CN220773537U - Computing device - Google Patents

Abstract

The application discloses a computing device, comprising: a heat sink; the main board is provided with a first board surface and a second board surface which are oppositely arranged, and the first board surface of the main board faces the top surface of the radiator and has a distance from the top surface of the radiator; the processor is arranged on the first plate surface of the main plate and is in contact with the radiator for heat transfer; the first electric device is arranged on the second plate surface of the main plate; and a heat transfer member connected between the first electric device and the heat sink and transferring heat of the first electric device to the heat sink. The computing device provided by the application has the advantage of balancing the heat dissipation effect of each electric device of the computing device.

Description

Computing device

Technical Field

The embodiment of the application relates to the technical field of heat dissipation of computing equipment, in particular to a computing device.

Background

With the current large data, cloud computing, artificial intelligence demands and product update iteration, the power consumption of heating elements in computing equipment is higher and higher, and the heat generated by the heating elements is higher and higher. The cooling effect of the heating element will directly affect the performance of the computing device.

A related computing device includes a housing, a CPU (Central Processing Unit ), a memory bank, a solid state disk, and other electrical devices disposed in an interior cavity of the housing. In this case, since the heat generation amount of the CPU is much higher than that of the other electric devices, the CPU is closer to the heat transfer medium than the other electric devices for rapid cooling of the CPU.

However, the above-described method may result in poor heat dissipation effect of the electronic device having a heat generation amount inferior to that of the CPU, such as the memory bank and the solid state disk.

Disclosure of Invention

An object of the embodiment of the present application is to provide a computing device, which can solve the problem that devices such as a memory bank and a solid state disk, which generate heat less than a CPU, have poor heat dissipation effect.

To achieve the above object, an aspect of embodiments of the present application provides a computing device, including:

a heat sink;

the main board is provided with a first board surface and a second board surface which are oppositely arranged, and the first board surface of the main board faces the top surface of the radiator and has a distance from the top surface of the radiator;

the processor is arranged on the first plate surface of the main plate and is in contact with the radiator for heat transfer;

the first electric device is arranged on the second plate surface of the main plate;

and a heat transfer member connected between the first electric device and the heat sink and transferring heat of the first electric device to the heat sink. .

Optionally, at least part of the top surface of the heat spreader is exposed from the through hole of the motherboard or at least one side of the motherboard;

the heat transfer member is connected to the exposed top surface of the heat sink.

Optionally, the heat transfer element is covered on a second board surface of the main board, and a second space for accommodating the first electric device is formed between the heat transfer element and the second board surface of the main board, and the second space is provided with an opening for the first electric device to pass through;

the first electrical device is in contact with the heat transfer element for transferring heat.

Optionally, the second board surface of the main board is provided with a first connector, the first connector is disposed in the second space, and one side of the first connector facing the opening is in plug-in electrical connection with the first electrical device.

Optionally, the computing device further comprises a first thermal pad disposed between the heat transfer element and the first electrical device.

Optionally, the computing device further includes a second electrical device disposed on a side of the heat transfer element facing away from the second space, and the second electrical device is in contact with the heat transfer element for heat transfer.

Optionally, the main board is provided with a second connector, and the second connector is located outside the second space;

the heat transfer element is provided with a groove, and the groove is provided with a first notch and a second notch which are oppositely arranged;

the second electrical device slides into the recess from the first slot and slides out of the recess from the second slot and is electrically connected to the second connection plug.

Optionally, the computing device further comprises a second thermal pad disposed between the second electrical device and the heat transfer element.

Optionally, the computing device further includes a housing, where the housing covers the top surface of the heat sink and forms a first space with the top surface of the heat sink;

the motherboard, the processor, the first electrical device and the second electrical device are disposed in the first space, and the second electrical device is in contact with the housing for heat transfer.

Optionally, the computing device further comprises a third thermal pad disposed between the second electrical component and an inner shell wall of the housing.

In summary, the computing device provided in the embodiment of the present application, through setting the processor and the first electrical device on two sides of the motherboard respectively, and through contacting the processor with the top surface of the radiator to cool the processor, and connect the first electrical device with the radiator through the heat transfer element, so as to transfer the heat of the first electrical device to the radiator. Therefore, the processor and the first electric device can transfer heat to the radiator, and the radiator has the advantage of balancing the heat dissipation effect of each electric device of the computing device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a longitudinal cross-sectional view of a computing device provided in an embodiment of the present application;

FIG. 2 is a partial exploded view of the computing device shown in FIG. 1;

FIG. 3 is an exploded view of the computing device shown in FIG. 1.

Reference numerals illustrate:

100. a heat sink; 110. a plate body; 120. a fin;

200. a main board;

300. a processor;

410. a first electrical device; 420. a second electrical device;

500. a heat transfer member; 510. a first portion; 511. a groove; 520. a second portion;

610. a first thermal pad; 620. a second thermal pad; 630. a third thermal pad;

710. a first connector; 720. a second connector;

800. a housing; 810. a sidewall; 820. a top wall;

910. a first space; 920. and a second space.

Detailed Description

As described in the background art, the computing device in the related art has a problem that the heat dissipation effect of the electronic device such as the memory bank, the solid state disk, and the like, which generates heat less than that of the CPU, is poor. The inventors have found that the cause of this problem is:

most computing devices are cooled by air or liquid cooling. In the air cooling process, the CPU is placed at a position in the case, which is closer to the air inlet, so that air is blown to the CPU and then to other devices (such as a memory bank, a solid state disk and the like); in liquid cooling, a flowing heat transfer medium (such as a refrigerant and the like) exchanges heat with the CPU by virtue of a pipeline or exchanges heat with the CPU in a spraying mode, and then exchanges heat with a memory bank or a solid state disk. When the CPU is hot, the temperature of the heat transfer medium flowing to other devices is high, which is unfavorable for heat dissipation of other devices.

To the above technical problem, the embodiment of the application provides a computing device, which is configured to cool a processor by respectively arranging the processor and a first electric device on two sides of a motherboard and directly contacting the processor with a radiator, and indirectly cool the first electric device by connecting the first electric device with the radiator through a heat transfer element. Therefore, the processor and the first electric device can transfer heat to the radiator, and the radiator has the advantage of balancing the heat dissipation effect of each electric device of the computing device.

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments.

All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure. The following embodiments and features of the embodiments may be combined with each other without conflict.

Fig. 1 is a longitudinal cross-sectional view of a computing device provided in an embodiment of the present application. Referring to fig. 1, a computing device provided in an embodiment of the present application may include a motherboard 200, a processor 300, and a first electrical device 410. The first electrical device 410 and the processor 300 may be disposed on the motherboard 200. The first electrical device 410 may be a memory bank, a network card, a solid state disk, etc., however, the first electrical device 410 may also be another processor.

In addition, the computing device may also include a heat sink 100. Referring to fig. 2 and 3, the heat sink 100 may include a plate 110, the plate 110 may have a top surface and a bottom surface opposite to each other, the top surface of the plate 110 may be in contact with an electrical device for heat transfer, and the bottom surface of the plate 110 may be through which a heat transfer medium may flow for heat removal. Wherein the heat transfer medium may be one of the following: gaseous working medium such as air, single-phase liquid working medium such as water, and two-phase working medium such as refrigerant. In order to improve the heat dissipation effect of the heat sink 100, the heat sink 100 may further include fins 120, and the fins 120 may be connected to the bottom surface of the plate body 110. The fins 120 may be plural, and the plural fins 120 may be disposed at intervals.

Referring to fig. 1, the motherboard 200 may have a first board surface and a second board surface disposed opposite to each other. The first board surface of the motherboard 200 may face the top surface of the heat sink 100, and a space may be provided between the first board surface and the top surface of the heat sink 100.

There are various ways of implementing the spaced arrangement of the motherboard 200 and the top surface of the heat sink 100. For example, the top surface of the heat sink 100 is connected with a stud, the main board 200 is provided with a through hole penetrating through the main board 200, and a fastener such as a bolt can be inserted through the through hole and connected with the stud in a threaded manner. The foregoing embodiments are merely illustrative, and are not particularly limited.

With continued reference to fig. 1, the processor 300 may be disposed on a first board surface of the motherboard 200 and in thermal contact with the heat sink 100. The first electrical device 410 (such as a memory bank, a network card, a solid state disk, etc.) needs to be in a larger space for easy disassembly by a user due to replacement according to the user's requirement. Because of the low height of the processor 300, if the first electrical device 410 is disposed between the first board surface of the motherboard 200 and the top surface of the heat sink 100, the user can only replace the first electrical device 410 by removing the motherboard 200. To facilitate user disassembly, the first electrical device 410 may be disposed on the second board surface of the motherboard 200. In addition, in order to achieve heat dissipation of the first electric device 410, the computing apparatus provided in the embodiments of the present application may further include a heat transfer member 500, the heat transfer member 500 may be connected between the first electric device 410 and the heat sink 100, and the heat transfer member 500 may conduct heat of the first electric device 410 to the heat sink 100. In this way, both the processor 300 and the first electrical device 410 can transfer heat to the heat sink 100, which has the advantage of balancing the heat dissipation effect of the various electrical devices of the computing device.

Since the first electric device 410 is separated from the heat sink 100 at both sides of the main board 200, at least a portion of the top surface of the heat sink 100 is exposed in order to connect both through the heat transfer member 500, and the heat transfer member 500 may be connected to the exposed top surface of the heat sink 100. For example, the main board 200 may be provided with a through hole through which the heat transfer member 500 passes, and the top surface of the heat sink 100 may be exposed. As another example, referring to fig. 1, 2, and 3, the main board 200 may be shorter than the top surface of the heat sink 100, in other words, the main board 200 has a space accommodating the heat transfer member 500 between at least one side outer edge of the orthographic projection of the top surface of the heat sink 100 and a corresponding side outer edge of the top surface of the heat sink 100. In this manner, at least a portion of the top surface of the heat spreader 100 is exposed from at least one side of the motherboard 200. In addition, referring to fig. 2, the top surface of the heat sink 100 and the heat transfer member 500 may be detachably coupled by a fastener such as a bolt.

With continued reference to fig. 1, the heat transfer element 500 is in contact with the first electrical device 410 for heat transfer. The heat transfer element 500 may be covered on the second plate surface of the main board 200, and a second space 920 may be formed between the heat transfer element 500 and the second plate surface of the main board 200. The second space 920 may be used to accommodate the first electric device 410, and the second space 920 may have an opening through which the first electric device 410 is inserted for the purpose of assembling and disassembling the first electric device 410.

Specifically, the second board surface of the main board 200 is provided with a first connector 710, and one side of the first connector 710 facing the opening is electrically connected to the first electrical device 410 in a plugging manner. For example, in fig. 1, the heat transfer member 500 may be L-shaped. Specifically, the heat transfer member 500 may include a first portion 510 and a second portion 520, the first portion 510 may extend in a left-right direction, and the first portion 510 may be in contact with a top surface of the first electrical device 410 to transfer heat. The second portion 520 may be connected to the first portion 510, and the second portion 520 may be positioned at the left side of the main board 200, and may extend up and down to the top surface of the heat sink 100 and be connected to the top surface of the heat sink 100. As such, the right side of the second space 920 formed between the heat transfer member 500 and the second plate surface of the main plate 200 has an opening. The first connector 710 is disposed in the second space 920, and a right side of the first connector 710 is electrically connected with the first electrical device 410 by plugging.

In order to prevent dust, water, etc. from contaminating the electrical components of the computing device, referring to fig. 1, the computing device may further include a housing 800, the housing 800 may be covered on the top surface of the heat sink 100, and a first space 910 may be formed between the housing 800 and the top surface of the heat sink 100. The main board 200, the processor 300, the first electric device 410, and the second electric device 420 are disposed in the first space 910.

Alternatively, at least a portion of the heat transfer member 500 may extend in a direction intersecting the second plate surface of the main board 200 and may be connected to the side wall 810 of the case 800 so as to radiate heat outward through the side wall 810 of the case 800. For example, in FIG. 1, the second portion 520 is in thermal contact with the left side wall 810 of the housing 800 and may be removably coupled by fasteners such as bolts.

Optionally, in order to improve the heat transfer efficiency, the heat transfer apparatus provided in the embodiments of the present application may further include a first heat conductive pad 610, and the first heat conductive pad 610 may be disposed between the heat transfer member 500 and the first electric device 410. Further, the first thermal pad 610 may be made of a thermal conductive material having a certain buffering force, such as thermal conductive silica gel, thermal conductive silicone grease, thermal conductive glue, thermal conductive gel, etc., so as to avoid the heat transfer element 500 and the first electrical device 410 from colliding with each other during assembly.

Alternatively, the first electric devices 410 may be plural (two or more), each of the first electric devices 410 may be disposed in the second space 920 formed by the heat transfer member 500 and the main board 200, and a side of the first electric devices 410 facing away from the main board 200 may contact the heat transfer member 500 to transfer heat. The plurality of first electrical devices 410 may be disposed at intervals, and the arrangement of the positions of the plurality of first electrical devices 410 is not particularly limited, and only needs to be convenient for a user to plug.

How the heat transfer member 500 is used to dissipate heat from the second electrical device 420 is described below.

Referring to fig. 1, a second electric device 420 may be disposed at a side of the first heat transfer member 500 facing away from the second space 920, and the second electric device 420 may transfer heat in contact with the heat transfer member 500. In this way, in addition to the heat dissipation of the second electric device 420, because the first electric device 410 and the second electric device 420 transfer heat with the heat transfer element 500 at the same time, the electric device with higher heat productivity can transfer part of heat to the electric device with lower heat productivity, so as to further improve the heat dissipation effect. In fig. 1, the second electric device 420 is shown as being disposed on a side (upper side) of the heat transfer member 500 away from the motherboard 200, and the contact heat transfer surface of the second electric device 420 and the heat transfer member 500 is parallel to the second board surface, however, the second electric device 420 may also be disposed on a side (left side, right side, etc.) of the heat transfer member 500, and the contact heat transfer surface of the second electric device 420 and the heat transfer member 500 may intersect with the second board surface of the motherboard 200.

Referring to fig. 1, the main board 200 may be optionally further provided with a second connector 720, and the second connector 720 may be located outside the second space 920. Referring to fig. 3, the heat transfer member 500 may be provided with a groove 511, and the groove 511 may have a first notch and a second notch disposed opposite to each other. The second electrical device 420 can slide from the first slot into the recess 511 and can slide from the second slot out of the recess 511 and can be plugged into an electrical connection with a second connection. In this manner, the recess 511 defines the direction of movement of the second electrical device 420, facilitating a plug-in mating of the second electrical device 420 with the second connector 720. In addition, the groove 511 and the second electric device 420 may be detachably connected by a clamping connection, a fastening connection, or the like, so as to facilitate the fixing of the second electric device 420.

To facilitate heat transfer between the heat transfer element 500 and the second electrical device 420, referring to fig. 1, the computing device may optionally further comprise a second thermal pad 620, which second thermal pad 620 may be disposed between the second electrical device 420 and the first portion 510. Further, the second thermal pad 620 may be made of a thermal conductive material with a certain buffering force, such as thermal conductive silica gel, thermal conductive silicone grease, thermal conductive glue, thermal conductive gel, etc., so as to avoid the heat transfer element 500 and the second electrical device 420 from colliding with each other during assembly.

Alternatively, the second electric devices 420 may be plural (two or more), each of the plural second electric devices 420 may be disposed at a side of the heat transfer member 500 facing away from the second space 920, and each of the plural second electric devices 420 may be in contact with the heat transfer member 500 to transfer heat. The plurality of second electrical devices 420 may be disposed at intervals, and the arrangement of the positions of the plurality of second electrical devices 420 is not particularly limited, and only needs to be satisfied for convenient insertion and extraction by a user.

With continued reference to fig. 1, optionally, a second electrical device 420 may also be disposed in a first space 910 formed by the housing 800 and the top surface of the heat sink 100. In order to improve the heat dissipation effect, the second electric device 420 may also dissipate heat in contact with the case 800. For example, in fig. 1, the bottom surface of the second electrical device 420 is in heat transfer contact with the heat transfer element 500, and the top surface of the second electrical device 420 is in heat transfer contact with the top wall 820 of the housing 800.

Further, a third thermal pad 630 may be disposed between the second electrical device 420 and the inner housing wall of the housing 800. The third thermal pad 630 may be made of a thermal conductive material with a certain buffering force, such as thermal conductive silica gel, thermal conductive silicone grease, thermal conductive glue, thermal conductive gel, etc., so as to avoid the collision between the housing 800 and the second electrical device 420 during assembly.

Alternatively, the first electrical device 410 may be a memory bank, and the second electrical device 420 may be a solid state disk.

In summary, the computing device provided in the embodiments of the present application provides for cooling the processor 300 by disposing the processor 300 and the first electric device 410 on both sides of the motherboard 200, respectively, and by contacting the processor 300 with the top surface of the heat sink 100, and connecting the first electric device 410 with the heat sink 100 through the heat transfer member 500, so as to transfer the heat of the first electric device 410 to the heat sink 100. In this way, both the processor 300 and the first electrical device 410 can transfer heat to the heat sink 100, which has the advantage of balancing the heat dissipation effect of the various electrical devices of the computing device.

The assembly sequence of the computing device provided by the embodiment of the application:

the first electrical device 410 is inserted into the first connector 710 of the motherboard 200, and then the first thermal pad 610 is overlaid on the first electrical device 410.

Then, the second electric device 420 is assembled, and the second heat conducting pad 620 is attached between the second electric device 420 and the heat transfer member 500, so that heat of the second electric device 420 can be better conducted to the heat transfer member 500, and a buffering effect can be achieved. The second electric device 420 is locked to the heat transfer member 500 with a fastener such as a bolt or a screw, and then the wire of the second electric device 420 is inserted.

After the second electric device 420 is assembled, the second electric device is assembled on the radiator 100; the assembled heat transfer member 500 is flattened against the first thermal pad 610, and heat of the first electrical device 410 can be transferred to the heat transfer member 500. The heat transfer member 500 is fastened to the heat sink 100 by using a fastening member such as a bolt or a screw, so that the heat transfer member 500 is tightly attached to the heat sink 100, thereby better conducting the internal heat in the case 800 to the outside of the case 800.

Finally, the third heat conduction pad 630 is attached above the second electric device 420, and then the top wall 820 of the shell 800 is assembled to the radiator 100 from above; the third thermal pad 630 may conduct heat of the second electrical device 420 to the outer housing 800, thereby further conducting heat out of the interior cavity of the housing 800.

The terms "upper" and "lower" are used to describe the relative positional relationship of the respective structures in the drawings, and are merely for convenience of description, not to limit the scope of the application, and the relative relationship changes or modifications are considered to be within the scope of the application without any substantial change in technical content.

It should be noted that: in this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Furthermore, in the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A computing device, comprising:

a heat sink;

the main board is provided with a first board surface and a second board surface which are oppositely arranged, and the first board surface of the main board faces the top surface of the radiator and has a distance from the top surface of the radiator;

the processor is arranged on the first plate surface of the main plate and is in contact with the radiator for heat transfer;

the first electric device is arranged on the second plate surface of the main plate;

and a heat transfer member connected between the first electric device and the heat sink and transferring heat of the first electric device to the heat sink.

2. The computing device of claim 1, wherein at least a portion of a top surface of the heat spreader is exposed from a through-hole of the motherboard or at least one side of the motherboard;

the heat transfer member is connected to the exposed top surface of the heat sink.

3. The computing device of claim 2, wherein the heat transfer element is covered on a second board surface of the main board, and a second space for accommodating the first electric device is formed between the heat transfer element and the second board surface of the main board, and the second space has an opening through which the first electric device passes;

the first electrical device is in contact with the heat transfer element for transferring heat.

4. A computing device according to claim 3, wherein the second panel of the motherboard is provided with a first connector disposed in the second space, and wherein a side of the first connector facing the opening is electrically connected with the first electrical device in a plugging manner.

5. The computing device of claim 3, further comprising a first thermal pad disposed between the heat transfer element and the first electrical device.

6. The computing device of any of claims 3-5, further comprising a second electrical device disposed on a side of the heat transfer element facing away from the second space, the second electrical device in contact with the heat transfer element to transfer heat.

7. The computing device of claim 6, wherein the motherboard is provided with a second connector, the second connector being located outside of the second space;

the heat transfer element is provided with a groove, and the groove is provided with a first notch and a second notch which are oppositely arranged;

the second electrical device slides into the recess from the first slot and slides out of the recess from the second slot and is electrically connected to the second connection plug.

8. The computing device of claim 6, further comprising a second thermal pad disposed between the second electrical device and the heat transfer element.

9. The computing device of claim 6, further comprising a housing covering the top surface of the heat sink and forming a first space with the top surface of the heat sink;

the motherboard, the processor, the first electrical device and the second electrical device are disposed in the first space, and the second electrical device is in contact with the housing for heat transfer.

10. The computing device of claim 9, further comprising a third thermal pad disposed between the second electrical component and an inner shell wall of the housing.