CN220691362U - Air blowing and sucking type CPU radiator - Google Patents
Air blowing and sucking type CPU radiator Download PDFInfo
- Publication number
- CN220691362U CN220691362U CN202322101942.6U CN202322101942U CN220691362U CN 220691362 U CN220691362 U CN 220691362U CN 202322101942 U CN202322101942 U CN 202322101942U CN 220691362 U CN220691362 U CN 220691362U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- fan
- radiator
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007664 blowing Methods 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 56
- 230000000694 effects Effects 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 abstract description 3
- 230000004907 flux Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an air blowing and sucking type CPU radiator, which comprises a heat dissipation copper base, a heat dissipation pipe group arranged above the heat dissipation copper base, a heat dissipation component arranged above the heat dissipation pipe group, a fan cover arranged above the heat dissipation component, a heat dissipation module and a heat dissipation module, wherein the heat dissipation component comprises a heat dissipation fin group, a first heat dissipation fan arranged at the top of the heat dissipation fin group and a second heat dissipation fan arranged at the bottom of the heat dissipation fin group; according to the utility model, the first cooling fan and the second cooling fan are respectively arranged at the top and the bottom of the long cooling fin group, when the CPU is used for cooling, the first cooling fan and the second cooling fan are simultaneously started, the second cooling fan is used for sucking air from the top of the cooling copper base to the first cooling fan and then discharging the air from the first cooling fan, and as the first cooling fan and the second cooling fan are simultaneously operated, the cooling performance of the effective cooling fin group is further improved, and the cooling effect of the CPU radiator is further improved.
Description
Technical Field
The utility model relates to the technical field of CPU radiators, in particular to a blowing and sucking type CPU radiator.
Background
With the progress of semiconductor technology, the operation speed of the cpu of a computer has been greatly improved in recent years. The higher the heat flux on the surface of the chip is, how to increase the heat dissipation efficiency and improve the stability of the system becomes the primary work. When the clock pulse of the CPU is higher and the operation number is faster, the heat flux and the temperature generated by the chip are higher and higher, and in order to effectively dissipate heat and increase the heat dissipation speed of the computer, the most common method is to increase the heat dissipation performance.
The existing CPU radiator is used for accelerating air circulation through a cooling fan to radiate heat. However, when a single cooling fan is used for cooling, the thickness of the cooling fins cannot be too thick, and the cooling efficiency cannot be improved because the thickness of the cooling fins is limited.
Disclosure of Invention
In view of the above, the present utility model is directed to a wind blowing type CPU radiator with dual cooling fans.
In order to solve the technical problems, the technical scheme of the utility model is as follows: the utility model provides a formula CPU radiator blows, includes the heat dissipation copper base, sets up the heat dissipation nest of tubes of heat dissipation copper base top is installed the radiator unit of heat dissipation nest of tubes top is installed the fan cover of radiator unit top, its characterized in that, radiator unit includes the radiator fin group, installs the first radiator fan at radiator fin group top, install the second radiator fan of radiator fin group bottom.
Preferably, the heat dissipation fin group is formed by welding a plurality of rectangular aluminum sheets, a heat dissipation through hole for installing the first heat dissipation fan and the second heat dissipation fan is arranged in the middle of the heat dissipation fin group, and a plurality of heat dissipation pipe installation holes and fan installation threaded holes are formed in the periphery of the heat dissipation through hole.
Preferably, a fan bracket for installing the first cooling fan is further arranged at the top of the cooling fin group.
Preferably, the heat-dissipating tube group includes a first type of heat-conducting tube and a second type of heat-conducting tube, and the second type of heat-conducting tube is installed outside the first type of heat-conducting tube.
Preferably, the first heat conducting pipe and the second heat conducting pipe are both U-shaped heat conducting pipes, and the U-shaped heat conducting pipes comprise two heat conducting straight pipes and heat conducting bent pipes arranged at the bottoms of the two heat conducting straight pipes.
Preferably, the included angle between the heat conduction straight pipe and the heat conduction bent pipe in the heat conduction pipe is larger than the included angle between the heat conduction straight pipe and the heat conduction bent pipe in the heat conduction pipe.
Preferably, the two sides of the heat dissipation copper base are also provided with mounting spring plates.
The utility model has the technical effects that: according to the utility model, the first cooling fan and the second cooling fan are respectively arranged at the top and the bottom of the long cooling fin group, when the CPU is used for cooling, the first cooling fan and the second cooling fan are simultaneously started, the second cooling fan is used for sucking air from the top of the cooling copper base to the first cooling fan and then discharging the air from the first cooling fan, and as the first cooling fan and the second cooling fan are simultaneously operated, the cooling performance of the effective cooling fin group is further improved, and the cooling effect of the CPU radiator is further improved.
Drawings
FIG. 1 is a perspective view of a CPU heat sink with air blowing and sucking;
FIG. 2 is an exploded view of a CPU heat sink of FIG. 1;
FIG. 3 is a block diagram of the fin group of FIG. 1;
FIG. 4 is a side view of a heat pipe of the type of FIG. 1;
FIG. 5 is a perspective view of a heat pipe of the type shown in FIG. 4;
FIG. 6 is a side view of the heat pipe of FIG. 1;
fig. 7 is a perspective view of a heat pipe of the type shown in fig. 6.
Detailed Description
The following detailed description of the utility model is provided in connection with the accompanying drawings to facilitate understanding and grasping of the technical scheme of the utility model.
In this embodiment, it should be understood that the directions or positional relationships indicated by the terms "middle", "upper", "lower", "top", "right", "left", "upper", "back", "middle", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present utility model, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model.
In this embodiment, if not specifically described, the members may be connected or fixed by bolts, pins, or the like, which are commonly used in the prior art, and therefore, the details thereof will not be described in this embodiment.
The utility model provides a formula CPU radiator blows, as shown in fig. 2, includes heat dissipation copper base 1, sets up heat dissipation nest of tubes 2 of heat dissipation copper base 1 top, install heat dissipation subassembly 3 of heat dissipation nest of tubes 2 top, install fan cover 4 of heat dissipation subassembly 3 top, fan cover 4 installs first radiator fan 32 top. The heat dissipation assembly 3 includes a heat dissipation fin group 31, a first heat dissipation fan 32 mounted on the top of the heat dissipation fin group 31, and a second heat dissipation fan 33 mounted on the bottom of the heat dissipation fin group 31. When the first cooling fan 32 and the second cooling fan 33 are turned on, the rotation speed and the rotation direction of the fan motor are the same. The top of the heat radiation fin group 31 is further provided with a fan bracket 34 for mounting the first heat radiation fan 32. The first radiator fan 32 is fixed to the fan bracket 34 by bolts. The two sides of the radiating copper base 1 are also provided with mounting spring plates 6. The mounting spring 6 is matched with the upper buckle and the lower buckle to mount the air blowing and sucking type CPU radiator on the top of the CPU.
As shown in fig. 3, the heat dissipation fin set 31 is formed by welding a plurality of rectangular aluminum sheets, and a heat dissipation through hole 311 for installing the first heat dissipation fan 32 and the second heat dissipation fan 33 is provided in the middle of the heat dissipation fin set 31, after the first heat dissipation fan 32 and the second heat dissipation fan 33 are simultaneously turned on, the second heat dissipation fan 33 sucks air from the top of the heat dissipation copper base 1, sends the air to the first heat dissipation fan 32, and then is discharged by the first heat dissipation fan 32. A plurality of radiating pipe mounting holes 312 and fan mounting screw holes 313 are arranged around the radiating through holes 311. The heat radiation pipe group 2 is mounted at the bottom of the heat radiation fin group 31 by being inserted into the heat radiation pipe mounting hole 312.
The heat radiation pipe group 2 includes a type of heat conduction pipe 21 and a type of heat conduction pipe 22, and the type of heat conduction pipe 22 is installed outside the type of heat conduction pipe 21. Specifically, two heat pipes 21 of one type are installed together, and two heat pipes 22 of two types are installed outside the two heat pipes 21 of one type.
As shown in fig. 4-7, the first heat-conducting pipe 21 and the second heat-conducting pipe 22 are both U-shaped heat-conducting pipes, and each U-shaped heat-conducting pipe comprises two heat-conducting straight pipes 101 and a heat-conducting bent pipe 102 installed at the bottom of each heat-conducting straight pipe 101. Two heat conduction straight pipes 101 are installed at two ends of the heat conduction bent pipe 102 to form a U-shaped pipe.
The included angle between the heat conducting straight pipe 101 and the heat conducting bent pipe 102 in the first type of heat conducting pipe 21 is larger than the included angle between the heat conducting straight pipe 101 and the heat conducting bent pipe 102 in the second type of heat conducting pipe 22. Specifically, the included angle between the heat conduction straight pipe 101 and the heat conduction bent pipe 102 in the heat conduction pipe 21 of the type is about 150 °, and the included angle between the heat conduction straight pipe 101 and the heat conduction bent pipe 102 in the heat conduction pipe 22 of the type is about 140 °.
Working principle: after the air blowing and sucking type CPU radiator is arranged on the top of the CPU, the heat radiating copper base 1 guides the heat generated by the CPU to the heat radiating fin group 31 to radiate, and after the first heat radiating fan 32 and the second heat radiating fan 33 are simultaneously started, the circulation of air in the heat radiating fin group 31 is quickened, and the heat radiating speed of the heat radiating fin group 31 is improved.
The utility model has the technical effects that: according to the utility model, the first cooling fan and the second cooling fan are respectively arranged at the top and the bottom of the long cooling fin group, when the CPU is used for cooling, the first cooling fan and the second cooling fan are simultaneously started, the second cooling fan is used for sucking air from the top of the cooling copper base to the first cooling fan and then discharging the air from the first cooling fan, and as the first cooling fan and the second cooling fan are simultaneously operated, the cooling performance of the effective cooling fin group is further improved, and the cooling effect of the CPU radiator is further improved.
Of course, the above is only a typical example of the utility model, and other embodiments of the utility model are also possible, and all technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of the utility model claimed.
Claims (7)
1. The utility model provides a formula CPU radiator blows, includes the heat dissipation copper base, sets up the heat dissipation nest of tubes of heat dissipation copper base top is installed the radiator unit of heat dissipation nest of tubes top is installed the fan cover of radiator unit top, its characterized in that, radiator unit includes the radiator fin group, installs the first radiator fan at radiator fin group top, install the second radiator fan of radiator fin group bottom.
2. The air blowing and sucking type CPU radiator as claimed in claim 1, wherein the radiating fin group is formed by welding a plurality of rectangular aluminum sheets, a radiating through hole for installing a first radiating fan and a second radiating fan is arranged in the middle of the radiating fin group, and a plurality of radiating pipe installing holes and fan installing threaded holes are formed around the radiating through hole.
3. A blow-down type CPU radiator as claimed in claim 2, wherein the top of the fin group is further provided with a fan bracket for mounting the first heat radiation fan.
4. A blow-down wind type CPU radiator as claimed in claim 1, wherein the heat radiation pipe group includes a type of heat conduction pipe and a type of heat conduction pipe, the type of heat conduction pipe being installed outside the type of heat conduction pipe.
5. The air blowing and sucking type CPU radiator as set forth in claim 4, wherein said heat pipes are U-shaped heat pipes, and the U-shaped heat pipes include two heat conducting straight pipes and heat conducting bent pipes installed at bottoms of the two heat conducting straight pipes.
6. The air blowing and sucking type CPU radiator as set forth in claim 4, wherein the included angle between the heat conducting straight pipe and the heat conducting bent pipe in the heat conducting pipe of the first kind is larger than the included angle between the heat conducting straight pipe and the heat conducting bent pipe in the heat conducting pipe of the second kind.
7. A wind-blowing and sucking type CPU radiator as claimed in claim 1, wherein mounting spring plates are further installed on both sides of the heat dissipation copper base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322101942.6U CN220691362U (en) | 2023-08-05 | 2023-08-05 | Air blowing and sucking type CPU radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322101942.6U CN220691362U (en) | 2023-08-05 | 2023-08-05 | Air blowing and sucking type CPU radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220691362U true CN220691362U (en) | 2024-03-29 |
Family
ID=90409018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202322101942.6U Active CN220691362U (en) | 2023-08-05 | 2023-08-05 | Air blowing and sucking type CPU radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220691362U (en) |
-
2023
- 2023-08-05 CN CN202322101942.6U patent/CN220691362U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7273092B2 (en) | Modularized cooler | |
US7363963B2 (en) | Heat dissipation device | |
CN100343985C (en) | Heat dissipating device | |
CN102056461A (en) | Heat dissipating device | |
CN1320357A (en) | Apparatus for cooling a box with heat genrating elements received therein and a method for cooling same | |
JP2833999B2 (en) | LSI cooling module | |
KR100939992B1 (en) | Cooling Apparatus, and Electric-Electronic Equipment with the Cooling Apparatus | |
CN109152314B (en) | Heat abstractor, control radiating component and washing machine | |
CN207674759U (en) | A kind of semiconductor cooling device | |
JP4603783B2 (en) | Liquid cooling system and radiator | |
CN220691362U (en) | Air blowing and sucking type CPU radiator | |
JP4682858B2 (en) | Cooling device for electronic equipment | |
CN210038688U (en) | Heat radiation module | |
TWI397369B (en) | Heat dissipation device | |
CN212628965U (en) | Water-cooling radiating fin group and water-cooling radiator | |
CN212623948U (en) | Double-fan strong pressure type CPU radiator | |
US7021366B2 (en) | Heat dissipation apparatus and method | |
CN215379665U (en) | Spiral composite fin radiator structure and radiator | |
CN219698305U (en) | Needle-shaped fin heat radiator applied in frequency converter | |
JP2007042724A (en) | Heat sink | |
CN219349470U (en) | Novel air-cooled radiator | |
CN1243463C (en) | Heat emission module structure for electronic device | |
CN219288017U (en) | Heat dissipation device for heat dissipation of electronic device | |
CN216310718U (en) | Auxiliary heat radiator for CPU water-cooling radiator | |
CN213755497U (en) | Air-cooling and water-cooling integrated radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |