CN220232401U - Computer power supply with integrated heat radiation structure - Google Patents
Computer power supply with integrated heat radiation structure Download PDFInfo
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- CN220232401U CN220232401U CN202321449368.7U CN202321449368U CN220232401U CN 220232401 U CN220232401 U CN 220232401U CN 202321449368 U CN202321449368 U CN 202321449368U CN 220232401 U CN220232401 U CN 220232401U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 55
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- 238000009792 diffusion process Methods 0.000 claims abstract description 19
- 230000026058 directional locomotion Effects 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 39
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- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
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- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 2
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- 239000000428 dust Substances 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 description 23
- 238000005057 refrigeration Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 12
- 230000033001 locomotion Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a computer power supply with an integrated heat dissipation structure, which comprises a shell for accommodating an electric energy conversion element, wherein the shell comprises a first shell layer and a second shell layer which are sleeved with each other, and a clearance space between the first shell layer and the second shell layer, which are overlapped in an axis, is used for limiting an annular cup cavity which can be sleeved outside an inner shell cavity of the first shell layer; a plurality of heat exchange units capable of conducting heat transfer are inlaid on the side wall of the second shell layer at intervals in the circumferential direction, heat transfer diffusion units are distributed on the surface array of the heat exchange units facing the annular cup body cavity, radiating fins are arranged on the surfaces, far away from the heat transfer diffusion units, of the heat exchange units, and active radiating fans capable of driving airflow to conduct directional movement to enable heat dissipated by the surfaces of the radiating fins to be transferred in a directional mode are suspended and supported on the outer sides of the radiating fins. The utility model can effectively prevent the computer power supply from being polluted and covered by dust so as to ensure the heat dissipation efficiency.
Description
Technical Field
The present utility model relates to computer power supplies, and particularly to a computer power supply with an integrated heat dissipation structure.
Background
Along with the development of information society and electronic products, a computer is an increasingly popular device in our life, is also called a computer, is an electronic computing machine for high-speed computing, can perform numerical computation, can perform logic computation, has a memory function, is a modern intelligent electronic device capable of automatically and rapidly processing mass data according to program operation, is composed of various devices, is a computer power supply, converts alternating current into direct current, provides stable and reliable direct current, and is used for system components such as a system main board, various adapters, expansion cards, a hard disk drive, an optical disk drive and the like in a host case, a keyboard and a mouse. The computer power supply is a hub for supplying power to various parts of the computer and is an important component of the computer.
At present, in order to ensure the working state of the continuous working of the computer power supply, a cooling fan is usually arranged on the computer power supply, and corresponding cooling holes are formed in the shell, so that cooling air flow generated by the cooling fan can drive external air to pass through the cooling holes and then cool electronic components and the core board in the computer power supply. However, during the operation of the computer power supply, the continuous operation of the cooling fan often deposits and accumulates the impurities such as dust contained in the external air at the cooling holes, which causes the blockage of the cooling holes, especially, part of the dust enters the computer power supply through the cooling holes, so that the surface of the electronic component is covered with the dust, and the electronic component cannot effectively transfer heat in an outward volatilizing manner, and at the same time, the blockage of the cooling holes causes the cooling airflow to not effectively enter the computer host, so as to cool the accessories such as the power supply. In this state, the computer power supply needs to remove dust and clean the interior and the heat dissipation holes regularly, however, the cleaning treatment needs to disassemble the computer host and the computer power supply shell to clean the interior, the disassembly mode is tedious and the time cost is high, especially the complicated and frequent disassembly and assembly process is extremely easy to cause the damage of related accessories, and the service lives of the computer host and the computer power supply are reduced.
Furthermore, there are differences in one aspect due to understanding to those skilled in the art; on the other hand, as the inventors studied numerous documents and patents while the present utility model was made, the text is not limited to details and contents of all that are listed, but it is by no means the present utility model does not have these prior art features, the present utility model has all the prior art features, and the applicant remains in the background art to which the rights of the related prior art are added.
Disclosure of Invention
The utility model aims to provide a computer power supply with an integrated radiating structure, which can prevent the computer power supply from being polluted and covered by dust and can avoid the problem that the service life of related accessories is reduced because the computer power supply can radiate heat efficiently under the condition of periodically and fussy disassembly operation, so as to solve the problem that the computer power supply with the radiating structure radiates heat in a mode of constructing an air cooling radiating channel, but the single air cooling radiating structure is extremely easy to cause the dust contained in the air to enter the computer power supply and adhere to the surface of an electronic element to cause slow radiation and block radiating holes to cause small radiating airflow and ineffective radiation, and the radiating structure needs to be cleaned regularly but is extremely easy to cause the abrasion of the accessories to be disassembled frequently, thereby reducing the service life of the computer power supply.
The technical scheme adopted by the utility model is as follows: the computer power supply with the integrated heat dissipation structure comprises a shell for accommodating an electric energy conversion element, wherein the shell comprises a first shell layer and a second shell layer which are sleeved with each other, and a clearance space between the first shell layer and the second shell layer, which are overlapped in an axis, is used for limiting an annular cup body cavity which can be sleeved outside an inner shell cavity of the first shell layer; a plurality of heat exchange units capable of conducting heat transfer are inlaid on the side wall of the second shell layer at intervals in the circumferential direction, heat transfer diffusion units are distributed on the surface array of the heat exchange units facing the annular cup body cavity, radiating fins are arranged on the surfaces, far away from the heat transfer diffusion units, of the heat exchange units, and active radiating fans capable of driving airflow to conduct directional movement to enable heat dissipated by the surfaces of the radiating fins to be transferred in a directional mode are suspended and supported on the outer sides of the radiating fins.
According to a preferred embodiment, the heat transfer diffusion unit comprises a heat absorption column and a corrosion resistant layer wrapped on the surface of the heat absorption column, wherein the heat absorption column with a diamond-shaped shunt section is supported on the surface of the heat exchange unit in an array manner capable of shunting the heat conduction liquid flowing in the cavity of the annular cup for a plurality of times to disturb the state of the heat conduction liquid so as to force the heat transferred by the heat conduction liquid to be absorbed by the heat absorption column.
According to a preferred embodiment, the axial upper end of the inner shell cavity of the first shell layer is provided with a top opening for dismounting the electric energy conversion element; the upper end of the shell in the axial direction is provided with a cover body for sealing the top opening of the inner shell cavity defined by the first shell layer, and the cover body is provided with a plurality of openings which can be used for the output end and the input end of the electric energy conversion element to be in butt joint with an external electric cable.
According to a preferred embodiment, the electrical energy conversion element comprises a module body, a first joint, a second joint and a third joint, wherein the axial upper end of the module body is provided with the first joint, the second joint and the third joint which are electrically or signally connected with the inner core plate thereof; the first, second and third connectors extend through the opening to the exterior of the housing.
According to a preferred embodiment, a rotating assembly capable of stirring the heat conducting liquid loaded in the cavity of the annular cup body is arranged at the bottom of the cavity of the annular cup body, and the rotating assembly drives the heat conducting liquid in the cavity of the annular cup body to move in a directional annular mode in a rotating mode around a shaft so as to accelerate the heat conducting liquid to take away the heat transferred by the first shell layer.
According to a preferred embodiment, the rotating assembly comprises an agitation plate, a drive turning bar and a rotating electric machine, wherein the rotating electric machine is mounted within the second housing layer, and an output shaft of the rotating electric machine extends through the second housing layer and into a bottom chamber of the annular cup chamber.
According to a preferred embodiment, the transmission turning rod in a U shape is in transmission connection with an output shaft of the rotating electric machine placed in a bottom chamber of the annular cup chamber, two parallel ends of the transmission turning rod, which are distant from the rotating electric machine, are placed in side chambers of the annular cup chamber, and the parallel ends of the transmission turning rod are further provided with the stirring plates, respectively, which are capable of stirring the heat transfer liquid in the annular cup chamber during rotation.
According to a preferred embodiment, at least two stirring plates are arranged on the same end rod body of the transmission rotating rod at intervals in a mutually parallel mode, and the stirring plates can stir the heat conduction liquid to rotate in the same direction in the rotating process in a mode of constructing turbine blades.
According to a preferred embodiment, the active heat dissipation fan arranged laterally is detachably mounted on the outer side surface of the second shell layer through a transverse support rod; the active heat dissipation fan, the heat exchange unit and the rotating motor are electrically connected with an external power supply and are mutually connected in parallel.
According to a preferred embodiment, the first shell layer is made of the same high heat dissipation conductive metal material as the heat dissipation fins.
The beneficial effects of the utility model are as follows:
this application is through setting up the heat transfer diffusion unit of being connected with heat transfer unit in the casing to construct the annular cup cavity that is used for the heat conduction liquid to store in the casing, make the inside heat dissipation of power and heat transfer realize by utilizing the water-cooling heat dissipation in the enclosure space and the semiconductor refrigeration radiating mode, for the air-cooling heat dissipation, avoided the air current to need get into inside the power, the power casing needs to set up louvre and inside heat dissipation passageway and lead to the defect that the dust is attached to, thereby guaranteed the inside cleanliness factor of power, and the combination of water-cooling heat dissipation and semiconductor refrigeration heat dissipation has the advantage that heat conduction efficiency is higher and heat transfer is faster, thereby can be more effectively to the operating temperature of the electric energy conversion component who controls the constitution power, make it keep a stable and temperature controllable operating condition, thereby promote its life. And the radiating mode does not need to be disassembled and cleaned regularly, so that the electronic element forming the power supply can keep a stable working position for a long time, and the damage possibly caused by frequent disassembly and assembly is avoided. In addition, this application still sets up the radiating fin that helps it to carry out the heat dissipation with bigger surface area in the outside of heat transfer unit to promote its radiating efficiency who shifts heat, and the radiating fin outside still is provided with the initiative radiator fan that can help the heat that gives off to carry out the transfer of more distant outside space, so that radiating efficiency obtains further promotion. In addition, as the radiating fins can be directly externally installed, dust possibly attached to the surfaces of the radiating fins can be cleaned without disassembling a computer power supply, and the operation difficulty and the complexity of surface cleaning are greatly reduced.
The rotating assembly that this application set up can rotate the heat conduction liquid in the annular cup cavity and stir for the heat conduction liquid can be driven by stirring board and take place to rotate in the annular cup cavity, and receive the reposition of redundant personnel of heat absorption post and continuously change motion state in the rotation in-process, thereby forces the heat conduction liquid and can accomplish heat transfer and transfer more effectively, in order to effectively reduce electric energy conversion element's operating temperature.
Drawings
FIG. 1 is a schematic diagram of a preferred computer power supply with an integrated heat dissipation structure according to the present utility model;
fig. 2 is a partially expanded plan view of a preferred heat exchange unit with an integrated heat dissipating structure according to the present utility model.
List of reference numerals
1: a housing; 2: an electric energy conversion element; 3: a heat exchange unit; 4: a heat transfer diffusion unit; 5: a heat radiation fin; 6: an active heat dissipation fan; 7: a rotating assembly; 8: a transverse support rod; 11: a first shell layer; 12: a second shell layer; 13: an annular cup chamber; 14: a cover body; 21: a module body; 22: a first joint; 23: a second joint; 24: a third joint; 41: a heat absorption column; 42: a corrosion resistant layer; 71: an agitating plate; 72: a transmission rotating rod; 73: a rotating electric machine; 131: a bottom chamber; 132: a side chamber; 141: an opening.
Detailed Description
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the present utility model will be briefly described below with reference to the accompanying drawings and the description of the embodiments or the prior art, and it is obvious that the following description of the structure of the drawings is only some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
The technical solution provided by the present utility model will be described in detail by way of examples with reference to the accompanying drawings. It should be noted that the description of these examples is for aiding in understanding the present utility model, but is not intended to limit the present utility model. In some instances, some embodiments are not described or described in detail as such, as may be known or conventional in the art.
Furthermore, features described herein, or steps in all methods or processes disclosed, may be combined in any suitable manner in one or more embodiments in addition to mutually exclusive features and/or steps. It will be readily understood by those skilled in the art that the steps or order of operation of the methods associated with the embodiments provided herein may also be varied. Any order in the figures and examples is for illustrative purposes only and does not imply that a certain order is required unless explicitly stated that a certain order is required.
The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling) where appropriate (where no paradox is constructed).
The following detailed description refers to the accompanying drawings.
Example 1
The application provides a computer power supply with integrated heat radiation structure, it includes casing 1, electric energy conversion component 2, heat transfer unit 3, heat transfer diffusion unit 4, fin 5, initiative heat dissipation fan 6, rotating assembly 7 and horizontal bracing piece 8.
According to a specific embodiment shown in fig. 1, a housing 1 is detachably loaded with an electric energy conversion element 2 for direct current transmission with other accessories of a computer host. The heat exchange units 3 are circumferentially arranged on the side shell wall of the shell 1 at intervals in a gapless embedded mode. The surface array of the heat exchange unit 3 in the interstitial shell cavity defined by the housing 1 is provided with transfer diffusion units 4 capable of transferring heat to the heat exchange unit 3. The gap housing cavity defined by the housing 1 is filled with a heat conducting liquid. The electric energy conversion element 2 is separated from the heat transfer liquid by a housing wall. The heat generated during operation of the electric energy conversion element 2 can be absorbed by the heat transfer liquid through the partition wall, so that the heat transfer liquid can further transfer the operating heat. A rotating assembly 7 is also provided in the gap housing cavity to facilitate movement of the heat transfer fluid so that it absorbs and transfers heat more effectively in a more active state of movement. The surface of the heat exchange unit 3 far away from the heat transfer diffusion unit 4 is also provided with a plurality of radiating fins 5 at intervals. The heat radiating fins 5 can radiate the heat transferred by the heat exchanging unit 3 to the external environment, thereby realizing the transfer of heat. The outside of the radiating fin 5 is suspended with an active radiating fan 6 through a transverse supporting rod 8 supported on the side wall of the shell 1, so that heat emitted from the surface of the radiating fin 5 can be directly and directionally discharged out of the computer host, the working temperature of the environment of the whole computer host is reduced, the computer host and a power supply can keep a stable working environment parameter, and the service lives of the power supply and related accessories are prolonged. The closed internal heat transfer structure of this application for the inside defect that is polluted and covered by dust can not appear in the power, consequently need not regularly dismantle and maintain, guaranteed the structural stability and the integrity of power long-time work.
Preferably, the housing 1 comprises a first shell 11 and a second shell 12, which are mutually nested. Further preferably, the gap space between the first shell 11 and the second shell 12, which are axially coincident, defines an annular cup chamber 13 that can be sleeved outside the inner shell of the first shell 11. Preferably, the axial upper end of the inner housing cavity of the first shell layer 11 is provided with a top opening for dismounting the electric energy conversion element 2. It is further preferable that the axial upper end of the housing 1 is provided with a cover 14 that seals the top opening of the inner housing chamber defined by the first shell 11. Specifically, the cover 14 is provided with a plurality of openings 141 for interfacing the output and input ends of the power conversion element 2 with external electrical cables. Preferably, the first shell layer 11 is made of the same high heat dissipation conductive metal material as the heat dissipation fins 5. Preferably a copper-containing metal substrate. The copper material or the copper-containing base material selected by the first shell layer 11 can effectively transfer the heat generated by the electric energy conversion element into the heat conduction liquid, so that the heat transfer efficiency of the electric energy conversion element 2 is ensured, the heat generated by the electric energy conversion element 2 during operation is prevented from being deposited in the inner shell cavity defined by the first shell layer 11, the actual working efficiency and the working state of the electric energy conversion element 2 are influenced due to the fact that the surface temperature of the electric energy conversion element 2 is too high, the damage of the electronic element in the electric energy conversion element caused by the working in a high-temperature environment is avoided, and the service life of the electric energy conversion element 2 is prolonged.
Preferably, the electrical energy conversion element 2 comprises a module body 21, a first joint 22, a second joint 23 and a third joint 24. Preferably, the module body 21 is provided at an axially upper end thereof with a first connector 22, a second connector 23 and a third connector 24 electrically or signal-connected to the inner core plate thereof. Specifically, the first, second and third joints 22, 23 and 24 extend to the outside of the housing 1 through the opening 141. Preferably, the openings 131 have different dimensions so that they can be matched to the cross-sectional dimensions of different connectors. Preferably, the first connector 22, the second connector 23 and the third connector 24 may correspond to an input terminal, an output terminal and a spare detection connector, respectively.
Preferably, a plurality of heat exchange units 3 capable of transferring heat are embedded at circumferential intervals on the side wall of the second shell layer 12. As shown in fig. 2, the surface of the heat exchange unit 3 facing the annular cup chamber 13 is provided with the heat transfer diffusion unit 4 in an array, and the surface of the heat exchange unit 3 away from the heat transfer diffusion unit 4 is provided with the heat radiation fins 5. Further preferably, the heat exchange units 3 are mounted on the second shell layer 12 in a non-clearance embedded manner, and four heat exchange units 3 are separately disposed on four sides of the second shell layer 12. Specifically, the heat exchange unit 3 may be a semiconductor refrigeration heat dissipation structure, where a cold end of the semiconductor refrigeration heat dissipation structure faces the annular cup cavity 13 inside the second shell layer 12 to absorb heat existing in the heat conducting liquid and the heat transfer diffusion unit 4. The hot end of the semiconductor refrigeration heat dissipation structure is located on the outer side face of the second shell layer 12, so that the contact surface between the semiconductor refrigeration heat dissipation structure and the external environment can be increased through the heat dissipation fins 5, and the heat transferred by the semiconductor refrigeration heat dissipation structure is accelerated to be dissipated outwards. Preferably, the semiconductor refrigeration and heat dissipation structure corresponding to the heat exchange unit 3 directly adopts the existing semiconductor refrigeration sheet, which utilizes the peltier effect for refrigeration and is electrically connected with an external power supply through a wire. This application is through setting up the heat transfer diffusion unit 4 that is connected with heat transfer unit 3 in casing 1 to construct the annular cup cavity 13 that is used for the heat conduction liquid to store in casing 1, make the inside heat dissipation of power and heat transfer be realized by utilizing the mode of water-cooling heat dissipation and semiconductor refrigeration heat dissipation in the enclosure space, for the air-cooling heat dissipation, avoided the air current to need get into inside the power, the power casing needs to set up louvre and inside heat dissipation passageway and leads to the defect that the dust is attached to, thereby guaranteed the inside cleanliness factor of power, and the combination of water-cooling heat dissipation and semiconductor refrigeration heat dissipation has the advantage that heat conduction efficiency is higher and heat transfer is faster, thereby can be more effectively to the operating temperature of the electric energy conversion component 2 of controlling the constitution power, make it can keep a stable and temperature controllable operating condition, thereby promote its life. And the radiating mode does not need to be disassembled and cleaned regularly, so that the electronic element forming the power supply can keep a stable working position for a long time, and the damage possibly caused by frequent disassembly and assembly is avoided. In addition, this application still sets up the radiating fin 5 that helps it to carry out the heat dissipation with bigger surface area in the outside of heat transfer unit 3 to promote its radiating efficiency who shifts heat, and radiating fin 5 outside still is provided with the initiative cooling fan 6 that can help the heat that gives off to carry out the transfer of more outside space, so that radiating efficiency obtains further promotion. In addition, because the radiating fins 5 can be directly externally installed, dust possibly attached to the surfaces of the radiating fins 5 can be cleaned without disassembling a computer power supply, and the operation difficulty and the complexity of surface cleaning are greatly reduced. The integrated design of the annular cup cavity 13 that this application held through heat transfer unit 3, heat transfer diffusion unit 4, radiating fin 5, initiative heat dissipation fan 6 and heat conduction liquid to combine semiconductor refrigeration, water-cooling and forced air cooling heat dissipation each other, can also maintain forced air cooling radiating circulation in the time of guaranteeing inside sealed heat dissipation, thereby the heat radiation structure that integrates has stronger radiating effect.
Preferably, the heat transfer diffusion unit 4 includes a heat absorption column 41 and a corrosion resistant layer 42 wrapped around the surface of the heat absorption column 41. Preferably, the heat absorbing columns 41 having a diamond-shaped flow dividing section are supported on the surface of the heat exchanging unit 3 in an array in such a manner that the heat conducting liquid flowing in the annular cup chamber 13 can be divided a plurality of times to disturb the state of the heat conducting liquid so that the heat transferred by the heat conducting liquid can be forced to be absorbed by the heat absorbing columns 41. Further preferably, inside the heat absorption column 41 is a metal plate type energy storage diffuser. Preferably, the corrosion-resistant layer 42 is an HDEP film fixedly attached to the surface of the heat absorption column 41 by a strong adhesive. Further preferably, the HDEP film has a thickness of 0.1 to 0.5mm.
Preferably, the outside of the radiating fin 5 is suspended and supported with an active radiating fan 6 which can drive the airflow to directionally move so as to directionally transfer the heat radiated by the surface of the radiating fin 5. Preferably, the heat radiating fins 5 are provided in plural in parallel, which are existing metal heat radiating fins.
Preferably, the laterally positioned active heat dissipation fans 6 are detachably mounted on the outer side surface of the second shell layer 12 by means of the transverse support bars 8. Further preferably, the active heat dissipation fan 6, the heat exchange unit 3 and the rotating electric machine 73 are electrically connected with an external power supply, and are connected in parallel with each other.
Preferably, the bottom of the annular cup chamber 13 is provided with a rotating assembly 7 capable of stirring the heat-conducting liquid loaded in its chamber. Preferably, the rotating component 7 drives the heat conducting liquid in the cavity 13 of the annular cup body to move in a directional annular way in a pivoting mode so as to accelerate the heat conducting liquid to take away the heat transferred by the first shell layer 11. Further preferably, the rotating assembly 7 includes an agitating plate 71, a drive turning rod 72, and a rotating motor 73. Specifically, the rotary electric machine 73 is mounted within the second casing 12, and an output shaft of the rotary electric machine 73 penetrates the second casing 12 and extends into the bottom chamber 131 of the annular cup chamber 13. Preferably, the drive pawl 72, which is U-shaped, is in driving connection with an output shaft of a rotary motor 73 disposed in a bottom chamber 131 of the annular cup chamber 13. It is further preferable that both parallel ends of the transmission turn bar 72 distant from the rotary motor 73 are placed in the side chambers 132 of the annular cup chamber 13, and that the parallel ends of the transmission turn bar 72 are further provided with stirring plates 71 capable of stirring the heat conductive liquid in the annular cup chamber 13 during rotation, respectively. Specifically, at least two stirring plates 71 are disposed on the same end rod body of the transmission rotating rod 72 at intervals in a mutually parallel manner, and the stirring plates 71 can stir the heat-conducting liquid to rotate in the same direction in the rotating process in a manner of constructing turbine blades. The rotating assembly 7 provided by the application can stir the heat conduction liquid in the annular cup cavity 13 in a rotating way, so that the heat conduction liquid can be driven by the stirring plate 71 to rotate in the annular cup cavity 13 and is subjected to the shunting of the heat absorption column 41 in the rotating process to continuously change the motion state, thereby forcing the heat conduction liquid to more effectively complete the heat transfer and transfer so as to effectively reduce the working temperature of the electric energy conversion element 2.
The utility model is not limited to the above-described alternative embodiments, and any person who may derive other various forms of products in the light of the present utility model, however, any changes in shape or structure thereof, all falling within the technical solutions defined in the scope of the claims of the present utility model, fall within the scope of protection of the present utility model. It should be understood by those skilled in the art that the present description and drawings are illustrative and not limiting to the claims. The scope of the utility model is defined by the claims and their equivalents. Throughout this document, the word "preferably" is used in a generic sense to mean only one alternative, and not to be construed as necessarily required, so that the applicant reserves the right to forego or delete the relevant preferred feature at any time.
Claims (10)
1. A computer power supply with an integrated heat dissipation structure, comprising a housing (1) for accommodating an electric energy conversion element (2), characterized in that,
the shell (1) comprises a first shell layer (11) and a second shell layer (12) which are sleeved with each other, and a clearance space between the first shell layer (11) and the second shell layer (12) with the axes being coincident is used for limiting an annular cup body cavity (13) which can be sleeved outside an inner shell cavity of the first shell layer (11);
a plurality of heat exchange units (3) capable of conducting heat transfer are inlaid on the side wall of the second shell layer (12) at intervals in the circumferential direction, heat transfer diffusion units (4) are distributed on the surface array of the annular cup body cavity (13) in a facing mode, radiating fins (5) are arranged on the surface, far away from the heat transfer diffusion units (4), of the heat exchange units (3), and active radiating fans (6) capable of driving airflow to conduct directional movement to enable heat dissipated on the surfaces of the radiating fins (5) to be transferred in a directional mode are supported on the outer sides of the radiating fins (5) in a hanging mode.
2. The computer power supply with integrated heat dissipation structure as set forth in claim 1, wherein the heat transfer diffusion unit (4) comprises a heat absorption column (41) and a corrosion resistant layer (42) wrapped on the surface of the heat absorption column (41), wherein,
the heat absorption columns (41) with diamond-shaped flow distribution cross sections are supported on the surface of the heat exchange unit (3) in an array mode that heat conduction liquid flowing in the annular cup body cavity (13) can be distributed for multiple times to disturb the state of the heat conduction liquid so as to force heat transferred by the heat conduction liquid to be absorbed by the heat absorption columns (41).
3. The computer power supply with the integrated heat dissipation structure as set forth in claim 2, wherein a top opening for dismounting the electric energy conversion element (2) is formed at an axial upper end of the inner housing cavity of the first housing layer (11);
the upper end of the shell (1) in the axial direction is provided with a cover body (14) for blocking the top opening of the inner shell cavity defined by the first shell layer (11), and the cover body (14) is provided with a plurality of openings (141) which can be used for the output end and the input end of the electric energy conversion element (2) to be in butt joint with an external electric cable.
4. The computer power supply with integrated heat dissipation structure as recited in claim 3, characterized in that the power conversion element (2) comprises a module body (21), a first connector (22), a second connector (23) and a third connector (24), wherein,
the axial upper end of the module main body (21) is provided with the first joint (22), the second joint (23) and the third joint (24) which are electrically connected or in signal connection with the inner core plate;
the first, second and third connectors (22, 23, 24) extend through the opening (141) to the outside of the housing (1).
5. The computer power supply with the integrated heat dissipation structure as set forth in claim 4, wherein a rotating component (7) capable of stirring the heat conduction liquid loaded in the annular cup body chamber (13) is arranged at the bottom of the annular cup body chamber, and the rotating component (7) drives the heat conduction liquid in the annular cup body chamber (13) to move in a directional annular way in a pivoting manner so as to accelerate the heat conduction liquid to take away the heat transferred by the first shell layer (11).
6. The computer power supply with integrated heat dissipation structure as recited in claim 5, wherein the rotating assembly (7) comprises an agitation plate (71), a transmission rotating rod (72) and a rotating motor (73), wherein,
the rotating motor (73) is installed in the second shell layer (12), and an output shaft of the rotating motor (73) penetrates through the second shell layer (12) and extends into a bottom chamber (131) of the annular cup body chamber (13).
7. The computer power supply with integrated heat dissipation structure as set forth in claim 6, wherein said transmission rotary rod (72) having a U-shape is in transmission connection with an output shaft of said rotary motor (73) disposed in a bottom chamber (131) of said annular cup chamber (13),
two parallel ends of the transmission rotating rod (72) which are far away from the rotating motor (73) are arranged in a side chamber (132) of the annular cup body chamber (13), and the parallel ends of the transmission rotating rod (72) are respectively provided with the stirring plates (71) which can stir the heat conduction liquid in the annular cup body chamber (13) in the rotating process.
8. The computer power supply with an integrated heat dissipation structure as set forth in claim 7, wherein at least two stirring plates (71) are disposed on the same end rod body of the transmission rotating rod (72) at intervals in a mutually parallel manner, and the stirring plates (71) can stir the heat conduction liquid to rotate in the same direction in the rotating process in a manner of constructing turbine blades.
9. The computer power supply with integrated heat dissipation structure as claimed in claim 8, characterized in that the active heat dissipation fan (6) arranged laterally is detachably mounted on the outer side surface of the second shell layer (12) through a transverse support bar (8);
the active heat dissipation fan (6), the heat exchange unit (3) and the rotating motor (73) are electrically connected with an external power supply and are mutually connected in parallel.
10. The computer power supply with integrated heat dissipation structure as claimed in claim 9, characterized in that said first shell layer (11) is made of the same high heat dissipation conductive metal material as said heat dissipation fins (5).
Priority Applications (1)
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CN202321449368.7U CN220232401U (en) | 2023-06-08 | 2023-06-08 | Computer power supply with integrated heat radiation structure |
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CN202321449368.7U CN220232401U (en) | 2023-06-08 | 2023-06-08 | Computer power supply with integrated heat radiation structure |
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CN220232401U true CN220232401U (en) | 2023-12-22 |
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CN202321449368.7U Active CN220232401U (en) | 2023-06-08 | 2023-06-08 | Computer power supply with integrated heat radiation structure |
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2023
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