CN220296144U - Silicon wafer cutting machine - Google Patents
Silicon wafer cutting machine Download PDFInfo
- Publication number
- CN220296144U CN220296144U CN202321729207.3U CN202321729207U CN220296144U CN 220296144 U CN220296144 U CN 220296144U CN 202321729207 U CN202321729207 U CN 202321729207U CN 220296144 U CN220296144 U CN 220296144U
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- China
- Prior art keywords
- rectangular
- silicon wafer
- cutting machine
- shaped frame
- rectangular cavity
- Prior art date
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 239000010703 silicon Substances 0.000 title claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 45
- 238000005520 cutting process Methods 0.000 title claims abstract description 31
- 238000003698 laser cutting Methods 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 abstract description 24
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer cutting machine. The technical proposal comprises: the laser cutting machine comprises a machine base and a U-shaped frame, wherein rectangular grooves are symmetrically formed in two sides of the upper surface of the machine base, a polished rod is installed in each rectangular groove, a translation screw rod is rotatably installed in each rectangular groove, two U-shaped sides of the U-shaped frame are respectively connected with the polished rod in each rectangular groove in a sliding mode and in spiral mode, a rectangular cavity I is formed in each U-shaped frame beam, a longitudinal translation screw rod is rotatably installed in each rectangular cavity I, a movable seat is installed in each limiting mode, the movable seat stretches out of each rectangular cavity I to be provided with a laser cutting head, a rectangular cavity II is formed in the middle of the upper surface of the machine base, two table boards are movably installed at the tops of the rectangular cavities II, a movable seat I is installed in the middle of the lower ends of the rectangular cavities II, and an electric telescopic rod is connected between the two movable seats I and two movable seats II. The utility model realizes automatic collection of cut silicon wafers and improves the processing efficiency of the silicon wafers.
Description
Technical Field
The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer cutting machine.
Background
The silicon wafer cutting machine is also called a silicon wafer laser cutting machine and a laser scribing machine. The working principle of the silicon wafer cutting machine is that a high-energy laser beam is irradiated on the surface of a workpiece to locally melt and gasify the irradiated area, so that the silicon material is cut. The silicon wafer cutting machine is mainly used for scribing and cutting metal materials and silicon, germanium, gallium arsenide and other semiconductor substrate materials, can be used for processing solar panels, silicon wafers, ceramic wafers, aluminum foils and the like, has fine and attractive workpieces and smooth trimming, and can greatly improve the processing efficiency and optimize the processing effect.
Traditional silicon chip cutting machine does not possess automatic material function of receiving, needs the manual work to take away the silicon chip after cutting from the cutting bench, and when the manual work was got the material, the cutting machine will stop work, has influenced silicon chip machining efficiency.
Disclosure of Invention
The utility model aims to provide a silicon wafer cutting machine which is provided with the advantages of automatically collecting cut silicon wafers without manual material collection, improving the processing efficiency of the silicon wafers and solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the silicon wafer cutting machine comprises a machine base and a U-shaped frame, wherein rectangular grooves are symmetrically formed in two sides of the upper surface of the machine base, a polish rod is installed in each rectangular groove, a translation screw rod is rotatably installed in each rectangular groove, two U-shaped sides of the U-shaped frame are respectively connected with the polish rod in each rectangular groove in a sliding mode and in spiral mode, a rectangular cavity I is formed in a cross beam of the U-shaped frame, a longitudinally moving screw rod is installed in each rectangular cavity I in a limiting mode, a movable seat is installed in each rectangular cavity I in a limiting mode, the movable seat is in spiral mode with the longitudinally moving screw rod, a laser cutting head is installed in each movable seat extending out of the rectangular cavity I, a rectangular cavity II is formed in the middle of the upper surface of the machine base, two platens are movably installed at the tops of the rectangular cavity II, a movable seat II is installed in the middle of the bottoms of the two platens, and an electric telescopic rod is connected between the two movable seats I and two movable seats II.
Preferably, four corners of the bottom end of the stand are provided with four feet in a rectangular array. Through setting up four lower margin, realize carrying out stable support to the frame.
Preferably, two translation motors are installed on the right side of the machine base, and output shafts of the two translation motors are connected with the two translation screw rods through flanges. By arranging two translation motors, the laser cutting head is driven to translate.
Preferably, a longitudinal movement motor is arranged on the back of the U-shaped frame, and an output shaft of the longitudinal movement motor is connected with a longitudinal movement screw rod through a flange. By arranging the longitudinal movement motor, the laser cutting head is driven to longitudinally move.
Preferably, a collecting bin is arranged in the machine base and positioned below the middle of the second rectangular cavity, and a material collecting drawer is inserted into the collecting bin from the front. Through setting up the collection drawer, realize collecting the silicon chip after cutting.
Preferably, the control box is installed on the front of the U-shaped frame, and the control box is electrically connected with the translation motor, the longitudinal movement motor, the laser cutting head and the electric telescopic rod respectively. Through setting up the control box, realize being convenient for the going on of overall control silicon chip cutting work.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, by arranging the two electric telescopic rods, the cutting is finished, a worker firstly takes away the residual silicon plate after cutting, and starts the two electric telescopic rods through the control box, the two electric telescopic rods work to drive one end of the inner sides of the two platens to descend, the cut silicon wafers can slide along the two platens to be collected in the collecting drawer for centralized collection, the cut silicon wafers are automatically collected without manual collecting, and the silicon wafer processing efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a side view of the present utility model;
FIG. 3 is a diagram showing the internal structure of the engine base of the present utility model.
In the figure: 1. a base; 2. a material receiving drawer; 3. rectangular grooves; 4. translating the screw rod; 5. a polish rod; 6. a U-shaped frame; 7. a laser cutting head; 8. a movable seat; 9. a control box; 10. a translation motor; 11. a foot margin; 12. a longitudinally moving motor; 13. rectangular cavity I; 14. longitudinally moving the screw rod; 15. a movable seat I; 16. rectangular cavity II; 17. a platen; 18. a movable seat II; 19. an electric telescopic rod; 20. and (5) collecting a bin.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 3, the present utility model provides a silicon wafer cutting machine technical scheme: the silicon wafer cutting machine comprises a machine base 1 and a U-shaped frame 6, wherein four feet 11 are arranged at four corners at the bottom end of the machine base 1 in a rectangular array, rectangular grooves 3 are symmetrically formed in two sides of the upper surface of the machine base 1, a polished rod 5 is arranged in each of the two rectangular grooves 3, a translation screw rod 4,U is rotatably arranged in each of the two U-shaped sides of the machine base 6, the two U-shaped sides of the machine base 6 are respectively connected with the polished rod 5 in each of the two rectangular grooves 3 in a sliding manner and are in spiral connection with the translation screw rods 4, two translation motors 10 are arranged on the right side of the machine base 1, output shafts of the two translation motors 10 are connected with the two translation screw rods 4 through flanges, a rectangular cavity I13 is formed in a cross beam of the U-shaped frame 6, a longitudinal movement screw rod 14 is rotatably arranged in the rectangular cavity I13, a movable seat 8 is arranged in a limiting manner, the movable seat 8 is in spiral connection with the longitudinal movement screw rod 14, a longitudinal movement motor 12 is arranged at the back of the U-shaped frame 6, an output shaft of the longitudinal movement motor 12 is connected with the longitudinal movement screw rod 14 through the flanges, and the movable seat 8 extends out of the rectangular cavity I13, and a laser cutting head 7 is arranged; when the silicon plate cutting machine is used, a silicon plate is placed on two platen plates 17, a cutting program is set through a control box 9, two translation motors 10, a longitudinal movement motor 12 and a laser cutting head 7 are started, the two translation motors 10 and the longitudinal movement motor 12 work to drive two translation screw rods 4 and the longitudinal movement screw rod 14 to rotate, and the laser cutting head 7 is driven to translate and longitudinally move to cut the silicon plate.
A second rectangular cavity 16 is formed in the middle of the upper surface of the base 1, two bedplate 17 are movably mounted at the top of the second rectangular cavity 16, a second movable seat 18 is mounted in the middle of the bottoms of the two bedplate 17, a first movable seat 15 is mounted in the middle of the twice lower end of the second rectangular cavity 16, an electric telescopic rod 19 is connected between the first two movable seats 15 and the second movable seat 18, a collecting bin 20 is formed in the base 1 and below the middle of the second rectangular cavity 16, and a material collecting drawer 2 is inserted into the collecting bin 20 from the front; after cutting, a worker firstly takes away the residual silicon plate after cutting, two electric telescopic rods 19 are started through the control box 9, the two electric telescopic rods 19 work to drive one end of the inner sides of the two bedplate 17 to descend, and the cut silicon wafers can slide down along the two bedplate 17 to be collected in the collecting drawer 2 in a centralized mode. The front of the U-shaped frame 6 is provided with a control box 9, and the control box 9 is electrically connected with a translation motor 10, a longitudinal movement motor 12, a laser cutting head 7 and an electric telescopic rod 19 respectively.
The motors of the utility model are designed by adopting a small-sized servo motor-14 HS2408 model, the model motor is only selected by referring to the technical field, the technical field can select motors with the same parameters and functions according to actual production requirements for installation and debugging, and the utility model is not repeated.
When the silicon plate cutting machine is used, a silicon plate is placed on two table boards 17, a cutting program is set through a control box 9, two translation motors 10, a longitudinal movement motor 12 and a laser cutting head 7 are started, the two translation motors 10 and the longitudinal movement motor 12 work to drive two translation screw rods 4 and longitudinal movement screw rods 14 to rotate, the laser cutting head 7 is driven to translate and longitudinally move to cut the silicon plate, a worker firstly takes away the residual silicon plate after cutting, two electric telescopic rods 19 are started through the control box 9, the two electric telescopic rods 19 work to drive one ends of the inner sides of the two table boards 17 to descend, and cut silicon wafers can slide down along the two table boards 17 to the inside of a collecting drawer 2 to be collected in a concentrated mode.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The silicon wafer cutting machine comprises a machine base (1) and a U-shaped frame (6), and is characterized in that: rectangular grooves (3) are symmetrically formed in two sides of the upper surface of the base (1), a polished rod (5) is arranged in each rectangular groove (3), a translation screw rod (4) is rotatably arranged in each rectangular groove, two U-shaped edges of each U-shaped frame (6) are respectively connected with the polished rod (5) in each rectangular groove (3) in a sliding mode and are spirally connected with the corresponding translation screw rods (4), a rectangular cavity I (13) is formed in the cross beam of each U-shaped frame (6), a longitudinal movement screw rod (14) is rotatably arranged in each rectangular cavity I (13), a movable seat (8) is arranged in a limiting mode, the movable seats (8) are spirally connected with the longitudinal movement screw rods (14), a laser cutting head (7) is arranged in each movable seat (8) extending out of each rectangular cavity I (13), two platen (16) are movably arranged at the top of each rectangular cavity II (16), a movable seat II (18) is arranged in the middle of the bottoms of the two platen (17), a movable seat I (15) is arranged in the middle of the lower ends of each rectangular cavity II (16), and a telescopic connection between the two movable seats (15) and the two movable seats II (18) is arranged.
2. The silicon wafer cutting machine according to claim 1, wherein: four feet (11) are arranged at four corners of the bottom end of the base (1) in a rectangular array.
3. The silicon wafer cutting machine according to claim 1, wherein: two translation motors (10) are installed on the right side of the base (1), and output shafts of the two translation motors (10) are connected with the two translation screw rods (4) through flanges.
4. The silicon wafer cutting machine according to claim 1, wherein: the back of the U-shaped frame (6) is provided with a longitudinal movement motor (12), and an output shaft of the longitudinal movement motor (12) is connected with a longitudinal movement screw rod (14) through a flange.
5. The silicon wafer cutting machine according to claim 1, wherein: the collecting bin (20) is arranged below the middle of the rectangular cavity II (16) in the machine base (1), and the collecting drawer (2) is inserted into the collecting bin (20) from the front.
6. The silicon wafer cutting machine according to claim 1, wherein: the front of the U-shaped frame (6) is provided with a control box (9), and the control box (9) is electrically connected with the translation motor (10), the longitudinal movement motor (12), the laser cutting head (7) and the electric telescopic rod (19) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321729207.3U CN220296144U (en) | 2023-07-04 | 2023-07-04 | Silicon wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321729207.3U CN220296144U (en) | 2023-07-04 | 2023-07-04 | Silicon wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220296144U true CN220296144U (en) | 2024-01-05 |
Family
ID=89345889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321729207.3U Active CN220296144U (en) | 2023-07-04 | 2023-07-04 | Silicon wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220296144U (en) |
-
2023
- 2023-07-04 CN CN202321729207.3U patent/CN220296144U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |