CN220755336U - CT frame inside heat sink - Google Patents
CT frame inside heat sink Download PDFInfo
- Publication number
- CN220755336U CN220755336U CN202322300883.5U CN202322300883U CN220755336U CN 220755336 U CN220755336 U CN 220755336U CN 202322300883 U CN202322300883 U CN 202322300883U CN 220755336 U CN220755336 U CN 220755336U
- Authority
- CN
- China
- Prior art keywords
- air inlet
- heat dissipation
- cooling
- heat
- frame body
- Prior art date
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- 238000001816 cooling Methods 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 13
- 239000010935 stainless steel Substances 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 47
- 238000005057 refrigeration Methods 0.000 claims description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000002591 computed tomography Methods 0.000 description 32
- 230000000694 effects Effects 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a cooling device in a CT frame, which comprises a CT frame body, an exhaust net, a cooling box, an air inlet, a semiconductor refrigerating sheet, a heat radiation component, an air inlet pipe and an air inlet component, wherein the exhaust net is fixedly arranged on one side of the CT frame body, the other side of the CT frame body is communicated with the exhaust net, one side of the cooling box is communicated with the air inlet, the semiconductor refrigerating sheet works to cause a heating surface of the semiconductor refrigerating sheet to generate heat, a heat radiating fin plate can absorb heat, so that the contact area with air is increased, the heat radiation is enhanced, the heat on the surface of the heat radiating fin plate is blown away through the work of a heat radiation fan, a centrifugal fan is started to suck cool air generated by the semiconductor refrigerating sheet in the cooling box into the CT1 frame, the cool air is penetrated into the CT1 frame for circulation, the cooling is realized, the dustproof protective net is communicated with the air inlet, and the dustproof protective net is arranged as a stainless steel net, so that dust is reduced into the cooling box, and meanwhile the service life of the stainless steel net is prolonged.
Description
Technical Field
The utility model relates to the technical field of CT frame body equipment, in particular to a cooling device in a CT frame.
Background
CT, namely the computerized tomography, it utilizes accurate collimated X-ray beam, gamma ray, supersonic wave, etc., make one by one section scanning around some part of the human body together with the very high-sensitivity detector, it has characteristics such as the scanning time is fast, the picture is clear, can be used to the inspection of multiple diseases, for present CT apparatus, electrical components such as bulb, high-voltage generator, detector are installed on a rotatory bearing structure, wherein, high-power components such as bulb, high-voltage generator can produce a large amount of heat when working, and the detector performance is more sensitive to the temperature, lack the cooling effect to CT frame body, thus influence subsequent normal work.
A CT machine frame (application number: 202120627125.2) comprises a horizontally arranged bottom plate, two side plates vertically connected to opposite sides of the bottom plate and a reciprocating mechanism arranged on the ground and used for driving the bottom plate to reciprocate and linearly move, wherein the reciprocating mechanism comprises a reciprocating frame fixed on the ground, a screw rod horizontally rotatably connected to the reciprocating frame, a polish rod fixed on the reciprocating frame in parallel with the screw rod and a driving motor fixed on the reciprocating frame and used for driving the screw rod to rotate, and a connecting piece in threaded connection with the screw rod and a sliding piece in sliding connection with the polish rod are respectively arranged on the bottom plate. The CT scanning device has the effect of facilitating scanning and checking of severe patients by using the CT machine.
The above patent lacks cooling effect to CT frame body to influence subsequent normal work, consequently we need to provide a CT frame inside heat sink.
Disclosure of Invention
The utility model aims to provide a cooling device in a CT (computed tomography) frame, which is characterized in that a heating surface of a semiconductor refrigeration sheet is heated by working, a heat dissipation fin plate can absorb heat, so that the contact area with air is increased, the heat dissipation is enhanced, the heat on the surface of the heat dissipation fin plate is blown away by working of a heat dissipation fan, a centrifugal fan is started to suck cold air generated by the semiconductor refrigeration sheet in a cooling box into the CT1 frame, the cold air is penetrated into the CT1 frame for circulation, and the cooling is realized.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an inside heat sink of CT frame, includes CT frame body, exhaust net and cooler bin, one side fixed mounting of CT frame body has the cooler bin, the opposite side intercommunication of CT frame body has the exhaust net, still includes air inlet, semiconductor refrigeration piece, radiator unit, intake pipe, air inlet subassembly, one side intercommunication of cooler bin has the air inlet, just the inside of cooler bin is embedded to have the semiconductor refrigeration piece, the radiator unit who is used for the semiconductor refrigeration piece to generate heat the face cooling is installed to one side of semiconductor refrigeration piece, the top of cooler bin has the air inlet subassembly through the intake pipe intercommunication, just the air inlet subassembly with CT frame body is linked together, just the refrigeration face setting of semiconductor refrigeration piece is in the inside of cooler bin.
Preferably, the heat dissipation assembly comprises a heat dissipation fin plate and a heat dissipation fan, the heat dissipation fin plate is fixedly arranged on the heat generating surface of the semiconductor refrigerating sheet, and the heat dissipation fan is arranged on one side of the heat dissipation fin plate.
Preferably, the heat dissipation fin plate is an aluminum fin plate, and the heat dissipation fan and the heat dissipation fin plate are fixedly installed through four connecting columns.
Preferably, the air inlet assembly comprises a centrifugal fan and a connecting pipe body, the top of the air inlet pipe is communicated with the centrifugal fan, and the centrifugal fan is communicated with the cooling box through the connecting pipe body.
Preferably, the air inlet device further comprises a dustproof protective net communicated with the air inlet, and the dustproof protective net is a stainless steel net.
Preferably, the cooling box is arranged as an insulation box body, and fixing seats are fixedly arranged on two sides of the bottom of the CT frame body.
Preferably, the CT cooling device further comprises a support base, wherein the support base is fixedly arranged at the bottom of the cooling box, and one side of the support base is fixedly arranged on the surface of the CT frame body through bolts.
Compared with the prior art, the utility model has the beneficial effects that:
the semiconductor refrigerating sheet works to cause the heating surface of the semiconductor refrigerating sheet to generate heat, the heat radiating fin plate can absorb the heat, so that the contact area with the air is increased, the heat radiation property is enhanced, the heat on the surface of the heat radiating fin plate is blown away by the working of the heat radiating fan, the centrifugal fan is started to suck the cold air generated by the semiconductor refrigerating sheet in the cooling box into the CT1 rack, the cold air penetrates into the CT1 rack for circulation, the cooling is realized, the dustproof protective net communicated with the air inlet is included, and the dustproof protective net is arranged as the stainless steel net, so that the dust is reduced to enter the cooling box, and meanwhile, the service life of the stainless steel net is prolonged.
Drawings
FIG. 1 is a schematic perspective view of the structure of the present utility model;
FIG. 2 is a partial perspective cross-sectional view of the present utility model;
FIG. 3 is a perspective cross-sectional view of the cooling box of the present utility model;
FIG. 4 is an exploded perspective view of a heat dissipating assembly according to the present utility model;
fig. 5 is a perspective view of the structure of the present utility model.
In the figure: 1. a CT gantry body; 2. an exhaust screen; 3. a cooling box; 4. an air inlet; 5. a semiconductor refrigeration sheet; 6. a heat dissipation assembly; 61. a heat dissipation fin; 62. a heat radiation fan; 7. an air inlet pipe; 8. an air inlet assembly; 81. a centrifugal fan; 82. a connection pipe body; 9. a connecting column; 10. a dust-proof protective net; 11. a support base; 12. a fixing seat.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution: the utility model provides a CT frame inside heat sink, including CT frame body 1, exhaust net 2 and cooling tank 3, CT frame body 1's one side fixed mounting has cooling tank 3, CT frame body 1's opposite side intercommunication has exhaust net 2, still include air inlet 4, semiconductor refrigeration piece 5, radiator unit 6, intake pipe 7, air inlet unit 8, cooling tank 3's one side intercommunication has air inlet 4, and cooling tank 3's inside embeds semiconductor refrigeration piece 5, semiconductor refrigeration piece 5's one side is installed and is used for semiconductor refrigeration piece 5 to generate heat the cooling unit 6 of face cooling, cooling tank 3's top has air inlet unit 8 through intake pipe 7 intercommunication, and air inlet unit 8 is linked together with CT frame body 1, and semiconductor refrigeration piece 5's refrigeration face sets up in cooling tank 3's inside; the semiconductor refrigeration piece 5 works, the heating surface of the semiconductor refrigeration piece is caused to heat, the heat dissipation fin plate 61 can absorb heat, so that the contact area with air is increased, the heat dissipation is enhanced, heat on the surface of the heat dissipation fin plate 61 is blown away through the work of the heat dissipation fan 62, the centrifugal fan 81 is started to suck cold air generated by the semiconductor refrigeration piece 5 in the cooling box 3 into the CT1 rack, the cold air penetrates into the CT1 rack for internal circulation, cooling is achieved, the dustproof protection net 10 communicated with the air inlet 4 is included, the dustproof protection net 10 is arranged to be a stainless steel net, dust is reduced, the dust enters the cooling box 3, and meanwhile the stainless steel net is prolonged in service life.
The heat dissipation assembly 6 includes a heat dissipation fin plate 61 and a heat dissipation fan 62, the heat dissipation fin plate 61 is fixedly installed on the heat generating surface of the semiconductor refrigeration piece 5, the heat dissipation fan 62 is installed on one side of the heat dissipation fin plate 61, in this embodiment, the semiconductor refrigeration piece 5 works to cause the heat generating surface to generate heat, and the heat dissipation fin plate 61 can absorb heat, so that the contact area with air is increased, the heat dissipation is enhanced, and the heat on the surface of the heat dissipation fin plate 61 is blown away through the work of the heat dissipation fan 62.
The heat dissipation fin plate 61 is an aluminum fin plate, and the heat dissipation fan 62 and the heat dissipation fin plate 61 are fixedly installed through four connecting columns 9, it is to be noted that the heat dissipation fin plate 61 is an aluminum fin plate, and the heat dissipation fin plate 61 has a good heat transfer effect, and meanwhile, the heat dissipation fan 62 and the heat dissipation fin plate 61 are connected through the four connecting columns 9.
The air inlet assembly 8 comprises a centrifugal fan 81 and a connecting pipe 82, the top of the air inlet pipe 7 is communicated with the centrifugal fan 81, the centrifugal fan 81 is communicated with the cooling box 3 through the connecting pipe 82, and it is worth noting that the centrifugal fan 81 is started to suck cold air generated by the semiconductor refrigerating sheet 5 in the cooling box 3 into the CT1 rack, and the cold air is penetrated into the CT1 rack for internal circulation, so that cooling is realized.
Still including the intercommunication at the dustproof protection network 10 of air inlet 4, and dustproof protection network 10 sets up to stainless steel mesh, in this embodiment, including the dustproof protection network 10 of intercommunication at air inlet 4, and dustproof protection network 10 sets up to stainless steel mesh to reduce the dust and get into cooling tank 3 in, stainless steel mesh increase of service life simultaneously.
The cooling tank 3 sets up to the insulation can body, and the equal fixed mounting of both sides of CT frame body 1 bottom has fixing base 12, in this embodiment, the cooling tank 3 sets up to the insulation can body to reduce the loss of air conditioning, the equal fixed mounting of both sides of CT frame body 1 bottom has fixing base 12, and sets up fixing base 12 and supports CT frame body 1, and fixing base 12 sets up to the buffering seat.
Still include supporting base 11, supporting base 11 fixed mounting is in the bottom of cooler bin 3, and supporting base 11's one side passes through bolt fixed mounting at the surface of CT frame body 1, and it is to be noted that supporting base 11's one side passes through bolt fixed mounting at the surface of CT frame body 1, sets up supporting base 11 and supports cooler bin 3.
This device semiconductor refrigeration piece 5 work, lead to its face that generates heat, and heat dissipation fin 61 can adsorb the heat, thereby increase with air area of contact, strengthen the thermal diffusivity, and blow away heat on the heat dissipation fin 61 surface through radiator fan 62 work, start centrifugal fan 81 and inhale CT1 frame with the air conditioning that has the semiconductor refrigeration piece 5 to produce in the cooler bin 3, penetrate CT1 frame internal circulation with cold air, realize the cooling, including the dustproof protection network 10 of intercommunication at air inlet 4, and dustproof protection network 10 sets up to stainless steel mesh, thereby reduce the dust and get into in the cooler bin 3, stainless steel mesh increase of service life simultaneously.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a CT frame inside heat sink which characterized in that: including CT frame body (1), exhaust net (2) and cooling tank (3), one side fixed mounting of CT frame body (1) has cooling tank (3), the opposite side intercommunication of CT frame body (1) has exhaust net (2), still includes air inlet (4), semiconductor refrigeration piece (5), radiator unit (6), intake pipe (7), air inlet subassembly (8), one side intercommunication of cooling tank (3) has air inlet (4), just the inside of cooling tank (3) is embedded to have semiconductor refrigeration piece (5), radiator unit (6) that are used for the face cooling that generates heat of semiconductor refrigeration piece (5) are installed to one side of semiconductor refrigeration piece (5), the top of cooling tank (3) has air inlet subassembly (8) through intake pipe (7) intercommunication, just air inlet subassembly (8) with CT frame body (1) are linked together, just the refrigeration face setting of semiconductor refrigeration piece (5) is in the inside of cooling tank (3).
2. The CT gantry internal cooling apparatus of claim 1, wherein: the heat dissipation assembly (6) comprises a heat dissipation fin plate (61) and a heat dissipation fan (62), the heat dissipation fin plate (61) is fixedly arranged on the heating surface of the semiconductor refrigerating sheet (5), and the heat dissipation fan (62) is arranged on one side of the heat dissipation fin plate (61).
3. The CT gantry internal cooling apparatus of claim 2, wherein: the heat dissipation fin plates (61) are aluminum fin plates, and the heat dissipation fans (62) are fixedly installed between the heat dissipation fin plates (61) through four connecting columns (9).
4. The CT gantry internal cooling apparatus of claim 1, wherein: the air inlet assembly (8) comprises a centrifugal fan (81) and a connecting pipe body (82), the top of the air inlet pipe (7) is communicated with the centrifugal fan (81), and the centrifugal fan (81) is communicated with the cooling box (3) through the connecting pipe body (82).
5. The CT gantry internal cooling apparatus of claim 1, wherein: the air inlet device further comprises a dustproof protective net (10) communicated with the air inlet (4), and the dustproof protective net (10) is a stainless steel net.
6. The CT gantry internal cooling apparatus of claim 1, wherein: the cooling box (3) is arranged as an insulation box body, and fixing seats (12) are fixedly arranged on two sides of the bottom of the CT frame body (1).
7. The CT gantry internal cooling apparatus of claim 1, wherein: the CT cooling device further comprises a support base (11), wherein the support base (11) is fixedly installed at the bottom of the cooling box (3), and one side of the support base (11) is fixedly installed on the surface of the CT frame body (1) through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322300883.5U CN220755336U (en) | 2023-08-25 | 2023-08-25 | CT frame inside heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322300883.5U CN220755336U (en) | 2023-08-25 | 2023-08-25 | CT frame inside heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220755336U true CN220755336U (en) | 2024-04-09 |
Family
ID=90552730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322300883.5U Active CN220755336U (en) | 2023-08-25 | 2023-08-25 | CT frame inside heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220755336U (en) |
-
2023
- 2023-08-25 CN CN202322300883.5U patent/CN220755336U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |