CN220474606U

CN220474606U - Feeding device of chip board

Info

Publication number: CN220474606U
Application number: CN202321431588.7U
Authority: CN
Inventors: 梁杰坤
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-06-06
Filing date: 2023-06-06
Publication date: 2024-02-09
Anticipated expiration: 2033-06-06

Abstract

The application discloses a material feeding unit of chip board relates to chip processing technology field. The application comprises the following steps: the mounting frame is connected with the laser welding machine; the conveying piece is arranged on the mounting frame, two sides of the substrate are positioned on the conveying piece, the conveying piece comprises a feeding end and a discharging end, and the conveying piece is used for conveying the substrate from the feeding end to the discharging end; the fixing piece is arranged on the conveying piece and is used for fixing the substrate when the substrate is conveyed to the blanking end; and the driving piece is arranged on the conveying piece and is used for enabling the fixing piece to fix the substrate. This application installs the mounting in the unloading end department of transportation spare, when the base plate moved unloading end department, makes the mounting fix the base plate through the cooperation of driving piece, and the chip of being convenient for on the base plate when unloading, has reduced the base plate and has rocked the possibility, has reduced the possibility that causes the influence to the unloading.

Description

Feeding device of chip board

Technical Field

The application relates to the technical field of chip processing, in particular to a feeding device of a chip board.

Background

In chip processing, a die bonding head is generally used for sucking the chip to be mounted on a substrate, and the substrate needs to be conveyed to the die bonding head so as to be mounted on the substrate.

The current conveyer is when transporting the unloading end with the base plate, conveyer stops to separate chip and base plate, when separating chip and base plate, can not avoid making the base plate rock, when rocking too big, cause the influence to subsequent unloading easily, lead to the base plate to roll over even, for this application provides a material feeding unit of chip board and improves this problem.

Disclosure of Invention

The purpose of the present application is: for solving current conveyer when transporting the unloading end with the base plate, conveyer stops to separate chip and base plate, when separating chip and base plate, can not avoid making the base plate rock, when rocking too big, cause the influence to subsequent unloading easily, lead to the problem that the base plate tumbles even, this application provides a material feeding unit of chip board.

The application specifically adopts the following technical scheme for realizing the purposes:

a feeding device for a chip board, comprising:

the mounting frame is connected with the laser welding machine;

the conveying piece is arranged on the mounting frame, two sides of the substrate are positioned on the conveying piece, the conveying piece comprises a feeding end and a discharging end, and the conveying piece is used for conveying the substrate from the feeding end to the discharging end;

the fixing piece is arranged on the conveying piece and is used for fixing the substrate when the substrate is conveyed to the blanking end;

and the driving piece is arranged on the conveying piece and connected with the fixing piece, and the driving piece is used for enabling the fixing piece to fix the substrate.

Further, the transport member includes:

the mounting plates are symmetrically arranged on the mounting frame, a plurality of belt pulleys are rotatably arranged on the mounting plates, the mounting plates are provided with driving motors, and the driving motors are connected with one of the belt pulleys;

and the conveying belt is sleeved on the belt pulley and is used for conveying the substrate.

Further, the fixing member includes:

an upper plate mounted on top of the mounting plate, the width of the upper plate being greater than the thickness of the mounting plate;

and the top plate is slidably arranged on the mounting plate, and is positioned at the bottom of the base plate when the base plate is transported.

Further, the upper surface of the top plate is an inclined surface, and the highest point of the inclined surface is positioned at the blanking end.

Further, the driving member includes:

the air cylinder is arranged on the mounting plate, and an L-shaped plate is arranged on the pushing end of the air cylinder;

the pushing plate is arranged on the L-shaped plate, and a sliding rod is arranged on the pushing plate;

the connecting plate is connected with the top plate, a chute is arranged on the connecting plate, the highest point of the chute is close to the discharging end, and the sliding rod is in sliding fit with the chute.

Further, the mounting frame is located at the blanking end and is provided with a baffle, and when the substrate is transported to the blanking end, the baffle blocks the substrate.

Further, install the splint on the mounting panel, install the slide bar on the splint, the slide hole has been seted up on the splint, and the splint passes through slide bar and slide hole and mounting bracket sliding connection, threaded connection has the conflict pole on the splint, conflict pole one end is located in the slide hole, the external screw thread has been seted up on the touch-up pole.

Further, the connecting plate is connected with the top plate through bolts.

The beneficial effects of this application are as follows: this application installs the mounting in the unloading end department of transportation spare, when the base plate moved unloading end department, makes the mounting fix the base plate through the cooperation of driving piece, and the chip of being convenient for on the base plate when unloading, has reduced the base plate and has rocked the possibility, has reduced the possibility that causes the influence to the unloading.

Drawings

FIG. 1 is a schematic perspective view of the present application;

FIG. 2 is an exploded view of a portion of the construction of the present application;

FIG. 3 is an exploded view of the transport structure of the present application;

FIG. 4 is an exploded view of yet another carrier structure of the present application;

reference numerals: 1. a mounting frame; 2. a transport member; 201. a feeding end; 202. a blanking end; 203. a mounting plate; 204. a belt pulley; 205. a driving motor; 206. a conveyor belt; 3. a fixing member; 301. an upper plate; 302. a top plate; 4. a driving member; 401. a cylinder; 402. an L-shaped plate; 403. a push plate; 404. a slide bar; 405. a connecting plate; 406. a chute; 5. a baffle; 6. a slide bar; 7. a slide hole; 8. a touch-up rod; 9. and (3) clamping plates.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

As shown in fig. 1, a feeding device for a chip board according to an embodiment of the present application includes:

the mounting frame 1 is connected with the laser welding machine, and the mounting frame 1 is used for bearing parts of the feeding device;

the conveying member 2 is arranged on the mounting frame 1, two sides of the substrate are positioned on the conveying member 2, the conveying member 2 comprises a feeding end 201 and a discharging end 202, the conveying member 2 is used for conveying the substrate from the feeding end 201 to the discharging end 202, and in use, the conveying member 2 conveys the substrate from the feeding end 201 to the discharging end 202, so that chips on the substrate are conveyed to a proper position for discharging;

the fixing piece 3 is arranged on the conveying piece 2, when the substrate is conveyed to the blanking end 202, the fixing piece 3 fixes the substrate, and when the substrate is conveyed to the blanking end 202, the substrate is fixed through the cooperation of the fixing piece 3, so that the possibility of shaking of the substrate during blanking is reduced;

the driving piece 4 is arranged on the transporting piece 2, the driving piece 4 is connected with the fixing piece 3, the driving piece 4 is used for enabling the fixing piece 3 to fix the substrate, and when the transporting piece 2 transports the substrate, the fixing piece 3 is used for fixing the substrate through the matching of the driving piece 4, so that the operation is convenient;

compared with the prior art, the fixing piece 3 is arranged at the blanking end 202 of the conveying piece 2, when the substrate moves to the blanking end 202, the fixing piece 3 is used for fixing the substrate through the matching of the driving piece 4, so that the possibility of shaking the substrate is reduced when the chip on the substrate is blanked, and the possibility of influencing the blanking is reduced.

As shown in fig. 1 and 3, in some embodiments, the transport 2 comprises:

the mounting plate 203 is symmetrically arranged on the mounting frame 1, a plurality of belt pulleys 204 are rotatably arranged on the mounting plate 203, the mounting plate 203 is provided with a driving motor 205, the driving motor 205 is connected with one of the belt pulleys 204, and the driving motor 205 is used for driving the belt pulleys 204 to rotate on the mounting plate 203;

the conveying belt 206 is sleeved on the belt pulley 204, the conveying belt 206 is used for conveying substrates, the conveying belt 206 is sleeved on the belt pulley 204, when the belt pulley 204 rotates, the conveying belt 206 is driven to move, and then the substrates on the conveying belt 206 are conveyed, and the conveying belt is convenient to convey.

As shown in fig. 3, in some embodiments, the fixture 3 includes:

an upper plate 301 mounted on top of the mounting plate 203, the width of the upper plate 301 being greater than the thickness of the mounting plate 203 such that the edges of the upper plate 301 are beyond the extent obscured by the mounting plate 203;

the top plate 302 slidably mounted on the mounting plate 203 is located at the bottom of the substrate when the substrate is transported, and when the substrate is used, the top plate 302 is slid upwards, so that the upper surface of the top plate 302 and the edge of the upper plate 301 clamp the substrate, the substrate is fixed, and when chips on the substrate are fed, the possibility of shaking of the substrate is reduced.

As shown in fig. 1, in some embodiments, the upper surface of the top plate 302 is an inclined plane, and the highest point of the inclined plane is located at the blanking end 202, so that the closer the substrate is to the blanking end 202, the smaller the distance between the top plate 302 and the upper plate 301 is, the easier the substrate is fixed, and the practicability of the device is improved.

As shown in fig. 3 and 4, in some embodiments, the driver 4 includes:

the cylinder 401 is arranged on the mounting plate 203, the L-shaped plate 402 is arranged on the pushing end of the cylinder 401, and a shorter section of the L-shaped plate 402 is connected with the cylinder 401;

the pushing plate 403 is arranged on the L-shaped plate 402, a sliding rod 404 is arranged on the pushing plate 403, the pushing plate 403 is in sliding connection with the mounting frame 1, a longer section of the L-shaped plate 402 is connected with the pushing plate 403, and when the air cylinder 401 pushes the L-shaped plate 402 to slide, the L-shaped plate 402 drives the pushing plate 403 to slide on the mounting frame 1 along the horizontal direction;

the connecting plate 405 connected with the top plate 302 is provided with a chute 406, the highest point of the chute 406 is close to the blanking end 202, the slide bar 404 is in sliding fit with the chute 406, the connecting plate 405 and the mounting frame 1 are in sliding connection along the vertical direction, when the push plate 403 slides, the slide bar 404 slides in the chute 406 and is guided by the chute 406, when the slide bar 404 moves to the top end of the chute 406, the top connecting plate 405 moves upwards with the top plate 302 to further clamp the substrate, and as the upper surface of the top plate 302 is an inclined plane, the top plate 302 can clamp the substrate without moving too much distance, and the practicability of the device is improved.

As shown in fig. 1 and 3, in some embodiments, the mounting frame 1 is located at the blanking end 202 and is provided with the baffle 5, when the substrate is transported to the blanking end 202, the baffle 5 blocks the substrate, when the substrate moves to the blanking end 202, the movement of the substrate is blocked by the baffle 5, so that the substrate cannot be transported by the transporting member 2 continuously, the substrate is kept stable in the process of being clamped by the fixing member 3, the possibility of shaking the substrate in the clamped process is reduced, and the stability of the substrate is increased.

As shown in fig. 2, in some embodiments, a clamping plate 9 is installed on the mounting plate 203, a sliding rod 6 is installed on the clamping plate 9, a sliding hole 7 is formed on the clamping plate 9, the clamping plate 9 is slidably connected with the mounting frame 1 through the sliding rod 6 and the sliding hole 7, an abutting rod 8 is connected with the clamping plate 9 through threads, one end of the abutting rod 8 is located in the sliding hole 7, an external thread is formed on the abutting rod 8, a gap is formed on the clamping plate 9, when in use, the abutting rod 8 is rotated to enable plates on two sides of the gap on the clamping plate 9 to be close to each other, the clamping plate 9 is abutted with the sliding rod 6, sliding of the sliding rod 6 is limited, the distance between the two mounting plates 203 is changed through the sliding mounting plate 203, then the transportation piece 2 is applicable to substrates with different lengths, after adjustment is completed, the abutting rod 8 is rotated again, the clamping plate 9 on the clamping plate is abutted against the sliding rod 6 again, sliding between the mounting plate 203 and the sliding rod 6 is limited, and stability of the transportation piece 2 in use is improved.

As shown in fig. 3, in some embodiments, the connecting plate 405 is connected with the top plate 302 by bolts, the top plate 302 is detachably connected with the connecting plate 405 by bolts, when the device is used for a long time, the top plate 302 collides with the substrate for a long time, abrasion can be generated, and the device is convenient to detach and replace the top plate 302, so that the possibility of weakening the clamping effect of the substrate due to the abrasion of the top plate 302 is reduced.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A feeding device for a chip board, comprising:

a mounting frame (1) connected with the laser welding machine;

the conveying piece (2) is arranged on the mounting frame (1), two sides of the substrate are positioned on the conveying piece (2), the conveying piece (2) comprises a feeding end (201) and a discharging end (202), and the conveying piece (2) is used for conveying the substrate from the feeding end (201) to the discharging end (202);

a fixing member (3) mounted on the transporting member (2), the fixing member (3) fixing the substrate when the substrate is transported to the discharging end (202);

and the driving piece (4) is arranged on the conveying piece (2), the driving piece (4) is connected with the fixing piece (3), and the driving piece (4) is used for enabling the fixing piece (3) to fix the substrate.

2. Feeding device for chip boards according to claim 1, characterized in that the transport element (2) comprises:

the mounting plate (203) is symmetrically arranged on the mounting frame (1), a plurality of belt pulleys (204) are rotatably arranged on the mounting plate (203), the mounting plate (203) is provided with a driving motor (205), and the driving motor (205) is connected with one belt pulley (204);

and the conveying belt (206) is sleeved on the belt pulley (204), and the conveying belt (206) is used for conveying the substrate.

3. A feeding device for chip boards according to claim 2, characterized in that the fixing member (3) comprises:

an upper plate (301) mounted on top of the mounting plate (203), the upper plate (301) having a width greater than the thickness of the mounting plate (203);

and a top plate (302) slidably mounted on the mounting plate (203), the top plate (302) being positioned at the bottom of the substrate when the substrate is transported.

4. A feeding device for chip boards according to claim 3, characterized in that the upper surface of the top plate (302) is an inclined surface, and the highest point of the inclined surface is located at the blanking end (202).

5. A feeding device for chip boards according to claim 3, characterized in that the driving member (4) comprises:

an air cylinder (401) mounted on the mounting plate (203), wherein an L-shaped plate (402) is mounted on the pushing end of the air cylinder (401);

a push plate (403) arranged on the L-shaped plate (402), wherein a sliding rod (404) is arranged on the push plate (403);

the connecting plate (405) is connected with the top plate (302), a chute (406) is formed in the connecting plate (405), the highest point of the chute (406) is close to the blanking end (202), and the sliding rod (404) is in sliding fit with the chute (406).

6. A feeding device for chip boards according to claim 1, characterized in that the mounting frame (1) is provided with a baffle (5) at the blanking end (202), which baffle (5) blocks the substrate when the substrate is transported to the blanking end (202).

7. The feeding device of a chip board according to claim 2, characterized in that a clamping plate (9) is installed on the mounting plate (203), a sliding rod (6) is installed on the clamping plate (9), a sliding hole (7) is formed in the clamping plate (9), the clamping plate (9) is in sliding connection with the mounting frame (1) through the sliding rod (6) and the sliding hole (7), an abutting rod (8) is connected to the clamping plate (9) through threads, one end of the abutting rod (8) is located in the sliding hole (7), and external threads are formed in the abutting rod (8).

8. The feeding device for chip boards according to claim 5, wherein the connecting plate (405) is bolted to the top plate (302).