CN220679667U - Double-beam single-head laser processing system - Google Patents
Double-beam single-head laser processing system Download PDFInfo
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- CN220679667U CN220679667U CN202321772972.3U CN202321772972U CN220679667U CN 220679667 U CN220679667 U CN 220679667U CN 202321772972 U CN202321772972 U CN 202321772972U CN 220679667 U CN220679667 U CN 220679667U
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- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 238000005553 drilling Methods 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
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Abstract
The utility model discloses a double-beam single-head laser processing system, which comprises a laser oscillator for oscillating and generating a first polarized laser beam, a half reflecting mirror for dividing the first polarized laser beam into two paths, a phase plate for rotating the deflection direction of one path of the first polarized laser beam by 90 degrees to convert the deflection direction of the first polarized laser beam into a second polarized laser beam, two galvanometer scanners for respectively controlling the directions of the first polarized laser beam and the second polarized laser beam, and a single laser head for focusing the first polarized laser beam and the second polarized laser beam emitted by the two galvanometer scanners onto an F-Theta lens on a processing object of a workbench; the single laser head is characterized by further comprising a polarized beam splitter arranged at the front part of the F-Theta lens, wherein the polarized beam splitter is used for transmitting the first polarized laser beam and reflecting the second polarized laser beam, and the first polarized laser beam and the second polarized laser beam can be incident on the single laser head by taking the central axis of the F-Theta lens as a reference axis. The system has simple structure and low manufacturing cost, and can reduce the distortion phenomenon of the laser field of view.
Description
Technical Field
The utility model relates to a double-beam single-head laser processing system.
Background
Laser processing systems have been widely used in various industrial fields, such as laser printers for marking production lots with letters on the surfaces of semiconductor chips, laser drilling systems for drilling holes and special vias (via holes) with laser for connection between layers on electronic devices of multilayer substrates, and the like, which have been developed in recent years with the development of the semiconductor industry.
As shown in fig. 1, which is a schematic configuration diagram of a conventional double-headed laser drilling system in the prior art, it can be seen that a laser beam oscillated from a laser oscillator 1 is incident on a half mirror 4 as a beam splitter through a collimator 2 and an aperture 3 in this order. About 50% of the laser beam incident on the half mirror 4 is reflected into the main laser head 6, and the remaining transmitted laser beam is further reflected by the mirror 5, passing through the mechanical shutter into the sub laser head 7. The laser beams entering the main laser head 6 and the sub laser head 7 control the deflection directions of the light rays through the main galvanometer scanner 61 and the sub galvanometer scanner 71, respectively, and then focus and irradiate the first work object 10 and the second work object 11 through the corresponding main F-Theta lens 8 and sub F-Theta lens 8, respectively, to form through holes. The primary galvanometer scanner 61 is composed of a primary X-axis galvanometer 61a and a primary Y-axis galvanometer 61b, and the secondary galvanometer scanner 71 is composed of a secondary X-axis galvanometer 71a and a secondary Y-axis galvanometer 71b, each mirror being drive-controlled by a corresponding control device (not shown) to adjust its angle.
However, the conventional dual-head laser drilling system described above has a disadvantage in that one F-Theta lens is used for each laser head, and thus the manufacturing cost of the system may be relatively high. For this reason, U.S. patent No. 6,462,306 discloses a laser processing system, which is provided with two galvanometer scanners and only has one F-Theta lens, wherein two laser beams are respectively focused by a single F-Theta lens after the scanning directions of the two galvanometer scanners are controlled to form two irradiation beams, and the processing operation can be implemented at different points of a processed object. However, the laser processing system disclosed in the above U.S. patent No. 6,462,306 still has a defect that the optical axes of the two laser beams after the two galvanometer scanners control the scanning direction do not use the central axis of the F-Theta lens as the reference axis for incidence (i.e. the laser beam emitted from the central point of the galvanometer scanner does not coincide with the central axis of the F-Theta lens), which results in that a larger parallax is generated between the objective field of view and the theoretical field of view of the laser beam after the feedback of the processing path on the object, and the distortion of the objective field of view is aggravated, that is, the distortion phenomenon of the laser field of view is caused.
Fig. 2 shows a simulated view of the path of the laser beam emitted from a galvanometer scanner (Y-axis galvanometer) incident on an F-Theta lens at various scanning angles (the reference axis of the galvanometer scanner laser beam scanning is offset by 10mm from the central axis of the F-Theta lens) in a laser processing system as disclosed in the above-mentioned U.S. patent or similar laser processing system. As shown in fig. 2, since the reference axis of laser beam scanning by the galvanometer scanner is shifted by 10mm with respect to the central axis of the F-Theta lens, the paths of laser beams incident at the scanning angles of 5 °, 7.5 °, and 15 ° respectively are severely distorted.
Fig. 3 is a diagram of a lens record of a simulation comparison between an objective view field and a theoretical view field of a grid formed by irradiating and scanning a processed object with a laser beam emitted from the F-Theta lens in fig. 2, wherein the parallax of the laser beam finally emitted from the F-Theta lens onto the object is increased due to the deviation of the optical axis of the incident laser beam relative to the central axis of the F-Theta lens, and as can be seen from fig. 3, the objective view field of the grid formed by irradiating and scanning the object with the deflected laser beam has a remarkable distortion phenomenon that distortion is aggravated.
Disclosure of Invention
The utility model aims to provide a double-beam single-head laser processing system, which uses only one F-Theta lens to focus and form two paths of laser beams for processing, has the characteristics of simple structure and low manufacturing cost, and can ensure that the two paths of laser beams emitted from the control directions of two galvanometer scanners are incident on the F-Theta lens by taking the central axis of the F-Theta lens as a reference axis, thereby reducing the distortion phenomenon of the laser field of view.
The technical scheme of the utility model is as follows: a dual-beam single-head laser processing system comprises a laser oscillator for oscillating and generating a first polarized laser beam, a half mirror for dividing the first polarized laser beam into two paths, a phase plate for rotating the deflection direction of the first polarized laser beam of one path by 90 degrees to convert the first polarized laser beam into a second polarized laser beam, a first galvanometer scanner for controlling the direction of the first polarized laser beam of the other path, a second galvanometer scanner for controlling the direction of the second polarized laser beam and a single laser head, wherein the single laser head comprises an F-Theta lens for focusing the first polarized laser beam emitted by the first galvanometer scanner and the second polarized laser beam emitted by the second galvanometer scanner onto a processing object arranged on a workbench; the single laser head is characterized by further comprising a polarized beam splitter arranged at the front part of the F-Theta lens, wherein the polarized beam splitter is used for transmitting the first polarized laser beam and reflecting the second polarized laser beam, and the first polarized laser beam and the second polarized laser beam can be incident to the F-Theta lens by taking the central axis of the F-Theta lens as a reference axis.
It is known that under the control of a galvanometer scanner, an outgoing polarized laser beam is scanned at a deflection angle in the X-Y direction on a plane on which the object is being processed, and the reference axis of the scanning, i.e., the axis of the laser beam emitted from the center point of the galvanometer scanner, is scanned at a scanning angle in the X, Y direction, or at a deflection angle of 0. By the center axis of the F-Theta lens being the reference axis, it is meant that the laser beam emitted from the center point of the galvanometer scanner, whether transmitted or reflected by the polarizing beam splitter, has a final incident optical axis coincident with or along the center axis of the F-Theta lens.
Therefore, in the utility model, the first polarized laser beam emitted from the center point of the first galvanometer scanner is transmitted by the polarization beam splitter and then enters the F-Theta lens along the center axis of the F-Theta lens, and the second polarized laser beam emitted from the center point of the second galvanometer scanner is reflected by the polarization beam splitter and then enters the F-Theta lens along the center axis of the F-Theta lens, and the scanning angles of the two incident laser beams in the X direction and the Y direction of the plane of the processed object are 0.
Further, the utility model also comprises a collimator 12 and an aperture 14 which are sequentially arranged on the light path of the laser oscillator and the first polarized laser beam of the half mirror.
Further, in the utility model, the first polarized laser beam is a P polarized laser beam, and the second polarized laser beam is an S polarized laser beam; or the first polarized laser beam is an S polarized laser beam and the second polarized laser beam is a P polarized laser beam.
Further, the utility model also comprises a reflector group which is arranged on the optical path of at least one of the first polarized laser beam and the second polarized laser beam and is used for adjusting the path lengths of the first polarized laser beam and the second polarized laser beam to be equal.
Further, in the present utility model, a first mirror group is disposed on an optical path of a first polarized laser beam between the half mirror and the first galvanometer scanner, and a second mirror group is disposed on an optical path of a second polarized laser beam between the phase plate and the second galvanometer scanner; the first mirror group and the second mirror group are used for adjusting the path lengths of the first polarized laser beam and the second polarized laser beam respectively so as to be equal to each other.
Further, the first galvanometer scanner of the utility model includes a first X-axis galvanometer 21 and a first Y-axis galvanometer, and the second galvanometer scanner includes a second X-axis galvanometer and a second Y-axis galvanometer. The first galvanometer scanner and the second galvanometer scanner are used for controlling the directions of the corresponding laser beams so as to scan the plane of the processed object on the workbench along the X-Y direction.
Further, the utility model also comprises a first beam damper arranged corresponding to the first galvanometer scanner and a second beam damper arranged corresponding to the second galvanometer scanner. The first beam damper functions as: when the first galvanometer scanner is not in operation, the first polarized laser beam directed thereto from the first galvanometer scanner with the deflection direction controlled is received. Similarly, the second beam damper functions as: when the second galvanometer scanner is not in operation, the second polarized laser beam directed thereto from the second galvanometer scanner with the deflection direction controlled is received.
The technical scheme of the utility model has the following advantages:
on the one hand, the utility model is also provided with two galvanometer scanners and only provided with one F-Theta lens (single laser head), and two paths of laser beams generated by the two F-Theta lens are respectively focused by a single F-Theta lens after the control directions of the two galvanometer scanners to form two paths of irradiation beams, so that the processing operation can be implemented at different points of a processed object.
Meanwhile, the utility model further adds a polarized beam splitter for transmitting the first polarized laser beam and reflecting the second polarized laser beam for ensuring that the first polarized laser beam and the second polarized laser beam can be incident to the F-Theta lens by taking the central axis of the F-Theta lens as a reference axis, thereby reducing the parallax of a processing path of the laser beam emitted by the F-Theta lens for irradiating and scanning on a processed object, reducing the distortion phenomenon of a laser field and further improving the processing quality of the laser processing system.
The objects, advantages and features of the present utility model will be illustrated and explained by the following non-limiting description of preferred embodiments, which are given by way of example only with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic construction diagram of a conventional dual head laser drilling system of the prior art;
FIG. 2 is a schematic diagram of the path of a laser beam emitted from an (arbitrary) galvanometer scanner (Y-axis galvanometer) of the background art, which is incident on an F-Theta lens at three different scanning angles (the reference axis of the galvanometer scanner scanning is offset by 10mm with respect to the central axis of the F-Theta lens);
FIG. 3 is a simulated comparison of the objective field of view and the theoretical field of view of a grid formed by irradiation scanning of a laser beam emitted by the F-Theta lens of FIG. 2 on a processed object recorded by a lens;
FIG. 4 is a schematic configuration view of a preferred embodiment of the present utility model;
FIG. 5 is a schematic diagram of the path of a laser beam emitted from an (arbitrary) galvanometer scanner (Y-axis galvanometer) incident on an F-Theta lens at three different scanning angles (the reference axis of the galvanometer scanner scanning coincides with the central axis of the F-Theta lens);
FIG. 6 is a simulated comparison of the objective field of view of a grid formed by irradiation scanning of a laser beam emitted from the F-Theta lens of FIG. 5 on a workpiece recorded by a lens with a theoretical field of view.
1. A laser oscillator; 2. a collimator; 3. an aperture; 4. a half mirror; 5. a reflecting mirror; 6. a main laser head; 61. a main galvanometer scanner; 61a, a main X-axis galvanometer; 61b, a main Y-axis galvanometer; 7. an auxiliary laser head; 71. a secondary galvanometer scanner; 71a, a secondary X-axis vibrating mirror; 71b, an auxiliary Y-axis vibrating mirror; 8. a primary F-Theta lens; 9. a secondary F-Theta lens; 10. a first job object; 11. a second job object; 12. a phase plate; 13. a first galvanometer scanner; 13a, a first X-axis vibrating mirror; 13b, a first Y-axis vibrating mirror; 14. a second galvanometer scanner; 14a, a second X-axis vibrating mirror; 14b, a second Y-axis vibrating mirror; 15. a polarizing beam splitter; 16. F-Theta lenses; 17. a work table; 18. a first mirror; 19. a second mirror; 20. a third mirror; 21. a fourth mirror; 22. a fifth reflecting mirror; 23. a sixth mirror; 24. a first beam damper; 25. a second beam damper; l1, a first polarized laser beam; l2, a second polarized laser beam.
Description of the embodiments
Examples: fig. 4 shows a specific embodiment of a dual-beam single-head laser processing system according to the present utility model, which is shown as follows:
first, a laser oscillator 1 for oscillating a first polarized laser beam L1 and a collimator 2 and an aperture 3 for adjusting it to a straight laser beam are provided in order along the optical path of the first polarized laser beam L1. A half mirror 4 for dividing the first polarized laser beam L1 into two paths is provided at the rear of the diaphragm 3, wherein one path of the transmitted first polarized laser beam L1 is rotated by 90 degrees in the deflecting direction of the phase plate 12 to be converted into a second polarized laser beam L2, which forms the "double beam" of the present utility model together with the other path of the reflected first polarized laser beam L1.
The core of the utility model is the design of a single laser head consisting of a polarizing beam splitter 15 and an F-Theta lens 16. The first polarized laser beam L1 in the double-beam enters the first galvanometer scanner 13 after being reflected by the first reflecting mirror group, and then is emitted to the polarized beam splitter 15 in the single laser head after being reflected by the first X-axis galvanometer 13a and the first Y-axis galvanometer 13b in the first galvanometer scanner 13; the second polarized laser beam L2 enters the second galvanometer scanner 14 after being reflected by the second reflecting mirror group, and then exits to the polarized beam splitter 15 after being reflected by the second X-axis galvanometer 14a and the second Y-axis galvanometer 14b inside the second galvanometer scanner 14. The polarization beam splitter 15 is configured to transmit the first polarized laser beam L1 and reflect the second polarized laser beam L2, and enable the first polarized laser beam L1 and the second polarized laser beam L2 to be incident on the F-Theta lens 16 with the central axis of the F-Theta lens 16 as a reference axis, as shown in fig. 4, and finally, the F-Theta lens 16 together focus and irradiate on a processing object placed on the worktable 17 to process a through hole.
The first polarized laser beam L1 in this embodiment is a P polarized laser beam, and the second polarized laser beam L2 converted by the phase plate 12 is an S polarized laser beam.
As in the known technology, the first X-axis galvanometer 13a and the first Y-axis galvanometer 13b in the first galvanometer scanner 13 each control vibration by a corresponding driver (omitted from the figure) to control the deflection direction of the first polarized laser beam L1, so that the first polarized laser beam L1 can scan along the X-Y deflection angle on the plane of the object to be processed and process different areas; similarly, the second X-axis galvanometer 14a and the second Y-axis galvanometer 14b in the second galvanometer scanner 14 also control the vibration by corresponding drivers (omitted from the drawing) to control the deflection direction of the second polarized laser beam L2, so that the second polarized laser beam L2 can scan along the X-Y deflection angle on the plane of the object to be processed, and process different areas.
In this embodiment, the first mirror group between the half mirror 4 and the first galvanometer scanner 13 specifically includes a first mirror 18, a second mirror 19, a third mirror 20, and a fourth mirror 21, and one path of the first polarized laser beam L1 reflected by the half mirror 4 is reflected by the first mirror 18, the second mirror 19, the third mirror 20, and the fourth mirror 21 sequentially to the polarized beam splitter 15. The second mirror group between the phase plate 12 and the second galvanometer scanner 14 is specifically composed of a fifth mirror 22 and a sixth mirror 23, and the second polarized light beam L2 obtained after the conversion by the phase plate 12 is reflected to the polarized light beam splitter 15 sequentially by the fifth mirror 22 and the sixth mirror 23. The first mirror group and the second mirror group are used to adjust the path lengths of the first polarized laser beam L1 and the second polarized laser beam L2, respectively, so that they are equal.
In the present embodiment, a first beam damper 24 is also provided corresponding to the first galvanometer scanner 13, while a second beam damper 25 is provided corresponding to the second galvanometer scanner 14. The first beam damper 24 functions as: when the first galvanometer scanner 13 is not operated, the first polarized laser beam L1 directed thereto from which the deflection direction is controlled by the first galvanometer scanner 13 is received to dump energy. Similarly, the second beam damper 25 functions as: when the second galvanometer scanner 14 is not in operation, the second polarized laser beam L2 directed thereto from the second galvanometer scanner 14 with the deflection direction controlled is received thereby to dump energy.
In this embodiment, the first polarized laser beam L1 transmitted through the polarizing beam splitter 15 and the second polarized laser beam L2 reflected by the same can be incident on the F-Theta lens 16 with the central axis of the F-Theta lens 16 as the reference axis, which means that the incident optical axis of the first polarized laser beam L1 emitted from the central point of the first galvanometer scanner 13 through the polarizing beam splitter 15 coincides with the central axis of the F-Theta lens 16, and the incident optical axis of the second polarized laser beam L2 emitted from the central point of the second galvanometer scanner 14 through the polarizing beam splitter 15 coincides with the central axis of the F-Theta lens 16 without any deviation.
FIG. 5 is a schematic diagram showing the propagation path of the laser beam emitted from the (arbitrary) galvanometer scanner (Y-axis galvanometer) in three different scanning angles to the F-Theta lens; as shown in fig. 4, since the reference axis of laser beam scanning by the galvanometer scanner coincides with the central axis of the F-Theta lens, the laser beam paths incident at the scanning angles of 5 °, 7.5 °, and 15 ° respectively are each greatly reduced in distortion degree from that of fig. 2.
Fig. 6 is a diagram of a lens record of a simulation comparison of an objective view field and a theoretical view field of a grid formed by irradiating and scanning a laser beam emitted by the F-Theta lens in fig. 5 on a processed object, wherein the distortion phenomenon of the laser view field is remarkably reduced compared with fig. 3 due to the fact that the optical axis of the incident laser beam coincides with the central axis of the F-Theta lens.
Of course, the above is only a specific application example of the present utility model, and the protection scope of the present utility model is not limited in any way. In addition to the embodiments described above, other embodiments of the utility model are possible. All technical schemes formed by equivalent replacement or equivalent transformation fall within the scope of the utility model.
Claims (7)
1. A dual-beam single-head laser processing system includes a laser oscillator (1) for oscillating and generating a first polarized laser beam (L1), a half mirror (4) for dividing the first polarized laser beam (L1) into two paths, a phase plate (12) for rotating a deflection direction of the first polarized laser beam (L1) of one path by 90 degrees to convert it into a second polarized laser beam (L2), a first galvanometer scanner (13) for controlling a direction of the first polarized laser beam (L1) of the other path, a second galvanometer scanner (14) for controlling a direction of the second polarized laser beam (L2), and a single laser head including an F-Theta lens (16) for focusing the first polarized laser beam (L1) emitted through the first galvanometer scanner (13) and the second polarized laser beam (L2) emitted through the second galvanometer scanner (14) together onto a processing object placed on a work table (17); the single laser head is characterized by further comprising a polarized beam splitter (15) arranged at the front part of the F-Theta lens (16) and used for transmitting the first polarized laser beam (L1) and reflecting the second polarized laser beam (L2) and enabling the first polarized laser beam (L1) and the second polarized laser beam (L2) to be incident on the F-Theta lens (16) by taking the central axis of the F-Theta lens (16) as a reference axis.
2. A dual beam single head laser processing system according to claim 1, further comprising a collimator (2) and an aperture (3) arranged in sequence on the optical path of the first polarized laser beam (L1) of the laser oscillator (1) and the half mirror (4).
3. A dual beam single head laser processing system according to claim 1, wherein the first polarized laser beam (L1) is a P polarized laser beam and the second polarized laser beam (L2) is an S polarized laser beam; or the first polarized laser beam (L1) is an S polarized laser beam and the second polarized laser beam (L2) is a P polarized laser beam.
4. A dual beam single head laser processing system according to claim 1, further comprising a mirror group provided on an optical path of at least one of the first polarized laser beam (L1) and the second polarized laser beam (L2) for adjusting the path lengths of both to be equal.
5. A dual beam single head laser processing system according to claim 4, wherein a first mirror group is provided on the optical path of a first polarized laser beam (L1) between the half mirror (4) and the first galvanometer scanner (13), and a second mirror group is provided on the optical path of a second polarized laser beam (L2) between the phase plate (12) and the second galvanometer scanner (14); the first mirror group and the second mirror group are used for adjusting the path lengths of the first polarized laser beam (L1) and the second polarized laser beam (L2) respectively so as to be equal to each other.
6. A dual beam single head laser processing system according to claim 1, wherein the first galvanometer scanner (13) comprises a first X-axis galvanometer (13 a) and a first Y-axis galvanometer (13 b), and the second galvanometer scanner (14) comprises a second X-axis galvanometer (14 a) and a second Y-axis galvanometer (14 b).
7. A dual beam single head laser processing system according to claim 1 or 6, further comprising a first beam damper (24) disposed in correspondence with the first galvanometer scanner (13) and a second beam damper (25) disposed in correspondence with the second galvanometer scanner (14).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321772972.3U CN220679667U (en) | 2023-07-07 | 2023-07-07 | Double-beam single-head laser processing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321772972.3U CN220679667U (en) | 2023-07-07 | 2023-07-07 | Double-beam single-head laser processing system |
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| CN220679667U true CN220679667U (en) | 2024-03-29 |
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| CN202321772972.3U Active CN220679667U (en) | 2023-07-07 | 2023-07-07 | Double-beam single-head laser processing system |
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