CN220556462U - Scintillator packaging structure and detector - Google Patents

Abstract

The utility model relates to a scintillator packaging structure, which comprises a substrate, a scintillator arranged on the first surface of the substrate, wherein the exterior of the scintillator is coated with a packaging layer, the first surface of the substrate is provided with a main body area connected with the scintillator, and an edge area surrounding the main body area is arranged along the first direction and comprises a first area and a second area which are positioned on two opposite sides of the main body area, and the first area comprises a binding area; the packaging layer comprises a parylene film layer and a light absorption layer; in a first direction, the orthographic projection of the parylene film layer on the substrate comprises a first part and a second part which completely cover the main body area, and the second part at least covers part of the second area; in the first direction, the orthographic projection of the light absorbing layer on the substrate comprises a third part and a fourth part which completely cover the main body area, the fourth part at least covers part of the second area, and the orthographic projection area of the second part on the substrate is larger than the orthographic projection area of the fourth part on the substrate. The utility model also relates to a detector.

Description

Scintillator packaging structure and detector

Technical Field

The utility model relates to the technical field of photoelectric detection, in particular to a scintillator packaging structure and a detector.

Background

The FPXD flat panel detection comprises a direct type detector and an indirect type detector, wherein the direct type detector is mainly an amorphous selenium type detector, and can directly convert X-rays into electric signals; the indirect type scintillator is mainly of an amorphous silicon+scintillator structure, the scintillator is a material capable of emitting light after absorbing high-energy particles or rays, and is commonly used as cesium iodide crystals, and the working principle is as follows: an incident X-ray image is converted into a visible light image through a cesium iodide scintillation crystal; b: the visible light image is converted into a charge image by the amorphous silicon photodiode array of the next layer; c: the charge signals are extracted line by line, converted into digital signals, and then transmitted to a computer, thereby forming an X-ray digital image.

For indirect type detectors, in most application scenarios the higher the sensitivity of the detector, the better, so that the required image can be obtained with a lower dose. However, in some application scenarios, the sensitivity is not higher and better, for example, in the application of a breast detector, the breast detector is soft tissue due to the requirement of the application scenario, the used rays are soft rays, the self dose of the radiation is lower than that of a conventional common detector, if a higher signal-to-noise ratio is required, the sensitivity of the detector needs to be reduced to realize a larger dynamic range on the premise that the substrate noise cannot be reduced, so that the image quality is improved.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a scintillator packaging structure and a detector, which solve the problems of high sensitivity and limited application.

In order to achieve the above purpose, the technical scheme adopted by the embodiment of the utility model is as follows: a scintillator package structure includes a substrate, and a scintillator disposed on a first surface of the substrate, the scintillator configured to convert X-rays into visible light, the scintillator being externally coated with a package layer,

the first surface of the substrate is provided with a main body area connected with the scintillator and an edge area surrounding the main body area, and the edge area comprises a first area and a second area which are positioned on two opposite sides of the main body area along a first direction, wherein the first area comprises a binding area;

the packaging layer comprises a waterproof protective layer positioned on one side of the scintillator away from the substrate and a light absorption layer positioned on one side of the waterproof protective layer away from the scintillator;

in the first direction, the orthographic projection of the waterproof protective layer on the substrate comprises a first part which completely covers the main body area and a second part adjacent to the first part, and the second part at least covers part of the second area;

in the first direction, the orthographic projection of the light-absorbing layer on the substrate comprises a third part which completely covers the main body area and a fourth part adjacent to the third part, wherein the fourth part at least covers part of the second area, and the orthographic projection area of the second part on the substrate is larger than or equal to the orthographic projection area of the fourth part on the substrate.

Optionally, the waterproof protective layer comprises a parylene film layer.

Optionally, the substrate includes a first sidewall adjacent to the second region, the second portion includes a first sub-portion located on the first surface, and a second sub-portion formed by extending the first sub-portion away from the first portion, and an orthographic projection of the second sub-portion on the substrate covers at least a portion of the first sidewall.

Optionally, the substrate includes a first sidewall adjacent to the second region, and the substrate includes a second surface disposed opposite the first surface;

the orthographic projection of the second sub-part on the substrate completely covers the first side wall, and the second part further comprises a third sub-part which is formed by extending and bending the second sub-part, and the orthographic projection of the third sub-part on the substrate covers part of the second surface.

Optionally, the second surface includes a third region disposed opposite the binding region;

the binding region is located in an area outside of the orthographic projection of the first portion on the substrate, and the third region is located in an area outside of the orthographic projection of the third portion on the substrate.

Optionally, the area of the fourth portion is smaller than or equal to the area of the second region, and a difference between the length of the fourth portion and the length of the second region in the first direction is smaller than or equal to 0.2mm.

Optionally, the orthographic projection of the light absorbing layer on the first surface is located within the orthographic projection of the parylene film layer on the first surface.

Optionally, the light absorbing layer includes a black film layer connected to the scintillator, the black film layer having a reflectance of less than 5% reflecting visible light.

Optionally, the light absorbing layer further includes a carbon nano-coating layer located on a side of the black film layer away from the substrate.

Optionally, the packaging layer further comprises a metal film layer located on one side of the carbon nano coating away from the substrate.

Optionally, the packaging layer further comprises a PET protection film layer located on one side, far away from the substrate, of the metal film layer.

Optionally, the packaging adhesive is coated on one side of the packaging layer close to the second area, and coated on the outer part of the first side wall of the substrate close to one side of the second area.

Optionally, the thickness of the parylene film layer is 10-30um.

Optionally, the thickness of the encapsulation layer is 100-200um.

The embodiment of the utility model also provides a detector, which comprises the scintillator packaging structure and further comprises a functional circuit module arranged between the substrate and the scintillator, wherein the functional circuit module is used for converting the visible light into an electric signal and outputting the electric signal.

The beneficial effects of the utility model are as follows: the light absorption layer is arranged in the packaging layer of the scintillator packaging structure, so that the utilization rate of visible light is reduced, the sensitivity of the detector is reduced, the dose range to which the detector can respond is wider, and the dynamic range of the detector is improved.

In the first direction, the orthographic projection of the waterproof protective layer on the substrate comprises a first part which completely covers the main body area and a second part adjacent to the first part, the orthographic projection of the light absorption layer on the substrate comprises a third part which completely covers the main body area and a fourth part adjacent to the third part, and the orthographic projection area of the second part on the substrate is larger than or equal to the orthographic projection area of the fourth part on the substrate. Therefore, the problem that the packaging distance of the packaging layer is small and peeling is easy to occur can be solved, the waterproof and moistureproof performances of the CsI packaging are improved, and a narrower frame is realized.

Drawings

FIG. 1 is a schematic diagram of a package structure in the related art;

FIG. 2 shows a first schematic view of a scintillator package structure in an embodiment of the present utility model;

FIG. 3 is a second schematic diagram of a scintillator package structure in an embodiment of the present utility model;

FIG. 4 shows a third schematic diagram of a scintillator pack structure in an embodiment of the present utility model;

fig. 5 is a schematic view showing a state of the formation of a parylene film layer by preliminary vapor deposition;

FIG. 6 is a schematic diagram showing the state of the parylene film after removing the excess portion;

fig. 7 shows a second schematic diagram of the state of the parylene film after removing the excess.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

Referring to fig. 2-7, the present embodiment provides a scintillator package structure, including a substrate 1, and a scintillator 2 disposed on a first surface 110 of the substrate 1, the scintillator 2 being configured to convert X-rays into visible light, the scintillator 2 being externally coated with a package layer,

the first surface 110 of the substrate 1 has a main body area connected with the scintillator 2, and an edge area surrounding the main body area, wherein the edge area includes a first area 102 and a second area 101 located at two opposite sides of the main body area along a first direction, and the first area 102 includes a binding area;

the encapsulation layer comprises a parylene film layer 31 positioned on the side of the scintillator 2 away from the substrate 1, and a light absorption layer positioned on the side of the waterproof protective layer away from the scintillator 2;

in the first direction (X direction with reference to fig. 2), the orthographic projection of the waterproof protective layer on the substrate 1 comprises a first portion 301 entirely covering the main body region and a second portion adjacent to the first portion 301, the second portion covering at least part of the second region 101;

in the first direction, the orthographic projection of the light-absorbing layer on the substrate 1 includes a third portion that completely covers the main body region and a fourth portion adjacent to the third portion, the fourth portion at least covers part of the second region 101, and the orthographic projection area of the second portion on the substrate 1 is greater than or equal to the orthographic projection area of the fourth portion on the substrate 1.

Fig. 1 is a schematic structural diagram of a conventional flat panel detector, which comprises a substrate 1, a scintillator 2 and a packaging film material 3, wherein the scintillator 2 is easy to deliquesce when being contacted with air, so that packaging is needed, a common packaging mode is a film-sticking mode, the packaging film material 3 is usually a composite film, the packaging film material 3 generally comprises an adhesive layer and a reflecting layer, the adhesive layer is used for bonding the scintillator 2 and the packaging film material 3, and the reflecting layer is used for reflecting scattered visible light to the substrate 1, so that the utilization rate of the visible light is improved, and the sensitivity of the detector is further improved.

But some application scenarios are not applicable for high sensitivity detectors. Therefore, in order to reduce the sensitivity of the detector, the present embodiment provides a scintillator package structure, compared with the package film material in the conventional technology, the reflective layer in the package layer is removed, and the light absorption layer is additionally provided, so that the intensity of visible light irradiated onto the substrate 1 can be greatly reduced, the PIN photodiode on the substrate 1 (the substrate 1 is provided with a functional circuit module for converting the visible light into an electrical signal and outputting the electrical signal, and the functional circuit module includes a photodiode for converting the visible light into an electrical charge) receives a reduced number of photons, resulting in a reduced number of generated photo-generated charges, the number of charges read by the reading circuit is reduced, the gray scale of the image is reduced under the same dose of X-ray irradiation represented on the image, and finally the sensitivity of the detector is reduced.

In order to achieve a narrow frame, in the first direction, the length of the second area 101 is relatively small, and the encapsulation distance of the encapsulation layer is relatively small, and even in some embodiments, in the second area 101, the encapsulation distance of the encapsulation layer is only 1.3mm, so that reliability cannot be ensured, and the encapsulation layer is easily peeled off due to the small encapsulation distance of the encapsulation layer, which causes deliquescence of the scintillator 2. In this embodiment, the waterproof protection layer is provided, so as to increase the connection stability between the whole packaging layer and the substrate.

Illustratively, the waterproof protective layer may include a dense organic film layer, such as a parylene film layer.

Parylene is a novel thermoplastic plastic, is prepared by a unique vacuum vapor deposition process, and is prepared by 'growing' completely conformally coated polymer film coatings on the surface of a substrate by active small molecules, has performance advantages which are difficult to compare with other coatings, and can be applied to surfaces with various shapes, including sharp edges, cracks and inner surfaces. Compared with the traditional packaging film material, the packaging layer in the embodiment is additionally provided with the parylene film layer 31, so that the waterproof and moistureproof performances of the packaging layer can be greatly improved, the area of orthographic projection of the second part of the parylene film layer 31 on the substrate 1 is larger than the area of orthographic projection of the fourth part of the light absorption layer on the substrate 1 in the second area 101, the phenomenon that the packaging layer is easy to peel due to short packaging distance is improved, a narrower frame is realized, and the detectable range of the breast detector is improved.

Referring to fig. 2 and 6, in an exemplary embodiment, the substrate 1 includes a first sidewall 11 adjacent to the second region 101, the second portion includes a first sub-portion 302 located on the first surface 110, and a second sub-portion 303 formed by extending the first sub-portion 302 away from the first portion 301, and an orthographic projection of the second sub-portion 303 on the substrate 1 covers at least a portion of the first sidewall 11.

In the conventional solution, in order to implement the narrow-side version, the length of the second area 101 of the substrate 1 in the first direction is smaller, and then the maximum length of the portion of the encapsulation layer corresponding to the second area 101 in the first direction is the length of the second area 101 of the substrate 1 in the first direction, which has lower reliability. In this embodiment, the parylene film layer 31 is added, and the parylene film layer 31 includes a first sub-portion 302 covering the first surface 110, and further includes a second sub-portion 303 formed by extending the first sub-portion 302 and covering the first sidewall 11, so that the packaging area of the whole packaging layer can be increased.

In fig. 2 and fig. 6, the second sub-portion 303 covers a portion of the first side wall 11, but not limited to this, the size of the orthographic projection area of the second sub-portion 303 on the first side wall 11 may be set according to actual needs, for example, the second sub-portion 303 may completely cover the first side wall 11.

Referring to fig. 3 and 7, in an exemplary embodiment, in order to further increase the overall packaging area of the packaging layer, the substrate 1 includes a first sidewall 11 adjacent to the second region 101, and the substrate 1 includes a second surface 120 disposed opposite to the first surface 110;

the front projection of the second sub-portion 303 on the substrate 1 completely covers the first side wall 11, and the second portion further includes a third sub-portion 304 formed by extending and bending the second sub-portion 303, and the front projection of the third sub-portion 304 on the substrate 1 covers the second surface 120.

In an exemplary embodiment, the second surface 120 includes a third region 103 disposed opposite the binding region;

the binding area is located in an area outside the orthographic projection of the first portion 301 on the substrate 1, and the third area 103 is located in an area outside the orthographic projection of the third portion on the substrate 1.

The substrate 1 is made of a transparent material, such as glass, and after the bonding process is performed through the bonding area, the second surface 120 needs to detect the bonding area located on the first surface 110, and then the third area 103 needs to be exposed, so that the parylene film 31 cannot cover the third area 103, so as not to affect the bonding detection of the bonding area.

Referring to fig. 5 to 7, in preparing the parylene film 31, a parylene film is grown on the surface of the substrate 1 (including the first surface 110, the second surface 120, the first sidewall 11, and the second sidewall disposed opposite to the first sidewall 11 in the first direction) using a vacuum vapor deposition process, referring to fig. 5. It should be noted that, before the vapor deposition process, a high-temperature adhesive tape is attached to the binding region of the substrate 1 to be used as a simple mask, and after the vapor deposition process is finished, the high-temperature adhesive tape and the excess portion of the parylene film layer 31 are removed to expose the binding region and the third region 103, so as to facilitate the binding process.

According to practical needs, the parylene film layer 31 includes a first portion 301 covering the scintillator 2, a first sub-portion 302 located on the first surface 110, and a second sub-portion 303 located on the first sidewall 11, referring to fig. 6; or the parylene film layer 31 includes a first portion 301 overlying the scintillator 2, a first sub-portion 302 at the first surface 110, a second sub-portion 303 at the first sidewall 11, and a third sub-portion 304 at the second surface 120, see fig. 7.

In an exemplary embodiment, the area of the fourth portion is less than or equal to the area of the second region 101, and a difference between the length of the fourth portion and the length of the second region 101 in the first direction is less than or equal to 0.2mm.

In an exemplary embodiment, the front projection of the light absorbing layer onto the first surface 110 is within the front projection of the parylene film layer 31 onto the first surface 110.

The arrangement of the parylene film layer 31 increases the encapsulation distance of the encapsulation layer of the second area 101 in the first direction, and improves the reliability.

In an exemplary embodiment, the light absorbing layer includes a black film layer 32 coupled to the scintillator 2, the black film layer 32 reflecting less than 5% of visible light.

In some embodiments, the black film 32 is a black adhesive layer, and the black film 32 is disposed to adhere the encapsulation layer to the surface of the substrate 1, and more importantly, absorb the visible light scattered to the position of the black film 32, so that the intensity of the visible light irradiated onto the substrate 1 of the detector can be greatly reduced, and the sensitivity of the detector is further reduced.

Referring to fig. 2 and 3, in an exemplary embodiment, the light absorbing layer further includes a carbon nano-coating layer 33 on a side of the black film layer 32 remote from the substrate 1.

Referring to fig. 2 and 3, the encapsulation layer further includes a metal film layer 34 on a side of the carbon nano-coating 33 remote from the substrate 1, as an example.

The metal film layer 34 has the function of enhancing the waterproof and moistureproof effects of the packaging layer, the carbon nano coating 33 is matched with the black film layer 32, so that the overall light absorption effect of the packaging layer is further enhanced, the light reflection generated by the fact that the unabsorbed visible light irradiates the surface of the metal film layer 34 is prevented, and the uniformity of image quality can be improved.

The metal film layer 34 may be, for example, an aluminum foil, but is not limited thereto.

In an exemplary embodiment, the encapsulation layer further comprises a PET protection film layer 35 located on a side of the metal film layer 34 remote from the substrate 1.

The PET protective film layer 35 is used for protecting the metal film layer 34.

Referring to fig. 2 and 3, the exemplary scintillator package structure further includes an encapsulation compound 4, where the encapsulation compound 4 is coated on a side of the encapsulation layer near the second area 101, and coated on an outer portion of the first sidewall 11 on a side of the substrate 1 near the second area 101.

The encapsulation adhesive 4 may be UV adhesive, but not limited to this, the arrangement of the encapsulation adhesive 4 may enhance the connection stability between the encapsulation layer and the substrate 1, and the encapsulation adhesive 4 may protect the side surface of the encapsulation layer and the first side wall 11, thereby enhancing the waterproof effect.

In an exemplary embodiment, the thickness of the parylene film layer 31 is 10-30um, and the excessive thickness can easily influence the MTF characteristic (modulation transfer function (Modulation Transfer Function) of the detector, wherein the larger the MTF value is, the more obvious the image Contrast effect is, the Resolution (Resolution) and Contrast (Contrast) for evaluating the imaging of the flat panel detector are, the higher the Resolution is, the clearer and finer the shot image is, the higher the Contrast is, the more vividly the middle level, dark portion level, low Contrast shadow detail, weak Contrast and subtle color change are, and the lens with high Contrast is, so that the image has vivid contour, sharp edge, normal Contrast, rich level, fine texture, bright Contrast, strong color transition, soft color restoration reality and natural sense.

The encapsulation layer is illustratively 100-200um thick. The thickness of the encapsulation layer is too thick, which affects the adhesion effect between the encapsulation layer and the substrate 1 and is prone to warpage.

It should be noted that the encapsulation layer includes a parylene film layer 31 and a composite encapsulation film layer 30 (including a light absorbing layer, a metal film layer, and a PET protective film layer) other than the parylene film layer 31, and the parylene film layer 31 includes a first portion 301 covering the scintillator 2, and a second portion including a first sub-portion 302 covering the second region 101, and a second sub-portion 303 located on the first sidewall 11, and/or a third sub-portion 304 located on the second surface 120. The main area includes an AA area (effective display area) 10 with respect to the first surface 110, and the area of orthographic projection of the scintillator 2 on the first surface 110 is larger than the area of the AA area 10, so as to ensure uniformity of an image. The area of the orthographic projection of the portion (the first portion 301 and the first sub-portion 302) of the parylene film layer 31 located at one side of the first surface 110 on the first surface 110 is larger than the area of the orthographic projection of the scintillator 2 on the first surface 110, so that the waterproof performance is ensured, the area of the orthographic projection of the composite encapsulation film layer 30 on the first surface 110 is larger than the sum of the area of the orthographic projection of the first portion 301 on the substrate 1 and the area of the orthographic projection of the first sub-portion 302 on the substrate 1,

it should be noted that, the encapsulation distance of the encapsulation layer covering the scintillator 2 (the orthographic projection of the encapsulation layer on the first surface 110 relative to the orthographic projection of the scintillator 2 on the substrate 1, the length of the flared portion) is required to be determined by the reliability requirement, and the encapsulation distance is generally required to be greater than 2.5mm in the area except the second area 101 of the edge area of the substrate 1; referring to fig. 4, a is the distance between the edge of the scintillator 2 and the corresponding edge of the AA region, b is the distance between the edge of the scintillator 2 and the corresponding edge of the parylene film layer 31, c is the distance between the edge of the parylene film layer 31 and the corresponding edge of the encapsulation film layer, d is the distance between the edge of the encapsulation layer and the corresponding edge of the substrate 1, (the binding region needs to be exposed for the first region 102 having the binding region), so as to perform the subsequent binding process. a+b+c+d is the product frame (i.e. the area outside the AA area 10 is the frame), in the first direction, the encapsulation distance b+c is less than or equal to the length of the frame in the X direction, i.e. the length of the binding area in the X direction, and in the non-binding direction (the side of the second area 101), the encapsulation distance b+c is less than or equal to the length of the frame in the X direction; in some embodiments, a is 1.5mm, b is 0.5mm, c is 3.5mm, and d is 4.5mm, but not limited thereto.

Note that a, b, c, d is other side than the side corresponding to the first side wall 11.

The embodiment of the utility model also provides a detector, which comprises the scintillator packaging structure and further comprises a functional circuit module arranged between the substrate 1 and the scintillator 2, wherein the functional circuit module is used for converting the visible light into an electric signal and outputting the electric signal.

The scintillator 2 material is typically vapor deposition CsI, and the functional circuit module includes a TFT array and a photodiode.

Specifically, the detection principle of the detector is as follows:

a: the incident X-ray image is converted into a visible light image by cesium iodide scintillation crystal (scintillator 2);

b: the visible light image is converted into a charge image by an amorphous silicon photodiode array (arranged on the substrate 1) of the next layer;

c: the charge signals are extracted line by line, converted into digital signals, and then transmitted to a computer, thereby forming an X-ray digital image.

The preparation process of the detector comprises the following steps:

firstly, cleaning a cut single Panel, putting the Panel into a CsI evaporation device for CsI evaporation, and taking out the Panel after the Panel is evaporated to a required thickness;

performing CVD (vapor deposition) evaporation of Parylene (Parylene), placing a sample in a form of Panel+CsI into a CVD device, and growing a Parylene film layer by using a vacuum vapor deposition process, wherein a Bonding region of the Panel needs to be attached by using a high-temperature adhesive tape before CVD, the Bonding region is used as a simple mask, the high-temperature adhesive tape is removed after CVD is completed, and the redundant CVD film is removed so as to expose the Bonding region for a subsequent Bonding process, as shown in FIG. 6 and FIG. 7;

attaching the composite packaging film layer 30 (it is to be noted that the parylene film layer 31 in the packaging layer and the composite packaging film layer 30 outside the parylene film layer 31 are separately attached, and the composite packaging film layer 30 is attached as a whole), wherein 2 modes of vacuum attaching and non-vacuum attaching can be selected, and the non-vacuum roll attaching technology is adopted in the embodiment, the composite packaging film layer 30 meeting the size requirement and the characteristic requirement is attached to the side, away from the scintillator 2, of the parylene film layer 31, namely, the waterproof and dampproof effects are achieved, and the scratch-proof effects are also achieved;

and (3) performing an IC binding procedure, and binding electronic devices such as a Gate IC (Gate drive IC) and a Data IC (Data drive IC) to the binding area, so that the X-ray CsI flat panel detector is manufactured.

It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present utility model, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the utility model, and are also considered to be within the scope of the utility model.

Claims (15)

1. A scintillator package structure comprising a substrate, and a scintillator disposed on a first surface of the substrate, the scintillator being configured to convert X-rays into visible light, the scintillator being externally coated with a package layer, characterized in that,

the first surface of the substrate is provided with a main body area connected with the scintillator and an edge area surrounding the main body area, and the edge area comprises a first area and a second area which are positioned on two opposite sides of the main body area along a first direction, wherein the first area comprises a binding area;

the packaging layer comprises a waterproof protective layer positioned on one side of the scintillator away from the substrate and a light absorption layer positioned on one side of the waterproof protective layer away from the scintillator;

in the first direction, the orthographic projection of the waterproof protective layer on the substrate comprises a first part which completely covers the main body area and a second part adjacent to the first part, and the second part at least covers part of the second area;

in the first direction, the orthographic projection of the light-absorbing layer on the substrate comprises a third part which completely covers the main body area and a fourth part adjacent to the third part, wherein the fourth part at least covers part of the second area, and the orthographic projection area of the second part on the substrate is larger than or equal to the orthographic projection area of the fourth part on the substrate.

2. The scintillator package structure of claim 1, wherein the waterproof protective layer comprises a parylene film layer.

3. The scintillator package structure of claim 1, wherein the substrate includes a first sidewall adjacent to the second region, the second portion includes a first sub-portion at the first surface, and a second sub-portion formed by the first sub-portion extending away from the first portion, an orthographic projection of the second sub-portion on the substrate covers at least a portion of the first sidewall.

4. The scintillator package structure of claim 3, wherein the substrate includes a first sidewall adjacent to the second region, and the substrate includes a second surface disposed opposite the first surface;

the orthographic projection of the second sub-part on the substrate completely covers the first side wall, and the second part further comprises a third sub-part which is formed by extending and bending the second sub-part, and the orthographic projection of the third sub-part on the substrate covers part of the second surface.

5. The scintillator package structure of claim 4, wherein the second surface includes a third region disposed opposite the binding region;

the binding region is located in an area outside of the orthographic projection of the first portion on the substrate, and the third region is located in an area outside of the orthographic projection of the third portion on the substrate.

6. The scintillator package structure according to claim 3 or 4, wherein an area of the fourth portion is smaller than or equal to an area of the second region, and a difference in length of the fourth portion and a length of the second region in the first direction is smaller than or equal to 0.2mm.

7. The scintillator package structure of claim 2, wherein an orthographic projection of the light absorbing layer on the first surface is located within an orthographic projection of the parylene film layer on the first surface.

8. The scintillator package structure of claim 1, wherein the light absorbing layer comprises a black film layer coupled to the scintillator, the black film layer reflecting less than 5% of visible light.

9. The scintillator package structure of claim 8, wherein the light absorbing layer further comprises a carbon nano-coating on a side of the black film layer remote from the substrate.

10. The scintillator package structure of claim 9, wherein the package layer further comprises a metal film layer located on a side of the carbon nano-coating remote from the substrate.

11. The scintillator package structure of claim 10, wherein the package layer further includes a PET protective film layer on a side of the metal film layer remote from the substrate.

12. The scintillator package structure of claim 1, further comprising an encapsulation compound that encapsulates the encapsulation layer on a side of the encapsulation layer adjacent to the second region and encapsulates the substrate on an outer portion of the first sidewall on a side of the substrate adjacent to the second region.

13. The scintillator package structure of claim 2, wherein the parylene film layer has a thickness of 10-30um.

14. The scintillator package structure of claim 1, wherein the thickness of the encapsulation layer is 100-200um.

15. A detector comprising the scintillator package structure of any one of claims 1 to 14, further comprising a functional circuit module disposed between the substrate and the scintillator, the functional circuit module being configured to convert the visible light into an electrical signal and output the electrical signal.