CN220312040U - Welding device for chip - Google Patents

Welding device for chip Download PDF

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Publication number
CN220312040U
CN220312040U CN202321864379.1U CN202321864379U CN220312040U CN 220312040 U CN220312040 U CN 220312040U CN 202321864379 U CN202321864379 U CN 202321864379U CN 220312040 U CN220312040 U CN 220312040U
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China
Prior art keywords
mounting seat
welding
seat
welding table
chip
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CN202321864379.1U
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Chinese (zh)
Inventor
王珲荣
肖鹏
张燕锋
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Hunan Aochuangpu Technology Co ltd
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Hunan Aochuangpu Technology Co ltd
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Abstract

The utility model relates to the technical field of chip welding, in particular to a chip welding device which comprises a turntable, a mounting seat, a welding table, a differential head and an elastic component. The mounting seat is rotationally connected with the turntable; the welding table is hinged with the mounting seat; the differential head is connected with the welding table in a sliding way, and a measuring rod of the differential head is connected with the mounting seat; the elastic component is connected with the mounting seat and is elastically connected with the welding table; wherein, differential head and elastic component can cooperate the regulation to make the welding bench can rotate around the articulated rod with the mount pad. The welding table and the turntable are arranged on two sides of the mounting seat, namely the turntable is arranged below the welding table, so that the welding of the chip cannot be influenced, and the possibility of interference with external pressing equipment is low; the turntable can be pre-buried in the external bottom plate, so that the occupied space of the turntable can be saved. The differential head and the elastic component are all installed on the welding table, and are in the shape of an upright post, so that the occupied space is small.

Description

Welding device for chip
Technical Field
The utility model relates to the technical field of chip welding, in particular to a welding device for chips.
Background
The chip is usually formed by welding a substrate and components, specifically, the substrate is placed on a welding table, a heater is arranged in the welding table, the heater can heat the substrate to melt solder on the substrate, the components and the substrate are pressed for a certain time at the moment, and the welding of the chip is completed after cooling.
Because there may be material taking errors and carrying errors in the process of carrying the substrate to the welding table, the material unloading errors are finally caused, so that the actual placing position of the substrate on the welding table deviates from the theoretical placing position, the alignment errors of components and the substrate are caused, the welding precision of the chip is further affected, and even the chip is scrapped.
The parameters of the placement position of the substrate on the welding table mainly comprise a basal plane angle and a relative angle, wherein the basal plane angle refers to an included angle between the welding table and the horizontal plane, and theoretically, the basal plane angle is close to zero so as to ensure that the stress on each part is uniform when the substrate and the components are pressed and prevent the chip from being crushed; the relative angle refers to an included angle between an actual placement position and a theoretical placement position of the substrate in a horizontal plane, for example, an included angle between central axes of the two, and the theoretical relative angle should approach zero in order to ensure the alignment precision of the substrate and the components.
Some existing welding tables do not have a compensation adjustment function, and compensation adjustment is needed by means of external equipment to replace a substrate on the welding table, so that working hours are prolonged, and the external equipment occupies a large space. Some welding tables also have a partial compensation adjustment function, such as the welding table can rotate to adjust the relative angle, but the base angle is difficult to adjust, such as the whole welding table is driven to swing through the electric measuring rod, the adjustment mode is too complex, and driving equipment such as the electric measuring rod occupies a larger space.
Disclosure of Invention
First, the technical problem to be solved
In view of the above-mentioned drawbacks and shortcomings of the prior art, the present utility model provides a chip soldering apparatus, which solves the technical problem that the compensation adjustment device of the existing soldering station occupies a larger space.
(II) technical scheme
In order to achieve the above object, a die bonding apparatus of the present utility model includes:
a turntable;
the mounting seat is rotationally connected with the turntable;
the welding table is hinged with the mounting seat;
the differential head is in sliding connection with the welding table, and a measuring rod of the differential head is connected with the mounting seat;
the elastic component is connected with the mounting seat and is elastically connected with the welding table;
wherein, differential head with the elastic component can cooperate the regulation, so that the welding bench can rotate around with the articulated rod of mount pad.
Optionally, the welding table comprises a regulating seat, a heater and a heating plate;
the adjusting seat is hinged with the mounting seat; the heater is arranged on the adjusting seat; the heating plate is arranged on the heater;
the micro head is in sliding connection with the adjusting seat, and the elastic component is in elastic connection with the adjusting seat.
Optionally, a gap is provided between the adjustment seat and the mounting seat.
Optionally, the heating plate is provided with air holes.
Optionally, a limiting piece is arranged on the measuring rod of the micro head, and the limiting piece is arranged between the adjusting seat and the mounting seat;
and the measuring rod of the differential head is in sliding connection with the mounting seat.
Optionally, an empty avoiding groove is formed in the mounting seat, and the limiting piece can be lifted in the empty avoiding groove.
Optionally, the elastic component comprises an elastic member and a connecting member;
the connecting piece penetrates through the adjusting seat and then is connected with the mounting seat;
one end of the elastic piece is abutted with the adjusting seat, and the other end of the elastic piece is abutted with the head of the connecting piece.
Optionally, the connecting piece is a polish rod bolt or a pin.
Optionally, the turntable comprises a bearing seat, a slewing driver and a flange plate;
the bearing seat is rotationally connected with the rotating shaft of the rotary driver, the rotating shaft of the rotary driver is connected with the flange plate, and the flange plate is connected with the mounting seat.
(III) beneficial effects
The beneficial effects of the utility model are as follows:
the mount pad is connected with the revolving stage rotation to the welding bench is articulated with the mount pad, consequently the revolving stage can drive the welding bench and rotate, with the real-time regulation to the base plate relative angle, improves the welding precision of chip.
The differential head and the elastic component can be matched and adjusted so that the welding table can rotate around a hinging rod with the mounting seat. The adjustment size of the differential head is accurate to micrometers, the telescopic precision of the measuring rod is high, and the base surface angle of the welding table can be correspondingly adjusted by adjusting the telescopic quantity of the differential head, so that the welding precision of the chip is improved.
The elastic component is connected with the mounting seat to limit the elastic component. The elastic component is elastically connected with the welding table, so that the welding table can swing around the hinging rod in a butt joint manner, and the swing angle of the welding table is limited through the differential head. The elastic component can play a role in self-adaptive adjustment, and can stretch and retract along with stretching and retracting of the measuring rod of the differential head so as to enable the welding table to be abutted to the differential head in real time, and horizontal leveling of the welding table is achieved.
The differential head is used for adjusting the base angle of the welding table, and before the chip production is started, the differential head is used for horizontally leveling the welding table, namely, the base angle is adjusted to be approximately zero, so that errors of the base angle caused by factors such as line stop, expansion due to heat, contraction due to cold, collision vibration and the like of the production line are effectively eliminated, and the chip welding precision is improved. After one-time adjustment, the welding table can carry out high-precision welding operation for a long time through the limiting effect of the differential head and the elastic assembly on the welding table, so that the working hour for adjusting the angle of the base surface is greatly reduced.
The welding table and the turntable are arranged on two sides of the mounting seat, namely the turntable is arranged below the welding table, so that the welding of the chip cannot be influenced, and the possibility of interference with external pressing equipment is low; the turntable can be pre-buried in the external bottom plate, so that the occupied space of the turntable can be saved. The differential head and the elastic component are all installed on the welding table, and are in the shape of an upright post, so that the occupied space is small.
Drawings
FIG. 1 is a schematic diagram of a soldering apparatus for chips according to the present utility model;
FIG. 2 is a perspective view of a die bonding apparatus according to the present utility model;
FIG. 3 is a schematic front view of a soldering apparatus for chips according to the present utility model;
FIG. 4 is a schematic side view of a die bonding apparatus of the present utility model;
fig. 5 is a plan view of the soldering apparatus for chips of the present utility model.
[ reference numerals description ]
1: a turntable; 11: a bearing seat; 12: a slewing drive; 13: a flange plate;
2: a mounting base; 21: an empty-avoiding groove;
3: a welding table; 31: an adjusting seat; 32: a heater; 33: a heating sheet; 331: air holes;
4: a differentiating head; 41: a limiting piece;
5: an elastic component; 51: an elastic member; 52: and a connecting piece.
Detailed Description
The utility model will be better explained by the following detailed description of the embodiments with reference to the drawings.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; "coupled" may be mechanical or electrical; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, the present utility model provides a soldering apparatus for a chip, which includes a turntable 1, a mount 2, a soldering station 3, a micro head 4, and an elastic member 5. The mounting seat 2 is rotationally connected with the turntable 1; the welding table 3 is hinged with the mounting seat 2; the differential head 4 is in sliding connection with the welding table 3, and a measuring rod of the differential head 4 is connected with the mounting seat 2; the elastic component 5 is connected with the mounting seat 2 and is elastically connected with the welding table 3; wherein, micro-head 4 and elastic component 5 can cooperate the regulation to make welding bench 3 can rotate around the articulated pole with mount pad 2.
In one embodiment, the micro-head 4 comprises a micro-cylinder, a shaft sleeve and a measuring rod, wherein the micro-cylinder is rotationally connected with the shaft sleeve, and the shaft sleeve is abutted with the welding table 3; the differential tube is connected with the measuring rod, and the measuring rod can be driven to synchronously rotate by rotating the differential tube, so that the high-precision extension and retraction of the measuring rod are realized. Specifically, the measuring rod is fixedly connected with the mounting seat 2, and the elastic component 5 is in a continuous tension state, so that the welding table 3 can be pulled upwards in real time, the welding table 3 is abutted with the shaft sleeve, and the shaft sleeve plays a limiting role in swinging of the welding table 3. When the measuring rod stretches, the welding table 3 rises under the tensile force of the elastic component 5, namely swings around the hinge shaft of the welding table 3 and the mounting seat 2, so that the welding table 3 is in real-time abutting connection with the shaft sleeve; when the measuring rod is contracted, the micro-cylinder and the shaft sleeve are pressed downwards, the welding table 3 is swung downwards against the tensile force of the spring, and the welding table 3 is abutted with the shaft sleeve in real time. According to the utility model, the differential head 4 and the elastic component 5 are driven in a matched manner, so that the rotation of the differential head 4 is skillfully converted into the swing of the welding table 3 around the hinging rod, the adjustment mode is simple and quick, and the differential head 4 and the elastic component 5 can continuously limit the welding table 3, so that the welding device can work for a long time with high precision, and the adjustment frequency of the welding table 3 to the basal plane angle is greatly reduced.
The mount pad 2 is connected with the revolving stage 1 rotation to the welding bench 3 articulates with the mount pad 2, consequently revolving stage 1 can drive the welding bench 3 rotation, with the real-time regulation to the base plate relative angle carries out, improves the welding precision of chip.
The differential head 4 and the elastic assembly 5 can be adjusted in a matched manner so that the welding table 3 can rotate around a hinging rod with the mounting seat 2. The adjustment size of the differential head 4 is accurate to micrometers, the extension precision of the measuring rod is high, and the base surface angle of the welding table 3 can be correspondingly adjusted by adjusting the extension quantity of the differential head 4, so that the welding precision of the chip is improved.
The elastic component 5 is connected with the mounting seat 2 to limit the elastic component 5. The elastic member 5 is elastically connected to the welding table 3, and thus can swing around the hinge rod in abutment with the welding table 3, and limit the swing angle of the welding table 3 by the differential head 4. The elastic component 5 can play a role in self-adaptive adjustment, and can stretch and retract along with stretching and retracting of the measuring rod of the micro head 4 so as to enable the welding table 3 to be abutted on the micro head 4 in real time, and horizontal leveling of the welding table 3 is achieved.
The differential head 4 is used for adjusting the base angle of the welding table 3, and before the chip production is started, the differential head 4 is used for horizontally leveling the welding table 3, namely, the base angle is adjusted to be zero, so that errors of the base angle caused by factors such as production line stop, expansion and contraction, collision and vibration are effectively eliminated, and the chip welding precision is improved. After one-time adjustment, the welding table 3 can perform high-precision welding operation for a long time through the limiting effect of the differential head 4 and the elastic component 5 on the welding table 3, so that the working time for adjusting the base angle is greatly reduced.
The welding table 3 and the rotary table 1 are arranged on two sides of the mounting seat 2, namely, the rotary table 1 is arranged below the welding table 3, so that the welding of chips cannot be influenced, and the possibility of interference with external pressing equipment is low; the turntable 1 can be embedded in the external bottom plate, and the occupied space of the turntable 1 can be saved. The differential head 4 and the elastic component 5 are both arranged on the welding table 3, and the differential head 4 and the elastic component 5 are both in the shape of an upright post, so that the occupied space is small.
The detection of the information of the actual placement position of the substrate can be completed through a detection camera, and detection equipment such as the detection camera can be arranged on external pressing equipment or can be arranged on the side or the upper side of the welding device. In this real-time example, the CCD technology is adopted, the detection camera takes a picture with the top surface of the welding table 3 as a reference, the actual picture is overlapped with the pre-stored reference picture in the system, namely, the side lengths of the top surfaces of the two welding tables 3 are overlapped to correct the reference, at the moment, the position of the substrate in the actual picture and the position of the substrate in the reference picture are compared, the edge spacing of the substrate is compared, finally, the CCD obtains the size deviation according to the picture proportion, and the turntable 1 further carries out compensation adjustment on the relative angle of the welding table 3 according to the size deviation. Similarly, when the base plate compensates and adjusts the base angle, the size deviation of the base angle of the welding table 3 is detected by the detection camera or the inclination sensor, and the operator correspondingly adjusts the differential head 4 according to the size deviation. The welding device integrates the compensation and adjustment functions of the base surface angle and the relative angle of the welding table 3, the base surface angle is indirectly adjusted through the differential head 4, and the relative angle is adjusted in real time through the turntable 1, so that the welding precision and the welding safety of the chip are improved.
As shown in fig. 2, the soldering station 3 includes a setting seat 31, a heater 32, and a heating sheet 33; the adjusting seat 31 is hinged with the mounting seat 2; the heater 32 is mounted on the adjusting seat 31; the heating plate 33 is mounted on the heater 32; the differentiating head 4 is slidably connected with the adjusting seat 31, and the elastic component 5 is elastically connected with the adjusting seat 31. Specifically, the heater 32 can heat the heating plate 33, and the heating plate 33 further conducts heat to the substrate to melt the solder on the substrate, so that the solder is convenient to press-fit and weld with the component. The heater 32, the differential head 4 and the elastic component 5 are all arranged on the adjusting seat 31, the differential head 4 and the elastic component 5 are all arranged on one side of the heater 32, and are in the shape of an upright post, so that the occupied space is small. Optionally, a step platform is provided on the adjusting seat 31, and the micro head 4 and the elastic component 5 are arranged at the step platform, so that the installation height of the micro head 4 and the elastic component 5 is further reduced, the top ends of the micro head 4 and the elastic component 5 do not exceed the top end of the heater 32, the occupied space is further reduced, and the interference with external equipment is effectively avoided.
Further, a gap is provided between the adjustment seat 31 and the mount 2. In this embodiment, the adjusting seat 31 is provided with a hinge block, the hinge block is hinged with the mounting seat 2 through a hinge rod, and the height of the hinge block is higher, and the specific height is set as required, so long as a gap is left between the adjusting seat 31 and the mounting seat 2. The clearance is reserved to increase the swingable angle of the adjustment seat 31, thereby increasing the adjustable range of the base angle of the welding table 3 and enhancing the adaptability to the base angle adjustment.
Next, the heating sheet 33 is provided with air holes 331. The air hole 331 is externally connected with an air pipe, and the heating sheet 33 adsorbs or desorbs the substrate by vacuum adsorption. Compared with the mode of directly placing the substrate on the heating plate 33, the air hole 331 is additionally arranged, so that the adsorption force of the heating plate 33 to the substrate can be enhanced, the substrate is fully abutted against the heating plate 33, the heating plate 33 can carry out compensation adjustment of the base angle through the differential head 4, the substrate is fully contacted with the heating plate 33, the base angle of the substrate is enabled to be close to zero, and the adjustment precision of the compensation adjustment of the base angle is further improved. And after the heating plate 33 adsorbs the substrate, the friction force between the heating plate and the substrate is increased, and the substrate is not easy to slip in the pressing process, so that the assembly of the chip is also facilitated.
Referring to fig. 1 and 3, a limiting piece 41 is arranged on the measuring rod of the micro head 4, and the limiting piece 41 is arranged between the adjusting seat 31 and the mounting seat 2; the measuring rod of the differential head 4 is in sliding connection with the mounting seat 2. In this embodiment, the elastic component 5 is in a continuously pressed state, so that the adjusting seat 31 can be pressed against the limiting member 41 in real time. Compared with the embodiment in which the measuring rod of the micro-head 4 is abutted with the mounting seat 2, in this embodiment, the adjusting seat 31, that is, the welding table 3 is abutted with the limiting member 41 in real time, but not with the shaft sleeve of the micro-head 4, and the limiting member 41 bears the pressure of the welding table 3, so that the shaft sleeve and the micro-cylinder can be effectively protected, and the adjusting precision of the micro-head 4 is further ensured.
Further, the mounting base 2 is provided with a clearance groove 21, and the stopper 41 can be lifted and lowered in the clearance groove 21. The clearance groove 21 can play a guiding role in lifting and lowering the limiting piece 41, so that the differential head 4 is limited in the horizontal direction, and the stability of the extension and retraction of the differential head 4 in the adjusting process is enhanced.
Next, the elastic assembly 5 includes an elastic member 51 and a connecting member 52; the connecting piece 52 penetrates through the adjusting seat 31 and then is connected with the mounting seat 2; one end of the elastic member 51 abuts against the adjustment seat 31, and the other end abuts against the head of the connecting member 52. The elastic member 51 may be rubber or a spring, in this embodiment, a spring is selected, and the connecting member 52 passes through the elastic member 51 and is fixedly connected with the mounting seat 2, so that the elastic member 51 can press or pull the adjusting seat 31, and further cooperate with the differential head 4 to perform compensation adjustment.
In addition, the connecting member 52 may be a polish rod bolt or a pin, as long as the connecting member can perform a fixed connection function. Optionally, the elastic component 5 further includes a spacer, where the connecting piece 52 penetrates through the spacer and the elastic piece 51, one end of the spacer abuts against the elastic piece 51, and the other end abuts against the head of the connecting piece 52, so as to increase the abutting surface between the elastic piece 51 and the head of the connecting piece 52, further enhance the stability of elastic force transmission, and improve the compensation adjustment precision.
As shown in fig. 3, 4 and 5, the turntable 1 includes a bearing housing 11, a swing driver 12 and a flange 13; the bearing seat 11 is rotationally connected with the rotating shaft of the rotary driver 12, the rotating shaft of the rotary driver 12 is connected with the flange 13, and the flange 13 is connected with the mounting seat 2. The rotary driver 12 may be an electric motor or a motor, and in this embodiment, a speed reducer is further provided, the rotary driver 12 is connected to the speed reducer, and the speed reducer is connected to the bearing housing 11. The arrangement of the flange 13 increases the contact area between the rotating shaft of the rotary driver 12 and the mounting seat 2, and the gravity of the mounting seat 2, the welding table 3 and other devices is distributed on the flange 13, so that the turntable 1 is more stable in transmission.
It should be understood that the above description of the specific embodiments of the present utility model is only for illustrating the technical route and features of the present utility model, and is for enabling those skilled in the art to understand the present utility model and implement it accordingly, but the present utility model is not limited to the above-described specific embodiments. All changes or modifications that come within the scope of the appended claims are intended to be embraced therein.

Claims (9)

1. A soldering apparatus for a chip, the soldering apparatus comprising:
a turntable (1);
the mounting seat (2), the said mounting seat (2) is connected with said rotary table (1) rotation;
the welding table (3) is hinged with the mounting seat (2);
the differential head (4) is in sliding connection with the welding table (3), and a measuring rod of the differential head (4) is connected with the mounting seat (2);
the elastic component (5) is connected with the mounting seat (2) and is elastically connected with the welding table (3);
wherein, differential head (4) with elastic component (5) can cooperate the regulation, so that welding bench (3) can rotate around with articulated pole of mount pad (2).
2. The soldering device for chips according to claim 1, wherein the soldering station (3) comprises an adjustment seat (31), a heater (32) and a heating plate (33);
the adjusting seat (31) is hinged with the mounting seat (2); the heater (32) is arranged on the adjusting seat (31); the heating plate (33) is mounted on the heater (32);
the micro head (4) is in sliding connection with the adjusting seat (31), and the elastic component (5) is in elastic connection with the adjusting seat (31).
3. The soldering device for chips according to claim 2, characterized in that a gap is provided between the adjustment seat (31) and the mounting seat (2).
4. The soldering apparatus of claim 2, wherein the heater chip (33) is provided with air holes (331).
5. The welding device of a chip according to claim 2, characterized in that a limiting piece (41) is arranged on the measuring rod of the differential head (4), and the limiting piece (41) is arranged between the adjusting seat (31) and the mounting seat (2);
the measuring rod of the micro head (4) is in sliding connection with the mounting seat (2).
6. The chip bonding apparatus according to claim 5, wherein the mounting base (2) is provided with a clearance groove (21), and the stopper (41) is capable of lifting in the clearance groove (21).
7. The soldering device of a chip according to claim 2, wherein the elastic assembly (5) comprises an elastic member (51) and a connecting member (52);
the connecting piece (52) penetrates through the adjusting seat (31) and then is connected with the mounting seat (2);
one end of the elastic member (51) is abutted against the adjusting seat (31), and the other end is abutted against the head of the connecting member (52).
8. The die bonding apparatus according to claim 7, wherein the connection member (52) is a polish rod bolt or a pin.
9. Welding device of chips according to any of claims 1-8, characterized in that the turntable (1) comprises a bearing seat (11), a slewing drive (12) and a flange (13);
the bearing seat (11) is rotationally connected with a rotating shaft of the rotary driver (12), the rotating shaft of the rotary driver (12) is connected with the flange plate (13), and the flange plate (13) is connected with the mounting seat (2).
CN202321864379.1U 2023-07-17 2023-07-17 Welding device for chip Active CN220312040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321864379.1U CN220312040U (en) 2023-07-17 2023-07-17 Welding device for chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321864379.1U CN220312040U (en) 2023-07-17 2023-07-17 Welding device for chip

Publications (1)

Publication Number Publication Date
CN220312040U true CN220312040U (en) 2024-01-09

Family

ID=89415243

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321864379.1U Active CN220312040U (en) 2023-07-17 2023-07-17 Welding device for chip

Country Status (1)

Country Link
CN (1) CN220312040U (en)

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