CN220233170U - Chip heat dissipation cold plate - Google Patents

Abstract

The utility model relates to the field of chip heat dissipation, in particular to a chip heat dissipation cold plate. The utility model provides a chip heat dissipation cold plate, includes cold plate, pipeline, cold plate liquid outlet, cold plate inlet and connects, the pipeline is located the inside of cold plate, the export of pipeline with cold plate liquid outlet intercommunication, the entry of pipeline with cold plate liquid inlet intercommunication, connect including sub-head and female head, cold plate liquid inlet with cold plate liquid outlet respectively with female head intercommunication, sub-head is located female head is far cold plate end. The self-sealing quick connector is connected to the chip heat dissipation cold plate, the self-sealing of the cold plate is realized by utilizing the characteristics of higher internal pressure and better sealing property, and meanwhile, the connector can be directly pulled out under the condition of stopping water supply, so that the operation of mounting, dismounting, replacing and maintaining the cold plate is facilitated.

Description

Chip heat dissipation cold plate

Technical Field

The utility model relates to the field of chip heat dissipation, in particular to a chip heat dissipation cold plate.

Background

Along with the development of chip technology, the second generation chips have been gradually popularized and applied in recent years, the functions of the chips are more and more powerful, the heat generated in unit time is more and more, the power consumption of the chips is higher, and whether the heat generated in the working process of the chips can be timely and effectively emitted or not can directly influence the working performance, the cost and the reliability of the chips, so that higher requirements are provided for the heat dissipation management of the chips.

Current research on heat dissipation schemes for chips is mainly focused on reducing thermal resistance. The reduction of the thermal resistance can be divided into three parts, the first is an external heat dissipation means for reducing the thermal resistance packaged into the atmosphere; the second is a package heat dissipation means for reducing the thermal resistance of the package structure; the third is a heat dissipation means for chip internal heat conduction that reduces the internal thermal resistance of the chip. The utility model aims at the first scheme, and designs a self-sealing chip heat dissipation cold plate which can be rapidly pulled out and plugged in without any processing on a chip.

At present, various cooling devices are added outside the power device package, and the main flow external cooling and radiating modes comprise traditional radiating modes such as air cooling, liquid cooling and the like, and external cooling modes such as heat pipe radiating, micro-channel cooling radiating and thermoelectric refrigerating radiating and the like which are widely used in the new century. Although the microchannel cooling and heat dissipation uses liquid as a cooling medium for heat dissipation, the advantage of water cooling also has the advantage of increasing the heat dissipation area of the package, and is more beneficial to the heat dissipation of modularized high-power chips, the etching technology of the microchannel is a difficult point of the heat dissipation mode, so that few chips adopt the heat dissipation. The thermoelectric refrigeration heat dissipation, namely the semiconductor refrigerator refrigeration heat dissipation, has the advantages of no need of refrigerant, long working time and high temperature control precision, but the use of the thermoelectric refrigeration heat dissipation can increase the overall power consumption of the equipment when in refrigeration, and the chip heat dissipation does not adopt the mode at present. At present, the existing chip heat dissipation mode mostly adopts air cooling, and is characterized in that a fan is used for carrying out forced convection heat exchange on the surface of the chip, but the fan heat dissipation mode has the problems of low efficiency, high noise, space restriction and the like. Another heat dissipation mode of the chip is liquid cooling, including modes of micro-channel liquid cooling, liquid spray cooling, liquid impact cooling and the like, and has the advantages of excellent heat dissipation effect, convenient use and the like, and is widely focused, but liquid cooling has a fatal disadvantage of being a problem of tightness, and the liquid cooling radiator on the market at present has the risk of leakage at a pipeline connection part, and once the problem occurs after the liquid cooling radiator is installed, the operation such as disassembly and maintenance is difficult, so that the two problems are needed to be solved at present.

The conventional chip cooling plate is generally integrated, and is cumbersome to detach after being mounted, and the tightness and the heat dissipation capability are also very important parts of the chip cooling plate.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art, and aims to provide a chip heat dissipation cold plate which comprises a cold plate, a pipeline, a cold plate liquid outlet, a cold plate liquid inlet and a joint, wherein the pipeline is arranged in the cold plate, an outlet of the pipeline is communicated with the cold plate liquid outlet, an inlet of the pipeline is communicated with the cold plate liquid inlet, the joint comprises a sub head and a main head, the cold plate liquid inlet and the cold plate liquid outlet are respectively communicated with the main head, and the sub head is arranged at the end of the main head far from the cold plate.

Preferably, a first cavity is formed in the cold plate, and the first cavity is matched with the pipeline;

and/or, the two outer side walls of the cold plate perpendicular to the thickness direction are respectively provided with a chip coupling area;

and/or the cold plate is provided with a plurality of screw holes;

and/or the material of the cold plate is selected from one or more of aluminum alloy, copper, titanium alloy and magnesium alloy;

and/or the length of the cold plate is 100-780mm;

and/or the width of the cold plate is 85-500mm.

Preferably, the first cavity is located on both sides of the pipe;

and/or, each outer side wall of the cold plate is provided with 1-20 chip coupling areas.

Preferably, a second cavity is arranged in the cold plate, and the second cavity is matched with the chip coupling area.

Preferably, the thickness of the first cavity is 1-6mm;

and/or the thickness of the second cavity is 2-10mm;

and/or the distance between the second cavity and the chip coupling area along the thickness direction of the cold plate is 2-12mm.

Preferably, a heat conducting phase change material is arranged in the first cavity and the second cavity.

Preferably, the first cavity is in communication with the second cavity;

and/or the phase transition temperature of the heat conduction phase transition material is 12-40 ℃.

Preferably, the thermally conductive phase change material is selected from one or more of ammonia, ethanol and acetone.

Preferably, the pipeline adopts a fluent simulation optimization design;

and/or the pipeline is arranged on the inner wall of the cold plate.

Preferably, the cold plate liquid inlet and the cold plate liquid outlet are respectively detachably communicated with the female head;

and/or the mother head is detachably communicated with the child head;

and/or the length of the female head is 20-70mm;

and/or the outer diameter of the female head is 20-60mm;

and/or the length of the sub-head is 20-60mm;

and/or the outer diameter of the sub-head is 5-30mm;

and/or the length of the joint is 50-12mm.

The utility model has the following beneficial technical effects:

1) The self-sealing quick connector is connected to the chip heat dissipation cold plate, the self-sealing of the cold plate is realized by utilizing the characteristics of higher internal pressure and better sealing property, and meanwhile, the connector can be directly pulled out under the condition of stopping water supply, so that the operation of mounting, dismounting, replacing and maintaining the cold plate is facilitated.

2) According to the chip heat dissipation cold plate, the first cavity and the second cavity are formed in the cold plate, and the heat conduction phase change material is filled in the first cavity and the second cavity, so that the heat dissipation capacity of the cold plate is greatly improved under the condition that the volume of the cold plate is not changed.

Drawings

Fig. 1 is a front view of a heat-dissipating cold plate of a chip according to the present utility model.

Fig. 2 is a rear view of the heat sink cold plate of the chip of the present utility model.

Fig. 3 is a cross-sectional view of a heat-dissipating cold plate of a chip according to the present utility model.

Fig. 4 is a schematic diagram of a sub-head and a mother head separated in a heat dissipation cold plate of a chip according to the present utility model.

Reference numerals:

1. cold plate

2. Pipeline

3. Liquid outlet of cold plate

4. Cold plate liquid inlet

5. Joint

51. Sub-head

52. Female head

6. First cavity

7. Chip coupling region

8. Screw hole

9. Second cavity

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.

It should be understood that the process equipment or devices not specifically identified in the examples below are all conventional in the art.

As shown in fig. 1, a chip cooling cold plate comprises a cold plate 1, a pipeline 2, a cold plate liquid outlet 3, a cold plate liquid inlet 4 and a joint 5, wherein the pipeline 2 is arranged in the cold plate 1, an outlet of the pipeline 2 is communicated with the cold plate liquid outlet 3, an inlet of the pipeline 2 is communicated with the cold plate liquid inlet 4, the cold plate liquid inlet 4 and/or the cold plate liquid outlet 3 are respectively provided with the joint 5, the joint 5 comprises a sub head 51 and a main head 52, the cold plate liquid inlet 4 and the cold plate liquid outlet 3 are respectively communicated with the main head 52, and the sub head 51 is arranged at the end of the main head 52 far from the cold plate 1. When the cold plate liquid inlet 4 is used, the cold plate liquid inlet 4 is connected with one end of one mother head 52, the other end of the mother head is connected with the child head 51, the child head 51 is far away from one end of the mother head 52 is connected with an external pipeline, the cold plate liquid outlet 3 is correspondingly connected with the mother head 52 and the child head 51, the child head 51 at the liquid cold plate liquid inlet 4 enters and sequentially flows through the mother head 52 at the inlet liquid cold plate liquid inlet 4, the internal liquid pipeline 2 and the mother head 52 at the cold plate liquid outlet 3, and finally flows out of the child head at the cold plate liquid outlet 3. In the process that fluid in an external pipeline flows from the cold plate liquid inlet 4 to the cold plate liquid outlet 3, the sealing effect of the chip heat dissipation cold plate is realized by utilizing the principle that the higher the fluid pressure is, the better the sealing performance is.

In a preferred embodiment, the material of the cold plate 1 is one or more of aluminum alloy, copper, titanium alloy and magnesium alloy; the length of the cold plate 1 is 100-780mm; the width of the cold plate 1 is 85-500mm.

In a preferred embodiment, a first cavity 6 is provided in the cold plate 1, and a heat-conducting phase-change material is received in the first cavity 6, and the first cavity 6 is matched with the pipeline 2, where the matching refers to corresponding position, shape, size, etc. The thermally conductive phase change material is in contact with the pipe 2, which may greatly increase the heat exchange capacity. Preferably, the thickness of the first cavity 6 is 1-6mm. The heat-conducting phase-change material is a heat-conducting interface material capable of changing from solid state to liquid state above a certain formula design temperature, and is also called as a phase-change heat-conducting material in the industry; the thermally conductive phase change material is a thermally enhanced polymer designed to minimize thermal resistance between the power dissipating electronic device and the heat sink to which it is coupled, and the small thermal resistance path allows the heat sink to perform optimally. Preferably, the phase transition temperature of the heat conductive phase change material is 12-40 ℃ due to the temperature limitation of the chip and the cooling water, and preferably, the heat conductive phase change material is one or more selected from ammonia, ethanol and acetone.

In a preferred embodiment, the cold plate 1 is provided with a plurality of screw holes 8, and the screw holes 8 are used for mounting and fixing the cold plate. Specifically, the heat-conducting phase-change material in the first cavity inside the cold plate 1 can be evaporated and expanded during operation, so that the internal pressure is increased, and the screw hole 8 penetrating through the whole cold plate 1 can provide a tensile force, so that the cold plate 1 is prevented from expanding due to too high internal pressure. The screw holes 8 are arranged in a uniform manner so that a relatively uniform force is provided.

In a preferred embodiment, the two outer side walls of the cold plate 1 perpendicular to the thickness direction are respectively provided with a chip coupling region 7; preferably, 1-20 chip coupling areas 7 are arranged on each outer side wall of the cold plate 1. Preferably, the two chip coupling regions 7 are respectively located at upper and lower central positions on one side of the cold plate 1.

In a preferred embodiment, at least one second cavity 9 is provided in the cold plate 1, the second cavity 9 being matched to the chip coupling region 7. The matching means that the second cavity 9 and the chip coupling area 7 are respectively located at two sides of one side wall of the cold plate 1 and are consistent in position, so as to conduct heat to the chip coupling area 7. Preferably, the thickness of the second cavity 9 is 2-10mm; preferably, the distance between the second cavity 9 and the chip coupling region 7 along the thickness direction of the cold plate 1 is 2-12mm, and the first cavity 6 is communicated with the second cavity 9; a heat-conducting phase-change material is arranged in the second cavity 9, and the phase-change temperature of the heat-conducting phase-change material is 12-40 ℃; the heat-conducting phase change material is selected from one or more of ammonia, ethanol and acetone.

The heat dissipation principle in the utility model is as follows: the heat dissipation of the whole cold plate is divided into three parts, wherein the first part is that the chip guides heat into the cold plate 1 through the heat conduction phase change material, the second part is that fluid in the pipeline 2 absorbs the heat of the cold plate and flows out, and the third part is that the natural convection heat dissipation is performed at the upper part of the cold plate 1.

In a preferred embodiment, the pipeline 2 is designed in a fluent simulation optimization manner; the minimum pressure drop and the maximum heat transfer capacity are targeted, while the optimal structure obtained by engineering application is considered. In the general electronic equipment heat dissipation design, the chip temperature needs to be reduced as much as possible, the flow speed needs to be increased, but the excessively high pressure loss is caused by increasing the flow speed, and the heat exchange can be weakened by reducing the flow speed, so that the pressure difference between an inlet and an outlet is reduced as much as possible, and meanwhile, the heat exchange capacity is taken into consideration, 1. The flow speed of fluid is fixed, and the length and the structure of the pipeline 1 are changed; 2. fixing the length and structure of the pipeline 1, and changing the fluid flow rate; the two conditions are subjected to simulation design to determine the pipeline structure and the fluid flow velocity with high heat exchange capacity and minimized pressure drop. The results show that the pressure drop of the system is minimum and the heat exchange capacity is strong when the fluid flow rate is between 2.5 and 3m/s under the pipeline structure shown in figure 3. Preferably, the duct 2 is provided on the inner wall of the cold plate 1.

Preferably, the cold plate liquid inlet 4 and the cold plate liquid outlet 3 are respectively and detachably communicated with the female head 52, the female head 52 is detachably communicated with the sub head 51, the length of the female head 52 is 20-70mm, the outer diameter of the female head 52 is 20-60mm, the length of the sub head 51 is 20-60mm, the outer diameter of the sub head 51 is 5-30mm, and the length of the joint is 50-12mm. The sub-head 51 and the main head 52 in the present utility model are commercially available. The chip heat dissipation cold plate using the sub-head 51 and the main head 52 has good heat dissipation performance, and the joint is free from leakage due to the existence of the joint, meanwhile, the plug connector can be directly pulled out under the condition of stopping water supply, so that the cold plate is convenient to mount, dismount, replace and maintain.

The thickness direction refers to a direction perpendicular to a side wall of the cold plate provided with the chip coupling region, the length refers to a longer vertical distance in the side wall of the cold plate provided with the chip coupling region, and the width refers to a shorter vertical distance in the side wall of the cold plate provided with the chip coupling region.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (9)

1. The utility model provides a chip heat dissipation cold plate, its characterized in that, including cold plate (1), pipeline (2), cold plate liquid outlet (3), cold plate inlet (4) and joint (5), pipeline (2) are located the inside of cold plate (1), the export of pipeline (2) with cold plate liquid outlet (3) intercommunication, the entry of pipeline (2) with cold plate inlet (4) intercommunication, cold plate liquid inlet (4) and/or cold plate liquid outlet (3) are equipped with joint (5) respectively, joint (5) include sub-head (51) and female head (52), cold plate liquid inlet (4) with cold plate liquid outlet (3) respectively with female head (52) intercommunication, sub-head (51) are located female head (52) are far away cold plate (1) end.

2. The chip cooling cold plate according to claim 1, wherein at least one first cavity (6) is provided inside the cold plate (1), the first cavity (6) being in contact with the pipe (2) for conducting heat to the pipe (2);

and/or, the two outer side walls of the cold plate (1) perpendicular to the thickness direction are respectively provided with a chip coupling region (7);

and/or, a plurality of screw holes (8) are arranged on the cold plate (1);

and/or the length of the cold plate (1) is 100-780mm;

and/or the width of the cold plate (1) is 85-500mm.

3. The chip cooling plate according to claim 2, characterized in that 1-20 chip coupling areas (7) are provided on each outer side wall of the cooling plate (1).

4. A cold plate for heat dissipation of chips according to claim 3, characterized in that at least one second cavity (9) is provided in the cold plate (1), which second cavity (9) is matched to the chip coupling region (7).

5. The heat sink for chips according to claim 4, characterized in that the thickness of the first cavity (6) is 1-6mm;

and/or the thickness of the second cavity (9) is 2-10mm;

and/or the distance between the second cavity (9) and the chip coupling area (7) along the thickness direction of the cold plate (1) is 2-12mm.

6. The chip cooling plate according to claim 4 or 5, characterized in that a heat conducting phase change material is arranged in the first cavity (6) and the second cavity (9).

7. The chip cooling plate according to claim 6, characterized in that the first cavity (6) communicates with the second cavity (9);

and/or the phase transition temperature of the heat conduction phase transition material is 12-40 ℃.

8. The chip cooling plate according to any one of claims 1-5, wherein the pipeline (2) is designed with fluent simulation optimization;

and/or the pipeline (2) is arranged on the inner wall of the cold plate (1).

9. A cold plate for heat dissipation of chips according to any one of claims 1-5, characterized in that the liquid inlet (4) of the cold plate and the

The liquid outlet (3) of the cold plate is detachably communicated with the female head (52) respectively;

and/or, the female (52) is in removable communication with the male (51);

and/or the length of the female head (52) is 20-70mm;

and/or the outer diameter of the female head (52) is 20-60mm;

and/or the length of the sub-head (51) is 20-60mm;

and/or the outer diameter of the sub-head (51) is 5-30mm;

and/or the length of the joint is 50-12mm.