CN220627508U - RTC series injection molding power thick film fixed resistor - Google Patents
RTC series injection molding power thick film fixed resistor Download PDFInfo
- Publication number
- CN220627508U CN220627508U CN202322247345.4U CN202322247345U CN220627508U CN 220627508 U CN220627508 U CN 220627508U CN 202322247345 U CN202322247345 U CN 202322247345U CN 220627508 U CN220627508 U CN 220627508U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- circuit board
- flexible circuit
- silica gel
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000000919 ceramic Substances 0.000 claims abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000741 silica gel Substances 0.000 claims abstract description 26
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 229920006268 silicone film Polymers 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 abstract description 9
- 108010025899 gelatin film Proteins 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- Details Of Resistors (AREA)
Abstract
The utility model discloses an RTC series injection molding power thick film fixed resistor, which relates to the technical field of electric elements and comprises a shell, wherein a ceramic substrate is arranged at the inner bottom of the shell, a resistance leading-out end is printed on the ceramic substrate, a resistance film layer is printed on the top surface of the ceramic substrate, a glass glaze layer for protecting the resistance film layer is arranged on the resistance film layer, and a plug-in port is welded on the resistance leading-out end; the bottom surface of the ceramic substrate is provided with a silica gel bottom plate, and the silica gel bottom plate is provided with a mounting plate; by arranging the silica gel bottom plate and the mounting plate, when the flexible circuit board is mounted on the flexible circuit board or other flexible materials, the flexible circuit board is bent, the mounting plate and the silica gel bottom plate are driven to bend along with the flexible circuit board, so that the bending degree of the flexible circuit board in the mounting area is the same as that of the flexible circuit board in other areas, and the flexible circuit board is prevented from being damaged due to different bending degrees in a small range.
Description
Technical Field
The utility model relates to the technical field of electrical elements, in particular to an RTC series injection molding power thick film fixed resistor.
Background
The power thick film fixed resistor is widely applied to various electronic equipment and systems because of high power bearing capacity and high stability; the main characteristic is that a layer of resistance paste film is used as resistance material, the paste is usually ruthenium paste, the working principle is that the resistance paste is used for blocking current to realize the adjustment of the current in a circuit, when the current passing through the resistor is increased, the total current passing through the resistor is reduced due to the fact that the resistance paste is increased, otherwise, when the current passing through the resistor is reduced, the total current passing through the resistor is increased due to the fact that the resistance paste is reduced.
Through retrieval, one Chinese patent with the bulletin number of CN213691624U discloses a planar mounting type thick film power resistor, which comprises a rectangular shell, wherein a ceramic substrate is arranged at the inner bottom of the rectangular shell, a resistor layer is printed on the top surface of the ceramic substrate, electrode layers are printed at two ends of the resistor layer, epoxy resin is filled and sealed in the rectangular shell, a wiring strip for leading out the epoxy resin is welded on the electrode layers, and a threaded mounting hole is formed in the wiring strip; the four corners of the rectangular shell are respectively provided with a sinking groove; the resistor body is directly printed on the surface of the ceramic substrate by adopting a thick film power resistor technology, so that heat generated by the resistor during working can be timely conducted out, the resistor can obtain larger continuous power, and a radiator is not required to be additionally arranged; because the four corners of the rectangular shell are provided with the sinking grooves, the stress can be reduced and the deformation of the rectangular shell can be prevented when the rectangular shell is installed.
The size of the power thick film fixing resistor is relatively large, when the power thick film fixing resistor is installed on the flexible circuit board, the flexible circuit board is different from the flexible circuit board at other parts between the threaded installation holes in bending degree due to the size and the installation mode of the power thick film fixing resistor, and the part of the flexible circuit board, where the power thick film fixing resistor is installed, can be damaged due to multiple bending of the flexible circuit board.
Disclosure of Invention
In order to overcome the technical problems, the utility model aims to provide the RTC series injection molding power thick film fixed resistor so as to solve the problem that the service life of the flexible circuit board is influenced because the size of the power thick film fixed resistor is slightly large and is arranged on the flexible circuit board in the prior art.
The aim of the utility model can be achieved by the following technical scheme:
the RTC series injection molding power thick film fixed resistor comprises a shell, wherein a ceramic substrate is arranged at the inner bottom of the shell, a resistor leading-out end is printed on the ceramic substrate, a resistor film layer is printed on the top surface of the ceramic substrate, a glass glaze layer for protecting the resistor film layer is arranged on the resistor film layer, and a plug-in port is welded on the resistor leading-out end; the ceramic substrate bottom surface is provided with the silica gel bottom plate, be provided with the mounting panel on the silica gel bottom plate.
As a further scheme of the utility model: the ceramic substrate is close to the silica gel bottom plate one side and is arc concave, a plurality of heat dissipation grooves have been seted up in the arc concave.
As a further scheme of the utility model: epoxy materials are injected into the shell, and a silica gel film is arranged between the glass glaze layer and the epoxy materials.
The utility model has the beneficial effects that:
1. according to the utility model, the mounting plate on the silica gel bottom plate and the mounting plate on the silica gel bottom plate are arranged, so that when the flexible circuit board is mounted on the flexible circuit board or other flexible materials, the flexible circuit board is bent, the mounting plate and the silica gel bottom plate are driven to bend along with the flexible circuit board, and further the bending degree of the flexible circuit board in the mounting area is the same as that of the flexible circuit board in other areas, the flexible circuit board is protected conveniently, and the flexible circuit board is prevented from being damaged due to different bending degrees in a small range.
2. According to the utility model, the ceramic substrate, the arc-shaped concave surface and the plurality of radiating grooves are formed in the arc-shaped concave surface, so that the radiating efficiency of the utility model is improved, the bearing power of the utility model is further improved, and meanwhile, the radiating effect is prevented from being deteriorated due to the fact that the silica gel bottom plate is completely attached to the ceramic substrate.
Drawings
The utility model is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic cross-sectional view of the present utility model;
FIG. 2 is a schematic diagram of the structure of the present utility model;
fig. 3 is a schematic structural view of a ceramic substrate according to the present utility model.
In the figure: 1. a housing; 2. a ceramic substrate; 3. a resistor leading-out end; 4. a resistive film layer; 5. a glass glaze layer; 6. a silicone film; 7. a plug port; 8. a silica gel bottom plate; 9. and (3) mounting a plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1, the RTC series injection molding power thick film fixed resistor comprises a housing 1, wherein a ceramic substrate 2 is arranged at the bottom of the housing 1, a resistor leading-out end 3 is printed on the ceramic substrate 2, a resistor film layer 4 is printed on the top surface of the resistor leading-out end 3, a glass glaze layer 5 for protecting the resistor film layer 4 is arranged on the resistor film layer 4, and an inserting port 7 is welded on the resistor leading-out end 3; the bottom surface of the ceramic substrate 2 is provided with a silica gel bottom plate 8, and the silica gel bottom plate 8 is provided with a mounting plate 9; an epoxy material is injected into the shell 1, and a silica gel film 6 is arranged between the glass glaze layer 5 and the epoxy material.
As shown in fig. 1-2, the ceramic substrate 2 may be a 96% alumina ceramic substrate, or other ceramic materials with high temperature resistance, good insulation and better heat dissipation performance, and is used for dissipating heat from the resistive film layer 4; one end of the resistance leading-out end 3 is connected with the resistance film layer 4, the other end is welded with a plug-in port 7, and the plug-in port 7 can be a 187 standard port or other ports convenient for circuit connection, so that a user can conveniently use a connector for connection; the resistor film layer 4 is printed on the ceramic substrate 2, so that direct heat dissipation is facilitated, and meanwhile, the shape, size and thickness of the resistor film layer 4 and the resistor lead-out end 3 can be controlled in a printing mode; the glass glaze layer 5 is of a glass phase structure, has good compactness, moisture resistance and corrosion resistance, small thermal expansion and good toughness, is convenient for relieving resistance change caused by thermal shock, is convenient for improving the insulating property, the electrical property and the mechanical property of the resistor, and is convenient for protecting the resistor film layer 4 from damage; the epoxy material is injected into the shell 1 and can be solidified into different shapes through different dies, so that the components with specific shapes and sizes can be conveniently customized and designed, and meanwhile, the epoxy material has excellent electrical insulation property, can effectively isolate current and prevent current leakage or short circuit; the silica gel film 6 covers the outer surface of the glass glaze layer 5, and the silica gel film has good tenacious property, so that the damage caused by the glass glaze layer 5 due to the volume change when the epoxy material is solidified can be prevented.
As shown in FIG. 3, one surface of the ceramic substrate 2 is a flat plane, so that the printed resistor lead-out terminal 3 and the resistor film layer 4 are convenient, the other surface is an arc concave surface, a plurality of heat dissipation grooves are formed in the arc concave surface, so that the ceramic substrate 2 is convenient to dissipate heat, a silica gel bottom plate 8 is installed on one side of the arc concave surface of the ceramic substrate 2, the silica gel bottom plate 8 is rectangular or cannot be completely attached to the ceramic substrate 2 to influence the heat dissipation of the ceramic substrate 2, a mounting plate 9 is installed on the silica gel bottom plate 8, and screw holes are formed in the mounting plate 9, so that the mounting plate 9 and the silica gel bottom plate 8 are driven to bend along with the bending of the flexible circuit board when the ceramic substrate is installed on a flexible circuit board or other flexible materials, so that the bending degree of the flexible circuit board in the mounting area is the same as that of the circuit board in other areas, the flexible circuit board is convenient to protect the flexible circuit board, the flexible circuit board is prevented from being damaged due to different bending degrees in a small range, and meanwhile, the silica gel bottom plate 8 cannot be completely attached to the ceramic substrate 2, so that the ceramic substrate 2 is convenient to dissipate heat.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (3)
- The RTC series injection molding power thick film fixed resistor is characterized by comprising a shell (1), wherein a ceramic substrate (2) is arranged at the inner bottom of the shell (1), a resistance leading-out end (3) is printed on the ceramic substrate (2), a resistance film layer (4) is printed on the top surface of the ceramic substrate (2), a glass glaze layer (5) for protecting the resistance film layer (4) is arranged on the resistance film layer (4), and a plug-in port (7) is welded on the resistance leading-out end (3); the ceramic substrate (2) bottom surface is provided with silica gel bottom plate (8), be provided with mounting panel (9) on silica gel bottom plate (8).
- 2. The RTC series injection molding power thick film fixed resistor of claim 1, characterized in that a side of the ceramic substrate (2) close to the silica gel base plate (8) is an arc concave surface, and a plurality of heat dissipation grooves are formed in the arc concave surface.
- 3. The RTC series injection molded power thick film fixed resistor of claim 1, characterized in that an epoxy material is injection molded in the housing (1), and a silicone film (6) is arranged between the glass glaze layer (5) and the epoxy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322247345.4U CN220627508U (en) | 2023-08-21 | 2023-08-21 | RTC series injection molding power thick film fixed resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322247345.4U CN220627508U (en) | 2023-08-21 | 2023-08-21 | RTC series injection molding power thick film fixed resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220627508U true CN220627508U (en) | 2024-03-19 |
Family
ID=90219598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322247345.4U Active CN220627508U (en) | 2023-08-21 | 2023-08-21 | RTC series injection molding power thick film fixed resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220627508U (en) |
-
2023
- 2023-08-21 CN CN202322247345.4U patent/CN220627508U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |