CN220254967U - Semiconductor water-cooling integration for electric carrier - Google Patents
Semiconductor water-cooling integration for electric carrier Download PDFInfo
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- CN220254967U CN220254967U CN202321619462.2U CN202321619462U CN220254967U CN 220254967 U CN220254967 U CN 220254967U CN 202321619462 U CN202321619462 U CN 202321619462U CN 220254967 U CN220254967 U CN 220254967U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000001816 cooling Methods 0.000 title claims abstract description 59
- 230000010354 integration Effects 0.000 title claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 155
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 238000005057 refrigeration Methods 0.000 claims description 22
- 230000001502 supplementing effect Effects 0.000 claims description 11
- 239000000498 cooling water Substances 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 description 16
- 230000005855 radiation Effects 0.000 description 6
- 239000000969 carrier Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
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Abstract
The utility model belongs to the technical field of electric vehicles, in particular to a semiconductor water-cooling integration for an electric vehicle, which comprises an integration shell, a water inlet channel and a water outlet channel which are arranged in the integration shell, wherein a circulating water pump is arranged in the integration shell, the water inlet end of the circulating water pump is communicated with the inner end of the water inlet channel, the water outlet end of the circulating water pump is communicated with the water outlet channel, a semiconductor refrigerating sheet is arranged in the integration shell, the cold surface of the semiconductor refrigerating sheet can act on liquid in the water inlet channel or the water outlet channel, and a cooling fan is arranged on the integration shell. The utility model has higher integral property, the circulating water pump and the cooling fan are integrally arranged in the integrated shell, the water cooling circulation flow can be realized by only communicating the water inlet channel and the water outlet channel with the two ends of the external water cooling circulation channel, meanwhile, the cooling water is refrigerated by the semiconductor refrigerating sheet, the temperature of the cooling water can be effectively reduced, and the cooling fan acts on the hot surface of the semiconductor refrigerating sheet to dissipate heat.
Description
Technical field:
the utility model belongs to the technical field of electric carriers, in particular to a semiconductor water-cooling integration for an electric carrier.
The background technology is as follows:
the electric vehicle is a mobile vehicle driven by a traction motor with electric energy as motive power, and the common electric vehicle mainly comprises an electric vehicle, an electric motorcycle and an electric booster vehicle, and compared with the traditional vehicle, the electric vehicle is internally provided with a battery for supplying electric power to a motor and an electric control unit for executing motor driving control, and in the operation process, the motor, the battery and the electric control unit all generate a large amount of heat, so that a corresponding cooling mechanism is required to be configured to take away the heat so as to prevent high-temperature overload of electronic components.
The cooling mechanism adopted in the existing electric vehicle is mainly air-cooled and water-cooled, the water-cooled mechanism is mainly communicated with the water tank, the circulating water pump, the radiator and the cooling channel of the motor or the battery or the electric control unit through pipelines, the circulating water pump drives the cooling liquid to circularly flow, meanwhile, most of the radiator is air-cooled and dissipates, the heat dissipation effect is limited, and because the number of parts is large, the cooling mechanism not only occupies a large installation space, but also is more and inconvenient in pipe fitting assembly nodes, and is easy to leak.
The utility model comprises the following steps:
the utility model aims to provide a semiconductor water-cooling integration for an electric carrier, which integrates a circulating water pump and a cooling fan in an integrated shell, can realize water-cooling circulation flow only by communicating a water inlet channel and a water outlet channel with an external water-cooling circulation channel, and simultaneously, carries out refrigeration on cooling water by a semiconductor refrigeration piece so as to effectively reduce the temperature of the cooling water,
the utility model is realized in the following way:
the utility model provides a semiconductor water-cooling integration for electric vehicle, includes integrated casing, and sets up inlet channel and the play water channel in integrated casing, and inlet channel and play water channel's outer end communicates with electric vehicle's water-cooling circulation channel's both ends respectively, be provided with circulating water pump in the integrated casing, circulating water pump's inlet end communicates with inlet channel's inner, play water end and play water channel intercommunication, is provided with the semiconductor refrigeration piece in the integrated casing, and the cold face of semiconductor refrigeration piece can act on the liquid in inlet channel or the play water channel, and is equipped with radiator fan on the integrated casing that is located the hot side of semiconductor refrigeration piece.
In the above-mentioned semiconductor water-cooling integration for electric vehicle, the integration shell is provided with a heat conduction seat and heat conduction fins uniformly distributed on one end face of the heat conduction seat, the heat conduction fins are inserted in the water outlet channel, and the cold face of the semiconductor refrigeration piece is attached to the other end face of the heat conduction seat.
In the above-mentioned semiconductor water-cooling integration for electric vehicle, a heat dissipation seat and heat dissipation fins uniformly distributed on the end face of the heat dissipation seat facing the heat dissipation fan are arranged on the integrated shell between the heat face of the semiconductor refrigeration sheet and the heat dissipation fan, and the heat face of the semiconductor refrigeration sheet is attached to the other end face of the heat dissipation seat.
In the above-mentioned semiconductor water-cooling integration for an electric carrier, the integrated housing located at the periphery of the heat dissipation seat and the heat dissipation fins is a hollowed-out housing.
In the above-mentioned semiconductor water-cooling integration for electric vehicle, a temperature control switch for detecting the temperature in the integrated housing is provided in the integrated housing, the temperature control switch, the circulating water pump, the cooling fan and the semiconductor cooling plate are all electrically connected with the control assembly, and the control assembly controls the opening or closing of the circulating water pump, the cooling fan and the semiconductor cooling plate according to the signals of the temperature control switch.
In the above-mentioned semiconductor water-cooling integration for electric vehicle, the integrated casing is including last casing and lower casing, is formed with into water appearance chamber and play water appearance chamber between last casing and the lower casing, has seted up the inlet port on the last casing that is located into water appearance intracavity, forms between inlet port and the water appearance chamber the water inlet passageway has been seted up on the last casing that is located out water appearance intracavity, forms between outlet port and the water appearance chamber the water outlet passageway, circulating water pump's water inlet end and water appearance chamber intercommunication, water outlet end pass through pipe fitting and play water appearance chamber intercommunication.
In the above-mentioned semiconductor water-cooling integration for electric vehicle, be located be provided with more than one baffle on the lower casing of going out the water appearance intracavity, and this baffle separates out the water appearance intracavity and forms U-shaped or S-shaped or labyrinth play water runner, circulating water pump' S play water end communicates with the head end of play water runner through the pipe fitting, the terminal of play water runner has been seted up to the play water port, the cold face of semiconductor refrigeration piece acts on the liquid in the play water runner.
In the above-mentioned semiconductor water-cooling integration for an electric carrier, a water supplementing hole is formed in the lower housing located in the water inlet cavity, and a water supplementing end cover is detachably connected to a port of the water supplementing hole.
Compared with the prior art, the utility model has the outstanding advantages that:
the utility model has higher integral property, the circulating water pump and the cooling fan are integrally arranged in the integrated shell, the water cooling circulation flow can be realized by only communicating the water inlet channel and the water outlet channel with the two ends of the external water cooling circulation channel, meanwhile, the cooling water is refrigerated by the semiconductor refrigerating sheet, the temperature of the cooling water can be effectively reduced, and the cooling fan acts on the hot surface of the semiconductor refrigerating sheet to dissipate heat.
Description of the drawings:
FIG. 1 is an overall perspective view of the present utility model;
fig. 2 is an overall exploded view of the present utility model.
In the figure: 1. an integrated housing; 2. a circulating water pump; 3. a semiconductor refrigeration sheet; 4. a heat radiation fan; 5. a heat conduction seat; 6. a heat conduction fin; 7. a heat dissipation seat; 8. a heat radiation fin; 9. a temperature control switch; 10. an upper housing; 11. a lower housing; 12. a water inlet port; 13. a water outlet port; 14. a pipe fitting; 15. a baffle; 16. a water supplementing hole; 17. and a water supplementing end cover.
The specific embodiment is as follows:
the utility model is further described below with reference to the specific examples, see fig. 1-2:
the utility model provides a semiconductor water-cooling integration for electric vehicle, includes integrated casing 1, and sets up inlet channel and the outlet channel in integrated casing 1, and inlet channel and outlet channel's outer end communicates with electric vehicle's water-cooling circulation channel's both ends respectively, be provided with circulating water pump 2 in the integrated casing 1, circulating water pump 2's inlet end communicates with inlet channel's inner, outlet end and outlet channel intercommunication, is provided with semiconductor refrigeration piece 3 in the integrated casing 1, and semiconductor refrigeration piece 3's cold face can act on inlet channel or outlet channel's liquid, and is equipped with radiator fan 4 on the integrated casing 1 that is located semiconductor refrigeration piece 3's hot face outside. The water cooling circulation channel of the electric carrier can be a water cooling channel configured on the motor or the battery or the electric control assembly.
The utility model has higher integral property, the circulating water pump 2 and the cooling fan 4 are integrally arranged in the integrated shell 1, the water cooling circulation flow can be realized by only communicating the water inlet channel and the water outlet channel with the two ends of the external water cooling circulation channel, meanwhile, the cooling water is refrigerated by the semiconductor refrigerating sheet 3, the temperature of the cooling water can be effectively reduced, and the cooling fan 4 acts on the hot surface of the semiconductor refrigerating sheet 3 to dissipate heat.
Still further, in order to make the cold face of the semiconductor refrigeration piece 3 effectively act on in the water outlet channel, be provided with heat conduction seat 5 on the integrated casing 1 and evenly distributed on the heat conduction fin 6 of heat conduction seat 5 one end face, heat conduction fin 6 inserts and establishes in the water outlet channel, the cold face of semiconductor refrigeration piece 3 is attached on the other end face of heat conduction seat 5. Wherein, the heat conduction seat 5 and the heat conduction fin 6 can be in an integrated structure.
Meanwhile, in order to effectively dissipate heat of the hot surface of the semiconductor refrigeration piece 3, a heat dissipation seat 7 and heat dissipation fins 8 uniformly distributed on the end face of the heat dissipation seat 7 facing the heat dissipation fan 4 are arranged on the integrated shell 1 between the hot surface of the semiconductor refrigeration piece 3 and the heat dissipation fan 4, and the hot surface of the semiconductor refrigeration piece 3 is attached to the other end face of the heat dissipation seat 7.
In order to further improve the heat radiation effect of the heat surface of the semiconductor refrigeration sheet 3, the heat radiation seat 7 and the heat radiation fins 8, the integrated housing 1 positioned at the periphery of the heat radiation seat 7 and the heat radiation fins 8 is hollowed out.
In consideration of that when the motor or the battery or the electric control assembly of the electric vehicle fails and continues to be in a high temperature state, the cooling water in the corresponding water cooling circulation channel also continues to be in a high temperature state, so that in order to protect the device, a temperature control switch 9 for detecting the temperature in the integrated housing 1 is arranged in the integrated housing 1, the temperature control switch 9, the circulating water pump 2, the cooling fan 4 and the semiconductor refrigerating sheet 3 are electrically connected with the control assembly, and the control assembly controls the opening or closing of the circulating water pump 2, the cooling fan 4 and the semiconductor refrigerating sheet 3 according to the signals of the temperature control switch 9. I.e. when the temperature control switch 9 detects that the temperature of the cooling water flowing through the integrated housing 1 is too high, the control assembly can immediately turn off the operation of the circulating water pump 2, the cooling fan 4 and the semiconductor cooling fin 3 to protect the circulating water pump 2, the cooling fan 4 and the semiconductor cooling fin 3.
Further, in the present embodiment, the specific composition structure of the integrated housing 1 is: the integrated shell 1 comprises an upper shell 10 and a lower shell 11, a water inlet containing cavity and a water outlet containing cavity are formed between the upper shell 10 and the lower shell 11, a water inlet port 12 is formed in the upper shell 10 positioned in the water inlet containing cavity, a water inlet channel is formed between the water inlet port 12 and the water inlet containing cavity, a water outlet port 13 is formed in the upper shell 10 positioned in the water outlet containing cavity, a water outlet channel is formed between the water outlet port 13 and the water outlet containing cavity, a water inlet end of the circulating water pump 2 is communicated with the water inlet containing cavity, and a water outlet end of the circulating water pump is communicated with the water outlet containing cavity through a pipe fitting 14.
Meanwhile, in order to prolong the length of the water outlet channel, so that the cold surface of the semiconductor refrigeration piece 3 can effectively act on cooling water in the water outlet channel, more than one baffle 15 is arranged on the lower shell 11 in the water outlet cavity, the baffle 15 separates the water outlet cavity to form a U-shaped or S-shaped or labyrinth water outlet channel, the water outlet end of the circulating water pump 2 is communicated with the head end of the water outlet channel through a pipe fitting 14, the tail end of the water outlet channel is arranged at the water outlet port 13, and the cold surface of the semiconductor refrigeration piece 3 acts on liquid in the water outlet channel.
In addition, in order to supplement the cooling water in the cooling circulation channel, a water supplementing hole 16 is formed in the lower housing 11 positioned in the water inlet cavity, and a water supplementing end cover 17 is detachably connected to a port of the water supplementing hole 16.
The above embodiment is only one of the preferred embodiments of the present utility model, and is not intended to limit the scope of the present utility model, therefore: all equivalent changes in shape, structure and principle of the utility model should be covered in the scope of protection of the utility model.
Claims (8)
1. The utility model provides a semiconductor water-cooling integration for electric carrier which characterized in that: the integrated shell (1) is internally provided with a circulating water pump (2), the water inlet end of the circulating water pump (2) is communicated with the inner end of the water inlet channel, the water outlet end of the circulating water pump is communicated with the water outlet channel, a semiconductor refrigerating sheet (3) is arranged in the integrated shell (1), the cold surface of the semiconductor refrigerating sheet (3) can act on liquid in the water inlet channel or the water outlet channel, and a radiator fan (4) is arranged on the integrated shell (1) positioned outside the hot surface of the semiconductor refrigerating sheet (3).
2. The semiconductor water-cooled integration for an electric vehicle of claim 1, wherein: the integrated shell (1) is provided with a heat conduction seat (5) and heat conduction fins (6) uniformly distributed on one end face of the heat conduction seat (5), the heat conduction fins (6) are inserted into the water outlet channel, and the cold face of the semiconductor refrigeration piece (3) is attached to the other end face of the heat conduction seat (5).
3. The semiconductor water-cooled integration for an electric vehicle of claim 1, wherein: the integrated shell (1) between the hot surface of the semiconductor refrigerating sheet (3) and the cooling fan (4) is provided with a cooling seat (7) and cooling fins (8) uniformly distributed on the end surface of the cooling seat (7) facing the cooling fan (4), and the hot surface of the semiconductor refrigerating sheet (3) is attached to the other end surface of the cooling seat (7).
4. A semiconductor water-cooled integration for an electric vehicle as recited in claim 3, wherein: the integrated shell (1) positioned at the peripheries of the radiating seats (7) and the radiating fins (8) is hollowed.
5. The semiconductor water-cooled integration for an electric vehicle of claim 1, wherein: the integrated shell (1) is internally provided with a temperature control switch (9) for detecting the temperature in the integrated shell (1), the temperature control switch (9), the circulating water pump (2), the cooling fan (4) and the semiconductor refrigerating sheet (3) are electrically connected with the control assembly, and the control assembly controls the opening or closing of the circulating water pump (2), the cooling fan (4) and the semiconductor refrigerating sheet (3) according to the signals of the temperature control switch (9).
6. A semiconductor water-cooled integration for an electric vehicle according to any of claims 1-5, wherein: the integrated shell (1) comprises an upper shell (10) and a lower shell (11), a water inlet containing cavity and a water outlet containing cavity are formed between the upper shell (10) and the lower shell (11), a water inlet port (12) is formed in the upper shell (10) located in the water inlet containing cavity, a water inlet channel is formed between the water inlet port (12) and the water inlet containing cavity, a water outlet port (13) is formed in the upper shell (10) located in the water outlet containing cavity, a water outlet channel is formed between the water outlet port (13) and the water outlet containing cavity, and the water inlet end of the circulating water pump (2) is communicated with the water inlet containing cavity and the water outlet end is communicated with the water outlet containing cavity through a pipe fitting (14).
7. The semiconductor water-cooled integration for an electric vehicle of claim 6, wherein: the lower shell (11) positioned in the water outlet cavity is provided with more than one baffle (15), the baffle (15) separates the water outlet cavity to form a U-shaped or S-shaped or labyrinth water outlet flow channel, the water outlet end of the circulating water pump (2) is communicated with the head end of the water outlet flow channel through a pipe fitting (14), the tail end of the water outlet flow channel is arranged at the water outlet port (13), and the cold surface of the semiconductor refrigerating sheet (3) acts on liquid in the water outlet flow channel.
8. The semiconductor water-cooled integration for an electric vehicle of claim 6, wherein: a water supplementing hole (16) is formed in the lower shell (11) in the water inlet cavity, and a water supplementing end cover (17) is detachably connected to the port of the water supplementing hole (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321619462.2U CN220254967U (en) | 2023-06-25 | 2023-06-25 | Semiconductor water-cooling integration for electric carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321619462.2U CN220254967U (en) | 2023-06-25 | 2023-06-25 | Semiconductor water-cooling integration for electric carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254967U true CN220254967U (en) | 2023-12-26 |
Family
ID=89234827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321619462.2U Active CN220254967U (en) | 2023-06-25 | 2023-06-25 | Semiconductor water-cooling integration for electric carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254967U (en) |
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2023
- 2023-06-25 CN CN202321619462.2U patent/CN220254967U/en active Active
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