CN220584707U - Fingerprint card - Google Patents
Fingerprint card Download PDFInfo
- Publication number
- CN220584707U CN220584707U CN202322352470.1U CN202322352470U CN220584707U CN 220584707 U CN220584707 U CN 220584707U CN 202322352470 U CN202322352470 U CN 202322352470U CN 220584707 U CN220584707 U CN 220584707U
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- module
- card
- main board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004831 Hot glue Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 7
- 239000002313 adhesive film Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 238000012797 qualification Methods 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 18
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model discloses a fingerprint card, comprising: the electronic component is arranged on the main board, and the main board is arranged in a space formed by the two layers of printed card bases and the middle layer card base or is embedded in the middle layer card base; a groove is arranged at one end of the printed card base at the same side with the electronic component, a fingerprint module is arranged in the groove, the fingerprint module and the printed card base at the same side with the electronic component are basically positioned at the same horizontal plane, the fingerprint module and the main board are fixedly provided with supporting modules which are higher than the electronic component and are conductive up and down, and other idle spaces between the two layers of printed card bases are filled with glue. The support module is added in the fingerprint card, so that the electronic component is not extruded, the electronic component is bent to reach the test standard, and the support module is connected with the main board, so that the firmness and the product qualification rate of the fingerprint card are enhanced.
Description
Technical Field
The utility model relates to the field of electronic equipment, in particular to a fingerprint card.
Background
A fingerprint card is a kind of smart card for storing user fingerprint information and unlocking with user fingerprint. The development of smart card technology is mature along with the development of microelectronic technology, and the smart card technology has wide application in various fields such as financial payment, electronic passport and the like, and the requirements on the security level of the smart card are continuously improved, so that the fingerprint information is extracted and stored in the fingerprint card security chip, and the smart card security chip has been increasingly concerned by the industry.
The fingerprint card is packaged and manufactured by sealing a safety chip (SE) and a micro-processing chip (MCU) together to form a sealed body and independently packaging a fingerprint acquisition chip into a fingerprint module. In the prior art, when the fingerprint module is packaged, the fingerprint module and the flexible circuit board are connected in a hot-pressing mode by using high-temperature conductive adhesive, and when the fingerprint card is produced by adopting a visual card anisotropic conductive adhesive film (English full name: anisotropic Conductive Film, abbreviated as ACF) process, only the components on the fingerprint module are welded with a main board after the fingerprint module is pressed and welded, so that the fingerprint pad is not firmly contacted, defective products are easy to generate, and the electronic component is bent to fail to meet the test standard, thereby influencing the qualification rate of finished products.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a fingerprint card.
The embodiment of the utility model provides a fingerprint card, which comprises: the electronic component is arranged on the main board, and the main board is arranged in a space formed by the two layers of printed card bases and the middle layer card base or embedded in the middle layer card base; the electronic component comprises a main board, a printed card base and a fingerprint module, wherein a groove is formed in one end of the printed card base on the same side as the electronic component, the groove is internally provided with the fingerprint module, the fingerprint module and the printed card base on the same side are basically positioned on the same horizontal plane, a supporting module which is higher than the electronic component and conducts electricity up and down is fixedly arranged between the fingerprint module and the main board, and other idle spaces between the two layers of printed card bases are filled with adhesive.
Further, the support module is a heightened block or a conductive metal block.
Further, the heightening block is a printed circuit board with a bonding pad on the outer surface, a via hole is arranged on the printed circuit board, and a metal conducting layer is covered on the via hole wall.
Further, the conductive part and the bonding pad of the supporting module are fixed on the fingerprint module and the main board in a welding mode, and other parts of the fingerprint module are fixed through hot melt adhesive.
Further, the supporting module is fixed between the fingerprint module and the main board through conductive adhesive.
Further, the conductive adhesive is an anisotropic conductive adhesive film.
Further, a supporting module is fixedly arranged between the printed card base provided with the fingerprint module and the main board.
Further, the support module is fixedly arranged between the printing card base provided with the fingerprint module and the main board, and the support module is particularly fixed between the printing card base provided with the fingerprint module and the main board through hot melt adhesive.
Further, another groove is formed in the other end of the printed card base provided with the fingerprint module, a contact module is fixedly arranged in the other groove, and a conductive support module is fixedly arranged between the contact module and the main board.
Further, a conductive supporting module is fixedly arranged between the contact module and the main board, and the supporting module is particularly fixed between the contact module and the main board in a welding mode.
Further, the main board is made of a printed circuit board or a flexible circuit board.
Further, a transparent film is arranged on the outer surface of the two layers of printing card bases.
Compared with the prior art, the utility model has the following advantages: the fingerprint card is added with the support module, so that the electronic component is not extruded, the electronic component is bent to reach the test standard, and the product qualification rate of the fingerprint card is further enhanced; the connecting area of the fingerprint module and the main board is increased through the supporting module, so that the firmness between the fingerprint module and the main board is improved.
Drawings
Fig. 1 and fig. 2 are schematic diagrams of a fingerprint card according to an embodiment of the present utility model;
fig. 3 and 4 are schematic structural views of a support module according to an embodiment of the present utility model;
fig. 5 to 8 are schematic diagrams of a fingerprint card according to another embodiment of the present utility model.
Detailed Description
The application provides a fingerprint card, and the detailed description of the specific embodiments of the application is given below with reference to the accompanying drawings. Examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the present application.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In order to make the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail with reference to the accompanying drawings.
An embodiment of the present utility model provides a fingerprint card, as shown in fig. 1, including: the electronic component is arranged on the main board, and the main board is arranged in a space formed by the two layers of printed card bases and the middle layer card base (shown in figures 5 and 6) or is inlaid in the middle layer card base (shown in figures 7 and 8); a groove (shown in fig. 2) is arranged at one end of the printed card base on the same side (based on the main board) as the electronic component, a fingerprint module is arranged in the groove, the fingerprint module and the printed card base on the same side as the electronic component are basically on the same horizontal plane (the outer surface of the fingerprint module and the outer surface of the printed card base are basically on the same horizontal plane, namely the height difference between the fingerprint module and the printed card base is not more than a preset value, for example, the height difference is less than 0.2 millimeter), a supporting module which is higher than the electronic component and conducts electricity up and down is fixedly arranged between the fingerprint module and the main board, the electronic component is not extruded through the supporting module, the product is ensured to be qualified, other free spaces between the two layers of printed card bases (including gaps between the parts and other parts of the space formed by the two layers of printed card bases and the middle layer card base) are filled with an adhesive, and all the parts are adhered into a whole through the adhesive, wherein the adhesive can be glue (shown in fig. 5 and 6), for example, the glue is epoxy resin or UV glue;
optionally, as shown in fig. 3 and fig. 4, the supporting module may be an elevated block or a conductive metal block, where the metal block may be a copper block, an aluminum block, an iron block, and the like, and preferably, the conductive metal block in this embodiment is a copper block, the elevated block is a printed circuit board (english full name: printed circuit board, abbreviated to: PCB) with a pad on an outer surface, a via hole is formed on the printed circuit board, a metal conductive layer is covered on a via hole wall, and the metal conductive layer is used for conducting electricity between the fingerprint module and the motherboard;
in this embodiment, the supporting module is described in detail by taking a heightening block or a copper block as an example, wherein the printed circuit board of the heightening block can be a single layer or multiple layers, the specific layer number is determined by the height to be heightened, and the printed circuit board of the heightening block is preferably a double layer in this embodiment;
optionally, as shown in fig. 5-7, the conductive part and the bonding pad of the supporting module (such as the heightening block or the copper block) are fixed on the fingerprint module and the main board by soldering tin, other parts of the fingerprint module are fixed by hot melt adhesive, for example, the fingerprint module is fixed on the heightening block or the adhesive or the middle-layer card base by the hot melt adhesive, and the adhesion firmness of the fingerprint module can be further enhanced by the hot melt adhesive;
optionally, the supporting module is fixed between the fingerprint module and the main board by conductive adhesive, for example, in fig. 8, the heightening block is fixed between the fingerprint module and the main board by conductive adhesive; wherein, the conductive adhesive is preferably an anisotropic conductive adhesive film (English full name: anisotropic Conductive Film, abbreviated as ACF);
optionally, a supporting module is fixedly arranged between the printed card base provided with the fingerprint module and the main board, and the supporting module can be nonconductive; the support module is fixed between the printing card base provided with the fingerprint module and the main board through hot melt adhesive;
optionally, in this embodiment, as shown in fig. 5 to 8, another groove is also provided at the other end of the printed card base provided with the fingerprint module, a contact module is fixedly provided in the other groove, and a conductive support module may be fixedly provided between the contact module and the motherboard;
further, a conductive supporting module can be fixedly arranged between the contact module and the main board, and the supporting module is particularly fixed between the contact module and the main board in a welding mode;
optionally, in this embodiment, the main board may be a printed circuit board or a flexible circuit board (Flexible Printed Circuit, abbreviated as FPC);
preferably, as shown in fig. 5-8, a transparent film is provided on the outer surface of the two layers of printed card base.
According to the fingerprint card, the supporting module is added, the height of the welding surface is improved through the supporting module, the height of tin in a soldering tin process is thinned, the electronic component is prevented from being extruded, the electronic component is bent to reach the test standard, and the product qualification rate of the fingerprint card is further improved; the welding area is increased through the support module, or the support module, the fingerprint module and the support module and the main board are bonded by using ACF glue, so that the connection firmness between the fingerprint module and the main board is improved.
Although the present application has been described herein in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed application, from a review of the figures, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
Although the present application has been described in connection with specific features and embodiments thereof, it will be apparent that various modifications and combinations can be made without departing from the spirit and scope of the application. Accordingly, the specification and drawings are merely exemplary illustrations of the present application as defined in the appended claims and are considered to cover any and all modifications, variations, combinations, or equivalents that fall within the scope of the present application. It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.
Claims (12)
1. A fingerprint card, comprising: the electronic component is arranged on the main board, and the main board is arranged in a space formed by the two layers of printed card bases and the middle layer card base or embedded in the middle layer card base; the electronic component comprises a main board, a printed card base and a fingerprint module, wherein a groove is formed in one end of the printed card base on the same side as the electronic component, the groove is internally provided with the fingerprint module, the fingerprint module and the printed card base on the same side are basically positioned on the same horizontal plane, a supporting module which is higher than the electronic component and conducts electricity up and down is fixedly arranged between the fingerprint module and the main board, and other idle spaces between the two layers of printed card bases are filled with adhesive.
2. The fingerprint card of claim 1, wherein the support module is a raised block or a conductive metal block.
3. The fingerprint card of claim 2, wherein the raised block is a printed circuit board with a bonding pad on the outer surface, a via hole is arranged on the printed circuit board, and a metal conductive layer is coated on the via hole wall.
4. The fingerprint card of claim 1, wherein the conductive parts and the bonding pads of the support module are fixed on the fingerprint module and the main board by welding, and other parts of the fingerprint module are fixed by hot melt adhesive.
5. The fingerprint card of claim 1, wherein the support module is secured between the fingerprint module and the motherboard by conductive glue.
6. The fingerprint card of claim 5, wherein the conductive adhesive is an anisotropic conductive adhesive film.
7. The fingerprint card of claim 1, wherein a support module is fixedly provided between a printed card base provided with the fingerprint module and the main board.
8. The fingerprint card of claim 7, wherein a support module is fixedly arranged between the printed card base provided with the fingerprint module and the main board, and the support module is particularly fixed between the printed card base provided with the fingerprint module and the main board through hot melt adhesive.
9. The fingerprint card of claim 1, wherein another groove is provided at the other end of the printed card base provided with the fingerprint module, a contact module is fixedly provided in the other groove, and a conductive support module is fixedly provided between the contact module and the main board.
10. The fingerprint card of claim 9, wherein a conductive support module is fixedly arranged between the contact module and the main board, and the support module is fixed between the contact module and the main board in particular by welding.
11. The fingerprint card of claim 1, wherein the motherboard is made of a printed circuit board or a flexible circuit board.
12. The fingerprint card of claim 1, wherein a transparent film is provided on an outer surface of the two-layer printed card base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322352470.1U CN220584707U (en) | 2023-08-31 | 2023-08-31 | Fingerprint card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322352470.1U CN220584707U (en) | 2023-08-31 | 2023-08-31 | Fingerprint card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220584707U true CN220584707U (en) | 2024-03-12 |
Family
ID=90107325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322352470.1U Active CN220584707U (en) | 2023-08-31 | 2023-08-31 | Fingerprint card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220584707U (en) |
-
2023
- 2023-08-31 CN CN202322352470.1U patent/CN220584707U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |