CN220592788U - Heat dissipation dustproof equipment for sapphire polishing operation and sapphire polishing system - Google Patents
Heat dissipation dustproof equipment for sapphire polishing operation and sapphire polishing system Download PDFInfo
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- CN220592788U CN220592788U CN202321985890.7U CN202321985890U CN220592788U CN 220592788 U CN220592788 U CN 220592788U CN 202321985890 U CN202321985890 U CN 202321985890U CN 220592788 U CN220592788 U CN 220592788U
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- polishing
- dust cover
- sapphire
- dust
- cooling device
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- 238000005498 polishing Methods 0.000 title claims abstract description 99
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 39
- 239000010980 sapphire Substances 0.000 title claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 239000000428 dust Substances 0.000 claims abstract description 78
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 230000002265 prevention Effects 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 claims abstract description 11
- 239000002826 coolant Substances 0.000 claims abstract description 10
- 238000007664 blowing Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000000191 radiation effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The present disclosure provides a heat dissipation dust prevention device and sapphire polishing system for sapphire polishing operation, comprising: the polishing device comprises a liquid cooling device for circularly supplying a cooling medium to a polishing position, an air cooling device for blowing cooling air to the polishing position, and a dust cover covered on the polishing position, wherein a filter screen is arranged on the dust cover so as to allow hot air of the polishing position to be discharged to an external space through the filter screen. According to the utility model, in the sapphire polishing processing process, the air cooling device and the liquid cooling device are combined together, so that the heat radiation effect is enhanced, the polishing position is positioned in the dust cover, and the filter screen is arranged on the dust cover, so that hot air in the dust cover can better circulate, the dust cover does not need to be opened for further heat radiation, the running and maintenance cost of parts such as a compressor in mechanical refrigeration is reduced, the energy consumption is greatly reduced, and the energy is saved.
Description
Technical Field
The disclosure relates to the technical field of radiators, in particular to a radiating dustproof device for sapphire polishing operation and a sapphire polishing system.
Background
The sapphire crystal has excellent chemical stability, thermal stability and radiation resistance, and is widely applied to the aviation, aerospace, civil industry and life fields. Meanwhile, the processing difficulty of the sapphire material is increased just because the sapphire has particularly stable chemical properties and high hardness.
The existing common sapphire wafer processing methods comprise grinding, mechanical polishing, chemical mechanical polishing, float polishing and other processing methods. In the process of processing and polishing the sapphire wafer, a water-cooling radiator is generally adopted, but the radiating effect cannot be achieved, the dust cover is required to be opened for radiating, so that the damage to parts such as a compressor in mechanical refrigeration is caused, and the running cost is increased.
Therefore, a need exists to provide a solution to the problem that the heat dissipation effect is achieved in the process of processing and polishing the sapphire wafer, the dust cover needs to be opened to dissipate the heat, so that the components such as the compressor are damaged in mechanical refrigeration, and the running cost is increased.
Disclosure of Invention
One technical problem to be solved by the present disclosure is: the problem of among the prior art reach the radiating effect in the in-process of carrying out processing polishing to sapphire wafer, need open the dust cover and dispel the heat, cause parts such as compressor damage in the mechanical refrigeration, have improved running cost is solved.
To solve the above technical problem, an aspect of an embodiment of the present disclosure provides a heat dissipation and dust prevention device for sapphire polishing operation, including: the polishing device comprises a liquid cooling device for circularly supplying a cooling medium to a polishing position, an air cooling device for blowing cooling air to the polishing position, and a dust cover covered on the polishing position, wherein a filter screen is arranged on the dust cover so as to allow hot air at the polishing position to be discharged to an external space through the filter screen.
In some embodiments, the heat dissipating dust device includes a housing for mounting the liquid cooling apparatus and/or the air cooling apparatus, the dust cover being rotatably coupled to the housing by a coupling shaft to allow the dust cover to rotate about the coupling shaft between different positions covering and uncovering the polishing position.
In some embodiments, the dust cover covers the air cooling device in a cover space of the dust cover in a state of covering the polishing position.
In some embodiments, the bottom of the dust cover is provided with a running track matched with the periphery of the polishing machine table, so that the dust cover is arranged on the periphery of the polishing machine table in the matched state.
In some embodiments, the air cooling device comprises a plurality of sets of fans arranged in pairs in a transverse direction and spaced apart from each other in a vertical direction, the fans being connected to blow cooling air toward the polishing location in a direction toward the filter screen.
In some embodiments, the device further comprises a motor for driving the fan to operate, and the motor drives the fan to operate and simultaneously can drive the dust cover to close.
In some embodiments, the heat dissipating dust-proof apparatus further includes a housing, the liquid cooling device includes a heat dissipating plate provided at one side of the housing, and the fan is mounted to the side of the housing where the heat dissipating plate is provided, such that the fan can cause the heat dissipating plate to dissipate heat.
In some embodiments, the dust cap is removably attachable to the polisher stage and is capable of being capped in an attached state at the polishing position above the polisher stage.
In some embodiments, the top end of the liquid cooling device is connected with a water inlet pipe, and the bottom end is connected with a water outlet pipe.
A second aspect of the disclosed embodiments provides a sapphire polishing system comprising a sapphire polisher and the heat dissipation and dust prevention apparatus described above.
Through above-mentioned technical scheme, the heat dissipation dust-proof equipment and sapphire polishing system for sapphire polishing operation that this disclosure provided, in sapphire polishing course of working, through combining forced air cooling device and liquid cooling device together, the radiating effect has been strengthened, and the polishing position is located the dust cover, be provided with the filter screen on the dust cover, make the circulation that hot air in the dust cover can be better, need not to open the dust cover and carry out further heat dissipation, and then reduce the operation and the maintenance cost of parts such as compressor in the mechanical refrigeration, greatly reduced the energy consumption, the energy has been practiced thrift.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
Fig. 1 is a schematic structural view of one implementation of a heat dissipating dust-proof device disclosed in an embodiment of the present disclosure.
Reference numerals illustrate:
1. a liquid cooling device; 2. a fan; 3. a dust cover; 4. a running rail; 5. a motor; 6. a housing; 7. and (3) a filter screen.
Detailed Description
Embodiments of the present disclosure are described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the disclosure and not to limit the scope of the disclosure, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.
The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.
In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the term "vertical" as used in this disclosure is not strictly vertical, but is within the tolerance of the error. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.
It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.
For overcoming the in-process that prior art exists to processing polishing to sapphire wafer and reaching the radiating effect, need open the dust cover and dispel the heat, cause parts such as compressor damage in the mechanical refrigeration, improved running cost's problem, this disclosed embodiment provides a radiating dustproof equipment for sapphire polishing operation, include: the polishing apparatus comprises a liquid cooling device 1 for circularly supplying a cooling medium to a polishing position, an air cooling device for blowing cooling air to the polishing position, and a dust cover 3 covered at the polishing position, wherein a filter screen 7 is provided on the dust cover 3 to allow hot air at the polishing position to be discharged to an external space through the filter screen 7.
Referring to fig. 1, the liquid cooling device 1 for circularly supplying the cooling medium to the polishing position can be combined with the air cooling device for blowing cooling air to the polishing position to be used in combination, so that the heat dissipation efficiency of the polishing machine table is improved, the dust cover 3 is arranged on the outer cover of the polishing position, the filter screen 7 is arranged on the dust cover 3, so that hot air generated in the polishing position can be allowed to be discharged to the external space through the filter screen 7, the cleaning of the air in the machine table is ensured, meanwhile, the temperature difference between the hot air and the external space is not too large, and the dust cover 3 does not need to be opened for further heat dissipation.
The cooling medium in the embodiments of the present disclosure may be water, deionized water, or other cooling medium, and in other embodiments, other types of cooling medium may be used, as long as the heat conductivity of the cooling medium can meet the cooling requirement of the polishing machine table.
Through above-mentioned technical scheme, the heat dissipation dustproof equipment that this disclosure provided, in sapphire polishing course of working, through combining forced air cooling device and liquid cooling device 1 together, the radiating effect has been strengthened, and the polishing position is located dust cover 3, be provided with filter screen 7 on the dust cover 3, make the circulation that hot air in the dust cover 3 can be better, need not to open dust cover 3 and carry out further heat dissipation, and then reduce the operation and the maintenance cost of parts such as compressor in the mechanical refrigeration, greatly reduced the energy consumption, practiced thrift the energy.
Wherein, according to some implementations of the disclosed embodiments, as shown in fig. 1, the heat dissipating dust-proof apparatus includes a housing 6 for mounting the liquid cooling device 1 and/or the air cooling device, and the dust cover 3 is rotatably connected to the housing 6 by a connecting shaft to allow the dust cover 3 to rotate about the connecting shaft between different positions of the cover and the open polishing position. It will be appreciated that the dust cap 3 may be rotatable by a connection shaft connected to the housing 6, allowing the dust cap 3 to rotate about the connection shaft between different positions covering and opening the polishing position, such that the dust cap 3 is able to completely cover the polishing position or the open state, etc.
Further, in a state where the cover is set at the polishing position, the dust cover 3 covers the air cooling device in the cover space. As shown in fig. 1, in a state of covering the polishing position, the dust cover 3 can completely cover the polishing position, so that dust and impurities are prevented from entering the polishing machine table to cause damage, and the inside is ensured to be clean.
In addition, the bottom of the dust cover 3 is provided with a running rail 4 which is matched with the periphery of the polishing machine table, so that the dust cover 3 is covered on the periphery of the polishing machine table in the matched state. It will be appreciated that the bottom of the dust cap 3 may be provided with a running rail 4 which cooperates with the periphery of the polishing machine table, ensuring that the dust cap 3 can further fully cover the polishing machine table along the running rail 4.
Wherein, according to some implementation manner of the embodiment of the disclosure, referring to fig. 1, the air cooling device comprises a plurality of sets of fans 2 which are transversely arranged in pairs and are vertically arranged at intervals, and the fans 2 are connected to blow cooling air to the polishing position along the direction towards the filter screen 7. The multiple groups of fans 2 are transversely arranged in pairs and vertically spaced from each other, the multiple groups of fans 2 are additionally arranged at different positions at even intervals, and the cooling air can be blown to polishing positions along the periphery, so that the polishing machine table is convenient to dissipate heat, and the fans 2 are additionally arranged at even intervals, so that the temperature of each position of the polishing machine table is kept as consistent as possible, and damage of local overhigh temperature equipment is prevented.
Further, the dust cover device also comprises a motor 5 for driving the fan 2 to operate, and the motor 5 can drive the dust cover 3 to be closed while driving the fan 2 to operate. As shown in fig. 1, by starting the motor 5 to rotate, the motor 5 drives the fan 2 to rotate, and then blows air towards the polishing position, so that heat dissipation to the polishing position is facilitated, and the motor 5 drives the fan 2 to rotate and simultaneously drives the dust cover 3 to be closed, it can be understood that the fan 2 rotates and exhausts air all around and simultaneously the dust cover 3 is driven to be closed by the motor 5, so that impurities and dust are prevented from entering the polishing machine table to cause damage.
The heat dissipation and dust prevention device further comprises a shell 6, the liquid cooling device 1 comprises a heat dissipation plate arranged on one side of the shell 6, and the fan 2 is mounted on one side of the shell 6, provided with the heat dissipation plate, so that the fan 2 can promote the heat dissipation of the heat dissipation plate. It will be appreciated that the heat dissipation plate may be made of copper, and may absorb a part of heat of the liquid cooling device 1 by providing the heat dissipation plate, and further improve the combustion efficiency by mounting the fan 2 to the side of the housing 6 provided with the heat dissipation plate, and using the fan 2 to generate flowing air flow to take away heat absorbed by the heat dissipation plate.
Wherein, according to some implementations of the disclosed embodiments, the dust cover 3 is detachably connected to the polisher stage and is capable of covering a polishing position above the polisher stage in a connected state. So set up, when the maintenance cleaning polisher platform is needed, convenient to detach dust cover 3, the staff of being convenient for maintains regularly washs etc..
Wherein, according to some implementations of the disclosed embodiments, the top end of the liquid cooling device 1 is connected with a water inlet pipe, and the bottom end is connected with a water outlet pipe. It will be appreciated that the worker installs the cooling pipes between the water inlet pipe and the water outlet pipe, respectively, so that the cooling medium flows therebetween to be supplied to the polishing position.
A second aspect of the disclosed embodiments provides a sapphire polishing system, wherein the sapphire polishing system comprises a sapphire polisher and the heat dissipation and dust prevention device described above.
Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.
Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.
Claims (10)
1. A heat dissipation dust protection apparatus for sapphire polishing operation, comprising: the polishing device comprises a liquid cooling device (1) for circularly supplying a cooling medium to a polishing position, an air cooling device for blowing cooling air to the polishing position and a dust cover (3) covered at the polishing position, wherein a filter screen (7) is arranged on the dust cover (3) so as to allow hot air at the polishing position to be discharged to an external space through the filter screen (7).
2. A heat dissipating dust preventing apparatus for sapphire polishing work according to claim 1, comprising a housing (6) for mounting the liquid cooling device (1) and/or the air cooling device, the dust cover (3) being rotatably connected to the housing (6) by a connecting shaft to allow the dust cover (3) to rotate about the connecting shaft between different positions covering and opening the polishing position.
3. The heat radiation and dust prevention apparatus for sapphire polishing work according to claim 2, wherein said dust cover (3) covers said air cooling device in a cover space thereof in a state of being covered at said polishing position.
4. The heat radiation and dust prevention apparatus for sapphire polishing work according to claim 2, wherein the bottom of the dust cover (3) is provided with a running rail (4) fitted with the periphery of the polishing machine table so that the dust cover (3) covers the periphery of the polishing machine table in a state where the running rail (4) is fitted with the periphery of the polishing machine table.
5. The heat radiation and dust prevention apparatus for sapphire polishing work according to claim 1, wherein the air cooling device comprises a plurality of sets of fans (2) arranged in pairs in the lateral direction and spaced apart from each other in the vertical direction, the fans (2) being connected to blow cooling air toward the polishing position in a direction toward the filter screen (7).
6. The heat radiation and dust prevention apparatus for sapphire polishing work according to claim 5, further comprising a motor (5) driving the fan (2) to operate, the motor (5) driving the fan (2) to operate and simultaneously driving the dust cover (3) to close.
7. The heat radiation and dust prevention apparatus for sapphire polishing work according to claim 6, further comprising a housing (6), wherein the liquid cooling device (1) comprises a heat radiation plate provided on one side of the housing (6), and the fan (2) is mounted to the side of the housing (6) provided with the heat radiation plate so that the fan (2) can cause the heat radiation of the heat radiation plate.
8. A heat dissipating dust preventing apparatus for sapphire polishing work according to claim 1, wherein the dust cover (3) is detachably attached to the polishing machine table and is capable of covering the polishing position above the polishing machine table in the attached state.
9. The heat dissipation and dust prevention device for sapphire polishing operation according to claim 1, wherein the top end of the liquid cooling device (1) is connected with a water inlet pipe, and the bottom end is connected with a water outlet pipe.
10. A sapphire polishing system comprising a sapphire polisher and a heat dissipation and dust prevention apparatus according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321985890.7U CN220592788U (en) | 2023-07-26 | 2023-07-26 | Heat dissipation dustproof equipment for sapphire polishing operation and sapphire polishing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321985890.7U CN220592788U (en) | 2023-07-26 | 2023-07-26 | Heat dissipation dustproof equipment for sapphire polishing operation and sapphire polishing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220592788U true CN220592788U (en) | 2024-03-15 |
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ID=90174695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321985890.7U Active CN220592788U (en) | 2023-07-26 | 2023-07-26 | Heat dissipation dustproof equipment for sapphire polishing operation and sapphire polishing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220592788U (en) |
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2023
- 2023-07-26 CN CN202321985890.7U patent/CN220592788U/en active Active
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