CN220606157U - Thin film type T-shaped thermocouple - Google Patents
Thin film type T-shaped thermocouple Download PDFInfo
- Publication number
- CN220606157U CN220606157U CN202322204180.2U CN202322204180U CN220606157U CN 220606157 U CN220606157 U CN 220606157U CN 202322204180 U CN202322204180 U CN 202322204180U CN 220606157 U CN220606157 U CN 220606157U
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- insulating layer
- circuit
- layer
- circuit layer
- pair
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- 239000010409 thin film Substances 0.000 title claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 128
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 229910001006 Constantan Inorganic materials 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 229920006332 epoxy adhesive Polymers 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 4
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model discloses a thin film type T-shaped thermocouple, which comprises: a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer, and a third insulating layer; the first circuit layer is electrically connected with an external circuit; the second circuit layer is electrically connected with the external circuit and the first circuit layer; the first insulating layer, the first circuit layer, the second insulating layer, the second circuit layer and the third insulating layer are sequentially laminated. The utility model adopts the film type insulating layer and the etching circuit, thereby greatly reducing the thickness of the whole thermocouple, obviously improving the sensitivity and further improving the measurement precision; and the utility model can be bent and folded, and has wide application range.
Description
Technical Field
The utility model relates to the technical field of thermocouples, in particular to a thin film type T-shaped thermocouple.
Background
The circuit in the T-shaped thermocouple in the prior art adopts wires made of corresponding materials, and the thickness of the wires is relatively large and the thickness of the insulating layer is large, so that the thickness of the whole T-shaped thermocouple is large, the sensitivity of detection is reduced, and the measurement accuracy of an experiment is reduced.
Disclosure of Invention
According to an embodiment of the present utility model, there is provided a thin film type T-type thermocouple including: a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer, and a third insulating layer;
the first circuit layer is electrically connected with an external circuit;
the second circuit layer is electrically connected with the external circuit and the first circuit layer;
the first insulating layer, the first circuit layer, the second insulating layer, the second circuit layer and the third insulating layer are sequentially laminated.
Further, the method further comprises the following steps: and an adhesive layer disposed between the first circuit layer and the second insulating layer or between the second circuit layer and the second insulating layer, and the first circuit layer or the second circuit layer may be adhered to the third insulating layer.
Further, the adhesive layer is made of epoxy resin glue.
Further, the first circuit layer includes: a pair of copper circuits is provided to the substrate,
a pair of copper circuits is located between the first insulating layer and the second insulating layer.
Further, the second circuit layer includes: a pair of constantan circuits,
the pair of constantan circuits corresponds to the pair of copper circuits one by one and is electrically connected with the corresponding copper circuits;
a pair of constantan circuits is located between the second insulating layer and the third insulating layer.
Further, a pair of copper circuits and a pair of constantan circuits are etched.
Further, the method further comprises the following steps: the pair of first wires are respectively in one-to-one correspondence with the pair of copper circuits and the pair of constantan circuits; one end of the first wire is connected with the corresponding copper circuit, and the other end is connected with the corresponding constantan circuit.
Further, the first wires are connected to the corresponding copper circuits and the corresponding constantan circuits, respectively, by soldering.
Further, the first insulating layer, the second insulating layer, and the third insulating layer are polyimide films.
Further, the positions between the first circuit layer and the second circuit layer may be interchanged.
According to the thin film type T-shaped thermocouple provided by the embodiment of the utility model, the thickness of the whole thermocouple is greatly reduced by adopting the thin film type insulating layer and the etching circuit, the sensitivity is obviously improved, and the measurement accuracy is further improved; and is foldable and has wide application range.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the technology claimed.
Drawings
FIG. 1 is an overall schematic of an embodiment according to the present utility model;
FIG. 2 is an enlarged view of FIG. 1 in the direction A;
FIG. 3 is a schematic exploded view of an embodiment of the present utility model;
fig. 4 is a schematic diagram showing the distribution of the copper circuit, the second insulating layer and the constantan circuit according to the embodiment of the utility model.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings, which further illustrate the present utility model.
Firstly, a thin film type T-shaped thermocouple according to an embodiment of the present utility model will be described with reference to FIGS. 1 to 4, and is used in the thermocouple technical field, and its application scenario is very wide.
As shown in fig. 1 to 4, the thin film type T-type thermocouple according to the embodiment of the present utility model includes: a first insulating layer 1, a first circuit layer 2, a second insulating layer 3, a second circuit layer 5, and a third insulating layer 6;
the first circuit layer 2 is electrically connected with an external circuit;
the second circuit layer 5 is electrically connected with an external circuit and is electrically connected with the first circuit layer 2;
the first insulating layer 1, the first circuit layer 2, the second insulating layer 3, the second circuit layer 5 and the third insulating layer 6 are sequentially laminated; and then the two components are connected together by adopting a hot pressing mode, and can be bent and folded after being molded so as to be arranged on different products.
Further, as shown in fig. 3, in this embodiment, the method further includes: the adhesive layer 4, the adhesive layer 4 is disposed between the first circuit layer 2 and the second insulating layer 3, or between the second circuit layer 5 and the second insulating layer 3, and the first circuit layer 2 or the second circuit layer 5 may be adhered to the third insulating layer 6. In the present embodiment, the adhesive layer 4 is provided between the second circuit layer 5 and the second insulating layer 3.
Further, in this embodiment, the adhesive layer 4 is made of epoxy resin, and the epoxy resin has good electrical insulation property, so that an electrical insulation layer can be provided between the first circuit layer 2 and the second circuit layer 5, so as to prevent the occurrence of safety problems such as current short circuit or electric shock; meanwhile, the epoxy resin adhesive plays a role in bonding an upper layer and a lower layer. In the hot-pressing process, the first circuit layer 2 or the second circuit layer 5 is pressed with the second insulating layer 3, then the other surface of the second insulating layer 3 is coated with a layer of epoxy resin adhesive, and the other circuit layer which is not hot-pressed with the second insulating layer 3 is hot-pressed with the other surface of the second insulating layer 3, so that the hot-pressing effect with the second insulating layer 3 is better.
Further, as shown in fig. 1 to 2 and 4, in this embodiment, the first circuit layer 2 includes: a pair of copper circuits (i.e., pure copper circuits) as the positive electrode;
a pair of copper circuits is located between the first insulating layer 1 and the second insulating layer 3.
Further, as shown in fig. 1 to 2 and 4, in the present embodiment, the second circuit layer 5 includes: a pair of constantan (i.e., copper nickel alloy) circuits 51 as cathodes;
the pair of constantan circuits corresponds to the pair of copper circuits one by one and is electrically connected with the corresponding copper circuits;
a pair of constantan circuits is located between the second insulating layer 3 and the third insulating layer 6.
Further, in the present embodiment, a pair of copper circuits and a pair of constantan circuits are etched.
Further, as shown in fig. 1 to 2 and 4, in this embodiment, the method further includes: a pair of first wires 7, wherein the pair of first wires 7 are in one-to-one correspondence with the pair of copper circuits and the pair of constantan circuits; one end of the first wire 7 is connected to a corresponding copper circuit, and the other end is connected to a corresponding constantan circuit.
Further, in the present embodiment, the first wires 7 are connected to the corresponding copper circuits and the corresponding constantan circuits, respectively, by soldering.
Further, as shown in fig. 3, in the present embodiment, the first insulating layer 1, the second insulating layer 3, and the third insulating layer 6 are polyimide films, polyimide has excellent mechanical properties, is insoluble in an organic solvent, and has good insulating properties.
Further, in the present embodiment, the positions between the first circuit layer 2 and the second circuit layer 5 are interchangeable.
Further, in the present embodiment, it further includes: a coupling or external lead 8 for connection between the copper and constantan circuits and an external power source.
Further, in the present embodiment, it further includes: polyimide reinforcing plates 9 for reinforcing the connection of the copper circuit and constantan circuit with the external leads 8.
In general, the polyimide film has an adhesive on one side, and it is assumed that the first circuit layer 2 and the second insulating layer 3 have the adhesive on one side of the polyimide film and are thermally pressed; then, when the second circuit layer 5 is thermally pressed against the second insulating layer 3, an adhesive layer 4 needs to be coated on the surface where the second circuit layer 5 contacts the second insulating layer 3, so that the second circuit layer 5 is thermally pressed against the second insulating layer 3 more tightly. Yet another way is: a polyimide film with adhesive on both sides is selected as the second insulating layer 3, and the first circuit layer 2, the second insulating layer 3 and the second circuit layer 5 are simultaneously thermally bonded, so that it is not necessary to coat the second insulating layer 3 with an adhesive layer 4. Finally, the first insulating layer 1 and the second insulating layer 3 are hot pressed together.
In the above, the thin film type T-shaped thermocouple according to the embodiment of the utility model is described with reference to fig. 1-4, and the thickness of the whole thermocouple is greatly reduced by adopting the thin film type insulating layer and the etching circuit, so that the sensitivity is remarkably improved, and the measurement precision is further improved; and the utility model can be bent and folded, and has wide application range.
It should be noted that in this specification the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.
While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.
Claims (9)
1. A thin film type T-type thermocouple comprising: a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer, and a third insulating layer;
the first circuit layer is electrically connected with an external circuit;
the second circuit layer is electrically connected with an external circuit and the first circuit layer;
the first insulating layer, the first circuit layer, the second insulating layer, the second circuit layer and the third insulating layer are sequentially stacked.
2. The thin film type T-type thermocouple of claim 1, further comprising: and an adhesive layer disposed between the first circuit layer and the second insulating layer or between the second circuit layer and the second insulating layer, and the first circuit layer or the second circuit layer may be adhered to the insulating layer.
3. The thin film type T-type thermocouple of claim 2, wherein said adhesive layer is an epoxy adhesive.
4. The thin film type T-type thermocouple of claim 1, wherein said first circuit layer comprises: a pair of copper circuits is provided to the substrate,
the pair of copper circuits is located between the first insulating layer and the second insulating layer.
5. The thin film type T-thermocouple of claim 4, wherein said second circuit layer comprises: a pair of constantan circuits,
the pair of constantan circuits are in one-to-one correspondence with the pair of copper circuits and are electrically connected with the corresponding copper circuits;
the pair of constantan circuits is located between the second insulating layer and the third insulating layer.
6. The thin film type T-type thermocouple of claim 5, further comprising: the pair of first wires are respectively in one-to-one correspondence with the pair of copper circuits and the pair of constantan circuits; one end of the first wire is connected with the corresponding copper circuit, and the other end of the first wire is connected with the corresponding constantan circuit.
7. The thin film type T-type thermocouple of claim 6, wherein said first lead wires are connected to said corresponding copper circuit and said corresponding constantan circuit, respectively, by soldering.
8. The thin film type T-type thermocouple of claim 5, wherein said first insulating layer, second insulating layer and said third insulating layer are polyimide films.
9. The thin film type T-type thermocouple of claim 1, wherein the locations between the first circuit layer and the second circuit layer are interchangeable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204180.2U CN220606157U (en) | 2023-08-16 | 2023-08-16 | Thin film type T-shaped thermocouple |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204180.2U CN220606157U (en) | 2023-08-16 | 2023-08-16 | Thin film type T-shaped thermocouple |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220606157U true CN220606157U (en) | 2024-03-15 |
Family
ID=90163899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322204180.2U Active CN220606157U (en) | 2023-08-16 | 2023-08-16 | Thin film type T-shaped thermocouple |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220606157U (en) |
-
2023
- 2023-08-16 CN CN202322204180.2U patent/CN220606157U/en active Active
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