CN220653641U - Bulk chip paster test fixture - Google Patents
Bulk chip paster test fixture Download PDFInfo
- Publication number
- CN220653641U CN220653641U CN202322132442.9U CN202322132442U CN220653641U CN 220653641 U CN220653641 U CN 220653641U CN 202322132442 U CN202322132442 U CN 202322132442U CN 220653641 U CN220653641 U CN 220653641U
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- fixed
- groove
- casing
- mounting
- top surface
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- 238000003825 pressing Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Tests Of Electronic Circuits (AREA)
Abstract
The utility model relates to the field of chip patch jigs and discloses a bulk chip patch trial jig which comprises a shell, wherein a limit groove is formed in the top surface of the shell, a placing groove is formed in the inner bottom surface of the limit groove, a plurality of through holes are formed in the inner bottom surface of the placing groove, the through holes are communicated with a cavity in the shell, two sliding holes are formed in the top surface of the shell, the sliding holes are communicated with the cavity in the shell, a limit plate is arranged in the shell, a plurality of movable columns are fixed on the top surface of the limit plate, the movable columns are arranged in a sliding mode with the through holes, the movable columns extend to the inner bottom surface of the placing groove, a plurality of springs are fixed on the bottom surface of the limit plate, and the other ends of the springs are fixedly arranged with the inner bottom surface of the shell. According to the utility model, the circuit board is ejected out of the inner wall surface of the placing groove through the cooperation of the spring and the pressing block, so that the circuit board can be rapidly taken out, and the working efficiency of the chip patch is improved.
Description
Technical Field
The utility model relates to the technical field of chip patch jigs, in particular to a bulk chip patch trial jig.
Background
Chip patch is an important link in the production process of electronic components, and the quality and efficiency of the chip patch directly influence the efficiency and product quality of the whole production line. In the chip mounting process, some jigs are usually required to assist in completing the mounting work, so as to improve the efficiency and reduce the manual operation error.
According to publication No.: chinese patent CN213547939U, a SMT printing and pasting jig, comprising an upper plate body, wherein the upper side of the upper plate body is provided with a first step, the inside of the first step is provided with a chip placing groove, and a plurality of miniature heat dissipation holes are arranged on the chip placing groove
The above solution still has the following drawbacks: the jig adopts the chip placing groove to place the chip, although the chip or the circuit board can be fixed, if the number of the chip or the circuit board is too large, the chip or the circuit board is easy to be clamped on the inner wall of the placing groove, so that the chip or the circuit board is not easy to take out after being processed, and a large amount of labor cost is wasted.
Disclosure of Invention
The utility model aims to provide a bulk chip patch test fixture, which is used for solving the problem that chips or circuit boards are not easy to take out after being processed, so that a large amount of labor cost is wasted.
In order to achieve the above object, the present utility model adopts the following technical scheme: the utility model provides a chip paster in bulk test fixture, includes the casing, the spacing groove has been seted up to the top surface of casing, the standing groove has been seted up to the inside bottom surface of spacing groove, a plurality of through-hole has been seted up to the inside bottom surface of standing groove, the through-hole is linked together with the inside cavity of casing, two slide holes have been seted up to the top surface of casing, the slide hole is linked together with the inside cavity of casing, the inside of casing is provided with the limiting plate, the top surface of limiting plate is fixed with a plurality of movable column, movable column and through-hole slip setting, the movable column extends to the inside bottom surface of standing groove, the bottom surface of limiting plate is fixed with a plurality of spring, the other end of spring and the inside bottom surface of casing are fixed to be set up, the left and right sides of limiting plate all is fixed with the press piece, press piece and slide hole slip setting, the inside of standing groove has placed the circuit board.
Preferably, one side of casing is fixed with the mounting bracket, the mounting hole has been seted up to the top surface of mounting bracket, the interior circular wall of mounting hole is fixed with the cylinder, the one end of cylinder telescopic link is fixed with the mounting panel, the bottom surface of mounting panel is fixed with the pressure equipment module.
Preferably, the top surface of casing is fixed with a plurality of spacing post, a plurality of spacing hole has been seted up to the top surface of mounting panel, spacing hole with spacing post slides and sets up.
Preferably, the four corners of the bottom surface of the shell are all fixed with supporting blocks, and the bottom surface of the supporting blocks is fixed with anti-slip pads.
Preferably, a guide block is fixed at one side of the shell, and the guide block corresponds to the limit groove.
Preferably, the mounting groove has been seted up in the inner wall left side of spacing groove, the holding tank is linked together with the mounting groove, the internal face of mounting groove is fixed with electric putter, electric putter telescopic link's one end is fixed with the promotion strip, promote strip and holding tank slip setting.
Compared with the prior art, the bulk chip patch test fixture adopting the technical scheme has the following beneficial effects:
1. the movable column can be driven to move under the action of the spring through the limiting plate, so that the circuit board can be placed in the placing groove, after the chip is crimped on the circuit board, the spring drives the limiting plate to reset, at the moment, the movable column applies upward force to the circuit board in the placing groove, so that the circuit board is ejected out of the inner wall surface of the placing groove, the circuit board can be rapidly taken out, subsequent processing is facilitated, the working efficiency of the chip patch is improved, and a large amount of labor cost is saved;
2. the mounting plate can be driven to move downwards through the air cylinder, the mounting plate can drive the pressing block to move, meanwhile, the press-mounting module can press the chip on the top surface of the circuit board, so that a large amount of labor cost is saved, and further manual operation errors are reduced;
3. the friction force between the supporting block and the top surface of the workbench can be increased through the anti-slip pad, so that the jig is prevented from sliding during working, the stability of the jig is improved, and the chip patch efficiency is improved;
4. can carry out the water conservancy diversion to the circuit board that the pressure equipment is good through the water conservancy diversion piece, make the tool can adapt to multiplex spare processing to improve the production efficiency of chip pressure equipment, and then improved the practicality of tool, simultaneously, can drive the promotion strip through electric putter and remove, after the chip paster on the circuit board, the promotion strip can promote the circuit board and remove to water conservancy diversion piece department, makes the circuit board can slide under the effect of water conservancy diversion piece, thereby makes things convenient for the staff to collect, and then saved a large amount of labour cost.
Drawings
Fig. 1 is a perspective view of an embodiment.
Fig. 2 is an exploded perspective view of an embodiment.
Fig. 3 is a perspective view of the limiting plate and the pressing block according to the embodiment.
Fig. 4 is an enlarged view of fig. 2 a of the embodiment.
In the figure: 1. a housing; 2. a limit groove; 3. a placement groove; 4. a through hole; 5. a sliding hole; 6. a limiting plate; 7. a movable column; 8. a spring; 9. pressing the blocks; 10. a circuit board; 11. a mounting frame; 12. a mounting hole; 13. a cylinder; 14. a mounting plate; 15. press-fitting the module; 16. a limit column; 17. a limiting hole; 18. a support block; 19. an anti-slip pad; 20. a flow guiding block; 21. a mounting groove; 22. a receiving groove; 23. an electric push rod; 24. pushing the strip.
Detailed Description
The preferred embodiments of the present utility model will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-4, a bulk chip patch test fixture comprises a housing 1, a limit groove 2 is formed in the top surface of the housing 1, a placement groove 3 is formed in the inner bottom surface of the limit groove 2, a plurality of through holes 4 are formed in the inner bottom surface of the placement groove 3, the through holes 4 are communicated with the inner cavity of the housing 1, two sliding holes 5 are formed in the top surface of the housing 1, the sliding holes 5 are communicated with the inner cavity of the housing 1, a limit plate 6 is arranged in the housing 1, a plurality of movable columns 7 are fixed on the top surface of the limit plate 6, the movable columns 7 and the through holes 4 are arranged in a sliding mode, the movable columns 7 extend to the inner bottom surface of the placement groove 3, a plurality of springs 8 are fixed on the bottom surface of the limit plate 6, the other ends of the springs 8 are fixedly arranged on the inner bottom surface of the housing 1, pressing blocks 9 are fixedly arranged on the left side and the right side of the limit plate 6, the pressing blocks 9 and the sliding holes 5 are slidably arranged, and a circuit board 10 is arranged in the placement groove 3.
In use, the movable column 7 can be driven to move under the action of the spring 8 through the limit plate 6, so that the circuit board 10 can be placed in the placing groove 3, after the chip is well pressed on the circuit board 10 in a pressing mode, the spring 8 drives the limit plate 6 to reset, at the moment, the movable column 7 applies upward force to the circuit board 10 in the placing groove 3, so that the circuit board 10 is ejected out of the inner wall surface of the placing groove 3, the circuit board 10 can be taken out rapidly, subsequent processing is facilitated, the work efficiency of chip mounting is improved, and a large amount of labor cost is saved.
As shown in fig. 1-3, a mounting frame 11 is fixed on one side of the housing 1, a mounting hole 12 is formed in the top surface of the mounting frame 11, an air cylinder 13 is fixed on the inner circular wall surface of the mounting hole 12, a mounting plate 14 is fixed at one end of a telescopic rod of the air cylinder 13, a press-fit module 15 is fixed on the bottom surface of the mounting plate 14, a plurality of limit posts 16 are fixed on the top surface of the housing 1, a plurality of limit holes 17 are formed in the top surface of the mounting plate 14, and the limit holes 17 and the limit posts 16 are slidably arranged.
In use, the mounting plate 14 can be driven to move downwards through the air cylinder 13, the mounting plate 14 can drive the pressing block 9 to move, the movable column 7 can move downwards, so that the circuit board 10 is stably placed in the placing groove 3, meanwhile, the press-mounting module 15 can press-mount chips on the top surface of the circuit board 10, so that a large amount of labor cost is saved, further, manual operation errors are reduced, meanwhile, the mounting plate 14 can be more stable in the downward movement process through the sliding arrangement of the limiting column 16 and the limiting hole 17, the press-mounting module 15 can stably press-mount the chips on the top surface of the circuit board 10, the chip mounting position is more accurate, and the chip mounting accuracy is improved.
As shown in fig. 1-3, support blocks 18 are fixed at four corners of the bottom surface of the housing 1, and anti-slip pads 19 are fixed at the bottom surface of the support blocks 18.
In use, the friction force between the support block 18 and the top surface of the workbench can be increased through the anti-slip pad 19, so that the jig is prevented from sliding during working, the stability of the jig is improved, and the chip mounting efficiency is further improved.
As shown in fig. 1-4, a guide block 20 is fixed on one side of the housing 1, the guide block 20 corresponds to the limit groove 2, an installation groove 21 is formed in the left side of the inner wall of the limit groove 2, a containing groove 22 is formed in the left side of the inner wall of the limit groove 2, the containing groove 22 is communicated with the installation groove 21, an electric push rod 23 is fixed on the inner wall surface of the installation groove 21, a pushing bar 24 is fixed on one end of a telescopic rod of the electric push rod 23, and the pushing bar 24 and the containing groove 22 are slidably arranged.
In use, the circuit board 10 which is well pressed and assembled can be guided by the guide blocks 20, so that the jig can adapt to multi-workpiece processing, the production efficiency of chip press fitting is improved, the practicability of the jig is further improved, meanwhile, the pushing strip 24 can be driven to move by the electric push rod 23, after the chip on the circuit board 10 is pasted, the circuit board 10 can be pushed by the pushing strip 24 to move to the guide blocks 20, the circuit board 10 can slide under the action of the guide blocks 20, the collection of workers is facilitated, and a large amount of labor cost is saved.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a chip paster in bulk test fixture, includes casing (1), its characterized in that, spacing groove (2) have been seted up to the top surface of casing (1), standing groove (3) have been seted up to the inside bottom surface of spacing groove (2), a plurality of through-hole (4) have been seted up to the inside bottom surface of standing groove (3), through-hole (4) are linked together with the inside cavity of casing (1), two slide holes (5) have been seted up to the top surface of casing (1), slide hole (5) are linked together with the inside cavity of casing (1), the inside of casing (1) is provided with limiting plate (6), the top surface of limiting plate (6) is fixed with a plurality of movable column (7), movable column (7) and through-hole (4) slide and set up, movable column (7) extend to the inside bottom surface of standing groove (3), the bottom surface of limiting plate (6) is fixed with a plurality of spring (8), the other end of spring (8) is fixed with the inside bottom surface of casing (1), both sides (9) are pressed down circuit (9) and are all pressed in the inside of limiting plate (6), sliding plate (9).
2. The bulk chip bonding test fixture of claim 1, wherein: one side of casing (1) is fixed with mounting bracket (11), mounting hole (12) have been seted up to the top surface of mounting bracket (11), interior circular wall face of mounting hole (12) is fixed with cylinder (13), the one end of cylinder (13) telescopic link is fixed with mounting panel (14), the bottom surface of mounting panel (14) is fixed with pressure equipment module (15).
3. The bulk chip bonding test fixture of claim 2, wherein: the top surface of casing (1) is fixed with a plurality of spacing post (16), a plurality of spacing hole (17) have been seted up to the top surface of mounting panel (14), spacing hole (17) with spacing post (16) slip setting.
4. The bulk chip bonding test fixture of claim 1, wherein: support blocks (18) are fixed at four corners of the bottom surface of the shell (1), and anti-slip pads (19) are fixed on the bottom surface of the support blocks (18).
5. The bulk chip bonding test fixture of claim 1, wherein: a guide block (20) is fixed on one side of the shell (1), and the guide block (20) corresponds to the limit groove (2).
6. The bulk chip bonding test fixture of claim 1, wherein: mounting groove (21) have been seted up in the inner wall left side of spacing groove (2), holding tank (22) are linked together with mounting groove (21), the internal face of mounting groove (21) is fixed with electric putter (23), electric putter (23) telescopic link's one end is fixed with promotes strip (24), promote strip (24) and holding tank (22) slip setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322132442.9U CN220653641U (en) | 2023-08-09 | 2023-08-09 | Bulk chip paster test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322132442.9U CN220653641U (en) | 2023-08-09 | 2023-08-09 | Bulk chip paster test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220653641U true CN220653641U (en) | 2024-03-22 |
Family
ID=90289179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322132442.9U Active CN220653641U (en) | 2023-08-09 | 2023-08-09 | Bulk chip paster test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220653641U (en) |
-
2023
- 2023-08-09 CN CN202322132442.9U patent/CN220653641U/en active Active
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| GR01 | Patent grant |