CN220305093U - Multi-point rapid contact angle measuring instrument for wafer - Google Patents
Multi-point rapid contact angle measuring instrument for wafer Download PDFInfo
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- CN220305093U CN220305093U CN202320833171.7U CN202320833171U CN220305093U CN 220305093 U CN220305093 U CN 220305093U CN 202320833171 U CN202320833171 U CN 202320833171U CN 220305093 U CN220305093 U CN 220305093U
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- contact angle
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- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 26
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- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- -1 printing and dyeing Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The utility model discloses a wafer multipoint rapid contact angle measuring instrument which comprises a bottom plate, a light source box and a drip assembly, wherein the light source box and the drip assembly are positioned on two sides of the top end of the bottom plate, the light source box and the drip assembly are respectively connected with the bottom plate through fixing frames, a sample platform is arranged on the top end of the bottom plate and between the light source box and the drip assembly, the drip assembly comprises a drip connecting block, and one side of the drip connecting block is provided with a precision motor. The beneficial effects are that: the operation of the motor drives the pushing block to move, so that the pushing rod is pushed to drop out the liquid in the needle tube through the needle head and automatically transfer the liquid to the sample platform; the Y-axis mechanism and the rotating motor are matched, the rotating motor drives the sample platform to horizontally move in the Y-axis mode, and the rotating motor drives the sample platform to horizontally rotate, so that automatic adjustment of different drip positions is achieved.
Description
Technical Field
The utility model relates to the technical field of measuring instruments, in particular to a wafer multipoint rapid contact angle measuring instrument.
Background
The contact angle measuring instrument is mainly used for measuring the contact angle of liquid to solid, namely the wettability of liquid to solid, can measure the contact angle of various liquids to various materials, and has very important effects on scientific research and production in industries such as petroleum, printing and dyeing, medicine, spraying, mineral dressing and the like.
The common contact angle measuring instrument mainly comprises a visual recognition system, a light source, a sample adding system and a sample platform for placing samples, and is characterized in that during operation, the manual rotation of the manual sample platform is used for enabling samples to be detected to be aligned to the sample adding system for sample adding, and finally the visual recognition system is used for performing visual analysis, but because the sample platform for placing the samples can only be manually rotated, when the dripping position is regulated, the positioning accuracy is poor, only the approximate position of the dripping position is regulated, the detection is irregular, the detection efficiency is lower, and the detection of a wafer is inconvenient. Since the wafer test is a continuous measurement of tens of points.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
Aiming at the problems in the related art, the utility model provides a wafer multipoint rapid contact angle measuring instrument, which aims to overcome the technical problems in the prior art.
For this purpose, the utility model adopts the following specific technical scheme:
the utility model provides a quick contact angle measuring apparatu of wafer multiple spot, includes the bottom plate and is located light source case and the dropping subassembly of bottom plate top both sides, the light source case with the dropping subassembly is all connected through the mount respectively with the bottom plate, the top of bottom plate just is located be equipped with sample platform between light source case with the dropping subassembly, the dropping subassembly pass through Z axle subassembly with correspond the mount is connected, sample platform's bottom is equipped with the rotating electrical machines, the bottom of rotating electrical machines be equipped with the Y axle mechanism that the bottom plate is connected.
As the preference, the dropping liquid subassembly includes the dropping liquid connecting block, the spout has been seted up to one side of dropping liquid connecting block, one side of spout be equipped with rather than assorted ejector pad, the bottom of ejector pad is equipped with the push rod of vertical setting, the bottom of push rod is equipped with the needle tubing, the bottom of needle tubing is equipped with rather than assorted syringe needle, just the needle tubing pass through the needle tubing fixed block with the dropping liquid connecting block is connected, on the mount and be located the below of dropping liquid subassembly be equipped with the camera that the light source case axial set up.
Preferably, the drip connecting block is provided with a motor connected with the pushing block, and one side of the light source box, which is close to the sample platform, is provided with a lens matched with the light source box.
Preferably, the Y-axis mechanism includes a support block located at the top end of the bottom plate, and an electric rail one connected to the rotating motor is disposed at the top end of the support block.
Preferably, the Z-axis assembly comprises a side block positioned at the top end of the fixing frame, and an electric guide rail II connected with the drip connecting block is arranged on one side of the side block.
Preferably, the sample platform is provided with a plurality of through holes which are uniformly distributed, and the number of the through holes is four, so that the sample platform is convenient to empty and take samples.
The beneficial effects of the utility model are as follows: through the design of the dropping component, the motor operates to drive the pushing block to move, so that the pushing rod is pushed to drop the liquid in the needle tube through the needle head and drop the liquid onto the sample platform; and the Y-axis mechanism and the rotating motor are matched, the operation of the Y-axis mechanism drives the sample platform to horizontally move along the Y axis through the rotating motor, and the operation of the rotating motor drives the sample platform to horizontally rotate, so that the automatic adjustment of the dripping position is realized, and the working efficiency of the automatic dripping device is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer multipoint rapid contact angle measurement apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a wafer multipoint rapid contact angle measurement apparatus according to a second embodiment of the present utility model;
FIG. 3 is a side view of a wafer multi-point rapid contact angle measurement apparatus according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a dropping unit in the wafer multi-point rapid contact angle measuring apparatus according to an embodiment of the present utility model.
In the figure:
1. a bottom plate; 2. a light source box; 3. a drip assembly; 4. a sample platform; 5. a drip connecting block; 6. a chute; 7. a pushing block; 8. a push rod; 9. a needle tube; 10. a needle tube fixing block; 11. a motor; 12. a lens; 13. a Z-axis assembly; 14. a fixing frame; 15. a rotating electric machine; 16. a Y-axis mechanism; 17. a camera; 18. a support block; 19. a side block; 20. a through hole; 21. a needle.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the utility model, a wafer multipoint rapid contact angle measuring instrument is provided.
Embodiment one;
as shown in fig. 1-4, the multipoint rapid contact angle measuring instrument for wafers according to the embodiment of the utility model comprises a bottom plate 1, and a light source box 2 and a liquid dropping assembly 3 which are positioned on two sides of the top end of the bottom plate 1, wherein the light source box 2 and the liquid dropping assembly 3 are respectively connected with the bottom plate 1 through a fixing frame 14, a sample platform 4 is arranged on the top end of the bottom plate 1 and between the light source box 2 and the liquid dropping assembly 3, the liquid dropping assembly 3 is connected with the corresponding fixing frame 14 through a Z-axis assembly 13, a rotating motor 15 is arranged at the bottom end of the sample platform 4, and a Y-axis mechanism 16 connected with the bottom plate 1 is arranged at the bottom end of the rotating motor 15.
Embodiment two;
as shown in fig. 1-4, the drip assembly 3 includes a drip connection block 5, a chute 6 is provided on one side of the drip connection block 5, a push block 7 matched with the chute 6 is provided on one side of the chute 6, a push rod 8 vertically arranged is provided at the bottom of the push block 7, a needle tube 9 is provided at the bottom of the push rod 8, a needle 21 matched with the needle tube 9 is provided at the bottom of the needle tube 9, the needle tube 9 is connected with the drip connection block 5 through a needle tube fixing block 10, a camera 17 axially arranged with the light source box 2 is provided on the fixing frame 14 and below the drip connection block 3, a motor 11 connected with the push block 7 is provided on the drip connection block 5, and a lens 12 matched with the light source box 2 is provided on one side of the light source box 2 close to the sample platform 4.
Embodiment three;
as shown in fig. 1-4, the Y-axis mechanism 16 includes a supporting block 18 located at the top end of the bottom plate 1, an electric rail one connected to the rotating motor 15 is disposed at the top end of the supporting block 18, the Z-axis assembly 13 includes a side block 19 located at the top end of the fixing frame 14, an electric rail two connected to the drip connection block 5 is disposed at one side of the side block 19, a plurality of evenly distributed through holes 20 are formed in the sample platform 4, and the number of the through holes 20 is four, so that the sample can be conveniently emptied and fetched.
In order to facilitate understanding of the above technical solutions of the present utility model, the following describes in detail the working principle or operation manner of the present utility model in the actual process.
In practical application, a wafer sample is placed on the sample platform 4, the rotating motor 15 is driven by the Y-axis mechanism 16 to drive the sample platform 4 to move to a proper position, then the dropping liquid component 3 is driven by the Z-axis component 13 to adjust to a proper height, the motor 11 is started to drive the push block 7 to move, the push rod 8 is pushed to drop liquid in the needle tube 9 through the needle head 21 and drop the liquid onto the wafer sample on the sample platform 4 (then the Z-axis component 13 is reset), the light source emits light, the liquid drops are irradiated through the lens, the camera is used for shooting and recording parameters, after the point measurement on the wafer sample is completed, the sample platform 4 is driven by the Y-axis mechanism 16 to horizontally move through the rotating motor 15, the sample platform 4 is driven by the rotating motor 15 to horizontally rotate, the position of the wafer sample is adjusted, then the measurement work is repeated, fifty points on the wafer can be tested, and the work efficiency of the wafer can be greatly improved. The contact angle measurement of a common 6-12 inch wafer can be satisfied, and then the position is adjusted through the matching of the Y-axis mechanism 16 and the rotating motor 15, and the measurement is repeated until the measurement of the point to be measured on the wafer sample is completed.
In summary, by means of the above technical solution of the present utility model, through the design of the drip assembly 3, the motor 11 operates to drive the pushing block 7 to move, so as to push the pushing rod 8 to drip the liquid in the needle tube 9 through the needle 21 and drop the liquid onto the sample platform 4; the Y-axis mechanism 16 and the rotating motor 15 are matched, the operation of the Y-axis mechanism 16 drives the sample platform 4 to horizontally move along the Y axis through the rotating motor 15, and the operation of the rotating motor 15 drives the sample platform 4 to horizontally rotate, so that the automatic adjustment of the dripping position is realized, and the working efficiency of the automatic dripping position is greatly improved.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a quick contact angle measuring apparatu of wafer multiple spot, its characterized in that, include bottom plate (1) and be located light source case (2) and dropping subassembly (3) of bottom plate (1) top both sides, light source case (2) with dropping subassembly (3) all are connected with bottom plate (1) through mount (14) respectively, the top of bottom plate (1) just is located be equipped with sample platform (4) between light source case (2) and dropping subassembly (3), dropping subassembly (3) are through Z axle subassembly (13) with corresponding mount (14) are connected, the bottom of sample platform (4) is equipped with rotating electrical machines (15), the bottom of rotating electrical machines (15) be equipped with Y axle mechanism (16) that bottom plate (1) are connected.
2. The wafer multipoint rapid contact angle measuring instrument according to claim 1, wherein the drip assembly (3) comprises a drip connection block (5), a chute (6) is formed in one side of the drip connection block (5), a pushing block (7) matched with the chute (6) is arranged on one side of the chute (6), a vertically arranged pushing rod (8) is arranged at the bottom end of the pushing block (7), a needle tube (9) is arranged at the bottom end of the pushing rod (8), a needle head (21) matched with the needle tube (9) is arranged at the bottom end of the needle tube (9), the needle tube (9) is connected with the drip connection block (5) through a needle tube fixing block (10), and a camera (17) axially arranged with the light source box (2) is arranged on the fixing frame (14) and below the drip assembly (3).
3. The rapid contact angle measuring instrument for wafers according to claim 2, wherein the drip connection block (5) is provided with a motor (11) connected with the push block (7), and a lens (12) matched with the light source box (2) is arranged on one side of the light source box, which is close to the sample platform (4).
4. A wafer multipoint rapid contact angle measuring instrument according to claim 3, wherein the Y-axis mechanism (16) comprises a support block (18) located at the top end of the base plate (1), and an electric guide rail (i) connected with the rotating motor (15) is arranged at the top end of the support block (18).
5. The wafer multipoint rapid contact angle measuring instrument according to claim 4, wherein the Z-axis assembly (13) comprises a side block (19) positioned at the top end of the fixing frame (14), and an electric guide rail II connected with the drip connection block (5) is arranged on one side of the side block (19).
6. The rapid contact angle measuring instrument for wafers according to claim 5, wherein the sample platform (4) is provided with a plurality of evenly distributed through holes (20), and the number of the through holes (20) is four, so that the sample can be conveniently emptied and taken.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320833171.7U CN220305093U (en) | 2023-04-14 | 2023-04-14 | Multi-point rapid contact angle measuring instrument for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320833171.7U CN220305093U (en) | 2023-04-14 | 2023-04-14 | Multi-point rapid contact angle measuring instrument for wafer |
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| CN220305093U true CN220305093U (en) | 2024-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202320833171.7U Active CN220305093U (en) | 2023-04-14 | 2023-04-14 | Multi-point rapid contact angle measuring instrument for wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117848908A (en) * | 2024-01-10 | 2024-04-09 | 东莞市晟鼎精密仪器有限公司 | Full-automatic wafer detection equipment based on visual data analysis |
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2023
- 2023-04-14 CN CN202320833171.7U patent/CN220305093U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117848908A (en) * | 2024-01-10 | 2024-04-09 | 东莞市晟鼎精密仪器有限公司 | Full-automatic wafer detection equipment based on visual data analysis |
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