CN220774347U - 一种集成电路芯片封装结构 - Google Patents
一种集成电路芯片封装结构 Download PDFInfo
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- CN220774347U CN220774347U CN202322093668.2U CN202322093668U CN220774347U CN 220774347 U CN220774347 U CN 220774347U CN 202322093668 U CN202322093668 U CN 202322093668U CN 220774347 U CN220774347 U CN 220774347U
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- heat
- conducting plate
- plate
- integrated circuit
- heat conducting
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000000741 silica gel Substances 0.000 claims abstract description 14
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 7
- 230000005855 radiation Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322093668.2U CN220774347U (zh) | 2023-08-05 | 2023-08-05 | 一种集成电路芯片封装结构 |
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CN202322093668.2U CN220774347U (zh) | 2023-08-05 | 2023-08-05 | 一种集成电路芯片封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN220774347U true CN220774347U (zh) | 2024-04-12 |
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CN202322093668.2U Active CN220774347U (zh) | 2023-08-05 | 2023-08-05 | 一种集成电路芯片封装结构 |
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CN (1) | CN220774347U (zh) |
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2023
- 2023-08-05 CN CN202322093668.2U patent/CN220774347U/zh active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240703 Address after: No. 20, Third Street, Karatumusuke Village, Gilgelang Township, Gongliu County, Ili Kazakh Autonomous Prefecture, Xinjiang Uygur Autonomous Region 835400 Patentee after: Chen Gaiying Country or region after: China Address before: 230000 C5, Binhu Times Square, Baohe District, Hefei City, Anhui Province, China Patentee before: Hefei Tian Shangyuan Information Technology Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |
Effective date of registration: 20240715 Address after: No. 119, 1st Floor, Building 26, No. 113 Yingayati Street, Yining City, Ili Kazakh Autonomous Prefecture, Xinjiang Uygur Autonomous Region 835100 Patentee after: Yili Tianen Technology Development Co.,Ltd. Country or region after: China Address before: No. 20, Third Street, Karatumusuke Village, Gilgelang Township, Gongliu County, Ili Kazakh Autonomous Prefecture, Xinjiang Uygur Autonomous Region 835400 Patentee before: Chen Gaiying Country or region before: China |