CN220567640U - Portable semiconductor refrigeration water cup - Google Patents
Portable semiconductor refrigeration water cup Download PDFInfo
- Publication number
- CN220567640U CN220567640U CN202322288419.9U CN202322288419U CN220567640U CN 220567640 U CN220567640 U CN 220567640U CN 202322288419 U CN202322288419 U CN 202322288419U CN 220567640 U CN220567640 U CN 220567640U
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- CN
- China
- Prior art keywords
- cavity
- cup
- semiconductor
- heat dissipation
- water cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 241000190070 Sarracenia purpurea Species 0.000 title claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000005192 partition Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 230000035622 drinking Effects 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 235000013361 beverage Nutrition 0.000 abstract description 5
- 235000020965 cold beverage Nutrition 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 239000003507 refrigerant Substances 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005347 demagnetization Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
- 235000020681 well water Nutrition 0.000 description 1
- 239000002349 well water Substances 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a portable semiconductor refrigeration water cup, which comprises a cup cover, a cup body and a base, wherein the cup body comprises an outer shell and an inner container which are arranged inside and outside, and a reserved gap between the outer shell and the inner container is used as a cold air flow channel; a hollow cavity is formed in the base, a partition plate is arranged in the hollow cavity, a semiconductor patch is arranged on the partition plate through a mounting port, a cavity space at one side of a refrigerating surface of the semiconductor patch is used as a refrigerating circulation cavity, and a drainage fan is further arranged in the refrigerating circulation cavity; the cavity space at one side of the heating surface of the semiconductor is used as a heat dissipation circulation cavity, and a heat dissipation fan is further arranged in the heat dissipation cavity. The utility model aims to provide a portable semiconductor refrigeration water cup which has the advantages of small volume, low energy consumption, low noise, high reliability and no refrigerant pollution, and can realize rapid refrigeration of beverage in the cup by only introducing direct current when in use, thereby being particularly suitable for the drinking requirements of cold beverages in application scenes such as outdoor camping in summer, camping in field marching and the like.
Description
Technical Field
The utility model relates to the technical field of semiconductor refrigeration, in particular to a portable semiconductor refrigeration water cup.
Background
There are two ways to cool or maintain the object temperature below the natural environment temperature, one is artificial cooling, which includes liquid vaporization, gas expansion, thermoelectric, solid adiabatic demagnetization, etc., and the artificial cooling is various in variety and form. The energy sources used for refrigeration are different, and there are compression type refrigerators which use electric energy as energy sources for refrigeration, such as ammonia, fluorine and other working media for realizing refrigeration cycle; there are refrigeration with steam as energy source, such as steam type lithium bromide absorption refrigerator; and other heat energy is used as energy for refrigeration, such as a hot water type lithium bromide refrigerator, a lithium bromide refrigerator directly burning oil or natural gas, a solar absorption refrigerator and the like. It is to consume a certain amount of energy to exchange for transferring the heat of the low-temperature object to the high-temperature object, thereby obtaining the low temperature. The liquid vaporization heat absorption refrigeration is a refrigeration mode commonly adopted at home and abroad at present. The other is natural refrigeration, and a temperature of 0 ℃ or higher can be generally obtained by using deep well water or natural ice to cool objects. The refrigeration capacity (i.e. the heat removed from the object to be cooled) and the refrigeration temperatures that may be reached often do not meet the production requirements, natural cooling being a heat transfer process. Artificial refrigeration is a unit operation that utilizes refrigeration equipment to add energy to transfer heat from a low temperature object to a high temperature object, which is a thermodynamic process.
Water is one of the most common substances, is an important resource for life of all people including life, is also the most important component of organisms, is also interesting, and cold drink is a necessary choice for rapidly relieving summer heat and quenching thirst when the weather is hot, but because the temperature in summer is too high, the drink in the water cup is similar to the ambient temperature, the taste is poor, and the aim of clearing summer heat is difficult to achieve, so people usually drink the drink together with the water cup in refrigeration equipment such as a refrigerator, a freezer and the like after freezing for a period of time.
However, the traditional refrigeration equipment such as refrigerators, freezers and the like has large volume and high energy consumption, and the refrigerant is easy to leak to cause environmental pollution. Especially, for application scenes such as outdoor camping in summer, camping in field, and the like, the traditional refrigeration equipment has the defect of difficult movement, so that the refrigeration equipment is inconvenient to use.
Disclosure of Invention
The utility model aims to provide a portable semiconductor refrigeration water cup which has the advantages of small volume, low energy consumption, low noise, high reliability and no refrigerant pollution, and can realize rapid refrigeration of beverage in the cup by only introducing direct current when in use, and is particularly suitable for the drinking requirements of cold drinks in application scenes such as outdoor camping in summer, camping in field, and the like, thereby solving the technical problems set forth in the background art.
In order to achieve the above purpose, the utility model provides a portable semiconductor refrigeration water cup, which comprises a cup cover, a cup body and a base, and is characterized in that: the cup body comprises an outer shell and an inner container which are arranged inside and outside, and a reserved gap between the outer shell and the inner container is used as a cold air flow channel; a hollow cavity is formed in the base, a partition plate is arranged in the hollow cavity, a semiconductor patch is arranged on the partition plate through a mounting opening, a cavity space at one side of a refrigerating surface of the semiconductor patch is used as a refrigerating circulation cavity for communicating an external space with a cold air flow channel, and a drainage fan is further arranged in the refrigerating circulation cavity; the cavity space at one side of the heating surface of the semiconductor is used as a heat dissipation circulation cavity communicated with the external space, and a heat dissipation fan is further arranged in the heat dissipation cavity.
Furthermore, a plurality of pipe orifices serving as outlets of the refrigeration circulation chamber are convexly and uniformly distributed on the top surface of the base; through holes serving as cold air flow passage inlets are arranged on the bottom surface of the cup body in one-to-one correspondence with the pipe orifices.
Further, the side wall of the base is provided with an air inlet of the refrigeration circulation chamber and a heat dissipation opening of the heat dissipation circulation chamber respectively.
Further, a diffuser is also provided between the semiconductor die and the drainage fan.
Further, a heat sink is further provided between the semiconductor die and the heat dissipation fan.
Further, a section of outer convex cavity communicated with the hollow cavity is formed on the side wall of the base, and a control switch and a power interface are arranged on the cavity wall of the outer convex cavity.
Furthermore, the shell is made of heat-insulating materials, and the liner is made of heat-conducting materials.
Compared with the prior art, the utility model has the remarkable effects that:
1. according to the utility model, the Pelt effect of the semiconductor materials is utilized, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that the purpose of refrigeration is realized;
2. the utility model has the advantages of small volume, low energy consumption, low noise, high reliability and the like, is very convenient to carry, can realize the rapid refrigeration of the beverage in the cup by only introducing direct current when in use, is particularly suitable for the drinking requirement of cold drink in application scenes such as outdoor camping in summer, camping in field marching and the like, and has wide application prospect;
3. cold air is adopted as a refrigerating medium, and the cold air flow passage arranged in a ring shape is matched for wrapping the inner container, so that the heat exchange area is increased, the temperature of drinks in the inner container is reduced rapidly, the pollution of the refrigerant is avoided, and the use effect is better;
4. the refrigerating and radiating efficiency of the semiconductor patch can be simultaneously improved by utilizing the diffuser and the radiator, so that the refrigerating effect of the refrigerating surface of the semiconductor patch is ensured, and the temperature of the drink is gradually reduced;
5. the cup cover, the cup body and the base are all designed in a split mode, so that the cup is convenient for a user to carry and take, and the use is more convenient.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view (one) of a portable semiconductor refrigeration water cup according to a first embodiment;
FIG. 2 is a perspective view (II) of a portable semiconductor refrigeration water cup according to the first embodiment;
FIG. 3 is an assembly view of a portable semiconductor refrigeration water cup according to the first embodiment;
FIG. 4 is a schematic view showing the internal structure of a portable semiconductor cooling water cup according to the first embodiment;
FIG. 5 is a schematic view showing the internal structure of a cup in the first embodiment;
FIG. 6 is a schematic view (one) of the internal structure of the base in the first embodiment;
FIG. 7 is a schematic view of the internal structure of the base (II) in the first embodiment;
reference numerals in the drawings: 1-bowl cover, 2-cup, 3-base, 4-shell, 5-inner bag, 6-cold air runner, 7-baffle, 8-semiconductor paste, 9-refrigeration circulation cavity, 10-drainage fan, 11-heat dissipation circulation cavity, 12-heat dissipation fan, 13-mouth of pipe, 14-through-hole, 15-air inlet, 16-thermovent, 17-diffuser, 18-radiator, 19-evagination cavity, 20-control switch, 21-power interface.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, in the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Fig. 1 to 7 show a first embodiment of the present utility model: a portable semiconductor refrigeration water cup comprises a cup cover 1, a cup body 2 and a base 3, wherein the cup body 2 comprises a shell 4 and a liner 4 which are arranged inside and outside, and a reserved gap between the shell 4 and the liner 4 is used as a cold air flow channel 6; a hollow cavity is formed in the base 3, a partition 7 is arranged in the hollow cavity, a semiconductor patch 8 is arranged on the partition 7 through a mounting opening, a cavity space at one side of a refrigeration surface of the semiconductor patch 8 is used as a refrigeration circulation cavity 9 for communicating an external space with the cold air flow channel 6, and a drainage fan 10 is further arranged in the refrigeration circulation cavity 9; the cavity space on the side of the heating surface of the semiconductor die 8 serves as a heat dissipation circulation chamber 11 communicated with the external space, and a heat dissipation fan 12 is further arranged in the heat dissipation chamber.
As shown in fig. 3 and 5, in the implementation, a plurality of nozzles 13 serving as outlets of the refrigeration circulation chamber 9 are uniformly distributed on the top surface of the base 3 in a protruding manner; through holes 14 serving as inlets of the cold air flow channels 6 are formed in the bottom surface of the cup body 2 in one-to-one correspondence with the pipe orifices 13. The side wall of the base 3 is provided with an air inlet 15 of the refrigeration circulation chamber 9 and a heat radiation opening 16 of the heat radiation circulation chamber 11. It should be noted that, due to the characteristics of cooling on one side and heating on the other side of the semiconductor patch 8, when the current direction of the dc power supply is changed, the cooling surface can be changed to a heating surface, so as to heat the beverage in the inner container 4, and therefore, when a user needs to drink hot, the cooling surface can also be realized by the water cup of the embodiment.
As can be seen from fig. 6 and 7, a diffuser 17 is also provided between the semiconductor die 8 and the fan 10 in order to increase the cooling efficiency. Similarly, in order to increase the heat dissipation efficiency, a heat sink 18 is further disposed between the semiconductor die 8 and the heat dissipation fan 12.
As shown in fig. 2, a section of outer protruding cavity 19 communicated with the hollow cavity is formed on the side wall of the base 3, and a control switch 20 and a power interface 21 are arranged on the cavity wall of the outer protruding cavity 19. Specifically, the control switch 20 is connected to the control circuits of the semiconductor die 8, the drainage fan 10, and the heat radiation fan 12. The power interface 21 is used for switching in direct current.
In order to separate heat exchange between the shell 4 and cold air and improve heat exchange between the liner 4 and cold air so as to improve refrigeration efficiency, the shell 4 is made of a heat-insulating material, and the liner 4 is made of a heat-conducting material.
In summary, the utility model utilizes the Pelt' er effect of the semiconductor material, when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can absorb heat and emit heat respectively, thereby realizing the purpose of refrigeration; the utility model has the advantages of small volume, low energy consumption, low noise, high reliability and the like, is very convenient to carry, can realize the rapid refrigeration of the beverage in the cup by only introducing direct current when in use, is particularly suitable for the drinking requirement of cold drink in application scenes such as outdoor camping in summer, camping in field marching and the like, and has wide application prospect; cold air is adopted as a refrigerating medium, and the inner container 4 is wrapped by the cold air flow passages 6 which are arranged in a ring shape, so that the heat exchange area is increased, the temperature of drinks in the inner container 4 is reduced rapidly, the pollution of the refrigerant is avoided, and the use effect is better; the refrigerating and radiating efficiency of the semiconductor patch 8 can be simultaneously improved by utilizing the diffuser 17 and the radiator 18, so that the refrigerating effect of the refrigerating surface of the semiconductor patch is ensured, and the temperature of the drink is gradually reduced; the cup cover 1, the cup body 2 and the base 3 are all in split design, so that the cup is convenient for a user to carry and take, and the use is more convenient.
The above disclosure is only a preferred embodiment of the present utility model, and it should be understood that the scope of the utility model is not limited thereto, and those skilled in the art will appreciate that all or part of the procedures described above can be performed according to the equivalent changes of the claims, and still fall within the scope of the present utility model.
Claims (7)
1. The utility model provides a portable semiconductor refrigeration drinking cup, includes bowl cover, cup and base, its characterized in that: the cup body comprises an outer shell and an inner container which are arranged inside and outside, and a reserved gap between the outer shell and the inner container is used as a cold air flow channel; a hollow cavity is formed in the base, a partition plate is arranged in the hollow cavity, a semiconductor patch is arranged on the partition plate through a mounting opening, a cavity space at one side of a refrigerating surface of the semiconductor patch is used as a refrigerating circulation cavity for communicating an external space with a cold air flow channel, and a drainage fan is further arranged in the refrigerating circulation cavity; the cavity space at one side of the heating surface of the semiconductor is used as a heat dissipation circulation cavity communicated with the external space, and a heat dissipation fan is further arranged in the heat dissipation circulation cavity.
2. A portable semiconductor refrigeration water cup as set forth in claim 1 wherein: a plurality of pipe orifices serving as outlets of the refrigeration circulation cavity are convexly and uniformly distributed on the top surface of the base; through holes serving as cold air flow passage inlets are arranged on the bottom surface of the cup body in one-to-one correspondence with the pipe orifices.
3. A portable semiconductor refrigeration water cup as set forth in claim 2 wherein: the side wall of the base is respectively provided with an air inlet of the refrigeration circulation chamber and a heat dissipation opening of the heat dissipation circulation chamber.
4. A portable semiconductor refrigeration water cup as set forth in claim 3 wherein: and a diffuser is arranged between the semiconductor patch and the drainage fan.
5. A portable semiconductor refrigeration water cup as set forth in claim 4 wherein: and a radiator is arranged between the semiconductor patch and the radiating fan.
6. A portable semiconductor refrigeration water cup as claimed in any one of claims 1 to 5 wherein: a section of outer protruding cavity communicated with the hollow cavity is formed on the side wall of the base, and a control switch and a power interface are arranged on the cavity wall of the outer protruding cavity.
7. A portable semiconductor refrigeration water cup as set forth in claim 6 wherein: the shell is made of heat-insulating materials, and the liner is made of heat-conducting materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322288419.9U CN220567640U (en) | 2023-08-24 | 2023-08-24 | Portable semiconductor refrigeration water cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322288419.9U CN220567640U (en) | 2023-08-24 | 2023-08-24 | Portable semiconductor refrigeration water cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220567640U true CN220567640U (en) | 2024-03-08 |
Family
ID=90094924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322288419.9U Active CN220567640U (en) | 2023-08-24 | 2023-08-24 | Portable semiconductor refrigeration water cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220567640U (en) |
-
2023
- 2023-08-24 CN CN202322288419.9U patent/CN220567640U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |