CN220455568U

CN220455568U - Parallel photoelectric unit and optical module

Info

Publication number: CN220455568U
Application number: CN202322148645.7U
Authority: CN
Inventors: 郭琦; 张翠改; 翟广涛; 武玉谦
Original assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Current assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Priority date: 2023-08-10
Filing date: 2023-08-10
Publication date: 2024-02-06
Anticipated expiration: 2033-08-10

Abstract

The utility model discloses a parallel photoelectric unit and an optical module with the same, wherein the photoelectric unit comprises: the chip carrier is provided with a first bonding pad area on one side surface and a second bonding pad area on the opposite side surface, and the first bonding pad area is electrically connected with the second bonding pad area through an interlayer via hole and a wiring; the photoelectric chip assembly is provided with a photoelectric chip, the photoelectric chip is provided with an optical signal interface and an electric signal interface, and the electric signal interface is electrically connected with the first bonding pad area; the optical fiber array comprises a plurality of optical fibers, and the optical fibers are positioned in optical fiber holes of the optical connector and are used for connecting an optical signal interface; the plastic package shell is positioned on the chip carrier plate and is used for plastic packaging of the photoelectric chip assembly and the optical connector, and the optical port of the optical connector, which is used for being connected with an external optical connector, is exposed out of the plastic package shell. The application realizes small-size and independent encapsulation of the photoelectric unit, and is convenient for assembly and mass production; and the plastic package is adopted to protect the photoelectric chip and the light path, so that the reliability is good.

Description

Parallel photoelectric unit and optical module

Technical Field

The utility model belongs to the technical field of optical communication, and particularly relates to a parallel photoelectric unit and an optical module.

Background

With rapid popularization and deep application of optical communication products in 4G, 5G and cloud services, demands for parallel optical transceiver modules and daily increases, and market demands are also developed towards continuous miniaturization, high speed, high density and low power consumption. 24. The 48, 96 and even 192 channel optical modules are generally formed by mounting a plurality of 4-channel or 12-channel photoelectric units on a printed board through silver paste, and after gold wire bonding is completed, coupling is completed one by using a multi-channel N-in-1 optical fiber ribbon to be assembled into a whole. Along with the increase of the number of channels, the corresponding reliability risk is increased, any path of poor or invalid photoelectric signals can cause the functional failure of the whole optical module product, the communication of the whole link is affected, and only a new optical module can be replaced after the whole optical module is scrapped, so that the cost is huge.

In addition, the photoelectric bare chip has poor performance of tolerating severe environment, the photoelectric bare chip needs to be packaged and protected in the optical module, the optical path cavity and the packaging difficulty exist in the package of the lens or the protective cover, and the metal airtight packaging form has complex process and higher material price cost.

Disclosure of Invention

Aiming at the problems pointed out in the background technology, the application provides a parallel photoelectric unit, which realizes small-size and packaged independent photoelectric units, and is convenient for assembly and batch independent production; and the plastic package is adopted to protect the photoelectric bare chip and the optical path, so that the reliability is good.

In order to solve the technical problems, the utility model is realized by adopting the following technical scheme:

a parallel optoelectronic unit comprising:

the chip carrier comprises a chip carrier body, wherein a first bonding pad area is arranged on one side surface of the chip carrier body, a second bonding pad area is arranged on the other side surface opposite to the one side surface of the chip carrier body, and the first bonding pad area is electrically connected with the second bonding pad area through an interlayer via hole and a wiring;

an optoelectronic chip assembly having an optoelectronic chip with an optical signal interface and an electrical signal interface, the electrical signal interface being electrically connected with the first pad region;

an optical coupling assembly comprising an optical fiber array and an optical connector, the optical fiber array comprising a plurality of optical fibers, the optical fibers being positioned within an optical fiber bore of the optical connector for connecting the optical signal interface;

and the plastic package shell is positioned on the chip carrier plate and is used for plastic packaging the photoelectric chip component and the optical coupling component, wherein an optical port, which is used for being connected with an external optical connector, of the optical connector is exposed out of the plastic package shell.

The parallel photoelectric unit has the following beneficial effects:

(1) The parallel photoelectric unit is compact in arrangement structure and realizes small-size design;

(2) The photoelectric unit can be formed independently and normally, has universality, is suitable for batch production, and is convenient to design, assemble and assemble;

(3) The photoelectric unit is provided with an independent optical port and a second welding area serving as an electric interface, so that optical connection and electric connection are conveniently realized with the outside;

(4) The photoelectric chip and the light path can be protected through the plastic package, the process is simple, and the reliability of the photoelectric unit for tolerating severe environments is improved.

In some embodiments of the present application, a module attaching area is disposed on the chip carrier, and is used for attaching the optoelectronic chip assembly, and the first pad area is disposed at the periphery of the module attaching area;

the module pasting area is connected with the second bonding pad area through a plurality of heat dissipation holes and is used for dissipating heat of the photoelectric chip assembly.

The module pasting area and the second bonding pad area are connected through the radiating holes, so that when the photoelectric chip generates heat, the radiating holes and the second bonding pad area radiate heat to the outside, and the radiating efficiency is improved.

In some embodiments of the present application, the optoelectronic chip assembly includes:

a ceramic block bonded to the module bonding region;

the optical chip is attached to the ceramic block and is provided with the optical signal interface;

and the electric chip is attached to the ceramic block and is provided with a first bonding pad forming the electric signal interface, the first bonding pad is electrically connected with the first bonding pad area through gold wire bonding, and the optical chip is electrically connected with the electric chip.

In some embodiments of the present application, the electrical chip is attached to the top surface of the ceramic block, the optical chip is attached to a side surface of the ceramic block, a second bonding pad is further disposed on the electrical chip, and a third bonding pad is further disposed on the optical chip;

the second bonding pad and the third bonding pad are electrically connected through gold wire bonding in a 90-degree switching mode.

The optical chip is attached to the side face of the ceramic block, and is convenient to connect with an optical connector.

In some embodiments of the present application, the optical connector is the remainder of the multichannel mini-MT ferrule after cutting the tail end of the MT ferrule after passing through the optical fiber, wherein the cut surface is formed as an inclined surface;

and carrying out optical grinding on two end faces of the ferrule where the two free ends of the optical fiber are located.

In order to realize the small-size manufacture of the optical module, the conventional multichannel mini-MT ferrule is cut to form the optical connector, and the cutting surface is an inclined surface which facilitates optical coupling between the optical connector and an optical signal interface of the optical chip.

And the two end surfaces of the insert core where the two free ends of the optical fiber are positioned are subjected to optical grinding, so that the optical fiber end surfaces of the two free ends of the optical fiber meet the requirements of the optical surface, and the reliable transmission of optical signals is realized.

In some embodiments of the present application, an optical adhesive is filled between the optical fiber end face of the optical fiber on the cutting plane and the optical signal interface.

The optical cement is adopted to fill the cavity between the optical signal interface and the optical fiber end face, the optical port is protected, and the optical connector can be coupled, aligned and fixed before the whole photoelectric unit is subjected to plastic package.

The optical adhesive is optical matching adhesive, is made of EPOXY material, has the infrared light transmittance of more than 95% at 850nm, such as 353ND adhesive of EPOXY company.

In some embodiments of the present application, the distance from the cutting surface to the vertical surface perpendicular to the axis of the optical fiber hole decreases sequentially.

The inclined surface with the inclined degree is adopted, so that the optical glue is conveniently filled between the optical signal interface and the end face of the optical fiber.

In some embodiments of the present application, the plastic package is formed by plastic packaging by a plastic packaging process.

And adopting a standard procedure of a mature semiconductor plastic package chip to carry out plastic package protection on the photoelectric chip.

In some embodiments of the present application, a plurality of low temperature solder balls are implanted in the second pad area.

And a plurality of low-temperature solder balls are planted in the second bonding pad area, so that the low-temperature solder balls are convenient to electrically connect with an external unit.

The application also relates to an optical module comprising:

a main circuit board;

and the plurality of parallel photoelectric units are electrically connected with the main circuit board through the respective second pad areas, and the optical ports of the optical connectors in the parallel photoelectric units are used for being connected with external optical connectors.

The plurality of independently packaged photoelectric units are welded to the main circuit board, so that the application can be expanded to complete the integral assembly of the optical module, the plurality of opposite photoelectric units are independent, when one photoelectric unit is damaged, only the photoelectric unit is independently replaced, the use of other photoelectric units is not delayed, and the use reliability of the whole optical module is improved.

Other features and advantages of the present utility model will become more apparent from the following detailed description of embodiments of the present utility model, which is to be read in connection with the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of one embodiment of a parallel photovoltaic unit according to the present utility model;

FIG. 2 is an exploded view of one embodiment of a parallel photovoltaic unit according to the present utility model;

FIG. 3 is a block diagram of a chip carrier at a first angle in an embodiment of a parallel optoelectronic unit according to the present utility model;

FIG. 4 is a block diagram of a chip carrier at a second angle in an embodiment of a parallel optoelectronic unit according to the present utility model;

FIG. 5 is a block diagram of an optoelectronic chip assembly disposed on a chip carrier in an embodiment of a parallel optoelectronic unit according to the present utility model;

FIG. 6 is a block diagram of an optical connector formation in one embodiment of a parallel optoelectronic unit in accordance with the present utility model;

FIG. 7 is a diagram showing the connection of an optical connector to an optoelectronic chip assembly on a chip carrier in an embodiment of a parallel optoelectronic unit according to the present utility model;

FIG. 8 is a cross-sectional view of an optical connector and optoelectronic chip assembly disposed on a chip carrier in one embodiment of a parallel optoelectronic unit in accordance with the present utility model;

FIG. 9 is a block diagram of another embodiment of a parallel photovoltaic unit according to the present utility model;

fig. 10 is a block diagram of an embodiment of an optical module according to the present utility model.

Reference numerals:

100. a parallel photovoltaic unit; 110. a chip carrier; 111. a module pasting area; 112. a first pad region; 113. a second pad region; 120. an optoelectronic chip assembly; 121. a ceramic block; 122. an electrical chip; 123. an optical chip; 130. an optical connector; 130', MT ferrule tail end; 131. a core insert; 132. cutting the noodles; 133. an optical fiber hole; 134. an end face; 135/136, introducer needle; 140. a plastic package shell; 150. an optical adhesive; 160. solder balls;

200. a main circuit board; 300. an external optical connector; 400. an optical fiber.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Referring to fig. 1 to 9, the present application proposes a parallel optoelectronic unit 100 having a small size, high integration and having independent electrical and optical interfaces, convenient for electrical connection with external electrical components and optical connection with an optical connector 130; and the whole photoelectric unit 100 is integrally protected and sealed by adopting the plastic package 140, so that the capability of the photoelectric unit 100 for adapting to severe environments is improved.

Referring to fig. 1 and 2, the parallel optoelectronic unit 100 includes a chip carrier 110, an optoelectronic chip assembly 120, an optical connector 130, and a plastic package 140.

The chip carrier 110 is manufactured by a general chip carrier process, and the chip carrier 110 is plate-shaped and serves as a carrier of the whole photoelectric unit 100.

Referring to fig. 3 to 5, one side of the chip carrier 110 serves to support the optoelectronic chip assembly 120, and thus, a first pad region 112 is provided on the one side (e.g., upper surface) and a second pad region 113 is provided on the other side (e.g., lower surface) opposite to the one side, the second pad region 113 corresponding to the first pad region 112, wherein each pad region has a plurality of pads thereon for solder connection with other components.

In some embodiments of the present application, the first pad area 112 is used for connection of the chip carrier board 110 and the optoelectronic chip assembly 120, in particular, the optoelectronic chip assembly 120 includes an optoelectronic chip having an electrical signal interface and an optical signal interface.

Wherein the optoelectronic chip comprises an optical chip 123 and an electrical chip 122, the electrical chip 122 and the optical chip 123 are electrically connected, and the electrical chip 122 has an electrical signal interface, and the optical chip 123 has an optical signal interface.

The first pad area 112 is used to electrically connect the electrical chip 122 and the chip carrier 110, so the first pad area 112 may be an electrical chip bonding pad, and a gold wire bonding process is used to electrically connect the electrical signal interface of the electrical chip 122 and the first pad area 112 of the chip carrier 110.

The second pad area 113 is used for connecting the whole optoelectronic unit 100 with an external main circuit board, and is correspondingly connected with the first pad area 112 through interlayer vias and traces of the chip carrier 110.

Referring to fig. 3, in order to assemble the optoelectronic chip assembly 120, the upper surface of the chip carrier plate 110 further includes a module attaching region 111, and the first pad region 112 is disposed at the periphery of the module attaching region 111, so that electrical connection between the electrical chip 122 and the chip carrier plate 110 is facilitated through a gold wire bonding process.

Referring to fig. 3 and 5, the photo chip assembly 120 is attached at the module attaching region 111.

In some embodiments of the present application, the module attach area 111 is a copper sheet on the chip carrier 110.

In order to meet the heat dissipation requirement of the optoelectronic chip assembly 120, the module attaching region 111 is connected to the second pad region 113 through a plurality of heat dissipation holes (not shown), and when the optoelectronic chip assembly 120 works and generates heat, the heat is guided to the outside through the heat dissipation holes and the second pad region 113, so that good heat dissipation is realized.

The plurality of pads in the first pad area 112 are disposed correspondingly according to the positions of the electrical signal interfaces of the electrical chip 122 to facilitate electrical connection.

In some embodiments of the present application, the optoelectronic chip assembly 120 is assembled to the chip carrier plate 110 via a micro-assembly process.

In some embodiments of the present application, referring to fig. 5, the optoelectronic chip assembly 120 includes a ceramic block 121, an optical chip 123, and an electrical chip 122, wherein the optical chip 123 and the electrical chip 122 are respectively mounted on the ceramic block 121.

In order to achieve the connection of the electrical chip 122 and the first pad area 112, a first pad (not labeled) and a second pad (not labeled) are also provided on the electrical chip 122, the first pad being for electrical connection with the first pad area 112 on the chip carrier 110 via gold wire bonding.

The optical chip 123 also has a third pad (not shown) thereon, and the second pad and the third pad are also electrically connected via gold wire bonding.

In assembly, the ceramic block 121 is first adhered to the module adhering region 111 of the chip carrier 110 by conductive silver paste, and then the optical chip 123 and the electrical chip 122 are adhered to the ceramic block 121.

To facilitate the assembly of the optical signal interface of the optical chip 123 and the optical connector 130, and the electrical connection of the electrical chip 122 and the first pad area 111, the optical chip 123 is attached to the side of the ceramic block 121, and the electrical chip 122 is attached to the top surface of the ceramic block 121.

Since the optical chip 123 is attached to the side of the ceramic block 121 and the electrical chip 122 is attached to the top surface of the ceramic block 121, the second bonding pad and the third bonding pad are electrically connected by gold wire bonding in a 90-degree transfer manner, so that the micro-assembly process of the optical chip assembly 120 is completed.

As above, the circuit connection of the photo-electric chip assembly 120 is completed.

In some embodiments of the present application, the optical connector 130 is used to connect to an optical signal interface of the optoelectronic chip assembly 120, and is used to output an optical signal generated by the optoelectronic unit 100.

The optical connector 130 includes a ferrule 131, and the ferrule 131 is provided with an optical fiber hole 133, and a plurality of optical fibers are fixed in the optical fiber hole 133 through the optical fiber hole 133 for interfacing with an optical signal.

To meet the small-scale fabrication of the optoelectronic unit 100, the optical connector 130 is implemented on the basis of a conventional multi-channel Mini-MT ferrule.

In some embodiments of the present application, a conventional twelve channel Mini-MT ferrule is used.

After the optical fiber array passes through the twelve-channel mini-MT ferrule, the tail end 130' of the MT ferrule is cut after the optical fiber is fixed by dispensing, so that the cutting surface 132 is formed into an inclined surface, and the front end part of the residual MT ferrule forms the optical connector 130.

The cut surface 132 of the ferrule 131 and the outer end surface 134 opposite to the cut surface 132 need to be optically ground, so that the optical fiber end surfaces of the two free ends of the optical fiber meet the requirement of the optical surface.

After optical lapping is completed, a pair of guide pins 135/136 may be mounted on the ferrule 131 to facilitate docking with an external optical connector (e.g., an external MT ferrule or an MPO ferrule) via the guide pins 135/136.

And the optical fiber position deviation of the optical connector 130 on the cutting surface 132 is less than 3 micrometers, so as to meet the requirement of multimode optical fiber coupling precision.

As such, the fiber end face of the optical connector 130 on the cut face 132 is for optical connection with the optical signal interface of the optoelectronic chip assembly 120 (see fig. 7 and 8), and the fiber end face of the optical connector 130 on the outer end face 134 is for optical connection with an external optical connector.

In some embodiments of the present application, the distance between the cutting surface 132 and the vertical surface perpendicular to the horizontal axis where the optical fiber hole is located from top to bottom is sequentially reduced, so, the optical glue 150 is conveniently filled between the optical fiber end surface of the optical fiber on the cutting surface 132 and the optical signal interface, so as to seal the optical path cavity between the two and protect the optical path, and prevent the optical port from being polluted when the whole photoelectric unit 100 is molded by the plastic package 140, and affect the optical signal transmission.

Thus, the optical chip 123 and the optical connector 130 are coupled and aligned and fixed, and the optical path connection is completed.

In some embodiments of the present application, the cut surface 132 forms an angle with the vertical surface as described above of between 7 ° and 9 °.

In some embodiments of the present application, by means of active coupling, when the intensities of the optical signal and the electrical response signal are monitored in real time to be optimal, the optical path is fixed in a coupling manner, so as to complete the alignment connection between the optical connector and the optical chip.

In some embodiments of the present application, the distance from the cutting surface 132 to the vertical surface perpendicular to the horizontal axis of the optical fiber hole sequentially increases from top to bottom, so, when the optical adhesive 150 is filled between the optical fiber end surface of the optical fiber on the cutting surface 132 and the optical signal interface, it needs to be confirmed from the side whether the two achieve the coupling butt joint.

The optical adhesive 150 is an optical matching adhesive, an EPOXY material, and has an infrared light transmittance of more than 95% at 850nm, such as 353ND adhesive from EPOXY corporation.

As above, the electrical and optical connection of the optoelectronic chip assembly 120 is completed (see fig. 7 and 8), and thereafter, the entire optoelectronic unit 100 is protected by the plastic package 140.

The plastic package protection is sealed and packaged in a manner of being opposite to the metal seal, and the plastic package protection is easy to operate and simple in process.

Referring to fig. 1, a plastic package 140 is disposed on the chip carrier 110 and is used for plastic packaging the optoelectronic chip assembly 120 and the optical connector 130, wherein an optical port of the optical connector 130 is exposed from the plastic package 140 so as to be in optical connection with an external optical connector.

In some embodiments of the present application, the photovoltaic unit 100 is encapsulated using existing well-established semiconductor chip encapsulation processes to form the encapsulation 140, see fig. 1 and 9.

In this way, the standard photoelectric unit 100 having the uniform external dimensions is manufactured to have the optical port (i.e., the optical port for connecting the optical connector 130 with the external optical connector) and the electrical interface (i.e., the second pad region 113) for electrical connection, which are passively plugged.

To facilitate electrical connection of the optoelectronic unit 100 to an external main circuit board, low temperature solder balls 160 are implanted in the second pad area 113, see fig. 2 and 9.

Because the optoelectronic chip and the optical connector 130 are temperature sensitive, in some embodiments of the present application, low temperature solder SnBi solder balls are used, with a melting point of 138 ℃, to prevent the solder balls 160 from affecting the internal components of the optoelectronic unit 100.

Therefore, the miniaturized and plastic-packaged photoelectric unit 100 has an independent passive plug optical interface which is in butt joint with an external common MT (metal-insulator) ferrule and an independent electrical interface which is a low-temperature solder ball 160, and has good reliability and simple operation; and the optoelectronic chip is subjected to plastic packaging, so that protection of the optoelectronic bare chip is realized, and the optical glue 150 is adopted to protect the optical path and the optical port, so that the optoelectronic chip is suitable for various severe environments, and the use reliability of the whole optoelectronic unit 100 is improved.

The photoelectric unit 100 is used as a standard photoelectric unit, has low manufacturing cost, is suitable for mass production of semiconductor technology, can be conveniently used as an independent unit to be assembled in an optical module, and is convenient to repair and replace.

Referring to fig. 10, the present application also relates to an optical module including a main circuit board 200 and a plurality of photo cells, each of which may be the photo cell 100 described above with reference to fig. 1 to 9.

Only one photovoltaic unit, photovoltaic unit 100, is shown in fig. 10.

The plurality of photovoltaic units 100 are electrically connected to the main circuit board 200, respectively.

Since the optical module provided in this embodiment includes the optical unit 100 provided in the foregoing embodiment, the optical module has the same beneficial effects as those of the optical unit 100 described above, and will not be described herein again.

The multiple photoelectric units 100 are adopted, and can be applied to 24 paths or 48 paths of multi-channel optical modules, and the like in an expanding manner, so that the design and the assembly are convenient.

In the subsequent optical module production, a proper number of photoelectric units 100 can be selected for design according to the number of channels, and only a standard N-in-1 MT optical fiber tape is needed.

As described above, since the optical units 100 have twelve channels, if 24 optical modules need to be fabricated, two optical units 100 may be selected, and four optical units 100 may be selected for 48 optical modules.

The photoelectric units 100 are welded with the main circuit board 200 through the low-temperature solder balls 160 to complete electric connection, and then the optical connector 130 is passively aligned with an external MT ferrule and fixed to complete optical connection, so that the whole assembly of the optical module can be completed, the operation process difficulty is greatly simplified, and the production efficiency is improved.

Of course, the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A parallel optoelectronic unit, comprising:

the optical fiber array comprises a plurality of optical fibers, and the optical fibers are positioned in an optical fiber hole of the optical connector and are used for connecting the optical signal interface;

and the plastic package shell is positioned on the chip carrier plate and is used for plastic packaging the photoelectric chip assembly and the optical connector, wherein an optical port, which is used for being connected with an external optical connector, is exposed out of the plastic package shell.

2. The parallel optoelectronic unit of claim 1, wherein a module attaching region is provided on the chip carrier for attaching the optoelectronic chip assembly, and the first pad region is disposed at a periphery of the module attaching region;

3. The parallel optoelectronic unit of claim 2, wherein the optoelectronic chip assembly comprises:

a ceramic block bonded to the module bonding region;

4. The parallel optoelectronic unit of claim 3, wherein the electrical chip is attached to a top surface of the ceramic block, the optical chip is attached to a side surface of the ceramic block, a second bonding pad is further disposed on the electrical chip, and a third bonding pad is further disposed on the optical chip;

5. The parallel optoelectronic unit of claim 1, wherein the optical connector is a remainder of the multichannel mini-MT ferrule after cutting the tail end of the MT ferrule after passing through the optical fiber, wherein the cut surface is formed as an inclined surface;

6. The parallel photovoltaic unit according to claim 5, characterized in that,

and optical glue is filled between the optical fiber end face of the optical fiber on the cutting face and the optical signal interface.

7. The parallel photoelectric unit according to claim 5 or 6, wherein the distance from the cutting surface to the vertical surface perpendicular to the axis of the optical fiber hole decreases in sequence.

8. The parallel optoelectronic unit of claim 1, wherein the plastic package is formed by a plastic package process.

9. The parallel optoelectronic unit of claim 1, wherein a plurality of low temperature solder balls are implanted in the second pad area.

10. An optical module, comprising:

a main circuit board;

a plurality of parallel photovoltaic units according to any one of claims 1 to 9, which are electrically connected to the main circuit board through respective second pad areas, the optical ports of the optical connectors in the parallel photovoltaic units being for connection with external optical connectors.