dissipation substrate, the air inlet end of the fan is aligned with the vent hole, and the air outlet end of the fan is aligned with the heat dissipation fins.
Further, one end of the heat pipe is connected to the front side of the substrate corresponding to the first heat source.
Further, a boss structure for being attached to the first heat source is arranged on the back surface of the heat dissipation substrate.
Further, a heat-conducting filling medium is arranged between the main board and the heat-radiating substrate.
Further, a sealing band is arranged between the radiating fins and the fan.
The utility model has the beneficial effects that: according to the utility model, the heat exchange is carried out by contacting the heat radiating substrate with the main board, the convection heat exchange is carried out by fully utilizing the air inlet flow of the fan and the air flow in the fan, the main board and the heat radiating substrate, and the heat radiating efficiency of the multi-heat source system is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic exploded view of the present utility model.
Fig. 3 is an exploded view of a heat dissipating module according to the present utility model.
Fig. 4 is a schematic structural diagram of a heat dissipation module according to the present utility model.
It should be noted that the drawings are not necessarily to scale, but are merely shown in a schematic manner that does not affect the reader's understanding.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present utility model will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.
It is also to be understood that the terminology used in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As shown in fig. 1 to 4, a heat dissipation structure of a multi-heat source system includes a main board 1 and a heat dissipation module 2 covering the main board 1; the main board 1 includes a first heat source 11 and a second heat source 12; the heat dissipation module 2 comprises a heat dissipation substrate 21, heat dissipation fins 22, a heat pipe 23 and a fan 24; the first heat source 11 is attached to the back surface of the heat dissipation substrate 21, one end of the heat pipe 23 is connected with the first heat source 11, and the other end is connected with the heat dissipation fins 22; the heat dissipation substrate 21 is provided with a vent 201 aligned with the second heat source 12, the fan 24 is fixed on the front surface of the heat dissipation substrate 21, the heat dissipation substrate 21 is used as an upper cover plate of the fan 24, the air inlet end of the fan 24 is aligned with the vent 201, and the air outlet end is aligned with the heat dissipation fins 22.
In this embodiment, heat generated by the first heat source 11 on the motherboard 1 is conducted to the heat dissipation fins 22 through the heat dissipation substrate 21 and the heat pipe 23 in sequence, and finally, the heat on the heat dissipation fins 22 is carried out of the system through the strong convection effect of the air flow at the air outlet end of the fan 24; a part of the heat of the second heat source 12 is also transferred to the heat-dissipating substrate 21 and is taken away by the combined action of the heat pipe 23, the heat-dissipating fins 22 and the fan 24; meanwhile, the second heat source 12 positioned at the vent 201 also performs convection heat exchange with the air flow at the air inlet end of the fan 24 so as to take away most of the heat of the second heat source 12; in addition, the front surface of the heat dissipation substrate 21 also exchanges heat with the turbulent flow inside the fan 24 again, thereby taking away heat and further improving the heat exchange efficiency of the heat dissipation module 2. According to the utility model, the heat exchange is carried out by contacting the heat radiating substrate with the main board, the convection heat exchange is carried out by fully utilizing the air inlet flow of the fan and the air flow in the fan, the main board and the heat radiating substrate, and the heat radiating efficiency of the multi-heat source system is improved.
Further, one end of the heat pipe 23 is connected to the front side of the substrate corresponding to the position of the first heat source 11. Heat from the first heat source 11 is rapidly transferred to the heat radiating fins 22.
Further, a boss structure 211 for bonding with the first heat source 11 is provided on the back surface of the heat dissipation substrate 21. The boss structure is copper material, is convenient for carry out heat transfer with first heat source 11.
Further, a heat-conductive filling medium is provided between the motherboard 1 and the heat dissipation substrate 21.
Further, a sealing tape 25 is provided between the radiator fins 22 and the fan 24. Specifically, the sealing tape 25 is an acetate tape, and seals the gap between the fan 24 and the heat radiation fins 22.
It should also be noted that, in the embodiments of the present utility model, the features of the embodiments of the present utility model and the features of the embodiments of the present utility model may be combined with each other to obtain new embodiments without conflict.
The above description is only of the preferred embodiments of the present utility model, and is not intended to limit the scope of the present utility model as defined in the claims. Although the present utility model has been described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications can be made without departing from the scope of the utility model, and it is intended to cover all such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.
Claims (5)
1. A heat dissipation structure of a multiple heat source system, characterized in that: the heat dissipation device comprises a main board and a heat dissipation module covered on the main board; the main board comprises a first heat source and a second heat source; the heat radiation module comprises a heat radiation substrate, heat radiation fins, a heat pipe and a fan; the first heat source is attached to the back surface of the heat dissipation substrate, one end of the heat pipe is connected with the first heat source, and the other end of the heat pipe is connected with the heat dissipation fins; the heat dissipation substrate is provided with a vent hole aligned with the second heat source, the fan is fixed on the front surface of the heat dissipation substrate, the air inlet end of the fan is aligned with the vent hole, and the air outlet end of the fan is aligned with the heat dissipation fins.
2. The heat dissipating structure of the multiple heat source system according to claim 1, wherein: one end of the heat pipe is connected to one side of the front surface of the substrate corresponding to the first heat source.
3. The heat dissipating structure of the multiple heat source system according to claim 1, wherein: the back of the heat dissipation substrate is provided with a boss structure which is used for being attached to the first heat source.
4. The heat dissipating structure of the multiple heat source system according to claim 1, wherein: and a heat conduction filling medium is arranged between the main board and the heat dissipation substrate.
5. The heat dissipating structure of the multiple heat source system according to claim 1, wherein: and a sealing belt is arranged between the radiating fins and the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322404077.2U CN220776363U (en) | 2023-09-05 | 2023-09-05 | Heat radiation structure of multi-heat source system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322404077.2U CN220776363U (en) | 2023-09-05 | 2023-09-05 | Heat radiation structure of multi-heat source system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220776363U true CN220776363U (en) | 2024-04-12 |
Family
ID=90598872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322404077.2U Active CN220776363U (en) | 2023-09-05 | 2023-09-05 | Heat radiation structure of multi-heat source system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220776363U (en) |
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2023
- 2023-09-05 CN CN202322404077.2U patent/CN220776363U/en active Active
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