CN220288670U - Temperature and pressure integrated film sensing sheet and film type pressure detection device - Google Patents
Temperature and pressure integrated film sensing sheet and film type pressure detection device Download PDFInfo
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- CN220288670U CN220288670U CN202321596038.0U CN202321596038U CN220288670U CN 220288670 U CN220288670 U CN 220288670U CN 202321596038 U CN202321596038 U CN 202321596038U CN 220288670 U CN220288670 U CN 220288670U
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- 230000008054 signal transmission Effects 0.000 claims abstract description 104
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- 239000000463 material Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000010408 film Substances 0.000 claims description 34
- 239000010409 thin film Substances 0.000 claims description 24
- 238000003032 molecular docking Methods 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 4
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- 238000010586 diagram Methods 0.000 description 8
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- 229910001006 Constantan Inorganic materials 0.000 description 5
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- 230000009286 beneficial effect Effects 0.000 description 4
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- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
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- 239000000919 ceramic Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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Abstract
The application relates to the technical field of sensing sheets and provides a temperature and pressure integrated film sensing sheet and a sensor, wherein the temperature and pressure integrated film sensing sheet comprises a base material and a signal butt joint area used for being in butt joint with external equipment; the temperature sensing part comprises an insulating layer, a temperature sensing area and a temperature signal transmission line which are arranged on the substrate, and the temperature signal transmission line is electrically connected with the temperature sensing area and extends to the signal butt joint area; the insulating layer is arranged on one side of the substrate, which is provided with the temperature sensing area, and covers the temperature sensing area and the part of the temperature signal transmission line outside the signal butt joint area; the pressure sensing part comprises a pressure sensing electrode, a pressure signal transmission wire and a pressure sensitive layer, wherein the pressure sensing electrode, the pressure signal transmission wire and the pressure sensitive layer are arranged on a base material, the pressure signal transmission wire is electrically connected with the pressure sensing electrode and extends to a signal butt joint area, the pressure sensitive layer is arranged on one side of the base material, where the pressure sensing electrode is arranged, and covers the pressure sensing electrode, and the temperature-pressure integrated film sensing sheet has various functions and high integration degree.
Description
Technical Field
The application relates to the technical field of sensing sheets, in particular to a temperature and pressure integrated film sensing sheet and a film type pressure detection device.
Background
Thin film pressure or temperature sensing sheets have been widely used in industrial fields due to their light, thin and flexible advantages. The common temperature and pressure integrated film sensing chip generates change of an electric signal based on the change of the pressure applied to the film sensing chip, and the collector converts the electric signal into pressure information by acquiring the changed electric signal.
In the prior art, a special temperature sensing sheet or a special pressure sensing sheet is generally required to be arranged independently when temperature and pressure sensing is carried out, so that the film sensing sheet has single function, and excessive parts and low integration degree are caused when related function application is carried out.
Disclosure of Invention
The utility model mainly aims to provide a temperature and pressure integrated film sensing sheet, and aims to solve the technical problem of single function of the film sensing sheet in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a warm-pressing integrated film sensor chip, comprising:
the base material is provided with a signal butt joint area for butt joint with external equipment;
the temperature sensing part comprises an insulating layer, a temperature sensing area and a temperature signal transmission line which are arranged on the base material, wherein the temperature signal transmission line is electrically connected with the temperature sensing area and extends to the signal butt joint area; the insulating layer is arranged on one side of the substrate, provided with the temperature sensing area, and covers the part of the temperature sensing area, which is outside the signal butt joint area, of the temperature signal transmission line;
the pressure sensing part comprises a pressure sensing electrode, a pressure signal transmission wire and a pressure sensitive layer, wherein the pressure sensing electrode, the pressure signal transmission wire and the pressure sensitive layer are arranged on the base material, the pressure signal transmission wire is electrically connected with the pressure sensing electrode and extends to the signal butt joint area, and the pressure sensitive layer is arranged on one side of the base material, provided with the pressure sensing electrode, and covers the pressure sensing electrode;
wherein the temperature sensing portion and the pressure sensing portion do not overlap each other on the substrate.
Further, the temperature sensing area comprises a first temperature sensing end and a second temperature sensing end, the first temperature sensing end and the second temperature sensing end are made of different metal materials, and the first temperature sensing end and the second temperature sensing end are overlapped and fixedly connected with each other to form the temperature sensing area.
Further, the temperature sensing part comprises two temperature signal transmission lines, wherein one temperature signal transmission line is electrically connected with the first temperature sensing end and extends to the signal butt joint area; the other temperature signal transmission line is electrically connected with the second temperature sensing end and extends to the signal butt joint area, the first temperature sensing end and the corresponding temperature signal transmission line are integrally formed and arranged, and the second temperature sensing end and the corresponding temperature signal transmission line are integrally formed and arranged.
Further, the temperature sensing area further comprises a first wire connected with the first temperature sensing end and a second wire connected with the second temperature sensing end, and the temperature sensing part comprises two temperature signal transmission lines, wherein one temperature signal transmission line is electrically connected with the first wire and extends to the signal butt joint area; the other temperature signal transmission line is electrically connected with the second lead and extends to the signal butt joint area, the first temperature sensing end and the first lead are integrally formed, and the second temperature sensing end and the second lead are integrally formed.
Further, when the first temperature sensing end is electrically connected with the temperature signal transmission line through the first wire and the second temperature sensing end is electrically connected with the temperature signal transmission line through the second wire, the width of the part, connected with the temperature signal transmission line, of the first wire is larger than the width of the part, not connected with the temperature signal transmission line, of the first wire, and/or the width of the part, connected with the first wire, of the temperature signal transmission line is larger than the width of the part, not connected with the first wire, of the temperature signal transmission line; the width of the part of the second wire connected with the temperature signal transmission line is larger than the width of the part of the second wire not connected with the temperature signal transmission line, and/or the width of the part of the temperature signal transmission line connected with the second wire is larger than the width of the part of the temperature signal transmission line not connected with the second wire.
Further, the thickness of each of the first temperature sensing end and the second temperature sensing end is between 30 μm and 500 μm.
Further, the first temperature sensing end and the second temperature sensing end are any one of polygonal, square, triangular, circular or racetrack.
Further, an area of a portion of the first temperature sensing terminal overlapping the second temperature sensing terminal is between 0.25 mm 2 and 4 mm 2.
Further, the widths of the first lead wire, the second lead wire and the temperature signal transmission line are set between 0.5mm and 2 mm.
Further, the temperature sensing part comprises a heat insulation layer, and the heat insulation layer covers other areas of the temperature sensing part except the signal butt joint area, the first temperature sensing end and the second temperature sensing end.
In addition, the utility model also provides a film type pressure detection device which comprises a collector and the temperature and pressure integrated film sensing sheet, wherein the collector is electrically connected with the temperature and pressure integrated film sensing sheet.
The application provides a warm-pressing integrative film sense piece's beneficial effect lies in:
in the temperature and pressure integrated film sensing sheet provided by the utility model, the temperature sensing part and the pressure sensing part are arranged on the base material, so that the capability of pressure sensing and temperature sensing can be realized simultaneously, the temperature and pressure integrated film sensing sheet has diversified functions and high integration degree, only one temperature and pressure integrated film sensing sheet is needed to be adopted for temperature and pressure sensing, more components are not needed to be combined (matched), in addition, the temperature sensing part and the pressure sensing part are not overlapped on the base material, the temperature sensing part and the pressure sensing part can be independently operated while being integrated on one base material, and no mutual interference and adverse effect are generated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a partially expanded schematic illustration of a temperature and pressure integrated thin film sensor chip according to an embodiment of the present application;
FIG. 2 is an exploded view of a portion of a temperature and pressure integrated thin film sensor chip according to one embodiment of the present application;
FIG. 3 is a partial component block diagram of a temperature and pressure integrated thin film sensor chip according to one embodiment of the present application;
FIG. 4 is an exploded view of a portion of a temperature and pressure integrated thin film sensor chip according to another embodiment of the present application;
FIG. 5 is a partial component block diagram of a temperature and pressure integrated thin film sensor chip according to another embodiment of the present application;
FIG. 6 is an exploded view of a portion of a temperature and pressure integrated thin film sensor chip according to one embodiment of the present application;
FIG. 7 is a partial component block diagram of a temperature and pressure integrated thin film sensor chip according to one embodiment of the present application;
FIG. 8 is a partial component block diagram of a temperature and pressure integrated thin film sensor chip according to one embodiment of the present application;
FIG. 9 is a block diagram of a temperature and pressure integrated thin film sensor chip according to an embodiment of the present application;
FIG. 10 is a block diagram of a temperature and pressure integrated thin film sensor chip according to an embodiment of the present application;
FIG. 11 is a schematic diagram illustrating a layout of a part of a temperature and pressure integrated thin film sensor chip according to an embodiment of the present disclosure;
fig. 12 is a schematic diagram illustrating a separation of a thin film pressure detection device according to an embodiment of the present application.
Reference numerals related to the above figures are as follows:
1-a substrate; 2-a first temperature sensing terminal;
3-a second temperature sensing terminal; 4-a pressure sensing electrode;
5-a pressure sensitive layer; 6-a first wire;
7-a second wire; 8-a third wire;
9-fourth wire; 10-signal docking area;
11-a temperature sensing zone; 12-an insulating layer;
13-pressure signal transmission wires; 14-a heat insulation layer;
15-collector.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
For the purpose of illustrating the technical solutions described herein, the following detailed description is provided with reference to specific drawings and examples.
Referring to fig. 1 to 11, an embodiment of the present utility model provides a temperature and pressure integrated film sensor chip, wherein the temperature and pressure integrated film sensor chip includes:
a substrate 1, the substrate 1 being provided with a signal docking area 10 for docking with an external device (e.g., a collector 15 or the like mentioned later);
the temperature sensing part comprises an insulating layer 12, a temperature sensing area and a temperature signal transmission line which are arranged on the substrate 1, wherein the temperature signal transmission line is electrically connected with the temperature sensing area and extends to the signal butt joint area; the insulating layer 12 is arranged on one side of the substrate 1 provided with the temperature sensing area and covers the temperature sensing area 11 and the part of the temperature signal transmission line except the signal butt joint area;
the pressure sensing part comprises a pressure sensing electrode 4, a pressure signal transmission wire and a pressure sensitive layer 5, wherein the pressure sensing electrode 4, the pressure signal transmission wire and the pressure sensing electrode 4 are arranged on the base material 1, the pressure signal transmission wire is electrically connected with the pressure sensing electrode 4 and extends to a signal butt joint area, and the pressure sensitive layer 5 is arranged on one side of the base material 1 provided with the pressure sensing electrode 4 and covers the pressure sensing electrode 4;
wherein the temperature sensing part and the pressure sensing part do not overlap each other on the substrate 1.
In the temperature and pressure integrated film sensing sheet provided by the utility model, the temperature sensing part and the pressure sensing part are arranged on the base material 1, so that the capability of pressure sensing and temperature sensing can be realized simultaneously, the temperature and pressure integrated film sensing sheet has the advantages of diversified functions and high integration degree, and only one temperature and pressure integrated film sensing sheet is needed when temperature and pressure sensing is carried out, and more components are not needed for combination (matching). In addition, the temperature sensing part and the pressure sensing part are not overlapped on the base material 1, so that the temperature sensing part and the pressure sensing part can be integrated on one base material 1 and can work independently, and the temperature sensing part and the pressure sensing part are not mutually interfered and have adverse effects.
It is understood that the fact that the temperature sensing portion and the pressure sensing portion do not overlap each other on the substrate 1 means specifically that: the temperature sensing part should avoid the pressure sensing part, including two cases, when the temperature sensing part and the pressure sensing part are arranged on the same side of the base material 1, no overlapping part exists between the temperature sensing part and the pressure sensing part; when the temperature sensing portion and the pressure sensing portion are disposed on different sides of the substrate 1, the projection of the pressure sensing portion on the surface on which the temperature sensing portion is disposed should have no overlapping portion with the temperature sensing portion.
It will be appreciated that the pressure sensing portion is mainly clamped between two objects to detect the pressing force between the two objects, so the pressure sensing portion should be as flat as possible, and if there are irregularities in the pressure sensing region of the pressure sensing portion, the irregularities may affect the pressure detection of the pressure sensing portion. Since the temperature sensing portion has a certain thickness, if there is an overlap between the projection of the temperature sensing portion in the direction in which the pressure sensing portion is pressed and the pressure sensing portion, the temperature sensing portion may affect the pressure sensing of the pressure sensing portion, and therefore, when the temperature sensing portion is set, the temperature sensing portion should be set avoiding the pressure detection area of the pressure sensing portion.
Referring to fig. 1 to 4, as an embodiment, the temperature sensing region includes a first temperature sensing terminal 2 and a second temperature sensing terminal 3, the first temperature sensing terminal 2 and the second temperature sensing terminal 3 are different metal materials, and the first temperature sensing terminal 2 and the second temperature sensing terminal 3 overlap each other and are fixedly connected to form the temperature sensing region.
Referring to the drawings, as an embodiment, the temperature sensing portion includes two temperature signal transmission lines. Wherein, a temperature signal transmission line is electrically connected with the first temperature sensing end 2 and extends to the signal docking area 10; the other temperature signal transmission line is electrically connected to the second temperature sensing terminal 3 and extends to the signal docking area 10. The first temperature sensing end 2 and the corresponding temperature signal transmission line are integrally formed and arranged, and the second temperature sensing end 3 and the corresponding temperature signal transmission line are integrally formed and arranged. It can be understood that the arrangement mode of the first temperature sensing end 2, the second temperature sensing end 3 and the temperature signal transmission line in an integrated manner makes the overall structure of the temperature sensing part simpler and more convenient for processing and manufacturing.
Referring to the figure, as another embodiment, the temperature sensing area further includes a first wire 6 connected to the first temperature sensing end 2 and a second wire 7 connected to the second temperature sensing end 3, and the temperature sensing portion includes two temperature signal transmission lines. Wherein a temperature signal transmission line (e.g. the third wire 8) is electrically connected to the first wire 6 and extends to the signal docking area 10; another temperature signal transmission line (e.g., the fourth wire 9) is electrically connected to the second wire 7 and extends to the signal docking area 10. The first temperature sensing end 2 and the first conducting wire 6 are integrally formed, and the second temperature sensing end 3 and the second conducting wire 7 are integrally formed. It can be understood that the first temperature sensing end 2 is electrically connected to the temperature signal transmission line through the first conductive wire 6, and the second temperature sensing end 3 is electrically connected to the temperature signal transmission line through the second conductive wire 7, so that the first conductive wire 6 and the temperature signal transmission line can be arranged in a segmented manner, and the second conductive wire 7 and the temperature signal transmission line can also be arranged in a segmented manner. The temperature signal transmission line is only used for transmitting signals, so that when the first temperature sensing end 2 or the second temperature sensing end 3 adopts noble metal, the temperature signal transmission line can still adopt cheaper metal, and the temperature signal transmission line is very beneficial to the manufacture and production cost of the temperature and pressure integrated film sensing sheet.
Referring to fig. 3 and 4, further, when the first temperature sensing terminal 2 is electrically connected to the temperature signal transmission line through the first conductive wire 6, and the second temperature sensing terminal 3 is electrically connected to the temperature signal transmission line through the second conductive wire 7, the width of the portion of the first conductive wire 6 connected to the temperature signal transmission line is greater than the width of the portion of the first conductive wire 6 not connected to the temperature signal transmission line, and/or the width of the portion of the temperature signal transmission line connected to the first conductive wire 6 is greater than the width of the portion of the temperature signal transmission line not connected to the first conductive wire 6; the width of the portion of the second wire 7 connected to the temperature signal transmission line is larger than the width of the portion of the second wire 7 not connected to the temperature signal transmission line, and/or the width of the portion of the temperature signal transmission line connected to the second wire 7 is larger than the width of the portion of the temperature signal transmission line not connected to the second wire 7. It can be appreciated that the wider connection portion is more beneficial to the connection of the first wire 6 and the temperature signal transmission line and the connection of the second wire 7 and the temperature signal transmission line, so that the connection of the first wire 6 and the temperature signal transmission line and the connection of the second wire 7 and the temperature signal transmission line are more stable and reliable.
According to one embodiment of the present utility model, the first temperature sensing terminal 2 and the second temperature sensing terminal 3 are fixed on the substrate 1 by adhesive bonding; when the temperature sensing region further includes the first wire 6 and the second wire 7, the first wire 6 and the second wire 7 are also fixed on the substrate 1 by adhesive bonding. Specifically, the first wire 6 is connected with the temperature signal transmission line through conductive adhesive, and the second wire 7 is connected with the temperature signal transmission line through conductive adhesive. Because at this time, both physical connection and electrical conduction are realized between the first conductive wire 6 and the temperature signal transmission line and between the second conductive wire 7 and the temperature signal transmission line by means of adhesion. Therefore, the first wire 6 is connected with the temperature signal transmission line through conductive adhesive, and the second wire 7 is connected with the temperature signal transmission line through conductive adhesive, so that whether the adhesive at other parts of the temperature sensing part is conductive or not is not particularly required. As one embodiment, the conductive paste is an anisotropic conductive paste, ACF (anisotropic conductive film), ACP (anisotropic conductive paste), or the like, and is not limited to these types of paste.
According to the preferred embodiment of the utility model, the thickness of the adhesive layer formed by the conductive adhesive is between 5 and 50 mu m, so that the adhesive strength can be ensured, and the conductive stability is ensured; meanwhile, the phenomenon that the flexibility is insufficient due to the fact that the adhesive layer is too thick or breakage occurs during bending can be avoided.
According to one embodiment of the present utility model, the first temperature sensing terminal 2 and the second temperature sensing terminal 3 constitute a temperature sensing region 11, and optional materials are combined with: the combination of copper-constantan, nickel chromium-nickel silicon and nickel chromium-constantan has the characteristic of high sensitivity, and meets specific use requirements. In consideration of cost, copper-constantan is preferable, the two materials are cheap and easy to purchase, and the linearity of the detection result of the temperature sensing part is good. When the first temperature sensing terminal 2 is copper, the second temperature sensing terminal 3 is constantan; when the first temperature sensing terminal 2 is constantan, the second temperature sensing terminal 3 is copper.
It can be understood that the smaller the thickness of the first temperature sensing end 2 and the second temperature sensing end 3, the higher the detection accuracy of the temperature sensing portion, the higher the detection accuracy, but the too small thickness will affect the service life of the temperature sensing area 11, but if the thickness is too thick, the overall flexibility of the thin film sensing sheet will be affected, and the bending of the thin film sensing sheet will not be easy.
According to one embodiment of the utility model, the thickness of each of the first temperature sensing terminal 2 and the second temperature sensing terminal 3 is between 30 μm and 500 μm. More preferably between 100 μm and 300 μm. The first temperature sensing end 2 and the second temperature sensing end 3 arranged in the interval can meet the temperature detection precision requirement and the service life and flexibility requirements.
According to an embodiment of the present utility model, the shape of the first temperature sensing terminal 2 and the second temperature sensing terminal 3 is any one of a polygon, a square, a triangle, a circle, or a racetrack shape. As a preferred embodiment, the first temperature sensing terminal 2 and the second temperature sensing terminal 3 are quadrangular or circular in shape. It can be appreciated that the two shapes are simpler, which is more convenient for controlling the shape precision in the process of processing and manufacturing, and is also convenient for overlapping the first temperature sensing end 2 and the second temperature sensing end 3.
It can be understood that the area of the overlapping portion (the temperature sensing region 11) between the first temperature sensing terminal 2 and the second temperature sensing terminal 3 should not be too large, and if the area is too large, the sensitivity of the temperature sensing portion will be affected; however, if the area of the overlapping portion between the first temperature sensing end 2 and the second temperature sensing end 3 is too small, the processing difficulty is increased, and the reliability is also affected. The present utility model defines an area of a portion where the first temperature sensing terminal 2 overlaps the second temperature sensing terminal 3, and according to a preferred embodiment of the present utility model, the area of the portion where the first temperature sensing terminal 2 overlaps the second temperature sensing terminal 3 is between 0.25 mm 2 and 4 mm 2. In this way, the service life of the sensing portion can be ensured while satisfying the sensitivity.
It will be appreciated that the primary function of the first wire 6, the second wire 7 or the temperature signal transmission line is to transmit signals, and therefore these wires do not need to be wide, but they cannot be made too narrow in view of strength reliability and the like. As a preferred embodiment, the widths of the first wire 6, the second wire 7, and the temperature signal transmission line are set between 0.5mm and 2mm in the present utility model. As a more preferred option, between 1mm and 1.5 mm.
According to a preferred embodiment of the present utility model, the temperature sensing part further comprises a thermal insulation layer 14, and the thermal insulation layer 14 covers other areas of the temperature sensing part than the signal docking area 10, the first temperature sensing terminal 2 and the second temperature sensing terminal 3. In the present utility model, the insulating layer 14 is used for insulating the temperature to which the wire is subjected, so as to further improve the accuracy of the temperature detection result.
In the present embodiment, the insulating layer 14 may be provided between each wire and the insulating layer 12, or the insulating layer 12 may be provided between the wire and the insulating layer 14. As a preferred embodiment, the insulating layer 12 is disposed between the wires and the insulating layer 14. It will be appreciated that the temperature sensing region 11 should avoid the insulating layer 14 to avoid adverse effects of the insulating layer 14 on temperature detection, the insulating layer 12 also covers the first temperature sensing end 2 and the second temperature sensing end 3, so that the insulating layer 12 is disposed between the conductive wire and the insulating layer 14 in a better structural scheme, and thus the insulating layer 12 for covering the first temperature sensing end 2, the second temperature sensing end 3 and the conductive wire can be positioned on the same surface without layering to form a step shape, so that the connection mode is simpler and more firm.
According to an embodiment of the present utility model, the warm-pressing integrated film sensor chip further includes a reinforcing structure (e.g. a reinforcing plate), and the reinforcing structure is correspondingly disposed on a side of the substrate 1 facing away from the signal docking area 10. The reinforcing plate is fixed on the base material 1 by bonding or hot pressing, and the reinforcing plate is correspondingly arranged on one side away from the signal butt joint area 10 so as to form a support for the base material 1 of the part. It will be appreciated that since the substrate 1 generally has a certain flexibility, if the external device is directly connected to the substrate 1, the flexibility of the substrate 1 will increase the difficulty and reliability of the connection. According to the utility model, the reinforcing plate is arranged on the back surface of the substrate 1 provided with the signal butt joint region 10, so that the rigidity of the signal butt joint region 10 can be enhanced through the reinforcing plate, and the connection between the signal butt joint region 10 and external equipment is facilitated.
Referring to fig. 5 to 8, according to an embodiment of the present utility model, the pressure sensing part further includes its corresponding insulation layer 12, and the insulation layer 12 is fixed on the base material 1 by bonding to cover the area of the pressure signal transmission wire 13 except the signal docking area 10.
According to an embodiment of the present utility model, the shape of the pressure sensing electrode 4 is not particularly limited, and the pressure sensing electrode 4 may be an interdigital electrode or an electrode with other shape.
The material of the pressure sensing electrode 4 is not particularly limited in the present utility model, and as a possible embodiment, the material of the pressure sensing electrode 4 is copper.
The connection manner between the pressure sensing electrode 4 and the pressure signal transmission wire 13 is not particularly limited in the present utility model, and as a possible implementation manner, the pressure sensing electrode 4 and the pressure signal transmission wire 13 are integrally formed.
According to one embodiment of the present utility model, the temperature sensing portion and the pressure sensing portion are disposed on the same side of the substrate 1, and the thickness of the temperature sensing portion is not greater than the thickness of the pressure sensing portion. Thus, when the object is pressed, the pressure acted by the object is firstly applied to the pressure sensing part, and the pressure applied by the object can be detected more quickly and accurately through the pressure sensing part. Meanwhile, the pressure applied by the object firstly acts on the pressure sensing part, so that the temperature sensing part can be prevented from being subjected to larger extrusion force to a certain extent, and the service life of the temperature sensing part is further prolonged. It can be understood that if the thickness of the pressure sensing portion is smaller than that of the temperature sensing portion, the object will press the temperature sensing portion first, so that the pressure result detected by the pressure sensing portion will have access to the actual situation, and the temperature sensing portion is easily damaged due to the larger pressing force.
As an embodiment, the insulating layer 12 corresponding to the pressure sensing portion and the insulating layer 12 corresponding to the temperature sensing portion may be integrally formed with the same insulating layer 12 or may be different insulating layers 12.
According to a preferred embodiment of the present utility model, the thickness of the insulating layer 12 (corresponding insulating layer 12 of the pressure sensing part and corresponding insulating layer 12 of the temperature sensing part) is between 50 μm and 300 μm. More preferably between 100 μm and 200. Mu.m. It can be appreciated that by limiting the thickness of the insulating layer 12, the insulation effect is satisfied, and meanwhile, the overall flexibility of the temperature and pressure integrated thin film sensing sheet can be prevented from being influenced by the excessively thick insulating layer 12, and the excessively raised temperature sensing part can be prevented from being caused by the excessively thick insulating layer 12.
It can be understood that the insulating layer 12 is mainly used for isolating external interference, so as to avoid that external equipment affects the electromotive force of the temperature sensing part and further affects the temperature detection result. In an embodiment of the present utility model, the optional insulating layer 12 (corresponding insulating layer 12 of the pressure sensing portion and corresponding insulating layer 12 of the temperature sensing portion) materials are: silica ceramic slurry, three-proofing paint, silica, and the like. When the first temperature sensing terminal 2 and the second temperature sensing terminal 3 are directly fixed on the substrate 1, the substrate 1 should also be insulated. In the embodiment of the present utility model, the optional material of the substrate 1 is PP, PE, etc.
It can be understood that in the present utility model, one temperature sensing portion may be integrated on the substrate 1, or a plurality of temperature sensing portions may be integrated on the substrate 1; one pressure sensing portion may be integrated on the substrate 1, or a plurality of pressure sensing portions may be integrated on the substrate 1.
Referring to fig. 12, in addition, the present utility model further provides a film type temperature and pressure detecting device, which includes a collector 15 and the foregoing temperature and pressure integrated film sensing sheet, where the collector 15 is electrically connected with the temperature and pressure integrated film sensing sheet, so as to transmit a pressure excitation signal and a temperature excitation signal to the temperature and pressure integrated film sensing sheet, and then acquire a pressure signal and a temperature signal. Specifically, the collector 15 is electrically connected to the temperature sensing portion and the pressure sensing portion through the signal docking area 10.
The foregoing description of the preferred embodiments is merely exemplary in nature and is in no way intended to limit the utility model, since it is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.
Claims (11)
1. A warm-pressing integrated film sensing sheet, comprising:
the base material is provided with a signal butt joint area for butt joint with external equipment;
the temperature sensing part comprises an insulating layer, a temperature sensing area and a temperature signal transmission line which are arranged on the base material, wherein the temperature signal transmission line is electrically connected with the temperature sensing area and extends to the signal butt joint area; the insulating layer is arranged on one side of the substrate, provided with the temperature sensing area, and covers the part of the temperature sensing area, which is outside the signal butt joint area, of the temperature signal transmission line;
the pressure sensing part comprises a pressure sensing electrode, a pressure signal transmission wire and a pressure sensitive layer, wherein the pressure sensing electrode, the pressure signal transmission wire and the pressure sensitive layer are arranged on the base material, the pressure signal transmission wire is electrically connected with the pressure sensing electrode and extends to the signal butt joint area, and the pressure sensitive layer is arranged on one side of the base material, provided with the pressure sensing electrode, and covers the pressure sensing electrode;
wherein the temperature sensing portion and the pressure sensing portion do not overlap each other on the substrate.
2. The temperature and pressure integrated film sensing sheet of claim 1, wherein the temperature sensing zone comprises a first temperature sensing end and a second temperature sensing end, the first temperature sensing end and the second temperature sensing end being of different metallic materials, the first temperature sensing end and the second temperature sensing end overlapping and fixedly connected to each other to form the temperature sensing zone.
3. The temperature and pressure integrated film sensing sheet according to claim 2, wherein the temperature sensing part comprises two temperature signal transmission lines, wherein one temperature signal transmission line is electrically connected with the first temperature sensing end and extends to the signal docking area; the other temperature signal transmission line is electrically connected with the second temperature sensing end and extends to the signal butt joint area, the first temperature sensing end and the corresponding temperature signal transmission line are integrally formed and arranged, and the second temperature sensing end and the corresponding temperature signal transmission line are integrally formed and arranged.
4. The temperature and pressure integrated film sensing sheet according to claim 2, wherein the temperature sensing area further comprises a first wire connected with the first temperature sensing end and a second wire connected with the second temperature sensing end, and the temperature sensing part comprises two temperature signal transmission lines, wherein one temperature signal transmission line is electrically connected with the first wire and extends to the signal butt joint area; the other temperature signal transmission line is electrically connected with the second lead and extends to the signal butt joint area, the first temperature sensing end and the first lead are integrally formed, and the second temperature sensing end and the second lead are integrally formed.
5. The temperature and pressure integrated thin film sensing sheet of claim 2, wherein when the first temperature sensing terminal is electrically connected to the temperature signal transmission line through a first wire and the second temperature sensing terminal is electrically connected to the temperature signal transmission line through a second wire, a width of a portion of the first wire connected to the temperature signal transmission line is greater than a width of a portion of the first wire not connected to the temperature signal transmission line, and/or a width of a portion of the temperature signal transmission line connected to the first wire is greater than a width of a portion of the temperature signal transmission line not connected to the first wire; the width of the part of the second wire connected with the temperature signal transmission line is larger than the width of the part of the second wire not connected with the temperature signal transmission line, and/or the width of the part of the temperature signal transmission line connected with the second wire is larger than the width of the part of the temperature signal transmission line not connected with the second wire.
6. The temperature and pressure integrated thin film sensor chip of any one of claims 2 to 5, wherein the first temperature sensing end and the second temperature sensing end each have a thickness of between 30 μm and 500 μm.
7. The temperature and pressure integrated thin film sensor chip of any one of claims 2 to 5, wherein the first and second temperature sensing ends are any one of polygonal, square, triangular, circular or racetrack in shape.
8. The temperature and pressure integrated thin film sensing sheet according to any one of claims 2 to 5, wherein an area of a portion where the first temperature sensing end and the second temperature sensing end overlap is between 0.25 mm 2 and 4 mm 2.
9. The temperature and pressure integrated film sensing sheet of claim 4, wherein the widths of the first wire, the second wire and the temperature signal transmission line are set between 0.5mm and 2 mm.
10. The temperature and pressure integrated thin film sensor chip of any one of claims 2 to 5, wherein the temperature sensing part comprises a heat insulating layer covering other areas of the temperature sensing part except the signal docking area, the first temperature sensing end and the second temperature sensing end.
11. A thin film pressure detection device comprising a collector and the temperature and pressure integrated thin film sensing sheet according to any one of claims 1 to 10, wherein the collector is electrically connected with the temperature and pressure integrated thin film sensing sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321596038.0U CN220288670U (en) | 2023-06-20 | 2023-06-20 | Temperature and pressure integrated film sensing sheet and film type pressure detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321596038.0U CN220288670U (en) | 2023-06-20 | 2023-06-20 | Temperature and pressure integrated film sensing sheet and film type pressure detection device |
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| Publication Number | Publication Date |
|---|---|
| CN220288670U true CN220288670U (en) | 2024-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321596038.0U Active CN220288670U (en) | 2023-06-20 | 2023-06-20 | Temperature and pressure integrated film sensing sheet and film type pressure detection device |
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| Country | Link |
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| CN (1) | CN220288670U (en) |
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2023
- 2023-06-20 CN CN202321596038.0U patent/CN220288670U/en active Active
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