CN220341196U - Wafer bonding machine loading table self-leveling device - Google Patents

Abstract

The utility model discloses a self-leveling device for an upper table of a wafer bonding machine, which comprises an upper table substrate, wherein an adsorption plate connecting plate is arranged below the upper table substrate, a plurality of through holes are formed in one side of the adsorption plate connecting plate, which faces the upper table substrate, self-leveling mechanisms are arranged in the through holes, the self-leveling mechanisms are arranged between the upper table substrate and the adsorption plate connecting plate, connecting columns are connected in the self-leveling mechanisms in a limiting sliding manner and are detachably connected with the upper table substrate, and the self-leveling mechanisms are used for leveling the upper table substrate. According to the utility model, through the self-leveling mechanism, when the downloading table is lifted to enable two wafers to be contacted, partial positions are contacted firstly due to misalignment or deflection, and passive deflection compensation is carried out through the self-leveling mechanism; the substrate of the upper carrier bears the self gravity of the upper carrier to realize the stability of bonding pressure, avoid stress concentration and reduce wafer warpage.

Description

Wafer bonding machine loading table self-leveling device

Technical Field

The utility model relates to the technical field of semiconductor device manufacturing, in particular to a self-leveling device for an uploading table of a wafer bonding machine.

Background

In the field of semiconductor manufacturing technology, it is often necessary to bond wafers together to increase the number of devices per unit area; the wafer bonding technology refers to tightly combining two wafers to be bonded through physical and chemical actions, bonding the two wafers to be bonded, integrating atoms at a bonding interface through van der Waals force, molecular force and even atomic force under the action of external force, and enabling the bonding interface to reach specific bonding strength.

Wafer-to-wafer bonding is a key technology for realizing 3D integrated circuits, in which wafer bonding alignment accuracy is an important characterization parameter; the defect of alignment accuracy of wafer bonding can seriously affect the later stage of the process, further affect the connection functionality of a circuit and reduce the yield of the wafer; at present, a mechanical motion error exists in an alignment system of bonding equipment, so that the final alignment precision is affected, and therefore, the wafer bonding alignment precision is still to be improved.

Disclosure of Invention

The utility model aims to provide a wafer bonding machine uploading table self-leveling device so as to solve the problems in the prior art.

In order to achieve the above object, the present utility model provides the following solutions: the utility model provides a self-leveling device for an upper table of a wafer bonding machine, which comprises an upper table substrate, wherein an adsorption plate connecting plate is arranged below the upper table substrate, a plurality of through holes are formed in one side, facing the upper table substrate, of the adsorption plate connecting plate, self-leveling mechanisms are arranged in the through holes, the self-leveling mechanisms are arranged between the upper table substrate and the adsorption plate connecting plate, connecting columns are connected in the self-leveling mechanisms in a limiting sliding manner, the connecting columns are detachably connected with the upper table substrate, and the self-leveling mechanisms are used for leveling the upper table substrate.

Preferably, the self-leveling mechanism comprises a shell, the shell is fixedly connected with the adsorption disc connecting plate, a reed is fixedly connected to the upper portion of the inner wall of the shell, a guide rod is fixedly connected to the center of one end of the connecting column extending into the shell, a reed is arranged between the guide rod and the connecting column, the reed is fixedly connected with the upper portion of the inner wall of the shell, and the guide rod is in limiting sliding connection with the through hole.

Preferably, the guide rod extends out of the through hole and is slidably connected with a limiting block in the circumferential direction, the limiting block is fixedly connected with the adsorption disc connecting plate, a spring is sleeved on the guide rod in the circumferential direction, and the spring is arranged in the through hole.

Preferably, the adsorption disc connecting plate is arranged in a circular ring shape.

Preferably, the connecting column is in a cylindrical shape.

Preferably, the shell is in a circular column shape.

Preferably, the limiting block is arranged in a circular ring shape, and the diameter of the limiting block is the same as that of the connecting column.

Preferably, the guide rod is in a stepped cylindrical arrangement.

The utility model discloses the following technical effects:

according to the utility model, through the self-leveling mechanism, when the downloading table is lifted to enable two wafers to be contacted, partial positions are contacted firstly due to misalignment or deflection, and passive deflection compensation is carried out through the self-leveling mechanism; the substrate of the upper carrier bears the self gravity of the upper carrier to realize the stability of bonding pressure, avoid stress concentration and reduce wafer warpage.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the bottom structure of the adsorption disk connection plate of the present utility model;

FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 at A-A in accordance with the present utility model;

1, uploading a platform substrate; 2. a connecting column; 3. a self-leveling mechanism; 3-1, reed; 3-2, limiting blocks; 3-3, a guide rod; 3-4, a spring; 3-5, a shell; 4. and an adsorption disc connecting plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1-3, the utility model discloses a self-leveling device for an upper table of a wafer bonding machine, which comprises an upper table substrate 1, wherein an adsorption plate connecting plate 4 is arranged below the upper table substrate 1, one side of the adsorption plate connecting plate 4, which faces the upper table substrate 1, is provided with a plurality of through holes, self-leveling mechanisms 3 are arranged in the through holes, the self-leveling mechanisms 3 are arranged between the upper table substrate 1 and the adsorption plate connecting plate 4, connecting columns 2 are connected in the self-leveling mechanisms 3 in a limiting sliding manner, the connecting columns 2 are detachably connected with the upper table substrate 1, and the self-leveling mechanisms 3 are used for leveling the upper table substrate 1. Round holes are symmetrically formed in centers of the adsorption plate connecting plate 4 and the self-leveling mechanism 3, the uploading platform substrate 1 is connected with a moving platform gantry of the wafer bonding machine through bolts, one sides, deviating from each other, of the adsorption plate connecting plate 4 and the self-leveling mechanism 3 are respectively connected with a wafer adsorption plate, and the wafer adsorption plates are used for adsorbing the turned first wafer to be bonded and the turned second wafer to be bonded.

According to the utility model, through the self-leveling mechanism 3, when the downloading table of the wafer bonding machine is lifted to enable two wafers to be contacted, partial positions are contacted firstly due to misalignment or deflection, and passive deflection compensation is carried out through the self-leveling mechanism 3; the substrate of the upper carrier bears the self gravity of the upper carrier of the wafer bonding machine to realize the stability of bonding pressure, avoid stress concentration and reduce wafer warpage.

Further optimizing scheme, self-leveling mechanism 3 includes shell 3-5, and shell 3-5 and adsorption disc connecting plate 4 fixed connection, the upper portion fixedly connected with reed 3-1 of shell 3-5 inner wall, and spliced pole 2 stretches into the one end center fixedly connected with guide bar 3-3 in the shell 3-5, is provided with reed 3-1 between guide bar 3-3 and the spliced pole 2, and reed 3-1 and the inner wall upper portion fixed connection of shell 3-5, guide bar 3-3 and the spacing sliding connection of through-hole. The reed 3-1 can deform in any direction, so that the phenomenon of jamming is effectively prevented.

According to a further optimization scheme, a limiting block 3-2 is slidably connected to the circumferential direction of the guide rod 3-3 extending out of the through hole, the limiting block 3-2 is fixedly connected with the adsorption disc connecting plate 4, a spring 3-4 is sleeved on the circumferential direction of the guide rod 3-3, and the spring 3-4 is arranged in the through hole. By arranging the limiting block 3-2, a gap of 3-5mm is reserved between the reed 3-1 and the limiting block 3-2, and a gap of 7-9mm is reserved between the limiting block 3-2 and the inner wall of the shell 3-5.

Further optimizing scheme, the adsorption disc connecting plate 4 is circular ring-shaped. The number of the self-leveling mechanisms 3 is three, so that the three self-leveling mechanisms 3 are arranged on the adsorption disc connecting plate 4 at equal intervals.

Further optimizing scheme, the connecting column 2 is in a cylindrical shape, and the shell 3-5 is in a circular ring cylindrical shape. Leaving an equal spacing between the outer wall of the connecting post 2 and the inner wall of the housing 3-5.

Further optimizing scheme, stopper 3-2 is the ring shape setting, and guide bar 3-3 is the cylindrical setting of ladder. The spring 3-4 can apply elastic force to the guide rod 3-3 through the limiting block 3-2.

The diameter of the limiting block 3-2 is the same as that of the connecting column 2. The spacing between the limiting block 3-2, the connecting column 2 and the inner wall of the shell 3-5 is the same.

In order to facilitate disassembly and maintenance, the loading platform substrate 1 and the connecting column 2 are fixedly connected with the connecting column 2, the reed 3-1 and the guide column 3-3, and the adsorption disc connecting plate 4, the shell 3-5 and the limiting block 3-2 by bolts.

The working process comprises the following steps: the loading platform of the wafer bonding machine adsorbs the turned first wafer to be bonded, the loading platform of the wafer bonding machine adsorbs the second wafer to be bonded, the loading platform moves to the lower part of the first wafer to be bonded and aligns, the loading platform is lifted to enable the two wafers to be bonded, and as the first wafer to be bonded and the second wafer to be bonded are not centered or are deflected, partial positions are contacted first, passive deflection compensation is carried out through the self-leveling mechanism 3, so that the surface, which is attached to the first wafer to be bonded and the second wafer to be bonded, is completely centered and tightly attached; the substrate 1 of the loading platform bears the self gravity of the loading platform of the wafer bonding machine to realize the stability of bonding pressure, effectively avoid stress concentration, reduce wafer warpage and enable a bonding interface to reach specific bonding strength.

In the description of the present utility model, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

The above embodiments are only illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solutions of the present utility model should fall within the protection scope defined by the claims of the present utility model without departing from the design spirit of the present utility model.

Claims (8)

1. The utility model provides a wafer bonding machine uploading table self-leveling device which characterized in that: including last platform substrate (1), the below of going up platform substrate (1) is provided with adsorption disc connecting plate (4), adsorption disc connecting plate (4) orientation a plurality of through-hole has been seted up to one side of going up platform substrate (1), all be provided with self-leveling mechanism (3) in the through-hole, self-leveling mechanism (3) set up go up platform substrate (1) with between adsorption disc connecting plate (4), spacing sliding connection has spliced pole (2) in self-leveling mechanism (3), spliced pole (2) with go up platform substrate (1) can dismantle the connection, self-leveling mechanism (3) are used for right go up platform substrate (1) leveling.

2. The wafer bonder upload stand self-leveling apparatus of claim 1 wherein: the self-leveling mechanism (3) comprises a shell (3-5), the shell (3-5) is fixedly connected with the adsorption disc connecting plate (4), a reed (3-1) is fixedly connected to the upper portion of the inner wall of the shell (3-5), a guide rod (3-3) is fixedly connected to the center of one end of the connecting column (2) extending into the shell (3-5), a reed (3-1) is arranged between the guide rod (3-3) and the connecting column (2), the reed (3-1) is fixedly connected with the upper portion of the inner wall of the shell (3-5), and the guide rod (3-3) is in limiting sliding connection with the through hole.

3. The wafer bonder upload stand self-leveling apparatus of claim 2 wherein: the guide rod (3-3) stretches out of the circumferential direction of the through hole and is connected with a limiting block (3-2) in a sliding mode, the limiting block (3-2) is fixedly connected with the adsorption disc connecting plate (4), a spring (3-4) is sleeved on the circumferential direction of the guide rod (3-3), and the spring (3-4) is arranged in the through hole.

4. The wafer bonder upload stand self-leveling apparatus of claim 1 wherein: the adsorption disc connecting plate (4) is arranged in a circular ring shape.

5. The wafer bonder upload stand self-leveling apparatus of claim 1 wherein: the connecting column (2) is in a cylindrical shape.

6. The wafer bonder upload stand self-leveling apparatus of claim 2 wherein: the shell (3-5) is arranged in a circular column shape.

7. The wafer bonder upload station self-leveling apparatus of claim 3 wherein: the limiting block (3-2) is arranged in a circular ring shape, and the diameter of the limiting block (3-2) is the same as that of the connecting column (2).

8. The wafer bonder upload stand self-leveling apparatus of claim 2 wherein: the guide rod (3-3) is arranged in a stepped cylindrical shape.