CN220408799U - Mechanical vision detection device for semiconductor preparation wafer conveying manipulator - Google Patents

Abstract

The utility model discloses a mechanical vision detection device for a semiconductor preparation wafer conveying manipulator, which comprises a mechanical arm used for conveying wafers, wherein a driving mechanism is arranged at the position of an end effector of the mechanical arm; the driving mechanism comprises a rotational degree of freedom which is connected with an adjusting mechanism for adjusting the axial whole circumferential angle of the end effector; positioning accuracy is improved: by using a machine vision inspection device and preferably a CCD industrial vision camera, the techniques of the present utility model can achieve high accuracy wafer positioning. The vision detecting piece detects the azimuth and attitude information of the wafer in advance, and the positioning accuracy is improved through accurate detection of the position of the wafer. The detection speed is quickened: the technology of the utility model can rapidly and accurately perform wafer positioning detection through the pre-detection and the optimized angle adjustment of the mechanical vision detection device. The method can obviously improve the detection speed, quicken the transmission and operation processes of the wafer and improve the production efficiency.

Description

Mechanical vision detection device for semiconductor preparation wafer conveying manipulator

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a mechanical vision detection device for a semiconductor preparation wafer conveying manipulator.

Background

Semiconductor preparation wafer handling robots are one of the key devices that play an important role in the semiconductor manufacturing process. It is widely used in semiconductor factories for automated processing and transport of thin and fragile wafers. The design and function of the manipulator are carefully optimized to ensure efficient, accurate and reliable wafer transfer tasks.

In the conventional art, the design of the wafer transfer robot needs to take into account the extreme sensitivity to the wafer. Wafers are the basis for semiconductor chip fabrication, and they are typically made of silicon materials, with highly fragile characteristics. Therefore, the robot must have precise control capability and a gentle manner of operation to avoid damage to the wafer. Wafer transfer robots typically employ multi-joint structures to provide flexible motion and handling capabilities. These joints are driven by high precision motors and sensors to achieve precise position control and force sensing. The robot is also equipped with various sensors and vision systems to monitor the position, attitude and surface imperfections of the wafer in real time, ensuring safety and quality control during transport. The robot arm also needs to work in close cooperation with other equipment and systems during wafer transfer. It may interact with carriers, turrets, cleaning devices, etc. to effect loading, unloading, positioning and transfer of wafers. This coordination and integration requires a highly programmable and communicative capability of the manipulator to enable real-time data exchange and instruction transfer with other devices.

However, through long-term work and research by the inventor, it is found that the detection and positioning system of the semiconductor preparation wafer conveying manipulator in the conventional technology has the following technical problems that needs to be solved:

(1) Lack of adaptivity: the traditional technology often lacks self-adaptive capability, and can not adjust and correct the motion trail and the gesture of the manipulator in real time so as to adapt to the changing requirements under different conditions.

(2) Poor scalability: conventional techniques may have difficulties in accommodating wafers of different sizes and shapes. Since conventional methods are typically based on predefined rules and models, additional engineering adjustments and customization may be required when processing non-standard or new wafers.

(3) The accuracy is limited: the positioning detection technology of the traditional semiconductor preparation wafer conveying manipulator is often influenced by sensor precision and system noise. This can lead to problems of relative instability of positioning accuracy and error accumulation, especially in long run and complex operation situations.

(4) The detection speed is slower: the positioning inspection method used in the conventional art may take a long time to complete the inspection of the position and posture of the wafer. This may limit the operating efficiency and productivity of the robot, resulting in a bottleneck problem of the production line.

(5) The robustness is not sufficient: the conventional technology has limited robustness against environmental changes and external disturbances. Environmental factors such as temperature changes, illumination changes, dust, etc. may interfere with the positioning detection results of the conventional methods, resulting in reduced performance or incorrect positioning.

For this purpose, a mechanical vision inspection device for a semiconductor preparation wafer conveying manipulator is proposed.

Disclosure of Invention

In view of the above, an embodiment of the present utility model is to provide a machine vision detection device for a semiconductor preparation wafer conveying manipulator, so as to solve or alleviate the technical problems existing in the prior art, that is, the accuracy is limited, and the accuracy is affected by sensor accuracy and system noise; the slower detection speed may limit the operating efficiency and productivity; poor expandability, and difficult adaptation to non-standard or novel wafers; the robustness is not enough and is easily influenced by environmental changes and external interference; the self-adaptability is lacking, and the motion trail and the gesture cannot be adjusted and corrected in real time; and provides at least one beneficial choice for this;

the technical scheme of the embodiment of the utility model is realized as follows: the mechanical vision detection device for the semiconductor preparation wafer conveying manipulator comprises a mechanical arm used for conveying wafers, wherein a driving mechanism is arranged at the position of an end effector of the mechanical arm;

the driving mechanism comprises a rotational degree of freedom which is connected with an adjusting mechanism for adjusting the axial whole circumferential angle of the end effector; the driving mechanism comprises at least six linear degrees of freedom which are distributed in an annular array mode, and the linear degrees of freedom are connected with a visual detection piece which is used for machine vision detection to conduct universal angle adjustment.

In the above embodiment, the semiconductor preparation wafer conveying manipulator adopts the mechanical vision detection device, and comprises a mechanical arm with a wafer conveying function. A driving mechanism is arranged at the position of an end effector of the mechanical arm. The driving mechanism consists of a rotational degree of freedom and at least six linear degrees of freedom which are distributed in a ring-shaped array. The rotational degrees of freedom are coupled to an adjustment mechanism for axial full circumference angular adjustment in the end effector. The linear degree of freedom is connected to a visual inspection piece for machine vision inspection for making adjustment of the universal angle.

Wherein in one embodiment: the visual inspection member is preferably a CCD industrial vision camera.

Wherein in one embodiment: the adjusting mechanism comprises two mutually opposite but not directly contacted disc bodies, and six linear actuators for outputting the linear degrees of freedom are arranged on the disc bodies in an annular array mode with the central axis as a reference;

the CCD industrial vision camera is arranged on the tray body facing the wafer;

the other disc body is arranged and is in operative connection with the rotational degree of freedom of the driving mechanism.

In the above embodiment, the adjustment mechanism includes two disks that are opposed to each other but do not directly contact each other. The disk body is annular, and is arranged with six linear actuators for outputting linear degrees of freedom with respect to its central axis. In addition, a CCD industrial vision camera is mounted on the tray body facing the wafer. The other disc is mounted in operative connection with the rotational degree of freedom of the drive mechanism.

Wherein in one embodiment: the linear actuator is preferably a servo cylinder; the cylinder body and the piston rod of the servo electric cylinder are respectively and universally hinged with one surface of each of the two disc bodies, which are opposite to each other, through universal joint couplings. The servo electric cylinders which are adjacent to each other are arranged in a V shape or an inverted V shape.

In the above embodiment, the linear actuator is preferably a servo cylinder. The cylinder body and the piston rod of the servo electric cylinder are connected with one surface of each of two mutually opposite disk bodies through a universal joint coupling. Adjacent two servo cylinders are arranged in a V-shape or inverted V-shape.

Wherein in one embodiment: the adjusting mechanism comprises a rack and a rotating table which is in rotary fit with the rack, the rack and the rotating table are sleeved on the outer surface of the end effector, and the central axis of the rotating table and the central axis of the end effector are the same central axis;

a rotating module for outputting the rotation freedom degree and driving the rotating table to rotate is arranged between the frame and the rotating table; the rotating table is provided with another disc body.

In the above embodiment, the adjusting mechanism includes the frame and the rotating table. The frame and the rotating table are sleeved on the outer surface of the end effector, and the central axis of the rotating table is the same as the central axis of the end effector. A rotation module for outputting the rotation freedom degree and driving the rotation table to rotate is arranged between the frame and the rotation table. In addition, another tray body is arranged on the rotating table.

Wherein in one embodiment: the rotating module comprises a rotating executing piece and a gear driven by the rotating executing piece, wherein the gear is meshed with a gear ring, and the gear ring is sleeved on the outer surface of the end effector and fixedly connected with the rotating table.

In the above embodiment, the rotation module includes the rotation actuator and the driving gear. The gear forms a gear ring by meshing, and the gear ring is sleeved on the outer surface of the end effector and fixedly connected to the rotating table.

Wherein in one embodiment: the rotation executing piece is preferably a servo motor, and an output shaft of the servo motor is fixedly connected with the gear.

Compared with the prior art, the utility model has the beneficial effects that:

1. positioning accuracy is improved: by using a machine vision inspection device and preferably a CCD industrial vision camera, the techniques of the present utility model can achieve high accuracy wafer positioning. The vision detecting piece detects the azimuth and attitude information of the wafer in advance, and the positioning accuracy is improved through accurate detection of the position of the wafer.

2. The detection speed is quickened: the technology of the utility model can rapidly and accurately perform wafer positioning detection through the pre-detection and the optimized angle adjustment of the mechanical vision detection device. The method can obviously improve the detection speed, quicken the transmission and operation processes of the wafer and improve the production efficiency.

3. And the expandability is improved: the technique of the present utility model employs flexible adjustment mechanisms, including rotational degrees of freedom and linear degrees of freedom. The design enables the manipulator to adapt to wafers with different sizes and shapes, and flexibly adjusts and adapts to novel wafers. This improves the scalability and adaptability of the system, making it suitable for different production requirements and wafer specifications.

4. Enhancing robustness: by using the mechanical vision detection device to detect the azimuth and the attitude of the wafer in advance and correcting the operation attitude and the angle of the mechanical arm in real time, the technology of the utility model enhances the robustness of the system. The method can resist environmental changes and external interference, and improves the stability and reliability of the system.

5. Improving the adaptivity: the technology of the utility model obtains the image data of the wafer through the mechanical vision detection device and carries out real-time interaction with the controller. By analyzing and processing the image data, the controller can adjust and correct the motion trail and the gesture of the manipulator in real time so as to adapt to the changing requirements under different conditions. The self-adaptive capacity enables the system to quickly respond and adapt to changes of production environments, and flexibility and adaptability of the system are improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic perspective view of a drive mechanism and an adjustment mechanism of the present utility model;

FIG. 3 is a schematic perspective view of an adjustment mechanism according to the present utility model;

reference numerals: 1. a mechanical arm; 2. a driving mechanism; 201. a frame; 202. a rotating table; 203. rotating the module; 3. an adjusting mechanism; 301. a tray body; 302. a linear actuator; 303. a universal joint coupling; 4. visual inspection piece.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. This utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below;

it should be noted that the terms "first," "second," "symmetric," "array," and the like are used merely for distinguishing between description and location descriptions, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of features indicated. Thus, a feature defining "first," "symmetry," or the like, may explicitly or implicitly include one or more such feature; also, where certain features are not limited in number by words such as "two," "three," etc., it should be noted that the feature likewise pertains to the explicit or implicit inclusion of one or more feature quantities;

in the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature; meanwhile, all axial descriptions such as X-axis, Y-axis, Z-axis, one end of X-axis, the other end of Y-axis, or the other end of Z-axis are based on a cartesian coordinate system.

In the present utility model, unless explicitly specified and limited otherwise, terms such as "mounted," "connected," "secured," and the like are to be construed broadly; for example, the connection can be fixed connection, detachable connection or integrated molding; the connection may be mechanical, direct, welded, indirect via an intermediate medium, internal communication between two elements, or interaction between two elements. The specific meaning of the terms described above in the present utility model will be understood by those skilled in the art from the specification and drawings in combination with specific cases.

In the prior art, the precision is limited and is influenced by the precision of a sensor and the noise of a system; the slower detection speed may limit the operating efficiency and productivity; poor expandability, and difficult adaptation to non-standard or novel wafers; the robustness is not enough and is easily influenced by environmental changes and external interference; the self-adaptability is lacking, and the motion trail and the gesture cannot be adjusted and corrected in real time; for this reason, referring to fig. 1-3, the present embodiment provides a related technical solution to solve the above technical problems: the mechanical vision detection device for the semiconductor preparation wafer conveying manipulator comprises a mechanical arm 1 for conveying wafers, wherein a driving mechanism 2 is arranged at the position of an end effector of the mechanical arm 1;

the driving mechanism 2 comprises a rotation degree of freedom which is connected with an adjusting mechanism 3 for adjusting the whole circumferential angle of the axial direction of the end effector; the driving mechanism 2 comprises at least six linear degrees of freedom arranged in an annular array, and the linear degrees of freedom are connected with a visual detection piece 4 for machine vision detection to perform universal angle adjustment.

When the robot arm is used, the end effector of the robot arm 1 is used for conveying wafers, at the moment, the visual detection piece 4 detects the azimuth and attitude information of the wafers in advance, the optimal detection angle of the current wafers is determined after comparison of the position information, then the driving mechanism 2 adjusts the adjusting mechanism 3 to adjust the whole circumference angle to the optimal azimuth angle outside the end effector, and then the adjusting mechanism 3 adjusts the visual detection piece 4 to the optimal attack angle in a universal mode for detection; the vision detecting piece 4 carries out all-round interaction on the azimuth, the angle and the gesture of the wafer at the moment, and carries out continuous interaction operation with the mechanical arm 1 through the controller, so as to continuously correct the operation gesture and the angle of the mechanical arm 1, and realize accurate transportation and operation.

In the scheme, the semiconductor preparation wafer conveying manipulator adopts a mechanical vision detection device and comprises a mechanical arm 1 with a wafer conveying function. A driving mechanism 2 is provided at the end effector position of the robot arm 1. The drive mechanism 2 consists of a rotational degree of freedom and at least six linear degrees of freedom arranged in a circular array. The rotational degrees of freedom are connected to an adjustment mechanism 3 for axial adjustment of the full circumference angle in the end effector. The linear degree of freedom is connected to a visual inspection piece 4 for machine vision inspection for adjustment of the universal angle.

In the scheme, all electric elements of the whole device are powered by mains supply; specifically, the electric elements of the whole device are in conventional electrical connection with the commercial power output port through the relay, the transformer, the button panel and other devices, so that the energy supply requirements of all the electric elements of the device are met.

Specifically, a controller is further arranged outside the device and is used for connecting and controlling all electrical elements of the whole device to drive according to a preset program as a preset value and a drive mode; it should be noted that the driving mode corresponds to output parameters such as start-stop time interval, rotation speed, power and the like between related electrical components, and meets the requirement that related electrical components drive related mechanical devices to operate according to the functions described in the related electrical components.

Specifically, the principle of the machine vision inspection device is to detect the azimuth and attitude information of the wafer in advance by the vision inspection piece 4. And determining the optimal detection angle of the current wafer by comparing the position information. Then, the driving mechanism 2 adjusts the entire circumferential angle to the optimum azimuth angle outside the end effector by the adjusting mechanism 3. Next, the adjusting mechanism 3 adjusts the visual inspection piece 4 to an optimum angle of attack by universal adjustment for inspection. At this time, the vision detecting member 4 performs all-round interaction on the azimuth, the angle and the posture of the wafer, and continuously performs interaction operation with the mechanical arm 1 through the controller, corrects the operation posture and the angle of the mechanical arm 1, and realizes accurate transportation and operation.

It will be appreciated that in this embodiment, the function of the machine vision inspection device is to achieve high accuracy wafer inspection during wafer transport. First, the orientation and posture information of the wafer is acquired in advance by the vision inspection piece 4 in the machine vision inspection apparatus. This enables the device to determine the optimal detection angle. By the cooperation of the drive mechanism 2 and the adjustment mechanism 3, the full circumference angle of the end effector and the universal angle of the visual inspection piece are adjusted to ensure optimal azimuth and angle of attack. Through interaction with the controller, the operation posture and the angle of the mechanical arm 1 are continuously corrected, so that the accurate transportation and operation of the wafer are realized. The device combines the flexibility of the mechanical arm and the accuracy of visual inspection, and provides an efficient and reliable wafer conveying and inspection solution.

In some embodiments of the present application, please refer to fig. 1-3 in combination: the visual inspection member 4 is preferably a CCD industrial vision camera.

In particular, a CCD industrial vision camera is a high performance image acquisition device specifically designed for industrial applications. It is based on CCD sensing technology, and has high sensitivity, low noise and good image quality. CCD industrial vision cameras typically have high resolution, fast image acquisition speeds and flexible image processing capabilities.

It will be appreciated that in the present embodiment, by selecting a CCD industrial vision camera as the vision inspection piece 4, the semiconductor preparation wafer transfer robot can obtain high-quality image data for the orientation and posture inspection of the wafer. The high sensitivity and low noise characteristics of the CCD sensor ensure accurate capture of wafer details and improved image quality. The high resolution and the rapid image acquisition speed of the camera enable the manipulator to acquire image information of the wafer in real time and perform rapid processing and analysis.

The CCD industrial vision camera also has flexible image processing capability, and various image algorithms and processing technologies such as edge detection, pattern recognition, shape matching and the like can be applied to realize accurate detection of the orientation and the gesture of the wafer. Therefore, the manipulator can adjust the position and the posture of the end effector in real time through interaction with the controller according to the image data acquired by the camera, and accurate transmission and operation of the wafer are ensured.

In summary, the CCD industrial vision camera is selected as the vision detecting piece 4, which provides high-quality image data for the semiconductor preparation wafer conveying manipulator, so that the wafer conveying manipulator can accurately and rapidly detect the wafer azimuth and the posture, and accurate wafer conveying and operation are realized.

In some embodiments of the present application, please refer to fig. 1-3 in combination: the adjusting mechanism 3 comprises two mutually opposite but not directly contacted disc bodies 301, and six linear actuators 302 for outputting linear degrees of freedom are arranged on the disc bodies 301 in an annular array mode with the central axis as a reference;

a CCD industrial vision camera is arranged on the tray 301 facing the wafer;

the other disc 301 is mounted in operative connection with the rotational degree of freedom of the drive mechanism 2.

In this solution, in this embodiment, the adjustment mechanism 3 comprises two mutually opposite discs 301, which are not in direct contact. The disk 301 is ring-shaped, and based on its center axis, six linear actuators 302 for outputting linear degrees of freedom are arranged. In addition, a CCD industrial vision camera is mounted on the tray 301 facing the wafer. The other disc 301 is mounted in operative connection with the rotational degree of freedom of the drive mechanism 2.

In particular, this design allows for full angular adjustment of the end effector and universal angular adjustment of the visual inspection piece by the arrangement of two opposing disks 301 and linear actuators 302. One of the discs 301, through a rotational degree of freedom connection with the drive mechanism 2, enables the entire manipulator to make a full angular adjustment of the end effector. The CCD industrial vision camera mounted on the other tray 301 can face the wafer, so that the detection of the orientation and the posture of the wafer is realized.

It will be appreciated that in this embodiment, by this design, the adjustment mechanism 3 provides relative movement between the two discs 301, with adjustment of the linear degree of freedom being achieved by the linear actuator 302. In this way, the manipulator can adjust the full circumference angle of the end effector by adjusting the relative position between the two disks 301. Meanwhile, the mounting position of the CCD industrial vision camera faces the wafer, so that the image information of the wafer can be accurately obtained, and the detection of the azimuth and the gesture of the wafer is realized.

Through coordination and instructions of the controller, the mechanical arm can adjust the position and the posture of the end effector in real time according to image data acquired by the CCD industrial vision camera so as to accurately convey the wafer and perform operation. This embodiment provides more flexibility and accuracy, ensuring wafer accuracy and reliability.

Therefore, by combining the tray 301, the linear actuator 302 and the CCD industrial vision camera, the semiconductor preparation wafer conveying manipulator can realize more accurate whole-circle angle adjustment and vision detection, and provides high quality and reliability for the conveying and operation of wafers.

In some embodiments of the present application, please refer to fig. 1-3 in combination: the linear actuator 302 is preferably a servo cylinder; the cylinder body and the piston rod of the servo electric cylinder are respectively and universally hinged with the opposite surfaces of the two disk bodies 301 through universal joint couplings 303. The servo electric cylinders adjacent to each other are arranged in a V shape or an inverted V shape.

In this embodiment, the linear actuator 302 is preferably a servo cylinder. The cylinder body and the piston rod of the servo cylinder are connected to respective one surfaces of two mutually opposed disk bodies 301 via a universal joint coupling 303. Adjacent two servo cylinders are arranged in a V-shape or inverted V-shape.

Specifically, a servo cylinder is used as a choice of the linear actuator 302, and the characteristic of the servo cylinder is used to realize adjustment of the linear degree of freedom. The servo cylinder is an actuator with precise position control and force control capabilities. The cylinder body and the piston rod of the servo cylinder can be connected to the respective one faces of the two opposing discs 301 by the connection of the universal joint coupling 303, realizing a relative movement.

It will be appreciated that in this particular embodiment, with this arrangement, two adjacent servo cylinders are arranged in a V or inverted V configuration, providing a greater range of degrees of freedom and flexibility. This arrangement enables the manipulator to make adjustments of linear degrees of freedom in multiple directions to accommodate different operational requirements. Accurate control and adjustment of the end effector can be achieved through the precise position control and force control capabilities of the servo cylinders. Such a layout and selection provides higher stability and reliability for the robot. The servo cylinder enables the manipulator to quickly and accurately adjust the position of the end effector during operation to meet the wafer conveying and operating requirements. By adopting the servo electric cylinder as the linear actuator 302 and arranging the linear actuator 302 and the disc 301 in a V shape or an inverted V shape, the semiconductor preparation wafer conveying manipulator realizes more flexible and accurate linear degree of freedom adjustment and provides higher stability and accuracy for the conveying and operation of wafers.

Further: the V-shaped or inverted V-shaped arrangement means that the working range of the servo cylinder can move along a V-shaped track or an inverted V-shaped track. This arrangement may provide a wider range of motion in the same space than a straight line arrangement, allowing the manipulator to more flexibly adjust and position the end effector in different directions. The V-shaped or inverted V-shaped arrangement of the servo cylinders may provide better balance and stability. The servo electric cylinder is inclined at a certain angle, so that the load of the end effector can be balanced and shared, and the instability and swing of the manipulator in the operation process are reduced, so that the overall motion precision and stability are improved. The servo cylinders of the V-shaped or inverted V-shaped arrangement can be adjusted in different directions. Each servo cylinder can be independently controlled, and the end effector can be accurately adjusted and positioned in different directions by adjusting the length or the position of the servo cylinder. This multi-directional adjustment capability enables the manipulator to accommodate complex work environments and various work requirements. The V-shaped or inverted V-shaped arrangement may more efficiently utilize space. A triangle or inverted triangle space is formed between the adjacent servo electric cylinders, so that the available space of the manipulator system can be utilized to the greatest extent. This arrangement allows more freedom in the limited space and increases the flexibility and functionality of the system.

In some embodiments of the present application, please refer to fig. 1-3 in combination: the adjusting mechanism 3 comprises a frame 201 and a rotating table 202 which is in rotary fit with the frame 201, the frame 201 and the rotating table 202 are sleeved on the outer surface of the end effector, and the central axis of the rotating table 202 and the central axis of the end effector are the same central axis;

a rotation module 203 for outputting a rotation degree of freedom and driving the rotation table 202 to rotate is installed between the frame 201 and the rotation table 202; another disc 301 is mounted on the turntable 202.

In this solution, in this embodiment, the adjustment mechanism 3 comprises a frame 201 and a rotating table 202. The frame 201 and the rotating table 202 are sleeved on the outer surface of the end effector, and the central axis of the rotating table 202 is the same as the central axis of the end effector. A rotation module 203 for outputting a degree of freedom of rotation and driving the rotation table 202 to rotate is installed between the frame 201 and the rotation table 202. In addition, another disk 301 is mounted on the turntable 202.

Specifically, the adjustment mechanism 3 effects adjustment of the rotational degree of freedom of the end effector by a combination of the frame 201 and the rotational stage 202. The telescoping design of the gantry 201 and the turret 202 ensures that they are tightly coupled to the end effector and that they share the same central axis. A rotation module 203 is installed between the frame 201 and the rotation table 202 for outputting a rotation degree of freedom and driving the rotation table 202 to rotate. In addition, coordination and connection with other components is achieved by mounting another disk 301 on turntable 202.

It will be appreciated that in this particular embodiment, this arrangement and design allows for adjustment of the rotational degrees of freedom of the adjustment mechanism 3 at the outer surface of the end effector. The rotation table 202 can be rotated by the control of the rotation module 203, thereby adjusting the rotation angle of the end effector. By installing another tray 301, connection and coordination with other components can be achieved, further improving the operational flexibility and accuracy of the manipulator.

This arrangement of the adjustment mechanism 3 enables the robot to perform rotational degree of freedom adjustment according to the wafer requirements, thereby accommodating different transfer and work requirements. The control of the rotation module 203 and the rotational capability of the rotation stage 202 enable precise rotation angle adjustment of the end effector to meet wafer transfer and handling requirements.

In summary, the semiconductor wafer handling robot achieves adjustment and coordinated connection of rotational degrees of freedom of the end effector through a combination of the frame 201, the rotational stage 202, the rotational module 203, and the other tray 301, providing greater flexibility and accuracy for wafer transfer and operation.

In some embodiments of the present application, please refer to fig. 1-3 in combination: the rotation module 203 comprises a rotation executing piece and a gear driven by the rotation executing piece, wherein the gear is meshed with a gear ring, and the gear ring is sleeved on the outer surface of the end effector and fixedly connected to the rotation table 202.

In this embodiment, the rotation module 203 includes a rotation actuator and a drive gear. The gears form a ring gear by meshing, which is sleeved on the outer surface of the end effector and fixedly connected to the rotary table 202.

Specifically, the rotation module 203 is designed to control the rotational degree of freedom of the end effector. The rotation executing piece is connected with the driving gear, and the rotation of the rotation executing piece is driven by the rotation of the gear. The meshing of the gears forms a ring gear that is sleeved on the outer surface of the end effector and fixedly attached to the rotary table 202. By rotation of the rotary actuator, the turret 202 and the end effector may be rotated together.

It will be appreciated that in this embodiment, this design allows the rotational module 203 to control the rotational degrees of freedom of the end effector through the driving of gears. By controlling the rotation of the gears, the manipulator can precisely adjust the angle of rotation of the end effector. The ring gear is sleeved on the outer surface of the end effector and fixedly connected to the rotating table 202, so that tight connection and coordinated movement of the rotating table 202 and the end effector are ensured.

The design enables the manipulator to flexibly adjust the rotation angle of the end effector so as to adapt to the requirements of wafer conveying and operation. By controlling the driving gear of the rotation module 203, the rotation of the end effector can be precisely controlled to achieve precise transfer and operation of the wafer.

In summary, through the design of the rotating actuator and the driving gear of the rotating module 203, and the sleeving and fixing connection of the gear ring and the end effector, the semiconductor preparation wafer conveying manipulator realizes the precise control of the rotation freedom degree of the end effector, and provides high flexibility and accuracy for the conveying and operation of the wafer.

In some embodiments of the present application, please refer to fig. 1-3 in combination: the rotation executing piece is preferably a servo motor, and an output shaft of the servo motor is fixedly connected with the gear.

Specifically, a servo motor is a special motor that has high precision position and speed control capabilities. The servo motor is used as a rotation executing piece, and an output shaft of the servo motor is fixedly connected with the gear. When the servo motor is driven, rotation of the output shaft will be transmitted through the gear to the rest of the rotary module, thereby driving rotation of the end effector.

It can be appreciated that in this embodiment, a servo motor is used as a choice of the rotation actuator, so that the manipulator has high precision and reliable rotation control capability. The servo motor can realize accurate control of the rotation angle of the end effector through accurate position feedback and closed-loop control. Through the fixed connection with the gear, the rotation power of the servo motor can be effectively transmitted to the rotation module, and then the rotation of the end effector is controlled.

This embodiment enables the manipulator to precisely control the angle of rotation of the end effector during transport and operation. The accurate positioning and adjustment of the wafer can be realized through the high-precision control of the servo motor and a closed-loop feedback system. This is critical to wafer handling and operation during semiconductor fabrication.

In conclusion, by taking the servo motor as a rotation executing piece and fixedly connecting the servo motor with the gear, the semiconductor preparation wafer conveying manipulator realizes high-precision and reliable rotation control of the end effector, and provides precision and stability for the conveying and operation of wafers.

Summarizing, aiming at the related problems in the prior art, the specific embodiment is based on the mechanical vision detection device for the semiconductor preparation wafer conveying manipulator, and adopts the following technical means or characteristics to realize the solution:

(1) For precision limited: the technology of this embodiment employs a machine vision inspection device, wherein the vision inspection piece uses a preferred CCD industrial vision camera. Compared with the traditional sensor, the CCD industrial vision camera has higher sensitivity and low noise characteristic and can provide higher-quality image data. Accurate azimuth and attitude detection of the wafer can be realized through accurate image processing, so that the positioning accuracy is improved.

(2) For slower detection speeds: in the technique of the present embodiment, a machine vision inspection device is used to perform the preliminary inspection of the wafer orientation and posture information. And determining the optimal detection angle of the current wafer through position information comparison. Then, the driving mechanism adjusts the whole circumferential angle of the end effector and the adjusting mechanism to conduct universal adjustment, so that the optimal attack angle is detected. The method for pre-detecting and optimizing the angle adjustment can quickly and accurately perform positioning detection, and improves the detection speed.

(3) Poor scalability to: flexible adjustment mechanisms are used in the technology of this embodiment, including rotational degrees of freedom and linear degrees of freedom. The rotational freedom degree realizes the whole circumference angle adjustment through the driving mechanism 2 and the adjusting mechanism 3, and the linear freedom degree realizes the universal angle adjustment through the linear actuator. The design and the layout enable the manipulator to adapt to wafers with different sizes and shapes, flexibly adjust and adapt to novel wafers, and improve expandability.

(4) For lack of robustness: in the technique of the present embodiment, a machine vision detection device is used to detect the azimuth and attitude information of the wafer in advance and correct the operation attitude and angle of the robot arm 1 in real time. Through interaction with the controller, gesture correction is continuously carried out so as to adapt to environmental changes and external interference, and robustness is improved. In addition, the technology of the specific embodiment also adopts a high-precision servo electric cylinder and a rotation module, and the modules have stability and anti-interference capability, so that the robustness is further improved.

(5) For lack of adaptivity: in the technology of the embodiment, the image data of the wafer is obtained through the mechanical vision detection device, and continuous interaction operation is carried out with the controller. By analyzing and processing the image data, the controller can adjust and correct the motion trail and the gesture of the manipulator in real time so as to adapt to the changing requirements under different conditions. This adaptive capability enables the manipulator to quickly respond and adapt to changes in the production environment.

In some embodiments of the present application, the above description describes the mechanical principle of a mechanical vision inspection device for a semiconductor preparation wafer conveying manipulator provided in the present embodiment; the principles of its control and system aspects will be further described in the following disclosure:

in the scheme, the CCD industrial vision camera can realize omnibearing interaction of azimuth, angle and gesture of the wafer through an image processing and analysis algorithm, and correct the operation gesture and angle of the mechanical arm through continuous interaction with the controller so as to realize accurate transportation and operation:

s1, defining a coordinate system: the wafer plane is set as an XY plane, the circle center of the wafer is set as the origin O of the coordinate system, and the X axis and the Y axis are aligned with the wafer plane.

S2, azimuth calculation: let the coordinates of the center of the wafer on the image be (Px, py) and the coordinates of the center of the image be (Cx, cy). According to the geometric relationship, the offset Δx and Δy of the wafer center relative to the image center can be calculated, namely:

ΔX＝Px-Cx

ΔY＝Py-Cy

then, the azimuth θ can be calculated, representing the azimuth offset angle of the wafer center with respect to the image center, as follows:

θ＝atan2(ΔY,ΔX)

s3, calculating an attitude angle: by means of an image processing algorithm, the edge contour of the wafer can be detected, and the optimal circle can be fitted.

S3.1, preprocessing an image: preprocessing the acquired image, including denoising, smoothing, graying and other operations, so as to improve the accuracy and stability of subsequent edge detection.

S3.2, edge detection: applying an edge detection algorithm, exemplary: canny operator;

the Canny operator detects the position of the wafer edge in the image. The edge detection algorithm identifies the location of edge pixels, thereby forming a set of edge points.

S3.3, circular fitting: and performing circular fitting on the edge point set through a fitting algorithm to find the best circle to represent the wafer.

Exemplary: the least squares fit serves as a fitting algorithm. The circle center and the radius which are most in line with the edge point set can be found by the least square method so as to describe the position and the shape of the wafer: let the edge point set consist of N edge points, each of which has coordinates (xi, yi), where i is the index of the point. The goal of the circular fit is to find the best center coordinates (Cx, cy) and radius R;

calculating center coordinates:

Cx＝(∑xi)/NCy＝(∑yi)/N

radius calculation:

R＝sqrt((∑(xi-Cx)^2+(yi-Cy)^2)/N)

the formulas calculate the optimal center coordinates and radius by using a least square method in a manner of minimizing the sum of the squares of the distances from the edge points to the fitted circle. This results in a fitted circle to represent the position and shape of the wafer.

It should be noted that the actual edge detection and circular fitting algorithm may also be combined with other techniques and optimization strategies, such as adaptive thresholding, RANSAC algorithm, etc., to further improve the accuracy and robustness of the fitting.

S3.4, setting the circle center coordinates (Cx ', cy') of the circle obtained by fitting and the radius as R. Then, the inclination angle α of the wafer can be calculated, which represents the inclination degree between the wafer plane and the image plane, as follows:

α＝atan((Cy'-Cy)/(Cx'-Cx))

s4, interaction and correction: based on the azimuth angle θ and the attitude angle α calculated above, these data are transmitted to the controller:

s4.1, motion planning: from the azimuth angle θ and the attitude angle α, a target attitude and angle of the robot arm 1 can be defined.

S4.2, a control algorithm: the mechanical arm 1 adopts PID control, and calculates a control signal u as an input of the mechanical arm 1. The calculation formula of the PID controller is as follows:

u(t)＝Kp*e(t)+Ki*∫e(t)dt+Kd*de(t)/dt

where e (t) is the azimuth or attitude angle error, kp, ki and Kd are the proportional, integral and derivative gains, respectively.

S4.3, setting the error of azimuth angle or attitude angle as e (t), wherein the integral term of the error is ≡e (t) dt, and the differential term of the error is de (t)/dt;

control signal u (t) =kp×e (t) +ki×je (t) dt+kd×de (t)/dt

S4.4, calculating integral terms: calculating the discrete form of the integral term by adopting an accumulated error method, wherein a discrete numerical integration method can be used; illustratively, the trapezoidal rule is employed:

∫e(t)dt≈∑[e(t_i)*Δt]

where t_i represents a discrete point in time and Δt is a time interval.

And (3) differential term calculation:

the difference method is used to approximate the calculation for the discrete form of the derivative term, exemplary: forward differential:

de(t)/dt≈[e(t)-e(t-Δt)]/Δt

where Δt is the time interval.

Synthesizing the above iterative formulas to obtain the discrete form of the control signal as follows:

u[t]＝Kp*e[t]+Ki*∑[e(t_i)*Δt]+Kd*[e[t]-e[t-Δt]]/Δt

s4.5, control signal conversion: according to the calculation result of the control signal u, the control signal u is converted into a control signal of an actuator of the mechanical arm 1, such as a joint angle or a position and posture control signal of an end effector. The specific conversion method depends on the structure and control mode of the mechanical arm.

S5, cycle control: the CCD industrial vision camera, the controller and the mechanical arm 1 are continuously interacted, and the running gesture and the angle of the mechanical arm are corrected according to the change of the azimuth angle and the gesture angle, so that accurate transportation and operation are realized.

The above examples merely illustrate embodiments of the utility model that are specific and detailed for the relevant practical applications, but are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (7)

1. The utility model provides a mechanical vision detection device for semiconductor preparation wafer transport manipulator, includes arm (1) that are used for the wafer to carry, its characterized in that: a driving mechanism (2) is arranged at the position of an end effector of the mechanical arm (1);

the driving mechanism (2) comprises a rotation degree of freedom which is connected with an adjusting mechanism (3) for adjusting the axial whole circumferential angle of the end effector;

the driving mechanism (2) comprises at least six linear degrees of freedom which are annularly arranged in an array, and the linear degrees of freedom are connected with a visual detection piece (4) for mechanical visual detection to perform universal angle adjustment; the visual detection piece (4) is a CCD industrial visual camera.

2. The machine vision inspection device for a semiconductor manufacturing wafer transfer robot of claim 1, wherein: the adjusting mechanism (3) comprises two mutually opposite but not directly contacted disc bodies (301), and six linear actuators (302) for outputting the linear degrees of freedom are arranged on the disc bodies (301) in an annular array mode by taking the central axis as a reference;

the CCD industrial vision camera is installed on the tray body (301) facing to the wafer;

the other disc (301) is mounted in operative connection with the rotational degree of freedom of the drive mechanism (2).

3. The machine vision inspection device for a semiconductor manufacturing wafer transfer robot of claim 2, wherein: the linear actuator (302) is a servo electric cylinder;

the cylinder body and the piston rod of the servo electric cylinder are respectively and universally hinged with one surface of each of the two disc bodies (301) which are opposite to each other through a universal joint coupling (303).

4. The machine vision inspection device for a semiconductor manufacturing wafer handling robot of claim 3, wherein: the servo electric cylinders which are adjacent to each other are arranged in a V shape or an inverted V shape.

5. The machine vision inspection device for a semiconductor manufacturing wafer transfer robot according to any one of claims 2 to 4, wherein: the adjusting mechanism (3) comprises a frame (201) and a rotating table (202) which is in rotary fit with the frame (201), the frame (201) and the rotating table (202) are sleeved on the outer surface of the end effector, and the central axis of the rotating table (202) and the central axis of the end effector are the same central axis;

a rotating module (203) for outputting the rotational freedom degree and driving the rotating table (202) to rotate is arranged between the stand (201) and the rotating table (202);

the rotating table (202) is provided with another disc body (301).

6. The mechanical vision inspection device for a semiconductor manufacturing wafer handling robot of claim 5, wherein: the rotating module (203) comprises a rotating executing piece and a gear driven by the rotating executing piece, wherein the gear is meshed with a gear ring, and the gear ring is sleeved on the outer surface of the end effector and fixedly connected with the rotating table (202).

7. The machine vision inspection device for a semiconductor manufacturing wafer handling robot of claim 6, wherein: the rotation executing piece is a servo motor, and an output shaft of the servo motor is fixedly connected with the gear.