CN220671925U - Miniature 5G core network host case - Google Patents

Abstract

The utility model relates to a miniature 5G core network host case. The chassis comprises: the box body, set up in radiator, power module of box body inner chamber, and be used for fixed the box body support of box body has offered initiative louvre, passive louvre on the box body. The box comprises six apron, includes left side apron, right side apron, top surface apron, bottom surface apron, front side apron and back apron respectively. The radiator comprises an active radiator and a passive radiator, wherein the active radiator is fixed on the front side cover plate and aligned with the active radiating holes. The passive radiator is fixed on the back cover plate. The power module is fixed on the bottom cover plate and is on the same horizontal line with the passive radiator. The box body support comprises a first support and a second support, wherein the first support and the second support are fixed at two ends of the bottom cover plate of the box body in the length direction. The chassis can meet flexible installation requirements and long-term operation heat dissipation requirements, and has the advantages of low noise, small size, weight and good compatibility of expansion modules.

Description

Miniature 5G core network host case

Technical Field

The utility model relates to the technical field of micro-machine case heat dissipation, in particular to a micro-machine case of a 5G core network host machine.

Background

The existing 5G core network main machine product is mainly based on a rack-mounted server design, adopts a standard 1-2U chassis, and is convenient to use in a scene with a standard rack such as a machine room. The miniature 5G core network mainly provides a small-range special 5G network, and each component in the system is required to be flexibly deployed, so that the whole system can be rapidly deployed in any environment without depending on a machine room and a cabinet. However, the traditional case air duct design cannot cover all parts of the main board, only supports a cabinet installation mode, is poor in heat dissipation performance and large in working noise, and cannot meet the flexible construction requirement of a small and miniature 5G private network.

Disclosure of Invention

Accordingly, it is necessary to provide a micro 5G core network mainframe box that can efficiently dissipate heat and avoid high frequency noise while keeping the size small and the weight light.

In order to achieve the above object, the present utility model provides a micro 5G core network host chassis, including: the box body, set up in radiator, power module of box body inner chamber, and be used for fixed the box body support of box body has offered initiative louvre, passive louvre on the box body.

The box comprises six apron, includes left side apron, right side apron, top surface apron, bottom surface apron, front side apron and back apron respectively.

The radiator comprises an active radiator and a passive radiator, wherein the active radiator is fixed on the front side cover plate and aligned with the active radiating holes. The passive radiator is fixed on the back cover plate.

The power module is fixed on the bottom cover plate and is on the same horizontal line with the passive radiator.

The box body support comprises a first support and a second support, wherein the first support and the second support are fixed at two ends of the bottom cover plate of the box body in the length direction.

In one embodiment, the micro 5G core network host chassis further includes a processor sleeve and an expansion module, the processor sleeve is disposed in an inner cavity of the case, the processor sleeve is fixed on the bottom cover plate through a screw, and the expansion module is fixed on the bottom cover plate through a screw.

In one embodiment, the cross sections of the first bracket and the second bracket along the length direction are semi-arched, and the first bracket comprises a first support piece fixed on the bottom cover plate and a second support piece fixed on the object placing surface, and cross-shaped mounting holes are respectively formed in two ends of the second support piece along the length direction.

In one embodiment, the passive heat dissipation holes comprise a power passive heat dissipation hole and an equipment passive heat dissipation hole which are formed in the back cover plate, wherein the power passive heat dissipation hole is aligned with the passive heat sink in the horizontal direction. The back cover plate is also provided with a processor sleeve interface and an expansion module interface.

In one embodiment, the left cover plate is provided with a left air inlet, the right cover plate is provided with a right air inlet, and the left air inlet and the right air inlet are in the same horizontal plane.

In one embodiment, a nameplate and a power key are arranged on the front side cover plate, and a first active heat dissipation hole and a second active heat dissipation hole are formed in the front side cover plate and are symmetrically distributed with the power key as a center.

In one embodiment, the micro 5G core network host chassis is mounted on a wall, on a horizontal desktop, and embedded in a standard 1-2U-shaped frame.

In one embodiment, the active louvers occupy 55% of the front side cover plate area.

In one embodiment, a dust screen is arranged on the side of the active heat dissipation hole, which faces away from the inner cavity of the box body.

In one embodiment, the top cover plate is a detachable cover plate, and the periphery of the top cover plate is fixed with the left side cover plate, the right side cover plate, the front side cover plate and the back side cover plate by bolts respectively.

Above-mentioned miniature 5G core network host computer machine case includes: the box body, set up in radiator, power module of box body inner chamber is used for fixed the box body support of box body. The miniature 5G core network host case adopts the design of an active radiator and a passive radiator, the active radiator is positioned on the front side cover plate and aligned with the active radiating holes, and the passive radiator is fixed on the back side cover plate, so that the design is beneficial to effective heat dissipation and maintains the stability and performance of the host. And secondly, the power module is fixed on the bottom cover plate and is on the same horizontal line with the passive radiator, and the radiator is independently arranged for the power module, so that the layout is favorable for uniform heat distribution, the possibility of heat concentration is reduced, and the efficiency and the service life of the power module are improved. In addition, the box body support comprises a first support and a second support which are fixed at two ends of the bottom surface cover plate of the box body in the length direction, the supports are favorable for providing additional structural support, the box body support can be suitable for various installation modes such as cabinet installation, desktop installation and wall hanging installation, a heat dissipation space of the box body at the bottom is provided based on the installation modes, in the implementation process, the problem of heat dissipation of the bottom of the box body is solved, and meanwhile, the problem of interference of other heat sources is effectively isolated, so that the flexibility and heat dissipation of equipment installation are improved, and the service life of the micro 5G core network host box is also favorable for being prolonged.

Drawings

Fig. 1 is a front view of a micro 5G core network host chassis according to an embodiment of the present utility model;

FIG. 2 is a left side view of a micro 5G core network host chassis according to one embodiment of the present utility model;

FIG. 3 is a top view of a micro 5G core network mainframe box according to an embodiment of the utility model;

FIG. 4 is a rear view of a micro 5G core network host chassis according to one embodiment of the present utility model;

FIG. 5 is a schematic diagram of a heat dissipation duct of a micro 5G core network host chassis according to an embodiment of the present utility model;

FIG. 6 is a top view of a case stand according to an embodiment of the present utility model;

reference numerals illustrate:

100. a case; 110. a front side cover plate; 120. a back cover plate; 130. a left side cover plate; 140. a right side cover plate; 150. a top cover plate; 160. a bottom cover plate;

111. a first active heat sink aperture; 112. a power button; 113. a second active heat sink aperture; 114. a nameplate; 115. a first heat dissipation panel; 116. a second heat dissipation panel;

121. a passive heat dissipation hole of the power supply; 122. passive heat dissipation holes of the equipment; 123. a motherboard interface; 124. expanding a reserved port of the module; 123. a power socket;

131. a left air inlet hole; 141. a right air inlet hole;

200. a box body bracket; 210. a first bracket; 211. a first support sheet; 212. a second support sheet; 213. a cross-shaped mounting hole; 214. the box body is fixed with a nail hole; 220 a second bracket;

301. a first active heat sink; 302. a second active heat sink; 310. a passive heat sink;

400. processor sleeve slice; 500. an expansion module; 600. and a power supply module.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1-4, the present utility model provides a micro 5G core network host chassis, including: the box body 100, the radiator and the power module which are arranged in the inner cavity of the box body 100, and the box body 100 bracket which is used for fixing the box body 100 are arranged on the box body 100, and the box body 100 is provided with active radiating holes and passive radiating holes.

Specifically, the hole shape of initiative louvre can be rectangle or oval, and every initiative louvre evenly arranges according to vertical grid, includes: a first active heat dissipation hole 111 and a second active heat dissipation hole 113. As shown in fig. 1, in an embodiment, a front cover plate 110 of a mainframe box of the micro 5G core network is provided with a first active heat dissipation hole 111 and a second active heat dissipation hole 113, and a power key 112 and a nameplate 114.

Wherein, the sum of the hole area of the first active heat dissipation hole 111 and the hole area of the second active heat dissipation hole 113 occupies 70% of the whole front cover plate 110. The front cover plate 110 has a first heat dissipation panel 115 and a second heat dissipation panel 116 embedded therein, the first active heat dissipation hole 111 is formed on the first heat dissipation panel 115, the second active heat dissipation hole 113 is formed on the second heat dissipation panel 116, and the first heat dissipation panel 115 and the second heat dissipation panel 116 are symmetrically distributed with the power key 112 as a center. The shape of the longitudinal grid of the first active heat dissipation holes 111 may be circular, or may be adjusted according to the shape of the heat sink, and the shape of the longitudinal grid of the second active heat dissipation holes 113 may be circular, or may be adjusted according to the shape of the heat sink.

The power key 112 can be used for opening the processor sleeve 400, the expansion module 500, the memory module, the display module and the like in the inner cavity of the micro 5G core network host case by applying pressure by a user, and a round key is selected for improving the beauty and touch sense. The nameplate 114 is mainly rectangular, is inlaid in the upper left corner of the left side cover plate 130, and can be attached to the surface of the nameplate 114 by glue, or a label groove is formed in the nameplate 114, and a case number sticker is inserted in the label groove.

The two ends of the bottom cover plate 160 in the length direction are respectively fixed with a first bracket 210 and a second bracket 220, the cross sections of the first bracket 210 and the second bracket 220 in the length direction are half-arched, the second support piece 211 of the first bracket 210 and the second support piece 211 of the second bracket 220 are respectively fixed with the bottom cover plate 160 through screws, and the second support piece 212 of the first bracket 210 and the second support piece 212 of the second bracket 220 are on the same horizontal plane. In addition, as shown in fig. 6, the second support piece 211 is provided with a fixing nail hole of the case body 100, two ends of the second support piece 212 are provided with cross-shaped mounting holes 213 and fixing nail holes, and the overall shape of the second support piece 212 is concave, so that stable support can be provided for the case body 100. The cross-shaped mounting holes 213 can be sized to fit hooks, cabinet mounting nails, screw nails and the like, so that the box 100 can be suitable for various mounting modes such as cabinet mounting, desktop mounting and wall hanging mounting, the flexibility of the miniature 5G core network host case is improved, the use scene of the miniature 5G core network host case is expanded, and the miniature 5G core network host case is not only limited to a machine room, but also has mobility.

It should be noted that, the bracket of the box 100 provides a heat dissipation space of the bottom side plate in addition to the implementation of coping with various installation modes such as desktop installation, wall hanging installation and the like, and the processor sleeve 400, the power module, the expansion module 500, the memory module, the display module and other devices installed in the inner cavity of the box 100 can conduct heat and dissipate heat in operation through heat difference outside the box 100, and is effectively isolated from heat sources outside the box 100, so that interference of other heat sources outside the box 100 can not be directly received.

As shown in fig. 2-3, a left air inlet 131 is formed at the joint of the left cover plate 130 and the front side cover plate 110, the upper part of the left cover plate 130 is fixed with the top cover plate 150 through a movable nut, the upper part of the right cover plate 140 is also fixed with the top cover plate 150 through a movable nut, and the fixed positions of the left and right sides are on the same horizontal plane, so that the top cover plate 150 is convenient to detach and overhaul equipment in the inner cavity of the box body 100. In addition, the left cover plate 130 is uniformly provided with left air inlet holes 131 in the form of a transverse grid in the length direction thereof, and the right cover plate 140 is uniformly provided with right air inlet holes 141 in the form of a transverse grid in the length direction thereof. The left air inlet 131 and the right air inlet 141 are at the same horizontal plane, and the holes of the left air inlet 131 and the right air inlet 141 may be rectangular or elliptical.

It should be noted that, the air inlet holes are formed on the left and right sides of the box body 100, so that the cold air outside the box body 100 can be passively sucked through the active radiator arranged in the inner cavity of the box body 100, the heat dissipation of the active radiator is assisted, the temperature cooling of the inner cavity of the box body 100 is accelerated, and the heat dissipation efficiency of the whole machine box is improved.

As shown in fig. 4, the back cover 120 is provided with a reserved position of the expansion module 500, a main board interface 123, a power socket 125, and a power passive heat dissipation hole 121 and a device passive heat dissipation hole 122. The reserved position of the expansion module 500 may be an interface of the expansion module 500, or may be an independent reserved opening 124 of the expansion module, for example, a peripheral device directly connected to the motherboard, such as a network card, a graphics card, etc., and the reserved position of the expansion module 500 may be inserted into a hole with a size of the peripheral device. The size of the power passive heat dissipation hole 121 is consistent with that of the passive heat dissipation device 310, the device passive heat dissipation holes 122 are formed above the main board interface 123, the back cover plate 120 removes the area of the expansion module reserved opening 124, the main board interface 123, the power socket 125 and the power passive heat dissipation hole 121, the remaining area is provided with the device passive heat dissipation holes 122, and the holes of each device passive heat dissipation hole 122 can be rectangular or elliptical and are uniformly distributed according to an array.

Referring to fig. 5, fig. 5 shows a schematic diagram of a heat dissipation air duct of a micro 5G core network host chassis in an embodiment of the present utility model, when the core network host is started, a processor die 400, a power module and an expansion module 500 disposed in an inner cavity of the box body 100 start to operate, and meanwhile, an active radiator and a passive radiator 310 start to operate, where the active radiator is disposed on one side of the inner cavity of the box body 100 of the front side cover plate 110, and includes a first active radiator 301 and a second active radiator 302, and a heat dissipation surface of the first active radiator 301 is aligned with a coverage area of the first active heat dissipation hole 111, and a heat dissipation surface of the second active radiator 302 is aligned with a coverage area of the second active heat dissipation hole 113.

Specifically, hot air in the inner cavity of the box body 100 is generated in the running process of equipment in the inner cavity of the box body 100, and is used for forcedly sucking a large amount of cold air by driving the first active radiator 301 and the second active radiator 302, so that a large amount of cold air enters from the first active radiating holes 111 and the second active radiating holes 113 of the front cover plate 110 of the box body 100, and the cold air is quickly introduced into the inner cavity of the box body 100. The inside and outside air close to the left air inlet 131 of the first active radiator 301 forms a temperature difference under the driving of the first active radiator 301 and the second active radiator 302, and the inside and outside air close to the right air inlet 141 of the second active radiator 302 also forms a temperature difference, so that based on the temperature difference, less part of cold air is passively sucked into the inner cavity of the box 100 through the left air inlet 131 and the right air inlet 141, and the flow of the cold air entering the interior of the box is effectively improved. The wind directions of the first active radiator 301 and the second active radiator 302 are parallel to the processor sleeve sheet 400, the expansion module 500 and the power supply module on the main board, the wind directions of the left air inlet 131 and the right air inlet are also parallel to the processor sleeve sheet 400, the expansion module 500 and the power supply module on the main board, and the hot air in the inner cavity of the box body 100 blows towards the direction of the box back cover plate 120, and forms a full convection heat radiation air flue along with the passive radiator 310, the power passive heat radiation hole 121 and the equipment passive heat radiation hole 122 arranged on the back cover plate 120. The large-volume design in the case also solves the problem of high-frequency noise caused by high-speed airflow impacting the parts of the main board.

In some embodiments, a dust screen is disposed on a side of the active heat dissipation hole facing away from the inner cavity of the case 100, so as to effectively isolate large particle dust and other foreign matters from entering the inner cavity of the case 100.

In some embodiments, the size of the micro 5G core network mainframe can be adjusted according to practical application scenarios, and the micro 5G core network mainframe can be embedded in a standard 1-2U-shaped frame, and can also be adjusted to be 252mm long, 235.7mm wide and 95.2mm high and hung on a placement surface.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The utility model provides a miniature 5G core network host computer machine case which characterized in that, miniature 5G core network host computer machine case includes: the box comprises a box body, a radiator, a power module and a box body bracket, wherein the radiator and the power module are arranged in the inner cavity of the box body, the box body bracket is used for fixing the box body, and the box body is provided with an active radiating hole and a passive radiating hole;

the box body consists of six cover plates, and comprises a left cover plate, a right cover plate, a top cover plate, a bottom cover plate, a front cover plate and a back cover plate;

the radiator comprises an active radiator and a passive radiator, and the active radiator is fixed on the front side cover plate and aligned with the active radiating hole; the passive radiator is fixed on the back cover plate;

the power module is fixed on the bottom cover plate and is on the same horizontal line with the passive radiator;

the box body support comprises a first support and a second support which are fixed at two ends of the bottom cover plate of the box body in the length direction.

2. The micro 5G core network host chassis of claim 1, further comprising a processor nest plate and an expansion module disposed in the inner cavity of the case body, wherein the processor nest plate is fixed on the bottom cover plate by a screw, and the expansion module is fixed on the bottom cover plate by a screw.

3. The micro 5G core network mainframe box according to claim 1, wherein the cross sections of the first bracket and the second bracket along the length direction are semi-arched, and the micro 5G core network mainframe box comprises a first support piece fixed on the bottom cover plate and a second support piece fixed on the object placing plane, and two ends of the second support piece along the length direction are respectively provided with a cross-shaped mounting hole.

4. The micro 5G core network mainframe box of claim 1, wherein the passive heat dissipation holes include a power passive heat dissipation hole and an equipment passive heat dissipation hole that are opened on the back cover plate, wherein the power passive heat dissipation hole is aligned with the passive heat sink in a horizontal direction;

and the back cover plate is also provided with a processor die interface and an expansion module interface.

5. The micro 5G core network mainframe box according to claim 1, wherein the left cover plate is provided with a left air inlet hole, the right cover plate is provided with a right air inlet hole, and the left air inlet hole and the right air inlet hole are in the same horizontal plane.

6. The micro 5G core network host chassis according to claim 1, wherein a nameplate and a power key are disposed on the front side cover plate, and a first active heat dissipation hole and a second active heat dissipation hole are disposed on the front side cover plate, and the first active heat dissipation hole and the second active heat dissipation hole are symmetrically distributed with the power key as a center.

7. The miniature 5G core network host chassis of claim 1, wherein the miniature 5G core network host chassis is mounted on a wall, on a horizontal desktop, and embedded in a standard 1-2U-shaped frame.

8. The miniature 5G core network host chassis of claim 1, wherein the active heat dissipation aperture is 55% of the front side cover plate area.

9. The micro 5G core network mainframe box according to claim 1, wherein a dust screen is disposed on a side of the active heat dissipation hole facing away from the inner cavity of the case.

10. The micro 5G core network mainframe box according to claim 1, wherein the top cover plate is a detachable cover plate, and the periphery of the top cover plate is fixed with the left side cover plate, the right side cover plate, the front side cover plate and the back side cover plate by screws respectively.