CN220432701U - Antistatic heat conduction adhesive tape - Google Patents
Antistatic heat conduction adhesive tape Download PDFInfo
- Publication number
- CN220432701U CN220432701U CN202322035826.9U CN202322035826U CN220432701U CN 220432701 U CN220432701 U CN 220432701U CN 202322035826 U CN202322035826 U CN 202322035826U CN 220432701 U CN220432701 U CN 220432701U
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- CN
- China
- Prior art keywords
- layer
- heat
- antistatic
- conducting
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002390 adhesive tape Substances 0.000 title abstract description 29
- 239000010410 layer Substances 0.000 claims description 128
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 20
- 239000010445 mica Substances 0.000 claims description 17
- 229910052618 mica group Inorganic materials 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000005299 abrasion Methods 0.000 claims description 11
- 230000003068 static effect Effects 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Abstract
The utility model discloses an antistatic heat conduction adhesive tape, which belongs to the technical field of heat conduction adhesive tapes, and comprises the following components: the utility model increases the functional diversity of the heat-conducting adhesive tape, improves the protection effect of the heat-conducting adhesive tape on electronic components, prolongs the service life of the electronic components, and improves the practicability and the expansion application range of the heat-conducting adhesive tape.
Description
Technical Field
The utility model relates to the technical field of heat conduction adhesive tapes, in particular to an antistatic heat conduction adhesive tape.
Background
The heat-conducting adhesive tape is formed by mixing acrylic polymer with heat-conducting ceramic powder, coating the powder on two sides of glass fiber cloth, and compounding the powder with an organic silica gel adhesive, has the characteristics of high heat conduction and insulation, has certain softness, compressibility, adhesion and strong viscosity, has wide tolerance temperature range, and is used for being filled on uneven surfaces to enable a radiating fin and a heating device to be tightly adhered together;
the existing heat conduction adhesive tape is installed between the radiating fin and the heating device, the radiating fin and the heating device belong to electronic components, the electronic components are easily affected by static electricity to damage, but most of the heat conduction adhesive tapes only have the function of heat conduction, so that the heat conduction adhesive tape lacks the effect of preventing static electricity from being protected on contacted devices, and the practicability and the application range of the heat conduction adhesive tape are affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model aims to provide an antistatic heat conduction adhesive tape;
to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides an antistatic heat conduction adhesive tape, which comprises the following components: the anti-static adhesive comprises an abrasion-resistant layer, a first heat-conducting layer, an anti-static layer, a second heat-conducting layer, a pressure-sensitive adhesive layer and a discrete adhesive layer, wherein the bottom of the abrasion-resistant layer is adhered to the first heat-conducting layer, the bottom of the first heat-conducting layer is adhered to the anti-static layer, the bottom of the anti-static layer is adhered to the second heat-conducting layer, the bottom of the second heat-conducting layer is adhered to the pressure-sensitive adhesive layer, and the discrete adhesive layer is adhered to the bottom of the pressure-sensitive adhesive layer and the top of the abrasion-resistant layer;
the antistatic layer is composed of a double-layer net and mica powder, the mica powder is filled between the double-layer net, and the antistatic layer is used for reducing the damage of electronic devices due to static electricity.
The preferable technical scheme of the utility model is that the first heat conduction layer and the second heat conduction layer adopt graphene Pu films, and the thicknesses of the first heat conduction layer and the second heat conduction layer are 3-15 mu m.
The preferable technical scheme of the utility model is that a reinforcing column is arranged between the first heat conduction layer and the second heat conduction layer and is positioned on the side surface of the antistatic layer.
The preferable technical scheme of the utility model is that a plurality of grooves are formed in the bottom of the reinforcing column and the bottom surface of the pressure-sensitive adhesive layer, and the grooves are arranged in a horn shape in section.
The preferable technical scheme of the utility model is that the pressure-sensitive adhesive layer is made of heat-conducting materials, and the thickness of the pressure-sensitive adhesive layer is 0.02-1 mu m.
The preferable technical scheme of the utility model is that the wear-resistant layer is internally provided with a plurality of alumina particles, and the thickness of the wear-resistant layer is set to be 20-100 mu m.
Compared with the prior art, the utility model has the beneficial effects that:
according to the antistatic heat conduction adhesive tape, the double-layer net and the mica powder are arranged, the mica powder is filled between the double-layer net, so that the mica powder is wrapped by the double-layer net, and the conductive net is formed in the molecular structure of the double-layer net by virtue of the sheet-shaped structure of the mica powder, and the double-layer net is made of an antistatic material such as ATO (advanced technology attachment) material, so that the whole antistatic layer has conductivity, and the antistatic layer guides static, thereby realizing an antistatic effect.
Drawings
Fig. 1 is a schematic view of a related structure of an antistatic heat conductive adhesive tape according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a reinforcement column related structure provided in an embodiment of the present utility model;
FIG. 3 is a schematic view of an antistatic internal relevant structure provided in an embodiment of the present utility model;
in the drawings, the list of components represented by the various numbers is as follows:
1. a wear-resistant layer; 2. a first heat conducting layer; 3. an antistatic layer; 31. a double layer mesh; 32. mica powder; 4. a second heat conduction layer; 5. a pressure-sensitive adhesive layer; 51. a groove; 6. a reinforcing column; 7. a discrete adhesive layer.
Detailed Description
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
An antistatic heat conductive tape, the heat conductive tape comprising: the anti-static adhesive coating comprises an abrasion-resistant layer 1, a first heat-conducting layer 2, an anti-static layer 3, a second heat-conducting layer 4, a pressure-sensitive adhesive layer 5 and a discrete adhesive layer 7, wherein the bottom of the abrasion-resistant layer 1 is adhered to the first heat-conducting layer 2, the bottom of the first heat-conducting layer 2 is adhered to the anti-static layer 3, the bottom of the anti-static layer 3 is adhered to the second heat-conducting layer 4, the bottom of the second heat-conducting layer 4 is adhered to the pressure-sensitive adhesive layer 5, and the discrete adhesive layer 7 is adhered to the bottom of the pressure-sensitive adhesive layer 5 and the top of the abrasion-resistant layer 1;
the antistatic layer 3 is composed of a double-layer net 31 and mica powder 32, the mica powder 32 is filled between the double-layer net 31, and the antistatic layer 3 is used for reducing the damage of electronic devices due to static electricity.
As shown in fig. 1 and fig. 3, the antistatic heat conduction adhesive tape structure of the utility model comprises a discrete adhesive layer 7, a wear-resistant layer 1, a first heat conduction layer 2, an antistatic layer 3, a second heat conduction layer 4, a pressure-sensitive adhesive layer 5 and the discrete adhesive layer 7 from top to bottom in sequence;
the utility model is designed that an antistatic layer 3 is adhered between a first heat conduction layer 2 and a second heat conduction layer 4, the antistatic layer 3 consists of a double-layer net 31 and mica powder 32, the mica powder 32 is filled between the double-layer net 31, the mica powder 32 is wrapped by the double-layer net 31, and the flake structure of the mica powder 32 forms a conductive network in the molecular structure of the double-layer net 31, and the double-layer net 31 is an antistatic material such as ATO material, so that the whole conductive mica powder 32 has conductivity, and static electricity is led out, thereby realizing the effect of eliminating static electricity;
when the anti-static adhesive tape is used, firstly, the discrete adhesive layer 7 is torn off to expose the pressure-sensitive adhesive layer 5, the pressure-sensitive adhesive layer 5 is attached to the mounting position of a heating device, and is lightly pressed, then, the discrete adhesive layer 7 on the surface of the anti-static adhesive layer 1 is torn off, and the radiating fin is placed on the surface of the anti-static adhesive layer 1, so that the heat-conducting adhesive tape is positioned between the heating device and the radiating fin, and the anti-static layer 3 is used for eliminating static electricity at the position of the heating device and the radiating fin.
As a possible implementation manner of the present solution, as shown in fig. 1-2, it is preferable that the first heat conducting layer 2 and the second heat conducting layer 4 use graphene Pu films, and the thicknesses of the first heat conducting layer 2 and the second heat conducting layer 4 are 3 μm-15 μm; the graphene Pu film not only has ultrahigh heat conductivity, but also has electric conductivity, so that the heat conduction and antistatic effects of the heat conduction adhesive tape can be improved simultaneously, and the overall performance of the heat conduction adhesive tape is improved.
As a possible implementation manner of the present solution, as shown in fig. 2, it is preferable that a reinforcing column 6 is disposed between the first heat conduction layer 2 and the second heat conduction layer 4 and is located at a side surface of the antistatic layer 3; the reinforcing posts 6 are used for sealing the side surface of the double-layer net 31, so that the situation that the mica powder 32 is separated from the side surface of the double-layer net 31 is reduced, and the antistatic effect of the heat conducting adhesive tape is affected.
As a possible embodiment of the present embodiment, it is preferable that, as shown in fig. 2, a plurality of grooves 51 are opened at the bottom of the reinforcing post 6 and at the bottom surface of the pressure-sensitive adhesive layer 5, and the grooves 51 are provided in a horn shape in cross section; by pressing the horn-shaped groove 51, the groove 51 adsorbs the contact surface like a sucker, and the groove 51 is positioned at the edge part of the bottom of the pressure-sensitive adhesive layer 5, so that the fish contact surface at the edge part of the heat-conducting adhesive tape is tightly attached, and the situation that the heat-conducting adhesive tape is warped is reduced.
As one possible embodiment of the present embodiment, it is preferable that the pressure-sensitive adhesive layer 5 is a heat conductive material, and the thickness of the pressure-sensitive adhesive layer 5 is 0.02 μm to 1 μm, as shown in fig. 1 to 2; the heat conducting effect of the pressure-sensitive adhesive layer 5 is improved by the heat conducting material such as silicone grease, so that the heat radiating efficiency of the heat conducting adhesive tape is accelerated, and the effect of losing viscosity of the heat conducting adhesive tape due to high temperature is reduced.
As a possible embodiment of the present embodiment, it is preferable that, as shown in fig. 1, the abrasion-resistant layer 1 is provided therein to contain a plurality of alumina particles, and the thickness of the abrasion-resistant layer 1 is set to 20 μm to 100 μm; the aluminum oxide particles have thermal conductivity, and the heat below the wear-resistant layer 1 is conveniently radiated upwards through the aluminum oxide particles to dissipate heat, so that the heat dissipation effect of the heat-conducting adhesive tape is improved.
While the utility model has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the utility model. The utility model is not to be limited by the specific embodiments disclosed herein, and other embodiments are within the scope of the utility model as defined by the claims of the present application.
Claims (6)
1. An antistatic heat conducting tape, characterized in that the heat conducting tape comprises: the anti-static adhesive comprises an abrasion-resistant layer (1), a first heat-conducting layer (2), an anti-static layer (3), a second heat-conducting layer (4), a pressure-sensitive adhesive layer (5) and a discrete adhesive layer (7), wherein the bottom of the abrasion-resistant layer (1) is adhered to the first heat-conducting layer (2), the bottom of the first heat-conducting layer (2) is adhered to the anti-static layer (3), the bottom of the anti-static layer (3) is adhered to the second heat-conducting layer (4), the bottom of the second heat-conducting layer (4) is adhered to the pressure-sensitive adhesive layer (5), and the discrete adhesive layer (7) is adhered to the bottom of the pressure-sensitive adhesive layer (5) and the top of the abrasion-resistant layer (1);
the antistatic layer (3) is composed of a double-layer net (31) and mica powder (32), the mica powder (32) is filled between the double-layer net (31), and the antistatic layer (3) is used for reducing the damage of electronic devices due to static electricity.
2. The antistatic heat conductive tape of claim 1, wherein: the first heat conducting layer (2) and the second heat conducting layer (4) adopt graphene Pu films, and the thicknesses of the first heat conducting layer (2) and the second heat conducting layer (4) are 3-15 mu m.
3. The antistatic heat conductive tape of claim 2, wherein: a reinforcing column (6) is arranged between the first heat conduction layer (2) and the second heat conduction layer (4), and is positioned on the side face of the antistatic layer (3).
4. An antistatic heat conductive tape according to claim 3, wherein: a plurality of grooves (51) are formed in the bottom of the reinforcing column (6) and the bottom surface of the pressure-sensitive adhesive layer (5), and the grooves (51) are horn-shaped in cross section.
5. The antistatic heat conductive tape of claim 4, wherein: the pressure-sensitive adhesive layer (5) is made of a heat-conducting material, and the thickness of the pressure-sensitive adhesive layer (5) is 0.02 mu m-1 mu m.
6. The antistatic heat conductive tape of claim 1, wherein: the wear-resistant layer (1) is internally provided with a plurality of alumina particles, and the thickness of the wear-resistant layer (1) is set to be 20-100 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322035826.9U CN220432701U (en) | 2023-07-31 | 2023-07-31 | Antistatic heat conduction adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322035826.9U CN220432701U (en) | 2023-07-31 | 2023-07-31 | Antistatic heat conduction adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220432701U true CN220432701U (en) | 2024-02-02 |
Family
ID=89686356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322035826.9U Active CN220432701U (en) | 2023-07-31 | 2023-07-31 | Antistatic heat conduction adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220432701U (en) |
-
2023
- 2023-07-31 CN CN202322035826.9U patent/CN220432701U/en active Active
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| GR01 | Patent grant |