CN220128487U - Wafer cleaning and polishing device - Google Patents
Wafer cleaning and polishing device Download PDFInfo
- Publication number
- CN220128487U CN220128487U CN202321109886.4U CN202321109886U CN220128487U CN 220128487 U CN220128487 U CN 220128487U CN 202321109886 U CN202321109886 U CN 202321109886U CN 220128487 U CN220128487 U CN 220128487U
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- Prior art keywords
- polishing
- wafer
- suspension arm
- head
- negative pressure
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- 238000005498 polishing Methods 0.000 title claims abstract description 58
- 238000004140 cleaning Methods 0.000 title claims abstract description 13
- 239000000725 suspension Substances 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 abstract description 14
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 238000007517 polishing process Methods 0.000 abstract description 3
- 230000002457 bidirectional effect Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a wafer cleaning and polishing device, which belongs to the technical field of polishing equipment and comprises rotary driving equipment, wherein a rotary head is arranged at the output end of the rotary driving equipment, a polishing pad is attached above the rotary head, a suspension arm is rotatably connected with the polishing head through a bearing, a wafer is attached and adsorbed below the polishing head, and a negative pressure compressor is communicated with the rotary driving equipment and the suspension arm through an air passage base, and the air passage base and the suspension arm are vertically arranged in a sliding manner. According to the utility model, the bidirectional adsorption polishing mechanism is adopted, so that the defect that the polishing liquid drops along the side surface of the wafer to pollute the other surface of the wafer in the polishing process when the polishing liquid drops on the wafer is avoided.
Description
Technical Field
The utility model relates to the technical field of polishing equipment, in particular to a wafer cleaning and polishing device.
Background
The wafer is generally referred to as a silicon wafer, and is processed from a silicon ingot, millions of transistors can be etched on the silicon wafer through a special process, and the silicon wafer is widely applied to manufacturing of integrated circuits.
The prior art describes a polishing method and apparatus for a semiconductor chip [ publication No. CN1328765C ] in which a wafer is fixed on an operation platform, and a rotatable polishing device is disposed above and on a side surface of the wafer to polish the wafer, however, when polishing in this manner, polishing liquid flows to a bottom surface of the wafer through a side surface of the wafer to pollute the bottom surface, and after polishing, a first surface of the wafer is polished to a high degree of finish, a surface of the wafer is in a very flat state, and when polishing a second surface of the wafer, the polished first surface is at a bottom, and polishing liquid generated when polishing the second surface of the wafer flows to the first surface of the wafer at the bottom to pollute the first surface of the wafer with polishing liquid wastewater.
Disclosure of Invention
The utility model aims at: in order to solve the problem that the bottom surface of a wafer is easy to be polluted when the wafer is polished above after being fixed, the wafer cleaning and polishing device is provided.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a wafer cleaning and polishing apparatus, comprising:
the output end of the rotary driving device is provided with a rotary head, a grinding pad is attached above the rotary head,
the suspension arm is rotationally connected with a grinding head through a bearing, a wafer is attached and adsorbed below the grinding head,
the negative pressure compressor is communicated with the rotary driving device and the suspension arm through the air passage base, and the air passage base and the suspension arm are vertically arranged in a sliding mode.
As a further description of the above technical solution:
the rotary driving device comprises a rotary driving device, and is characterized in that a rotatable hollow rotating shaft is arranged at the output end of the rotary driving device, a communication cavity communicated with the hollow rotating shaft is formed in the rotary head, and the hollow rotating shaft is communicated with a negative pressure compressor.
As a further description of the above technical solution:
the rotary head is provided with an air hole attached to the grinding pad, and a screw plug is screwed at the opening of the bottom of the communication cavity.
As a further description of the above technical solution:
the air flue base is provided with a vertical rod, an expansion sliding rail is arranged on the outer side of the vertical rod, and a concave sliding groove matched with the expansion sliding rail for vertical sliding is formed in the suspension arm.
As a further description of the above technical solution:
an electric telescopic device is arranged between the top end of the vertical rod and the suspension arm, and a hose is communicated between the inner cavity of the vertical rod and the inner cavity of the suspension arm.
As a further description of the above technical solution:
the bearing is arranged at the joint between the suspension arm and the grinding head, and the hollow cavity is arranged in the inner cavity of the grinding head, the suspension arm, the vertical rod and the airway base and is communicated with the negative pressure compressor.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:
1. in the utility model, the bidirectional adsorption polishing mechanism is adopted, and the adsorption between the polishing head and the wafer and the adsorption between the rotating head and the polishing pad are adopted, so that the simultaneous adsorption and fixation of the polishing pad and the wafer can be realized through the negative pressure compressor, the simultaneous operation is convenient, the adsorption operation is realized, the wafer is reversely arranged, the polishing liquid used for polishing is rotationally dispersed above the adjustable polishing pad, and the defect that the other surface of the wafer is polluted due to the fact that the polishing liquid drops along the side surface of the wafer in the polishing process when the polishing liquid drops on the wafer is directly avoided.
Drawings
FIG. 1 shows a schematic rear side perspective view provided in accordance with an embodiment of the present utility model;
FIG. 2 shows a schematic view of a front side perspective structure provided in accordance with an embodiment of the present utility model;
FIG. 3 illustrates an expanded view of a three-dimensional structure provided in accordance with an embodiment of the present utility model;
fig. 4 shows a schematic diagram of a broken line cross-sectional structure provided according to an embodiment of the present utility model.
Legend description:
1. an airway base; 11. a vertical rod; 12. an expansion slide rail; 2. a negative pressure compressor; 3. a rotary driving device; 31. a rotating head; 32. a polishing pad; 33. air holes; 34. a screw plug; 35. a hollow rotating shaft; 36. a communication chamber; 4. a suspension arm; 41. an electric telescopic device; 42. a concave chute; 43. a grinding head; 44. a wafer; 45. a bearing; 46. and (3) a hose.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: a wafer cleaning and polishing apparatus comprising: the rotary driving device 3, the suspension arm 4 and the negative pressure compressor 2 are pneumatically connected with each other through the air passage base 1, the negative pressure compressor 2 and the negative pressure compressor 2 generate a negative pressure environment when working, the hollow rotating shaft 35 at the output end of the rotary driving device 3 and the communicating cavity 36 are communicated through the air passage base 1 to form negative pressure, the top end of the rotating head 31 is provided with an air hole 33 used for being adsorbed and attached to the lower end face of the grinding pad 32, the suspension arm 4 is rotationally connected with the grinding head 43 through a bearing 45, a wafer 44 is attached and adsorbed below the grinding head 43, the wafer 44 is arranged above the grinding pad 32, the diameter of the wafer 44 is smaller than the radius of the grinding pad 32, the air passage base 1 and the suspension arm 4 are vertically and slidably arranged, the suspension arm 4 is communicated with the vertical rod 11 through a hose 46, and the negative pressure is still kept in the grinding head 43 to adsorb the wafer 44 when the suspension arm 4 moves up and down relative to the vertical rod 11 through the electric telescopic device 41.
The rotation driving device 3 drives the polishing pad 32 to rotate through the rotating head 31, then drops the wafer polishing liquid onto the polishing pad 32, so that the polishing liquid is uniformly dispersed onto the surface of the polishing pad 32 in the process of rotating the polishing pad 32, meanwhile, the suspension arm 4 is arranged in a vertical sliding manner between the suspension arm 4 and the airway base 1, after the suspension arm 4 moves downwards, the wafer 44 below the polishing head 43 is driven to approach the polishing pad 32, so that the wafer 44 approaches the polishing pad 32 from top to bottom until the wafer is attached, polishing of the wafer 44 is achieved, meanwhile, the surface liquid tension of the wafer 44 does not influence the expansion of the polishing liquid, so that the wafer 44 is reversely adsorbed and fixed in the process, the polishing liquid is prevented from dropping onto the wafer 44 from top to bottom in the original polishing process, and pollution of the polishing liquid waste liquid to the other surface of the wafer is avoided.
Specifically, as shown in fig. 4, the output end of the rotary driving device 3 is provided with a rotatable hollow rotating shaft 35, the rotating head 31 is provided with a communication cavity 36 communicated with the hollow rotating shaft 35, the hollow rotating shaft 35 is communicated with the negative pressure compressor 2, the rotating head 31 is provided with an air hole 33 attached to the polishing pad 32, and a screw plug 34 is screwed at the opening of the bottom of the communication cavity 36, wherein the negative pressure compressor 2 is used for generating a negative pressure environment by exhausting air during working, and negative pressure is formed at the air hole 33 through the communication of the air, so that the polishing pad 32 attached above the rotating head 31 is fixed by atmospheric pressure, thereby reducing the displacement of the polishing pad 32 during polishing.
Specifically, as shown in fig. 3, a bearing 45 is disposed at the connection position between the boom 4 and the grinding head 43, the boom 4, the vertical rod 11 and the inner cavity of the air channel base 1 are all provided with hollow cavities and are communicated with the negative pressure compressor 2, wherein the bearing 45 is used for rotationally connecting the boom 4 and the grinding head 43, and simultaneously reducing gaps between the inner cavity of the boom 4 and the inner cavity of the grinding head 43, so that the wafer 44 is prevented from dropping due to air leakage, and meanwhile, the wafer 44 can be driven to rotate by the grinding pad 32 through the rotation speed difference between the inner side and the outer side of the wafer 44 when the wafer 44 is ground, so that the wafer 44 is driven to rotate by the grinding pad 32, and the wafer 44 is ground more uniformly, and the grinding pad 32 is prevented from generating concave-convex on grinding planes due to different rotation speeds of the wafer 44.
Specifically, as shown in fig. 1, a vertical rod 11 is installed on the airway base 1, an expansion slide rail 12 is arranged on the outer side of the vertical rod 11, a concave slide groove 42 which is matched with the expansion slide rail 12 to vertically slide is arranged on the suspension arm 4, an electric telescopic device 41 is installed between the top end of the vertical rod 11 and the suspension arm 4, a hose 46 is communicated between the inner cavity of the vertical rod 11 and the inner cavity of the suspension arm 4, wherein the electric telescopic device 41 contracts when in operation, the suspension arm 4 drives a wafer 44 to approach the grinding pad 32 through a grinding head 43, meanwhile, shaking and skew of the suspension arm 4 during downward translation are reduced through the matching effect between the concave slide groove 42 and the expansion slide rail 12, and the suspension arm 4 is kept to have a negative pressure environment all the time in the movement process through the hose 46 so as to be used for adsorbing the wafer 44 for stable grinding.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. A wafer cleaning and polishing apparatus, comprising:
the rotary driving device (3), the output end of the rotary driving device (3) is provided with a rotary head (31), a grinding pad (32) is attached above the rotary head (31),
a suspension arm (4), wherein the suspension arm (4) is rotationally connected with a grinding head (43) through a bearing (45), a wafer (44) is attached and adsorbed below the grinding head (43),
the negative pressure compressor (2), negative pressure compressor (2) all communicate with rotary driving equipment (3) and davit (4) through air flue base (1), air flue base (1) and davit (4) vertical slip setting.
2. The wafer cleaning and polishing device according to claim 1, wherein the output end of the rotary driving device (3) is provided with a rotatable hollow rotating shaft (35), the rotating head (31) is provided with a communicating cavity (36) communicated with the hollow rotating shaft (35), and the hollow rotating shaft (35) is communicated with the negative pressure compressor (2).
3. The wafer cleaning and polishing device according to claim 2, wherein the rotating head (31) is provided with an air hole (33) attached to the polishing pad (32), and a screw plug (34) is screwed at the bottom opening of the communicating cavity (36).
4. The wafer cleaning and polishing device according to claim 1, wherein a vertical rod (11) is installed on the air passage base (1), an expansion sliding rail (12) is arranged on the outer side of the vertical rod (11), and a concave sliding groove (42) matched with the expansion sliding rail (12) to vertically slide is formed in the suspension arm (4).
5. The wafer cleaning and polishing device according to claim 4, wherein an electric telescopic device (41) is arranged between the top end of the vertical rod (11) and the suspension arm (4), and a hose (46) is communicated between the inner cavity of the vertical rod (11) and the inner cavity of the suspension arm (4).
6. The wafer cleaning and polishing device according to claim 1, wherein a bearing (45) is arranged at the joint between the suspension arm (4) and the grinding head (43), and hollow cavities are formed in the grinding head (43), the suspension arm (4), the vertical rod (11) and the inner cavity of the air passage base (1) and are communicated with the negative pressure compressor (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321109886.4U CN220128487U (en) | 2023-05-10 | 2023-05-10 | Wafer cleaning and polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321109886.4U CN220128487U (en) | 2023-05-10 | 2023-05-10 | Wafer cleaning and polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220128487U true CN220128487U (en) | 2023-12-05 |
Family
ID=88954937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321109886.4U Active CN220128487U (en) | 2023-05-10 | 2023-05-10 | Wafer cleaning and polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220128487U (en) |
-
2023
- 2023-05-10 CN CN202321109886.4U patent/CN220128487U/en active Active
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